JP3905078B2 - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- JP3905078B2 JP3905078B2 JP2003409005A JP2003409005A JP3905078B2 JP 3905078 B2 JP3905078 B2 JP 3905078B2 JP 2003409005 A JP2003409005 A JP 2003409005A JP 2003409005 A JP2003409005 A JP 2003409005A JP 3905078 B2 JP3905078 B2 JP 3905078B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting element
- light
- conductor layer
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
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- Led Device Packages (AREA)
Description
1a:搭載部
2:反射部材
3:透明部材
5:発光素子
7:導体層
8:導電性接着材
9:溝
9a:金属層
Claims (3)
- 導体層が形成された上面を有しており、該上面の前記導体層の周囲の領域に溝を有する絶縁基体と、
導電性接着材を介して前記導体層に電気的に接続されており、前記導体層および前記溝を覆うように前記絶縁基体上に搭載された発光素子とを備え、
前記溝が、前記発光素子の外周より内側に位置しているとともに、
前記導体層の上面が、前記絶縁基体の前記溝が形成された領域の外側領域における前記絶縁基体の前記上面より低い位置にあることを特徴とする発光装置。 - 前記溝の底面が金属層で覆われていることを特徴とする請求項1記載の発光装置。
- 前記発光素子を覆う透明部材をさらに備えていることを特徴とする請求項1または請求項2記載の発光装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003409005A JP3905078B2 (ja) | 2003-12-08 | 2003-12-08 | 発光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003409005A JP3905078B2 (ja) | 2003-12-08 | 2003-12-08 | 発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005174998A JP2005174998A (ja) | 2005-06-30 |
JP3905078B2 true JP3905078B2 (ja) | 2007-04-18 |
Family
ID=34730527
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003409005A Expired - Fee Related JP3905078B2 (ja) | 2003-12-08 | 2003-12-08 | 発光装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3905078B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015194779A1 (ko) * | 2014-06-18 | 2015-12-23 | 엘지이노텍(주) | 발광 소자 패키지 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100755658B1 (ko) * | 2006-03-09 | 2007-09-04 | 삼성전기주식회사 | 발광다이오드 패키지 |
US7652297B2 (en) * | 2007-09-11 | 2010-01-26 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Light emitting device |
JP5509623B2 (ja) * | 2009-02-27 | 2014-06-04 | 日亜化学工業株式会社 | 発光装置 |
JP2013041931A (ja) * | 2011-08-12 | 2013-02-28 | Ricoh Co Ltd | 光学素子パッケージ、面発光レーザモジュール、光走査装置及び画像形成装置 |
JP6103401B2 (ja) * | 2013-06-07 | 2017-03-29 | パナソニックIpマネジメント株式会社 | 配線基板およびledモジュール |
JP6114149B2 (ja) * | 2013-09-05 | 2017-04-12 | トヨタ自動車株式会社 | 半導体装置 |
JP6139427B2 (ja) * | 2014-02-04 | 2017-05-31 | Hoya Candeo Optronics株式会社 | 発光装置及びその製造方法 |
KR101443870B1 (ko) * | 2014-03-05 | 2014-09-23 | 주식회사 루멘스 | 발광 소자 패키지, 백라이트 유닛, 조명 장치 및 발광 소자 패키지의 제조 방법 |
EP3439050B1 (en) * | 2017-08-02 | 2020-10-28 | Lg Innotek Co. Ltd | Light emitting device package |
JP7221647B2 (ja) * | 2018-10-24 | 2023-02-14 | スタンレー電気株式会社 | 半導体発光装置及び半導体発光装置の製造方法 |
-
2003
- 2003-12-08 JP JP2003409005A patent/JP3905078B2/ja not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015194779A1 (ko) * | 2014-06-18 | 2015-12-23 | 엘지이노텍(주) | 발광 소자 패키지 |
US10396247B2 (en) | 2014-06-18 | 2019-08-27 | Lg Innotek Co., Ltd. | Light-emitting device package |
Also Published As
Publication number | Publication date |
---|---|
JP2005174998A (ja) | 2005-06-30 |
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