JP3880085B2 - Non-contact type IC card and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an IC card and a manufacturing method thereof.
[0002]
[Prior art]
In recent years, an IC card on which an IC circuit using a semiconductor element is mounted has become widespread from the viewpoint of excellent data processing efficiency and security. Such IC cards include a contact type in which an external terminal is connected to a terminal of an external device to transmit / receive data, and a non-contact type in which an antenna is provided to transmit / receive data to / from an external device using electromagnetic waves. is there. Recently, the driving power of the IC circuit is supplied by electromagnetic induction, and the demand for a non-contact type IC card that does not incorporate a battery is increasing.
[0003]
A conventional non-contact type IC card is obtained by mounting components such as semiconductor elements, coils, capacitors, and batteries on a substrate, and then modularizing and stacking them with PVC, ABS, UV resin or the like to form a card. Manufactured. By the way, when such a module becomes large or has a complicated shape, it is generally impregnated with a UV resin or a thermosetting resin and embedded into a card.
[0004]
[Problems to be solved by the invention]
However, in the above-described IC card manufacturing method, when a resin having only photocuring property such as UV resin is used as an adhesive, the workability is excellent due to its fast curing property. Since the UV resin cannot be irradiated with UV light, there is a problem that an uncured portion is generated. Such an uncured portion of the UV resin may damage the appearance of the card or corrode electronic components.
[0005]
On the other hand, when a resin having only thermosetting properties is used as an adhesive, an uncured portion is not generated, but workability is poor because of poor fast curing properties, and a problem arises in terms of yield. .
The present invention has been made in view of the above-described problems of the prior art, and an object of the present invention is to provide an IC card that can manufacture a good IC card with excellent workability and a manufacturing method thereof.
[0006]
[Means for Solving the Problems]
To solve the problems of the prior art described above, in order to achieve the object described above, the non-contact type IC card manufacturing method of the present invention is to produce a card substrate having a concave portion on the surface side, electronic components incorporated the recess, pouring a resin having both UV-curable and thermosetting, at least said surface of said card substrate after the resin is irradiated with ultraviolet light from the surface side to the card substrate is poured into the recess Then, the resin film is hot pressed and pressure-bonded to cure the resin and fix the electronic component to the card substrate.
[0008]
In the non-contact type IC card of the present invention, a cylindrical electronic component module storing components such as a semiconductor element, an antenna coil, a capacitor, and a battery has a circular recess that is deeper than the thickness of the electronic component module. Mounted in the concave portion of the substantially rectangular card substrate , both ultraviolet curable and thermosetting are provided in the concave portion and on the surface of the electronic component module and the gap between the electronic component module and the concave portion. The resin which has is provided as an adhesive agent, and the resin film is provided on both surfaces of the card substrate .
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of a method for manufacturing a non-contact type IC card according to the present invention will be described below.
FIG. 1 is a schematic cross-sectional configuration diagram of a non-contact type IC card of the present embodiment.
[0010]
As shown in FIG. 1, in the non-contact type IC card 1 of this embodiment, an electronic component module 3 is mounted in a recess 2 a of a card core 2, and a cured resin 4 a is deposited on the electronic component module 3. Resin films 5 a and 5 b are formed on both surfaces of the card core 2. For the card core 2 and the resin films 5a and 5b, for example, a resin such as glass epoxy, polyimide, and PET (polyethylene terephthalate) is used. The electronic component module 3 stores components such as a semiconductor element, an antenna coil, a capacitor, and a battery. The curable resin 4a is an already cured resin having both ultraviolet curable properties and thermosetting properties. As the cured resin 4a, for example, an acrylic monomer having a viscosity of about 500 cps and containing 10 to 20% by weight of a melamine resin is used.
[0011]
A method for manufacturing the non-contact type IC card shown in FIG. 1 will be described below.
2 to 4 are diagrams for explaining a method of manufacturing the non-contact type IC card shown in FIG.
First, as shown in FIG. 2, a substantially rectangular thin plate-shaped card core 2 having a circular recess 2 a corresponding to the shape of the electronic component module 3 is manufactured. The card core 2 is manufactured using, for example, glass epoxy, polyimide, PET (polyethylene terephthalate), and the like.
[0012]
In addition, a cylindrical electronic component module 3 storing components such as a semiconductor element, an antenna coil, a capacitor, and a battery is manufactured.
Then, as shown in FIG. 2, the electronic component module 3 is mounted in the recess 2 a of the card core 2.
[0013]
Next, as shown in FIG. 3, the resin 4 is poured into the recess 2 a toward the surface of the electronic component module 3 attached to the card core 2. As a result, the resin 4 accumulates on the surface of the electronic component module 3 and also flows into the gap between the electronic component module 3 and the recess 2 a of the card core 2. The resin 4 is an uncured resin having both ultraviolet curable properties and thermosetting properties. As the resin 4, for example, an acrylic monomer having a viscosity of about 500 cps and containing 10 to 20% by weight of a melamine resin is used.
[0014]
Next, UV light is irradiated from the surface side of the card core 2. Thereby, the resin 4 deposited near the surface of the electronic component module 3 is cured. At this time, the resin 4 located in the gap between the electronic component module 3 and the recess 2a of the card core 2 is not irradiated with UV light, and the resin 4 in this portion remains uncured.
[0015]
Next, in a state where the card core 2 is sandwiched between the resin films 5a and 5b, the non-contact type IC card 1 is manufactured by hot pressing from both sides with the hot press plates 10a and 10b. The temperature of the hot press is, for example, about 120 to 130 ° C. By this hot pressing, the resin 4 flowing into the gap between the electronic component module 3 and the card core 2 is heated and cured.
[0016]
As described above, according to the IC card of the present embodiment and the manufacturing method thereof, the resin 4 deposited on the electronic component module is cured by irradiating UV light, so that it has good fast curing properties and excellent workability. ing. At the same time, the resin 4 located in the gap between the recess 2a and the electronic component module 3 is cured by hot pressing, so that the uncured resin 4 does not remain in the manufactured IC card 1. Therefore, adverse effects due to the uncured adhesive can be avoided.
[0017]
The present invention is not limited to the embodiment described above. For example, in the above-described embodiment, the types of the resins 4 and 4a are not particularly limited to those described above as long as they have both ultraviolet curable properties and thermosetting properties. In the above-described embodiment, the non-contact type IC card is exemplified. However, the present invention can be similarly applied to a contact type IC card.
[0018]
【The invention's effect】
As described above, according to the IC card and the manufacturing method thereof of the present invention, it is possible to improve the workability of the bonding work when mounting electronic components in the manufacturing process, and to avoid the adverse effects due to the uncured adhesive. can do. As a result, a good IC card can be manufactured with excellent workability.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional configuration diagram of a non-contact type IC card according to an embodiment of the present invention.
2 is a view for explaining a method of manufacturing the non-contact type IC card shown in FIG. 1. FIG.
3 is a view for explaining a method of manufacturing the non-contact type IC card shown in FIG. 1. FIG.
4 is a view for explaining a method of manufacturing the non-contact type IC card shown in FIG. 1. FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Non-contact type IC card 2 ... Card core 3 ... Electronic component module 4 ... Uncured resin 4a ... Cured resin 5a, 5b ... Resin film 10a, 10b ... Hot press board

Claims (2)

Producing a card substrate having a recess on the surface side ,
It said recess electronic components are incorporated, pouring a resin having both a UV-curable and thermosetting,
By the resin to bonding a resin film on at least the surface of the card substrate after irradiation of ultraviolet rays from the front side to the card substrate is poured into the recess to hot pressing, the electrons curing the resin Fix components to the card board
A method of manufacturing a non-contact type IC card. A cylindrical electronic component module storing components such as a semiconductor element, an antenna coil, a capacitor, and a battery is mounted in the concave portion of a substantially rectangular card substrate having a circular concave portion deeper than the thickness of the electronic component module. the surface of the electronic component module a said recess, and, in the gap between the electronic component module and the recess, a resin having both UV-curable and thermosetting is provided as an adhesive, the card substrate Non-contact IC card with resin films on both sides .

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