JPH09109578A - Ic card and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture a satisfactory IC card with an excellent operability. SOLUTION: An electronic component module 3 is mounted in the recess 2a of a card core 2, and uncured resin 4a having both ultraviolet curable and thermosetting properties is cast from above. The core 2 is irradiated with the ultraviolet ray, so that the resin 4a deposited on the module 3 is, for example, cured. Thereafter, when resin films 5a, 5b are pressed by a hot press, the uncured resin 4a disposed in the gap between the module 3 and the recess 2a is cured by the heat.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card and its manufacturing method.

[0002]

2. Description of the Related Art In recent years, from the viewpoint of efficiency of data processing and excellent security, IC cards having an IC circuit formed of a semiconductor element have become popular. Such an IC card is classified into a contact type in which an external terminal is connected to a terminal of an external device to transmit and receive data, and a non-contact type in which an antenna is provided and data is transmitted and received to and from the external device by electromagnetic waves. is there. Recently, the drive power of the IC circuit is supplied by electromagnetic induction, and the demand for a non-contact type IC card without a built-in battery is increasing.

A conventional non-contact type IC card is a card in which components such as a semiconductor element, a coil, a capacitor and a battery are mounted on a substrate, and a modularized product is laminated and bonded with PVC, ABS or UV resin. It is manufactured by doing. By the way, when such a module becomes large or has a complicated shape, in general, U
It is impregnated with V resin or thermosetting resin and embedded to form a card.

[0004]

However, in the above-described IC card manufacturing method, when a resin having only photo-curing property such as UV resin is used as an adhesive, it is difficult to work because of its rapid curing property. Although excellent, there is a problem that an uncured portion is generated because the UV resin that has flowed in such as the back surface of the module cannot be irradiated with UV light. Such an uncured portion of the UV resin may damage the appearance of the card or corrode electronic parts.

On the other hand, when a resin having only a thermosetting property is used as an adhesive, an uncured part is not generated, but since the rapid curing property is poor, the workability is poor and the yield is low. The problem arises. The present invention has been made in view of the above-mentioned problems of the conventional art, and an object of the present invention is to provide an IC card and a method for manufacturing the same that can manufacture a good IC card with excellent workability.

[0006]

In order to solve the above-mentioned problems of the prior art and achieve the above-mentioned object, a method of manufacturing an IC card according to the present invention is a card substrate having a recess for incorporating an electronic component. By manufacturing, by pouring a resin having both an ultraviolet curable and a thermosetting to the card substrate in which the electronic component is incorporated in the recess, and irradiating the card substrate in which the resin is poured with ultraviolet rays and then heating the resin. Then, the resin is cured to fix the electronic component to the card substrate.

The method of manufacturing an IC card of the present invention is
Preferably, the heating is performed when the resin film is hot pressed and pressure-bonded to at least the surface of the card substrate.
Further, in the IC card of the present invention, the electronic component is incorporated in the card substrate by using a resin having both ultraviolet curability and thermosetting as an adhesive.

In the method of manufacturing the IC card of the present invention, when the resin is poured into the card substrate in which the electronic component is incorporated, for example, the resin is deposited on the surface of the electronic component and the resin is deposited in the gap between the electronic component and the recess. Pour in. When the card substrate is irradiated with ultraviolet rays in such a state, the resin on the surface of the electronic component is relatively rapidly cured by the ultraviolet rays. At this time, the resin located in the gap between the electronic component and the recess is not irradiated with ultraviolet rays, and the resin in this portion is in an uncured state. Then, when the card substrate is heated, the resin located in the gap between the electronic component and the recess is cured by the heat.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the method for manufacturing a non-contact type IC card of the present invention will be described below. FIG.
It is a schematic cross-sectional block diagram of the non-contact type IC card of this embodiment.

As shown in FIG. 1, in the non-contact type IC card 1 of this embodiment, the electronic component module 3 is mounted in the recess 2a of the card core 2, and the cured resin 4a is deposited on the electronic component module 3. There is. On both sides of the card core 2,
Resin films 5a and 5b are formed. Card core 2
The resin films 5a and 5b are made of resin such as glass epoxy, polyimide and PET (polyethylene terephthalate). The electronic component module 3 stores components such as a semiconductor element, an antenna coil, a capacitor and a battery. The curable resin 4a has both ultraviolet curability and thermosetting property, and is already cured resin. As the cured resin 4a, for example, 500c
An acrylic monomer having a viscosity of about ps and containing 10 to 20% by weight of a melamine resin is used.

A method of manufacturing the non-contact type IC card shown in FIG. 1 will be described below. 2 to 4 are views for explaining a method of manufacturing the non-contact type IC card shown in FIG. First, as shown in FIG. 2, a substantially rectangular thin plate-shaped card core 2 having a circular recess 2 a corresponding to the shape of the electronic component module 3 is manufactured. The card core 2 is manufactured using a resin such as glass epoxy, polyimide, PET (polyethylene terephthalate), or the like.

Further, a cylindrical electronic component module 3 in which components such as a semiconductor element, an antenna coil, a capacitor and a battery are stored is manufactured. Then, as shown in FIG. 2, the electronic component module 3 is mounted in the recess 2 a of the card core 2.

Next, as shown in FIG. 3, a resin 4 is poured into the recess 2a toward the surface of the electronic component module 3 mounted on the card core 2. As a result, the resin 4
While being deposited on the surface of the electronic component module 3, it also flows into the gap between the electronic component module 3 and the recess 2 a of the card core 2. The resin 4 has both ultraviolet curability and thermosetting and is an uncured resin. As the resin 4, for example, an acrylic monomer having a viscosity of about 500 cps and containing 10 to 20% by weight of a melamine resin is used.

Next, UV light is irradiated from the front surface side of the card core 2. As a result, the resin 4 deposited near the surface of the electronic component module 3 is cured. At this time, the resin 4 located in the gap between the electronic component module 3 and the recess 2a of the card core 2 is not irradiated with UV light, and the resin 4 in this portion remains uncured.

Next, the card core 2 is attached to the resin film 5a,
Heat press plate 1 from both sides while sandwiched in 5b
The non-contact type IC card 1 is manufactured by hot pressing with 0a and 10b. The temperature of the hot press is, for example, 120 to 130 ° C.
It is about. By this hot pressing, the resin 4 that has flowed into the gap between the electronic component module 3 and the card core 2 is heated and cured.

As described above, according to the IC card and the method of manufacturing the same of the present embodiment, the resin 4 deposited on the electronic component module is cured by irradiating with UV light, so that it has a good quick-curing property and is easy to work. It has excellent properties. At the same time, the resin 4 located in the gap between the recess 2a and the electronic component module 3 is cured by hot pressing, so that the uncured resin 4 does not remain in the manufactured IC card 1. Therefore, it is possible to avoid the adverse effect of the uncured adhesive.

The present invention is not limited to the above embodiment. For example, in the embodiment described above, the resin 4, 4a
The type is not particularly limited as long as it has both ultraviolet curability and thermosetting property. Further, in the above-described embodiment, the non-contact type IC card is exemplified, but the present invention can be similarly applied to the contact type IC card.

[0018]

As described above, according to the IC card and the method of manufacturing the same of the present invention, it is possible to improve the workability of the bonding work when mounting the electronic component in the manufacturing process, and to carry out the uncured bonding. The adverse effect of the agent can be avoided. As a result, a good IC card can be manufactured with excellent workability.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional configuration diagram of a non-contact type IC card according to an embodiment of the present invention.

FIG. 2 is a diagram for explaining a manufacturing method of the non-contact type IC card shown in FIG.

FIG. 3 is a diagram for explaining a manufacturing method of the non-contact type IC card shown in FIG.

FIG. 4 is a diagram for explaining a manufacturing method of the non-contact type IC card shown in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Non-contact type IC card 2 ... Card core 3 ... Electronic component module 4 ... Unhardened resin 4a ... Hardened resin 5a, 5b ... Resin film 10a, 10b ... Hot press plate

Claims (3)

[Claims] 1. A card substrate having a recess for incorporating an electronic component is manufactured, and a resin having both an ultraviolet curability and a thermosetting property is poured into the card substrate in which the electronic component is incorporated in the recess. A method of manufacturing an IC card, wherein the resin is cured and the electronic component is fixed to the card substrate by irradiating the card substrate on which the resin has been cast with ultraviolet rays and then heating the resin. 2. The method of manufacturing an IC card according to claim 1, wherein the heating is performed when a resin film is hot-pressed and pressure-bonded to at least the surface of the card substrate. 3. An IC card in which an electronic component is incorporated in a card substrate by using a resin having both ultraviolet curability and thermosetting as an adhesive.