JP2001034727A - Non-contact ic card and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a non-contact IC card that the mechanical strength for bending and point pressure is sufficient flatness is excellent and a short circuit is prevented even when an IC chip is mounted by using a face down method with respect to a non-contact IC card in which an inlet is provided in a base and to provide its manufacturing method. SOLUTION: Relating to this non-contact IC card where an inlet 18 comprising a resin sheet 12, an antenna 17, an IC chip 13 and resin sealing is buried in a base, a cap-shaped reinforcement 14 is provided over the IC chip. The IC chip is provisionally sealed, the inlet is manufactured by covering the cap- shaped reinforcement filled up with resin over the IC chip, and the non-contact IC card is manufactured by burying the inlet in the base.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact IC card having improved reliability, and more particularly, to a highly reliable non-contact IC card which prevents an IC chip from being broken by bending or point pressure. It's about cards.

[0002]

2. Description of the Related Art Conventionally, as an ID card for identifying an individual, a magnetic or optical reading method has been widely used in credit cards and the like. However, with the popularization of technology, falsification of data and forgery cards have become available, and the number of people who are actually affected by forgery cards has increased. For this reason, in recent years, attention has been paid to managing personal data from the viewpoint of high security, such as a large information capacity and the ability to carry encrypted data in an IC card incorporating an IC chip.

A conventional IC card has been a contact IC card. That is, for information exchange between the IC circuit and the external data processing device, a connection terminal for electrical and mechanical connection was provided. For this reason, there have been various problems such as securing airtightness inside the IC circuit, countermeasures against electrostatic destruction, poor electrical connection of terminal electrodes, and complicated mechanism of the read / write device. In addition, since a human operation of inserting or attaching the contact IC card to the reading / writing device is required, and it is inefficient and complicated depending on the field of use, a remote data processing device that can be used in a portable state without any trouble is required. There has been a demand for a non-contact IC card capable of exchanging information.

[0004] Therefore, a non-contact IC card having an antenna coil for utilizing an electromagnetic wave in a plastic card and an IC chip having a memory and an arithmetic function has been devised. This is to drive an IC with induced electromotive force excited by an antenna coil in a non-contact IC card by an electromagnetic wave from an external read / write device, and there is no need to have a battery power supply inside the card. It is possible to provide an excellent card for activities such as those that can be used in the game.

Some applications of the non-contact IC card include a thin battery such as a paper battery therein to increase the transmission distance or use a high frequency band. From a viewpoint, a batteryless thing is desired in many cases.

Conventionally, when mounting an IC chip on such a non-contact IC card, the IC chip is mounted on a glass epoxy substrate by a wire bonding mounting method, a flip chip mounting method, or the like. It has been common practice to seal with a sealing resin for the purpose of protection from changes, retention of electrical insulation, and diffusion of heat generated during operation. Then, on such a glass epoxy substrate, I
The one on which the C chip is mounted is called an IC module. A connection between the IC module and the antenna coil is called an inlet.

[0007] Materials used for the sealing resin include epoxy resin, silicon resin, phenol resin, polyimide resin, acrylic resin, urethane resin, and mixed and modified resins thereof. The sealing process is performed by providing these resins on an IC chip by using a method such as injection, potting application using a dispenser, or printing application using a metal mask, and curing them by heat or ultraviolet rays. .

However, in recent years, in order to reduce the cost of the card, an electrode portion for joining the antenna coil and the IC chip is provided on a resin sheet without using the IC module, and a bare chip mounting for directly mounting the IC chip. Methods have also been tried. In this case, a face-down method is used in which a protrusion called a bump is provided on the electrode portion on the circuit formation surface of the IC chip using solder or gold, and the bump is connected to the electrode portion on the resin sheet through the bump.

In this connection, a resin containing conductive particles, such as an anisotropic conductive film or an anisotropic conductive resin, or an IC
An underfill for filling the space between the chip circuit surface and the base sheet is used. Also in this case, sealing with a sealing resin is performed to ensure the reliability of the operation of the inlet. However, for example, many IC modules mounted by a wire bonding mounting method or the like are sealed by a transfer molding method having high hardness and excellent shape stability, and have a higher mechanical strength than that. This is insufficient, and becomes a problem when managing money information and ID information that require a non-contact IC card to have high functionality.

[0010] The antenna provided on the non-contact IC card includes an antenna in which electric wires are formed in a loop shape, and an antenna in which a conductor foil is attached on a resin sheet and formed by a method such as etching. Although the shape and the number of windings vary depending on the frequency used, 13 MHz which is frequently used at present is used.
In the case of a frequency of the order, it is common to wind several turns.

An inlet made of such a resin sheet, an antenna formed on the resin sheet, an IC chip bonded to the antenna, and a sealing resin sealing the IC chip is embedded in a non-contact IC card. Various methods have been devised. For example, a thermal lamination method is often used in which an inlet is sandwiched in a plastic sheet as a base material of a card, heated and pressed by a press machine, and integrated by heat fusion.

[0012] In addition, a method of embedding an inlet in an adhesive or a hot melt and sandwiching it with a plastic sheet, a method using an injection technique,
The card can be manufactured by a method using a UV curing technique that does not impose a thermal burden on the card.

The non-contact IC card manufactured as described above loses all data if the IC chip is mechanically destroyed during use. A major issue is how to increase mechanical strength against pressure. So, for example, I
The sealing of the C chip plays a part of the role of protecting the IC chip by using a sealing resin having a hardness different from that of the base material of the card. When a face-down method of connecting an IC chip to an electrode portion on a resin sheet is used, sufficient mechanical strength has not been obtained at present.

[0014]

An object of the present invention is to provide a resin sheet, an antenna formed on the resin sheet, an IC chip bonded to the antenna, and an inlet made of a sealing resin for sealing the IC chip. Non-contact IC card provided between a plurality of substrates,
A non-contact IC card that has sufficient mechanical strength against bending of a non-contact IC card and point pressure such as point impact, even when the chip is mounted using a face-down method of connecting to an electrode portion on a resin sheet. , And a method of manufacturing the same.

[0015]

The present invention provides a resin sheet,
A non-contact IC card in which an antenna formed on a resin sheet, an IC chip connected to the antenna, and an resin seal encapsulating the IC chip is embedded between a plurality of base materials, A non-contact IC card characterized in that a hat-shaped cover for covering the IC chip is provided above the chip, and a reinforcing material having an opening partly in a skirt portion of the hat is provided.

The present invention also relates to the non-contact I according to the above invention.
The non-contact IC card according to the C card, wherein the reinforcing material is metal.

Further, according to the present invention, an inlet formed of a resin sheet, an antenna formed on the resin sheet, an IC chip connected to the antenna, and a sealing resin for sealing the IC chip is provided between a plurality of base materials. In the manufacture of a non-contact IC card embedded in an IC, 1) an IC chip is mounted and temporarily sealed on a sheet on which an antenna is formed, and 2) a hat-shaped reinforcing plate filled with a resin for final sealing is mounted on the IC.
Cover the chip, cure the resin, produce an inlet provided with a reinforcing plate covering the IC chip, 3) embed the inlet between a plurality of base materials,
A method for producing a non-contact IC card, which comprises producing a C card.

[0018]

Embodiments of the present invention will be described below. FIG. 1 is a sectional view showing one embodiment of a non-contact IC card according to the present invention. As shown in FIG. 1, a non-contact IC card according to the present invention includes a card substrate (11) composed of a plurality of substrates and an inlet (1) embedded between the plurality of substrates.
8). The inlet (18) includes a resin sheet (12), an antenna (17) formed on the resin sheet, an IC chip (13) joined to the antenna, a reinforcing material (14) covering the IC chip, and an IC.
It is composed of sealing resins (15) and (16) that seal the chip.

The card base material (11) is a plastic, for example, a resin such as vinyl chloride, PET, ABS, or polycarbonate, or a polymer alloy thereof. These have a multilayer structure, and an adhesive may be used between the layers.

On the resin sheet (12), an antenna (17) formed by winding a metal wire and an antenna (17) of a conductor foil formed by etching a conductor foil into an antenna pattern are provided. . The resin sheet (12)
Glass epoxy, polyimide, PET, vinyl chloride, A
Any resin that can be processed into a sheet, such as a resin such as BS or polycarbonate, or a polymer alloy thereof, can be used. As the conductive foil, copper, aluminum, or the like can be used, but aluminum foil is recommended in consideration of reducing the price of the non-contact IC card.

FIG. 2 is an enlarged perspective view showing the reinforcing member (14) in FIG. As shown in FIG. 2, the reinforcing member (14) has a hat shape, and has an opening (19) partially at a skirt portion of the hat shape. A cap-shaped reinforcing material (1) as shown in FIG.
4) is covered. The material of this reinforcement is metal,
The skirt has an opening. The inside is filled with a sealing resin (15) without gaps.

Since the metal reinforcing plate has a skirt, it is easy to obtain a flatness with respect to the resin sheet (12) on which the antenna is arranged. In addition, the provision of the opening prevents short circuit of the antenna pattern formed on the base material, and also plays a role of releasing the sealing resin that cannot be accommodated in the hat-shaped metal reinforcing material. By covering the IC chip with the metal reinforcing material in this manner, the force is dispersed by the reinforcing material with respect to the point pressure from above, and the pressure is not directly applied to the IC chip. The target strength is improved.

As a sealing method, a cap-shaped metal reinforcing material is filled with a sealing resin by a method such as potting, and a base formed on an IC chip by a method such as potting and printing as a temporary sealing in advance. Air is prevented from entering by combining with the sealing resin on the material. Excess resin that does not fit into the hat-shaped metal reinforcing material passes through the opening of the skirt and is formed like a sealing resin (16). The presence of the resin in this portion serves to reduce the stress applied to the base material when the card is bent.

In addition, since the reinforcing material is made of metal, it is strong against bending. As a material, iron, a SUS plate, or the like is preferable in terms of processability and price. The thickness to be used is desirably 30 to 150 μm from the viewpoint of having sufficient strength and being housed inside the card.

Specifically, a polyimide sheet (polyimide sheet 2) in which a copper foil antenna is formed by etching.
A 5 μm, copper foil part 15 μm) was mounted on a bare chip using a 30 μm anisotropic conductive film (ACF: Asahi Kasei) provided with a Myfair chip (manufactured by MIKRON) having gold bumps. Using a metal mask, thermosetting silicone resin was printed on the mounted bare chip. Next, the same resin was poured by a potting method into the inside of the hat-shaped reinforcing material, so that the antenna line came to the opening of the hem,
It was placed on an IC chip that had been printed and sealed. At this time, excess resin flowed out of the opening, and a fillet was formed on the metal reinforcing plate. The thus sealed polyimide sheet was placed in a thermosetting oven at 120 ° C. for one hour, and the sealing resin was cured to obtain an inlet.

As the substrate sheet used for the card, PET-G23 having a thickness of 250 μm and stretched PET24 having a thickness of 125 μm coated with a vinyl chloride / vinyl acetate copolymer adhesive having a thickness of 5 μm were used. With these two base sheets,
Insert the inlet from both sides of the inlet (5 in total)
(Layer structure). The five-layer laminated sheet was sandwiched from above and below by a stainless steel plate having a thickness of 0.5 mm, and was subjected to heating press. Pressing conditions are as follows.
After that, heat lamination was performed at 170 ° C. for 2 minutes at 15 kgf / cm ² .

Further, in order to prevent twisting at the time of card production and pocking on the card surface, a cooling press of 15 k
gf / cm ² at room temperature for 5 minutes. A non-contact IC card according to the present invention was obtained by punching out the card so as not to damage the antenna and the like inside the sheet.

Table 1 shows a comparison of mechanical strength between the card according to the present invention manufactured as described above and a conventional card manufactured only by sealing with an epoxy resin.

[0029]

[Table 1]

[0030]

According to the present invention, an inlet composed of a resin sheet, an antenna formed on the resin sheet, an IC chip connected to the antenna, and a resin sealant sealing the IC chip is formed between a plurality of base materials. In the non-contact IC card embedded in the IC chip, a reinforcing member having a hat shape covering the IC chip above the IC chip and having an opening at a skirt portion of the hat shape is provided. Even when mounted using the face-down method of connecting to the electrode part on the resin sheet, the mechanical strength is sufficient against bending of a non-contact IC card and point pressure such as point impact, and the base material of the reinforcing material A non-contact IC card which can easily obtain a flatness with respect to the antenna, can prevent a short circuit of the antenna, and can reduce a stress applied to the base material by the resin flowing out from the opening.

In addition, the present invention provides an inlet formed of a resin sheet, an antenna formed on the resin sheet, an IC chip connected to the antenna, and a resin seal sealing the IC chip, wherein a plurality of base materials are provided. In the manufacture of a non-contact IC card embedded in an IC, 1) an IC chip is mounted and temporarily sealed on a sheet on which an antenna is formed, and 2) a hat-shaped reinforcing plate filled with a resin for final sealing is mounted on the IC.
Cover the chip, cure the resin, produce an inlet provided with a reinforcing plate covering the IC chip, 3) embed the inlet between a plurality of base materials,
Because it is a method of manufacturing a C card, even when the IC chip is mounted using a face-down method of connecting to an electrode portion on a resin sheet, even if a non-contact IC card is bent or point pressure such as point impact is applied. The mechanical strength is sufficient, the flatness of the reinforcing material to the base material can be easily obtained, the short circuit of the antenna can be prevented, and the stress applied to the base material by the resin flowing out from the opening can be reduced. A method for manufacturing a non-contact IC card that can be used.

[Brief description of the drawings]

FIG. 1 is a sectional view showing one embodiment of a non-contact IC card according to the present invention.

FIG. 2 is an enlarged perspective view showing a reinforcing member in FIG. 1;

[Explanation of symbols]

 11: Card base material 12: Resin sheet 13: IC chip 14: Reinforcement material 15: Sealing resin 16: Sealing resin 17: Antenna 18: Inlet 19: Opening

Claims (3)

[Claims] An inlet formed of a resin sheet, an antenna formed on the resin sheet, an IC chip connected to the antenna, and a resin sealant sealing the IC chip is embedded between a plurality of base materials. In a non-contact IC card, the I
A non-contact IC card having a hat shape covering an IC chip above a C chip, and a reinforcing material having a partially open portion at a skirt portion of the hat shape. 2. The non-contact IC card according to claim 1, wherein the reinforcing member is a metal. 3. An inlet formed of a resin sheet, an antenna formed on the resin sheet, an IC chip connected to the antenna, and a sealing resin for sealing the IC chip is embedded between a plurality of base materials. In the production of a non-contact IC card, 1) an IC chip is mounted and temporarily sealed on a sheet on which an antenna is formed, and 2) a cap-shaped reinforcing plate filled with a resin for final sealing is put on the IC chip. , Curing the resin, I
Create an inlet with a reinforcing plate covering the C chip,
3) Embedding the inlet between a plurality of substrates,
A method for producing a non-contact IC card, which comprises producing a C card.