KR100666005B1 - Radiation curable conductive ink and manufacturing method for using the same - Google Patents

Abstract

Provided is a radiation curable conductive ink, which forms a conductive substrate via chemical crosslinking upon the irradiation of UV rays, visible rays or electron beams, and is useful as a material for producing layered electronic devices. The radiation curable conductive ink comprises: conductive powder having an average size of 40 micrometers or less; a cover layer for covering the surface of the conductive powder; and a photosensitive bonding agent having a viscosity of 5,000 cps or less at 25 deg.C and containing at least one reactive cyclic polymerizable organic compound. Before covering with the cover layer, the conductive power shows a silver content corresponding to 90% or less of the weight of the conductive powder before covering with the cover layer. The cover layer has a silver content corresponding to 30% or more of the weight of the cover layer, and the cover layer has a weight corresponding to 80% or less of the total weight of the conductive powder and the cover layer.

Description

Radiation curable conductive ink and manufacturing method using the same {RADIATION CURABLE CONDUCTIVE INK AND MANUFACTURING METHOD FOR USING THE SAME}

BRIEF DESCRIPTION OF THE DRAWINGS The drawings will be briefly described for the purpose of improving the technical method and purpose of the present invention.

1 is a schematic diagram of an application of an RFID system in a smart card according to the prior art,

2 is a structural schematic diagram illustrating RFID in a smart card according to the prior art,

3 is a flowchart of a method of manufacturing a conductive substrate using the radiation curable ink according to the present invention;

4 is another flow chart of a method for manufacturing a conductive substrate using the radiation curable conductive ink according to the present invention.

The present invention relates to a radiation curable conductive ink and a method for manufacturing a conductive substrate using the conductive ink, which specifically relates to an RFID antenna, a printed circuit board, a smart card (contactless chip card) element, a smart label, and a printed electronic component. It is applicable to electronic materials, including electronic interference (EMI) and antistatic materials.

Technological advances have emphasized multifunctionality and continued miniaturization in the design of various electronic products. More specifically, recent rapid developments in networking and wireless communications have shown a constant transformation in a wide range of portable electronics, changing the infinite potential of 21st century business forms. There is an inseparable relationship between miniaturization of electronics and electronic materials. For example, laminated antennas are replacing traditional stem antennas, and stacking of printed circuit boards has made small cellular telephones available on the market. made. In addition, the recent rapid growth in RFID has shown the application of RFID in electronic money, animal chip readers, smart cards (contactless chip cards), smart shop shopping, etc., which has already become an integral part of consumer life.

Although the above-described stacking of stacked antennas, printed circuit boards and RFID systems provides ease of use, many innovative products or new forms of business are still uncertain and impractical, and current manufacturing costs are still very high.

1 shows an example of RFID applied to a smart card (contactless chip card), the principle of which is the signal of the signal through the stacked antenna 12 from the chip 11 of the smart card 10 to the reader 20. It is about transmission. Antenna 21 of reader 20 then receives the signal, and microprocessor 22 decodes the signal to produce readable information. In addition, the reader 20 may transfer other data to the smart card 10, in which the chip 11 of the smart card 10 performs a write operation. Since the implemented transmission method is an inductive type (using coil resonance for generating high frequency signal induction), the smart card 10 does not need to be provided with a power supply.

In principle, the RFID transmission terminal can be configured in any form of inexpensive products, and can completely replace the current bar code used in all types of products, bringing unlimited convenience and the current lifestyle trend. Change it completely.

However, current technology still cannot overcome the problem of high cost of RFID system, which is more expensive than chip, mainly due to the high cost of the compared antenna.

Referring to FIG. 2, an antenna 12 of a smart card 10 mainly configured by disposing a wound coil on a stacked substrate 13 and thereby forming an antenna capable of transmitting and receiving signals. Shows. Conventional etching is used to place the wound coil on the stacked substrate 13. However, due to the complexity of the work program, costs cannot be lowered even by mass production.

Thus, if screen printing is used to directly install the wound coil on the laminated substrate, the working procedure can be effectively reduced and the cost can be saved. Although current technology has made it possible to make universal use of screen printing in the manufacture of circuit boards, the current main use of traditional thermosetting conductive inks containing pure silver powder effectively reduces manufacturing costs when used in the aforementioned RFID antennas or circuit boards. Can not.

Thus, the inventor of the present invention has developed a radiation-curable conductive ink and a method for producing a conductive substrate using the conductive ink, which can effectively reduce the manufacturing cost.

In an embodiment of the radiation curable conductive ink of the present invention, the chemical crosslinking reaction is achieved by irradiating the conductive ink with radiation, wherein the radiation used is a combination of ultraviolet, visible, electron beam or two or more of these three rays. It is one of the things. The conductive ink includes at least the following components:

(a) conductive powder with a cover layer, wherein the weight of the silver content of the conductive powder before covering with the cover layer is no greater than 90% of the weight of the conductive powder without the cover layer;

(b) a cover layer covering the surface of the conductive powder, wherein the weight of the silver content of the cover layer is 30% or more of the weight of the cover layer, and the weight of the cover layer is 80% of the total weight of the conductive powder and the cover layer Or less;

(c) conductive powder having a cover layer, wherein the average size of the conductive powder is 40 micrometers or less;

(d) photosensitivity, such as reactive cyclic monomers or reactive cyclic oligomers, having a viscosity of not more than 5,000 cps under a temperature condition of 25 ° C. and comprising at least one reactive cyclic organic compound capable of polymerization. Binders.

In another embodiment of the radiation curable conductive ink of the present invention, the chemical crosslinking reaction is achieved by irradiating the conductive ink with radiation, wherein the radiation used is ultraviolet, visible, electron beam or a combination of two or more of these three rays. Is one of. The conductive ink includes at least the following components:

(a) conductive powder with a cover layer, wherein the weight of the copper content of the conductive powder before covering with the cover layer is at least 30% of the weight of the conductive powder without the cover layer;

(b) a cover layer covering the surface of the conductive powder, wherein the weight of the silver content of the cover layer is 30% or more of the weight of the cover layer, and the weight of the cover layer is 80% or less of the total weight of the conductive powder and the cover layer ;

(c) conductive powder having a cover layer, wherein the average size of the conductive powder is 40 micrometers or less;

(d) A photosensitive binder, such as a reactive cyclic monomer or a reactive cyclic oligomer, having a viscosity of 5,000 cps or less and comprising at least one reactive cyclic organic compound capable of polymerization under a temperature condition of 25 ° C.

In another embodiment of the radiation curable conductive ink of the present invention, the chemical crosslinking reaction is achieved by irradiating the conductive ink with radiation, wherein the radiation used is a combination of ultraviolet, visible, electron beam or two or more of these three rays. It is one of the things. The conductive ink includes at least the following components:

(a) conductive powder with a cover layer, wherein the weight of the aluminum content of the conductive powder before covering with the cover layer is at least 30% of the weight of the conductive powder without the cover layer;

(b) a cover layer covering the surface of the conductive powder, wherein the weight of the silver content of the cover layer is 30% or more of the weight of the cover layer, and the weight of the cover layer is 80% or less of the total weight of the conductive powder and the cover layer ;

(c) conductive powder having a cover layer, wherein the average size of the conductive powder is 40 micrometers or less;

(d) A photosensitive binder, such as a reactive cyclic monomer or a reactive cyclic oligomer, having a viscosity of 5,000 cps or less and comprising at least one reactive cyclic organic compound capable of polymerization under a temperature condition of 25 ° C.

In another embodiment of the radiation curable conductive ink of the present invention, the chemical crosslinking reaction is achieved by irradiating the conductive ink with radiation, wherein the radiation used is a combination of ultraviolet, visible, electron beam or two or more of these three rays. It is one of the things. The conductive ink includes at least the following components:

(a) conductive metal powder, wherein the average size of the conductive powder is 40 micrometers or less;

(b) A photosensitive binder, such as a reactive cyclic monomer or a reactive cyclic oligomer, having a viscosity of 5,000 cps or less and comprising at least one reactive cyclic organic compound capable of polymerization under a temperature condition of 25 ° C.

A method of manufacturing a conductive substrate using screen printing is realized using the above-described components of the radiation curable conductive ink of the present invention, thereby shortening the working procedure and reducing the cost, and the method adopted here is described below.

The method of manufacturing the conductive substrate includes the following steps.

(a) applying a conductive powder, wherein the weight of the silver content of the conductive powder is 90% or less of the weight of the conductive powder;

(b) covering the conductive powder with a cover layer, wherein the weight of the silver content of the cover layer is at least 30% of the weight of the cover layer, and the weight of the cover layer is at most 80% of the total weight of the conductive powder and the cover layer. Wherein the conductive powder has a cover layer, and the average size of the conductive powder is 40 micrometers or less;

(c) mixing the conductive powder having a cover layer and the photosensitive binder, wherein the photosensitive binder has a viscosity of 5000 cps or less at a temperature of 25 ° C. and can polymerize such as a reactive cyclic monomer or a reactive cyclic oligomer. At least one reactive cyclic organic compound, thereby forming a radiation curable conductive ink.

(d) printing the radiation curable conductive ink on the surface of the substrate using screen printing;

(e) exposing the radiation curable conductive ink to radiation, wherein the radiation used is one of ultraviolet light, visible light, electron beam or a combination of two or more of these three rays, whereby Chemical cross-linking reaction and from which the conductive substrate is formed.

The method of manufacturing a conductive substrate using a radiation curable conductive ink includes the following steps:

(a) applying a conductive powder, wherein the copper content of the conductive powder is at least 30% of the weight of the conductive powder;

(b) covering the conductive powder with a cover layer, wherein the weight of the silver content of the cover layer is at least 30% of the weight of the cover layer, and the weight of the cover layer is 80% of the total weight of the conductive powder and the cover layer. The conductive powder has a cover layer, and the average size of the conductive powder is 40 micrometers or less;

(c) mixing the conductive powder having a cover layer and the photosensitive binder, wherein the photosensitive binder has a viscosity of 5000 cps or less at a temperature of 25 ° C. and can polymerize such as a reactive cyclic monomer or a reactive cyclic oligomer. At least one reactive cyclic organic compound, thereby forming a radiation curable conductive ink.

(d) printing the radiation curable conductive ink on the surface of the substrate using screen printing;

(e) exposing the radiation curable conductive ink to radiation, wherein the radiation used is one of ultraviolet light, visible light, electron beam or a combination of two or more of these three rays, whereby Chemical cross-linking reaction and from which the conductive substrate is formed.

The method of manufacturing a conductive substrate using a radiation curable conductive ink includes the following steps:

(a) applying a conductive powder, wherein the aluminum content of the conductive powder is at least 30% of the weight of the conductive powder;

(b) covering the conductive powder with a cover layer, wherein the weight of the silver content of the cover layer is at least 30% of the weight of the cover layer, and the weight of the cover layer is 80% of the total weight of the conductive powder and the cover layer. The conductive powder has a cover layer, and the average size of the conductive powder is 40 micrometers or less;

(c) mixing the conductive powder having a cover layer and the photosensitive binder, wherein the photosensitive binder has a viscosity of 5000 cps or less at a temperature of 25 ° C. and can polymerize such as a reactive cyclic monomer or a reactive cyclic oligomer. At least one reactive cyclic organic compound, thereby forming a radiation curable conductive ink.

(d) printing the radiation curable conductive ink on the surface of the substrate using screen printing;

(e) exposing the radiation curable conductive ink to radiation, wherein the radiation used is one of ultraviolet light, visible light, electron beam or a combination of two or more of these three rays, whereby Chemical cross-linking reaction and from which the conductive substrate is formed.

The method of manufacturing a conductive substrate using a radiation curable conductive ink includes the following steps:

(a) applying a conductive metal powder, wherein the average size of the conductive powder is 40 micrometers or less;

(b) forming a photosensitive binder having a viscosity of at most 5000 cps at a temperature of 25 ° C. and comprising at least one reactive cyclic organic compound capable of polymerization, such as a reactive cyclic monomer or a reactive cyclic oligomer;

(c) mixing the conductive powder and the photosensitive binder to form a radiation curable conductive ink;

(d) printing the radiation curable conductive ink on the surface of the substrate using screen printing;

(e) exposing the radiation curable conductive ink to radiation, wherein the radiation used is one of ultraviolet light, visible light, electron beam or a combination of two or more of these three rays, whereby Chemical cross-linking reaction and from which the conductive substrate is formed.

The method of manufacturing the conductive substrate using screen printing is implemented using the above-described radiation curable conductive ink of the present invention and the method of using the conductive ink to manufacture the conductive substrate, thereby shortening the working procedure and reducing the cost. To achieve the purpose. The method is particularly applicable to applications of RFID antennas, printed circuit boards, smart card (contactless antenna) components, smart labels, printed electronics, EMI and antistatic materials.

In addition, the radiation curable conductive ink mixed with the aforementioned components can be prepared within a few seconds as compared to between 3 minutes and 2 hours at about 80-220 ° C. required by common thermosetting resins (e.g., thermosetting type epoxy resins and polyester resins). It provides a chemical crosslinking reaction that occurs generally, thereby providing the present invention with the advantage of being rapidly curable and saving energy.

After the conductive powder applied by combining the properties of the aforementioned materials has undergone radiation crosslinking, in addition to the advantages of rapid cure rates, the resulting conductive substrates are provided with excellent electrical conductivity and resistance to oxidation.

In addition, due to the light-screen effect and high specific gravity of the conductive powder, rapid precipitation of the metallic powder easily occurs, and it is difficult for the radiation curable conductive ink to achieve the ideal degree of curing. In addition, it is difficult for the metallic powder to be uniformly dispersed to achieve a sufficiently thick conductive ink.

The present invention has been made to solve the above-mentioned disadvantages, and the radiation cured conductive ink has a rapid curing reaction, which achieves excellent electrical conductivity stability, resistance to oxidation and low cost, as well as suitable metallic powder dispersion and excellent electrical conductivity. Makes it possible.

Detailed description of the preferred embodiments follows in order to enhance the understanding of the technical methods of the present invention and the foregoing objects.

(Example)

The radiation curable conductive ink of the present invention undergoes a chemical crosslinking reaction by irradiating the conductive ink with radiation, wherein the conductive ink comprises at least the following components:

(a) conductive powder having a cover layer, wherein the weight of the silver content of the conductive powder before covering with the cover layer is at most 90% by weight of silver content and at least 30% by copper or aluminum;

(b) a cover layer covering the surface of the conductive powder, wherein the weight of the silver content of the cover layer is 30% or more of the weight of the cover layer, and the weight of the cover layer is 80% of the total weight of the conductive powder and the cover layer Or less;

(c) conductive powder having a cover layer, wherein the average size of the conductive powder is 40 micrometers or less;

(d) photosensitivity, such as reactive cyclic monomers or reactive cyclic oligomers, having a viscosity of not more than 5,000 cps under a temperature condition of 25 ° C. and comprising at least one reactive cyclic organic compound capable of polymerization. Binders.

Referring to FIG. 3, which shows a rapid manufacturing process for a conductive substrate material, the radiation curable conductive ink of the present invention mainly comprises a cover layer and a photosensitive binder. The manufacturing process adopted has the following steps:

(a) applying a conductive powder;

(b) covering the conductive powder with a cover layer, wherein the weight of the silver content of the cover layer is at least 30% of the weight of the cover layer, and the weight of the cover layer is at most 80% of the total weight of the conductive powder and the cover layer. being;

(c) mixing the conductive powder having a cover layer and the photosensitive binder, wherein the photosensitive binder has a viscosity of 5000 cps or less at a temperature of 25 ° C., thereby forming a cured conductive ink.

(d) printing the radiation curable conductive ink on the surface of the substrate using screen printing;

(e) exposing the radiation curable conductive ink to radiation, thereby causing the radiation curable conductive ink to undergo a chemical crosslinking reaction from which the conductive substrate is formed.

The conductive material produced by the present invention using the method described above includes at least: an RFID antenna, a printed circuit board, a smart card inductive element, a smart label, a printed electronic component, an EMI protection (electromagnetic interference), and an antistatic material. Has an application range.

In addition, step (d) of FIG. 3 described above uses screen printing to print a radiation curable conductive ink on a substrate, wherein the shape of the printed line includes at least a mesh, a grid, and a honeycomb shape, whereby It is possible to irradiate radiation within the gaps of one form, which increases the irradiation area and improves the curing efficiency, thus achieving substantially larger thicknesses.

In addition, the radiation used in the method for producing a conductive substrate using the above-mentioned radiation curable conductive printing ink and the conductive ink of the present invention is one or more of the following three radiation examples:

(1) ultraviolet light;

(2) visible light;

(3) electron beam.

The conductive powder of the method for producing a conductive substrate using the components of the above-mentioned radiation-curable conductive printing ink and the conductive ink of the present invention comprises silver, copper or aluminum, the content of which is one or more of the following three examples to be:

(1) the weight of the silver content of the conductive powder before covering with the cover layer is 90% or less of the weight of the conductive powder excluding the cover layer;

(2) the weight of the copper content of the conductive powder before covering with the cover layer is at least 30% of the weight of the conductive powder excluding the cover layer;

(3) The weight of the aluminum content of the conductive powder before covering with the cover layer is 30% or more of the weight of the conductive powder excluding the cover layer.

The above-mentioned conductive powder having a cover layer has an average size of 40 micrometers or less.

The conductive powder with the cover layer is mixed with a photosensitive binder, wherein the photosensitive binder comprises at least one reactive cyclic organic compound capable of polymerization, such as a reactive cyclic monomer or a reactive cyclic oligomer, and is also photosensitive The binder comprises at least one photoinitiator capable of absorbing visible light in the wavelength range of 390-800 mm, wherein the weight of the photoinitiator content is no greater than 20% of the total weight of the radiation curable conductive ink. Photoinitiators include TPO (diphenyl- (2,4,6-trimethylbenzoyl) phosphine oxide, CAS No. 75980-60-8), Ciba Irgacure-819 (bis- (2,4, 6-trimethylbenzoyl) -phenylphosphineoxide), ITX (isopropyl thioxanthone, CAS No. 5495-84-1 and CAS No. 83846-86-0), CPTX (1-chloro-4-propoxy) Oxanthone 1-chloro-4-propoxycityoxanthone 1-chloro-4-Hs propoxy-9s-thioxanthene-9-one, CAS No. 142770-42-1), EPD (ethyl 4- (dimethyl Amino) benzoate ethyl p- (dimethylamino) benzoate, CAS No. 10287-53-3), and the like, thereby improving the curing efficiency.

In another embodiment of the radiation curable conductive ink of the present invention, the radiation curable conductive ink of the present invention undergoes a chemical crosslinking reaction by irradiating the conductive ink with radiation, the conductive ink comprising at least the following components.

(a) conductive metal powder with an average size of 40 micrometers or less;

(b) A photosensitive binder having a viscosity of at most 5,000 cps at a temperature of 25 ° C. and comprising at least one reactive cyclic organic compound capable of polymerization, such as a reactive cyclic monomer or a reactive cyclic oligomer.

Referring to FIG. 4, which shows a rapid manufacturing process for a conductive substrate material, the radiation curable conductive ink of the present invention consists primarily of conductive powder and a photosensitive binder. The manufacturing process adopted has the following steps:

(a) applying a conductive metal powder;

(b) mixing the conductive powder and the photosensitive binder to form a radiation curable conductive ink;

(c) printing radiation curable conductive ink on the surface of the substrate using screen printing;

(d) exposing the radiation curable conductive ink to radiation to cause a chemical crosslinking reaction and the conductive substrate is formed therefrom.

The conductive material produced by the present invention using the method described above has an application range that includes at least an RFID antenna, a printed circuit board, a smart card inductive element, a smart label, printed electronics, an EMI protection, and an antistatic material. .

In addition, step (c) of FIG. 4 described above uses screen printing to print the spin-curable conductive ink on the substrate, wherein the shapes of the printed lines include at least a net shape and a honeycomb shape, whereby radiation is described above. It makes it possible to investigate the gap of one shapes, which increases the irradiation area and improves the curing efficiency, and thus can substantially increase the thickness.

In addition, the radiation used in the method for producing a conductive substrate using the above-mentioned radiation-curable conductive printing link and the conductive ink of the present invention is one or more of the following three radiation examples.

(1) infrared;

(2) visible light;

(3) electron beam.

The conductive powder mixed with the photosensitive binder comprises at least one photoinitiator capable of absorbing visible light in the wavelength range of 390-800 mm, wherein the weight of the photoinitiator content is less than 20% of the total weight of the radiation curable conductive ink. Occupy. The photoinitiators include TPO (diphenyl- (2,4,6-trimethylbenzoyl) phosphine oxide, CAS No. 75980-60-8), Ciba Irgacure-819 (bis- (2,4) , 6-trimethylbenzoyl) -phenylphosphineoxide), ITX (isopropyl thioxanthone, CAS No. 5495-84-1 and CAS No. 83846-86-0), CPTX (1-chloro-4-propoxy Citioxanthone 1-chloro-4-propoxycytoxanthone 1-chloro-4-Hs propoxy-9s-thioxanthene-9-one, CAS No. 142770-42-1), EPD (ethyl 4- ( Dimethylamino) benzoate ethyl p- (dimethylamino) benzoate, CAS No. 10287-53-3), and the like, to improve the curing efficiency.

The method for producing a conductive material using the above-described components of the radiation curable conductive printing ink of the present invention and the conductive ink includes a total weight of an anti-setting agent (anti-precipitant), which is a volatile organic compound. It may further comprise up to 15% of the amount or may contain up to 15% of the total organic dispersant. The anti-settling agent is a silicate and the organic dispersing agent is a surfactant, which increases the dispersibility of the conductive powder and prevents precipitation or slows down the precipitation rate, thereby conducting after radiation curing having excellent electrical conductivity and electrical conductivity stability. Provide printing ink.

The method for producing a conductive material using the above components of the radiation curable conductive printing ink of the present invention and the conductive ink further includes at least one binder, the content of which is 25% or less of the total weight of the conductive ink, By the radiation cross-linking with this to enhance the material properties of the conductive ink, it improves the electrical conductivity stability and adhesion to inorganic materials (conductive powder, glass, ceramic, etc.).

The method for producing a conductive material using the above-described components of the radiation curable conductive printing ink of the present invention and the conductive ink further includes an antioxidant or a metal corrosion inhibitor, and the weight of the content is 5% or less of the total weight. It improves the heat resistance, durability and electrical conduction stability of the conductive ink, especially in high temperature and high humidity environments or in environments susceptible to corrosion.

The components of the method for producing a conductive material using the above-described radiation curable conductive printing ink and conductive ink further include 15 ppm-5000 ppm of polymerization inhibitor. The polymerization inhibitor may be monomethyl ether hydroquinone (MEHQ) or hydroquinone (HQ), which further improves storage stability.

It is to be understood that the embodiments described herein are merely illustrative of the principles of the invention and that a wide variety of changes may be made by those skilled in the art without departing from the spirit and scope of the invention as set forth in the following claims. .

According to the present invention, there is provided a method for producing a conductive substrate using the radiation curable conductive ink and the conductive ink. It can be applied to the manufacture of RFID antennas, printed circuit boards, smart card (contactless chip card) devices, smart labels, printed electronic components, electronic interference (EMI) and anti-static materials, which can reduce manufacturing costs and simplify the work procedure. Become.

Claims (13)

In the radiation-curable conductive ink that performs a chemical crosslinking reaction by irradiating radiation, Conductive powder with an average size of 40 micrometers or less, A cover layer covering the surface of the conductive powder, and A photosensitive binder having at least 5,000 cps of viscosity under a temperature condition of 25 ° C. and containing at least one reactive cyclocyclized organic compound, The weight of the silver content of the conductive powder before covering with the cover layer is 90% or less of the weight of the conductive powder before covering with the cover layer, The weight of the silver content of the cover layer is 30% or more of the weight of the cover layer, the weight of the cover layer is radiation curable conductive ink, characterized in that less than 80% of the total weight of the conductive powder and the cover layer. In the radiation-curable conductive ink that performs a chemical crosslinking reaction by irradiating radiation, Conductive powder having an average size of 40 micrometers or less, A cover layer covering the surface of the conductive powder, and A photosensitive binder having at least 5,000 cps of viscosity under a temperature condition of 25 ° C. and containing at least one reactive cyclocyclized organic compound, The weight of the copper content of the conductive powder before covering with the cover layer is 30% or more of the weight of the conductive powder before covering with the cover layer, The weight of the silver content of the cover layer is more than 30% of the weight of the cover layer, the weight of the cover layer is radiation curable conductive ink, characterized in that less than 80% of the total weight of the conductive powder and the cover layer. In the radiation-curable conductive ink that performs a chemical crosslinking reaction by irradiating radiation, Conductive powder having an average size of 40 micrometers or less, A cover layer covering the surface of the conductive powder, and A photosensitive binder having at least 5,000 cps of viscosity under a temperature condition of 25 ° C. and containing at least one reactive cyclocyclized organic compound, The weight of the aluminum content of the conductive powder before covering with the cover layer is 30% or more of the weight of the conductive powder before covering with the cover layer, The weight of the silver content of the cover layer is more than 30% of the weight of the cover layer, the weight of the cover layer is radiation curable conductive ink, characterized in that less than 80% of the total weight of the conductive powder and the cover layer. In the radiation-curable conductive ink that performs a chemical crosslinking reaction by irradiating radiation, Conductive metal powder having an average size of 40 micrometers or less, and A radiation curable conductive ink having a viscosity of 5,000 cps or less and containing a photosensitive binder comprising at least one reactive cyclized organic compound capable of polymerization under a temperature condition of 25 ° C. In the method of manufacturing a conductive substrate using a radiation curing ink, (a) applying a conductive powder having an average size of 40 micrometers or less, (b) covering the conductive powder with a cover layer, (c) mixing the conductive powder having the cover layer and a photosensitive binder to form a radiation curable conductive ink, (d) printing the radiation curable conductive ink on the surface of the substrate using screen printing; (e) exposing the radiation curable conductive ink to radiation to form the conductive substrate by chemical crosslinking reaction of the radiation curable conductive ink, The weight of silver content of the said electroconductive powder is 90% or less of the weight of the said electroconductive powder, The weight of the silver content of the cover layer is 30% or more of the weight of the cover layer, the weight of the cover layer is 80% or less of the total weight of the conductive powder and the cover layer, And the photosensitive binder has a viscosity of 5000 cps or less at a temperature of 25 ° C. and contains at least one reactive cyclized organic compound capable of polymerization. In the method of manufacturing a conductive substrate using a radiation curing ink, (a) applying a conductive powder having an average size of 40 micrometers or less, (b) covering the conductive powder with a cover layer, (c) mixing the conductive powder having the cover layer and a photosensitive binder to form a radiation curable conductive ink, (d) printing the radiation curable conductive ink onto the surface of the substrate using screen printing, and (e) exposing the radiation curable conductive ink to radiation such that the radiation curable conductive ink undergoes a chemical crosslinking reaction to form the conductive substrate, The weight of the copper content of the conductive powder is 30% or more of the weight of the conductive powder, The weight of the silver content of the cover layer is 30% or more of the weight of the cover layer, the weight of the cover layer is 80% or less of the total weight of the conductive powder and the cover layer, Wherein said photosensitive binder has a viscosity of 5000 cps or less at a temperature of 25 ° C. and contains at least one reactive cyclized organic compound capable of polymerization. In the method of manufacturing a conductive substrate using a radiation curing ink, (a) applying a conductive powder having an average size of 40 micrometers or less, (b) covering the conductive powder with a cover layer, (c) mixing the conductive powder having a cover layer and the photosensitive binder to form a radiation curable conductive ink, (d) printing the radiation curable conductive ink onto the surface of the substrate using screen printing, and (e) exposing the radiation curable conductive ink to radiation such that the radiation curable conductive ink undergoes a chemical crosslinking reaction to form the conductive substrate, The weight of the aluminum content of the conductive powder is 30% or more of the weight of the conductive powder, The weight of the silver content of the cover layer is 30% or more of the weight of the cover layer, the weight of the cover layer is 80% or less of the total weight of the conductive powder and the cover layer, Wherein said photosensitive binder has a viscosity of 5000 cps or less at a temperature of 25 ° C. and contains at least one reactive cyclized organic compound capable of polymerization. In the method of manufacturing a conductive substrate using a radiation curing ink, (a) applying a conductive metal powder having an average size of 40 micrometers or less, (b) mixing the conductive powder and the photosensitive binder to form a radiation curable conductive ink, (c) printing the radiation curable conductive ink onto the surface of the substrate using screen printing, and (d) exposing the radiation curable conductive ink to radiation to cause the radiation curable conductive ink to undergo a chemical crosslinking reaction to form the conductive substrate, Wherein said photosensitive binder has a viscosity of at most 5000 cps at a temperature of 25 ° C. and contains at least one reactive cyclomonomer or reactive cyclopolymer. The method according to any one of claims 1 to 4, And the radiation used for irradiating is ultraviolet, visible or electron beam. The method according to any one of claims 1 to 4, The photosensitive binder includes one or more photoinitiators capable of absorbing visible light in the wavelength range of 390-800 mm, wherein the weight of the photoinitiator content is 20% or less of the total weight of the radiation curable conductive ink. Radiation curable conductive ink. The method according to any one of claims 5 to 8, Wherein the photosensitive binder comprises one or more photoinitiators capable of absorbing visible light in the wavelength range of 390-800 mm, wherein the weight of the photoinitiator content is 20% or less of the total weight of the radiation curable conductive ink. Substrate manufacturing method. The method according to any one of claims 1 to 4, And the conductive ink further comprises one or more coupling agents, wherein the weight of the coupling agent is 25% or less of the total weight of the conductive ink. The method according to any one of claims 5 to 8, And the radiation curable conductive ink further comprises one or more coupling agents, wherein the weight of the coupling agent is 25% or less of the total weight of the conductive ink.

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