M288301 八、新型說明： 【新型所屬之技術領域】 本創作係提供一種導電基材構造，特別適合運用在益 線射頻辨識系統（RFID)天線、印刷電路板、智慧卡（非 接觸式aa片卡）感應疋件、智慧標籤、抗電磁波干擾（腿1) 兀件及抗靜電材料等電子材料。 【先前技術】 =技進步的帶動下，各種電子產品在設計上不但講 二功此’其體積亦不斷的微型化。尤其是近年來網路及 通訊的快速發展，各種可攜式電子產品推陳出新，更 是改變了 21世紀商務型態的無限可能性。 好產品體積微型化和電子材料中的導電基材之進步 :者您不可分的關係。例如以導電基材製成之「薄片型天 板」=傳統的桿狀天線’加上導電基材中的「印刷電路 近d!化，造就了市面上各式輕薄短小的手機；又如 二的無線射頻辨識系統一)，可應用在 智慧型商店講物等’更是全面的進入消=;:;)， 上述導電基材製成之薄片型天線、印刷 ::辨識系統的薄型化雖然帶來許多便利性 前導、二 ‘，限於利用傳統的「-刻法」—製造ΐ 相…以致許多革命性的 仍處於構想而無法付諸施行。 陶務型悲 M288301 如第一圖所示，以無線射頻辨識系統（RFID)中的智 慧卡（非接觸式晶片卡）上為例，其原理是由智慧卡1〇 上的晶片U透過薄片狀天、線12傳輸信號至讀取器2〇，再 透過讀取器20之天線21純後，由微處理器22解碼以形 成可供讀取的資訊；同時，讀取器2()亦可將其他資訊回授 至智慧卡10上’由智慧卡1〇上的晶片u進行寫入動作。 其傳輸模式為錢式（透過線圈魏產生高頻訊號感應）， 因此智慧卡10上無須安裝電源。 其中，冬慧卡10上的薄片狀天線i 2以及讀取器 之天線21都是屬於導電基材中的一種，在概念上，若上述 無線射頻辨識系統之導電基材（天線）可以使用在包括低 價商品的任何一種物件上，甚至完全取代目前使用在各類 商品上的條碼，將會為生活帶來無限的便利，徹底改變生 活型態。 惟，如前所述以現今技術而言，仍無法克服導電基材 成本過高的問題，甚至高過晶片的價格，以致無法如同上 述構想，將導電基材，使用在包括低價商品的任何一種物 件上，甚為可惜。 緣此，本案創作人乃研發出一種導電基材構造，藉由 该導電基材構造之改良，將可有效降低製造成本。 【新型内容】 具體言之，本創作導電基材構造，係將感光樹脂混合 物與導電粉體混合而形成之輻射硬化型導電油墨，以網版 M288301 印刷方式印製於一絕緣材所製成 射線照射硬化，即可形成導電層 基材。 上述本創作實施時，網版印刷 印製於隔離層日寺，其印刷紋路至少2射硬化型導電油墨 巢狀’使韓射線得以照射於該等形 ^狀、格狀及蜂 射面積來提高硬化效率，達频“厚增加照M288301 VIII. New Description: [New Technology Field] This creation provides a conductive substrate structure, which is especially suitable for use in the RF antenna (RFID) antenna, printed circuit board, and smart card (non-contact aa chip card). Inductive components, smart labels, anti-electromagnetic interference (legs 1), electronic components such as anti-static materials. [Prior technology] Under the leadership of technological advancement, various electronic products are not only designed to be second-handed, but their volume is also constantly miniaturized. Especially in recent years, the rapid development of Internet and communication, the development of various portable electronic products has changed the infinite possibilities of business models in the 21st century. Good product volume miniaturization and advancement of conductive substrates in electronic materials: you are inseparable. For example, a "slice-type slab" made of a conductive substrate = a conventional rod-shaped antenna plus a "printing circuit in the conductive substrate" has created a variety of light and short mobile phones on the market; The radio frequency identification system (1) can be applied to intelligent store lectures, etc. 'More comprehensive access elimination =;:;), the above-mentioned conductive substrate made of sheet antenna, printing:: Identification system is thinner though Bringing many conveniences to the forefront, two's, limited to the use of the traditional "------------------------------------------------------------------------------------------------------- Tao Shi-type grief M288301 As shown in the first figure, taking the smart card (non-contact chip card) in the radio frequency identification system (RFID) as an example, the principle is that the wafer U on the smart card 1 is flaky The antenna 12 transmits the signal to the reader 2, and then passes through the antenna 21 of the reader 20, and is decoded by the microprocessor 22 to form information for reading. Meanwhile, the reader 2() can also The other information is fed back to the smart card 10, and the write operation is performed by the chip u on the smart card. The transmission mode is money type (high frequency signal sensing is generated through the coil), so there is no need to install a power supply on the smart card 10. Wherein, the sheet antenna i 2 on the winter Hui card 10 and the antenna 21 of the reader are all one of the conductive substrates, and conceptually, if the conductive substrate (antenna) of the above radio frequency identification system can be used in Any kind of object that includes low-priced goods, or even completely replace the bar codes currently used on various types of goods, will bring unlimited convenience to life and completely change the lifestyle. However, as described above, in the current technology, the problem of excessively high cost of the conductive substrate cannot be overcome, even higher than the price of the wafer, so that the conductive substrate cannot be used as any of the low-priced products as the above concept. It is a pity that an object is on the object. Therefore, the creator of the present invention has developed a conductive substrate structure, and the improvement of the structure of the conductive substrate can effectively reduce the manufacturing cost. [New content] Specifically, the conductive substrate structure of the present invention is a radiation-hardened conductive ink formed by mixing a photosensitive resin mixture and a conductive powder, and is printed on a ray made of an insulating material by screen printing M288301 printing method. The conductive layer substrate can be formed by irradiation hardening. In the implementation of the above-mentioned creation, the screen printing is printed on the isolation layer of the Japanese temple, and the printed grain is at least 2 shot-hardened conductive ink nested 'to enable the Han ray to be irradiated to the shape, the lattice shape and the bee area to improve Hardening efficiency, reaching frequency
#可2本創作，騎’導電層表面覆蓋—保護層，保護 利用不具導電性之材料所形成，如直接以塑勝覆 上述本創作實施時，隔離層進一步包 ; :收液體特性之不導電材料，例如塑膠、塑膠複合材Γ 玻璃、纖維布、紙張、陶瓷及硬化後之塗料層等。 上述本創作實施時，隔離層進—步附著θ於一 面，其中底材至少包括塑膠、塑膠複合材料、玻璃、紙張： 陶瓷、纖維布、硬化後之塗料層、金屬及具導電性或非導 電性材料其中之一。#可2本作, ride the 'conducting layer surface covering—protective layer, protect the use of non-conducting materials, such as directly with the plastic win over the above implementation of the creation, the isolation layer is further packaged; Materials such as plastics, plastic composites, glass, fiber cloth, paper, ceramics and hardened coatings. In the above implementation of the present invention, the isolation layer is attached to the θ on one side, wherein the substrate comprises at least plastic, plastic composite material, glass, paper: ceramic, fiber cloth, hardened coating layer, metal and conductive or non-conductive One of the materials.
之J離層表面後，藉由輻 附著於隔離層表面之導電 上述本創作實施時，輻射線包括紫外線、可見光及電 子束的其中一種或一種以上。 上述本創作實施時’導電油墨進一步含有以下成份： (a) 含銀90%以下、含銅30%以上或含鋁30%以上所 製成之導電粉體。 (b) 包覆於導電粉體外表之坡覆層，其中銀含量佔其 披覆層重量的30°/。以上，且披覆層重量佔導電粉 體及披覆層總重量80%以下。 M288301 (C)含披覆層之導電粉體，其平均粒徑為40micr〇以 下。 (d)感光樹脂混合物，在溫度25 °C條件下，黏度為 5,000 cps 以下。 以下進一步說明本創作之具體實施方式。 【實施方式】 如第二圖所示’本創作導電基材30構造，係將感光樹 • 脂混合物與導電粉體混合而形成之輻射硬化型導電油墨， 以網版印刷方式印製於一絕緣材所製成之隔離層4〇表面 後，藉由輻射線照射硬化，即可形成導電層5〇，該導電層 5〇附著於隔離層40表面，即可形成導電基材3〇。 曰 藉由上述導電層50附著於隔離層4〇表面所形成之導 電基材30構造，可應用sRFID天線、印刷電路板、智慧 卡（非接觸式晶片卡）感應元件、智慧標籤、抗電磁^ 籲擾（anti-EMI)材料及抗靜電材料；圖*中係以智慧卡為代 上述本創作實施時，利用網版印刷將輻射硬化型 隔離層40時，其印刷紋路至少包括有網狀、格 狀及蜂巢狀，純㈣得以照射於料形狀之空隙 增加照射面積來提高硬化效率，使導二 圈狀印刷，可應用在RFID天線、中智 上。 日^卞感應兀件等機構 M288301 實，時，為了保護導電層5〇，可進一步在導電層％ ::覆蓋-保護層60,該保護層6〇為不具導電性材曰料所 /丄如直接以塑膠片覆蓋；圖示中係以智慧卡為代表。 則述之隔離層40進一步包括有不吸收或低吸收液體 特性之材質，例如塑膠及塑膠複合材料、塗料及不導電之 材料：以圖示之智慧卡為例，智慧卡底部之塑膠即為隔離 層40 ;當然，輻射硬化型塗料也是可行的實施例之一。 、上述本創作實施時，隔離層40可依實施位置的不同， 進一步再附著於一底材表面，例如塑膠、塑膠複合材料、 玻璃、紙張、陶瓷、纖維布、硬化後之塗料層、金屬及具 導電性或非導電性材料其中之一。 此外，上述之導電油墨實施時，進一步含有至少以下 成份： (a) 含銀90%以下、含銅30%以上或含鋁3〇%以上 所製成之導電粉體。 (b) 包覆於導電粉體外表之披覆層，其中銀含量佔 其披覆層重量的30%以上，且披覆層重量佔導 電粉體及彼覆層總重量80%以下。 (c) 含披覆層之導電粉體’其平均粒徑為40micro 以下。 (d )感光樹脂混合物，在溫度25。C條件下，黏度 為5,000 cps以下。 其中銀或銅或銘所製成導電粉體，包括有下列三種施 實例的一種或一種以上： M288301 (1)若主要成份為銀，則銀含量宜佔導電粉體總重量 90%以下。 (2 )若主要成份為銅，則銅含量宜佔導電粉體總重量 30%以上。 (3 )若主要成份為铭’則銘含|宜佔導電粉體總重量 30%以上。 r 上述本創作中，輻射硬化型導電油墨成份中，含披覆 層之導電粉體佔輻射硬化型導電油墨總重量的1%以上。 _ 而感光樹脂混合物至少包括一種或一種以上可在可見光 390〜800 nm波長範圍内吸收之光啟始劑，該光啟始劑含量 在總重量的20%以下。例如TPO (diphenyl-(25456-trimethylbenzoyl) phosphine oxide、 CASNo.75980-60-8) > CibaAfter the J is separated from the surface of the layer, the radiation is adhered to the surface of the spacer layer. In the present invention, the radiation includes one or more of ultraviolet light, visible light, and an electron beam. In the above-mentioned implementation of the present invention, the conductive ink further contains the following components: (a) A conductive powder containing 90% or less of silver, 30% or more of copper, or 30% or more of aluminum. (b) A slope coating coated on the outer surface of the conductive powder, wherein the silver content is 30 °/ of the weight of the cladding layer. The above, and the weight of the coating layer accounts for 80% or less of the total weight of the conductive powder and the coating layer. M288301 (C) A conductive powder containing a coating layer having an average particle diameter of 40 micr or less. (d) A photosensitive resin mixture having a viscosity of 5,000 cps or less at a temperature of 25 °C. The specific implementation of this creation is further explained below. [Embodiment] As shown in the second figure, the structure of the conductive substrate 30 is a radiation-hardened conductive ink formed by mixing a photosensitive resin mixture with a conductive powder, and is printed on an insulation by screen printing. After the surface of the spacer 4 made of the material is cured by radiation, a conductive layer 5 is formed, and the conductive layer 5 is adhered to the surface of the spacer 40 to form a conductive substrate 3 .构造 The structure of the conductive substrate 30 formed by the conductive layer 50 attached to the surface of the isolation layer 4 can be applied to an sRFID antenna, a printed circuit board, a smart card (non-contact wafer card) sensing element, a smart tag, and an anti-electromagnetic device. Anti-EMI material and antistatic material; in the figure*, when the smart card is used to implement the above-mentioned creation, when the radiation hardening type isolation layer 40 is screen-printed, the printed grain includes at least a mesh, Grid-like and honeycomb-like, pure (four) can be irradiated to the gap of the material shape to increase the irradiation area to improve the hardening efficiency, so that the two-circle printing can be applied to RFID antennas and Chinese wisdom. In order to protect the conductive layer 5〇, the conductive layer :: can be further protected in the conductive layer % :: cover-protective layer 60, which is a non-conductive material. Covered directly with plastic sheets; the illustration is represented by a smart card. The isolation layer 40 further includes materials that do not absorb or absorb liquid characteristics, such as plastic and plastic composite materials, paints, and non-conductive materials: the smart card shown in the figure is an example, and the plastic at the bottom of the smart card is isolated. Layer 40; Of course, radiation hardening coatings are also one of the possible embodiments. In the above implementation of the present invention, the isolation layer 40 may be further attached to a substrate surface according to different implementation positions, such as plastic, plastic composite materials, glass, paper, ceramics, fiber cloth, hardened coating layer, metal and One of conductive or non-conductive materials. Further, when the conductive ink is further provided, it further contains at least the following components: (a) a conductive powder containing 90% or less of silver, 30% or more of copper, or more than 3% by weight of aluminum. (b) A coating layer coated on the outer surface of the conductive powder, wherein the silver content accounts for more than 30% by weight of the coating layer, and the weight of the coating layer accounts for less than 80% of the total weight of the conductive powder and the coating layer. (c) Conductive powder containing a coating layer' having an average particle diameter of 40 micro or less. (d) Photosensitive resin mixture at a temperature of 25. Under C conditions, the viscosity is below 5,000 cps. Among them, conductive powder made of silver or copper or Ming, including one or more of the following three examples: M288301 (1) If the main component is silver, the silver content should be less than 90% of the total weight of the conductive powder. (2) If the main component is copper, the copper content should account for more than 30% of the total weight of the conductive powder. (3) If the main ingredient is Ming', then it should contain more than 30% of the total weight of the conductive powder. r In the above creation, among the radiation-curable conductive ink components, the conductive powder containing the coating layer accounts for 1% or more of the total weight of the radiation-curable conductive ink. And the photosensitive resin mixture comprises at least one or more photoinitiators which are absorbable in the wavelength range of 390 to 800 nm of visible light, and the photoinitiator is contained in an amount of less than 20% by weight. For example, TPO (diphenyl-(25456-trimethylbenzoyl) phosphine oxide, CASNo.75980-60-8) > Ciba
Irgacure-8 19(Bis(2,4,6_trimethylbenzoyl)-phenylphosphineoxide)， ITX(isopropyl thioxanthone，CAS No. 5495-84-1 and 83846-86-0)， CPTX (1 -Chloro-4-propoxythioxanthone 修 l-chloro-4-propoxythioxanthone 1-chloro-4-propoxy-9H-thioxanthen_9-one， CAS No. 142770-42-1), EPD (ethyl 4-(dimethylamino) benzoate ethyl p-(dimethylamino) benzoate，CAS No. 10287-53-3)，等以增加 硬化的效率。 上述本創作「輻射硬化型導電油墨」成份中，進一步 包含有佔輻射硬化型導電油墨總重量10%以下的無機系抗 沉殿劑（anti-settling agent)或總重量15%以下有機系分散 M288301 f。其中無機系抗沉澱劑係為矽酸鹽類(silica)，有機季分 散劑為界面活槌如 ^ β成$刀 、… 性&彳，猎以提高其導電粉體顆粒的分散性與 ，止或減緩其沉殿速度，使經輕射硬化後的導電油墨具有 更佳的導電性與導電穩定性。· 人上述本創作「輻射硬化型導電油墨」成份中，進一步 I 3有種以上的偶合劑（coupling agent)。偶合劑含量佔 整體導電油墨重量25%以下，藉以來提高輻射硬化後的導 電，墨物性’ I電敎性及與提高對無機物（如玻璃，陶 竞等等）的接著強度。 上述本創作「輕射硬化型導電油墨」成份中，進一步 包含有總重量5%以下的抗氧化劑，進一步提高導電油墨 的财熱性，耐久性與導電穩定性，尤其處於高溫高濕或腐 姓環境中。. 上述本創作「輕射硬化型導電油墨」成份中，進一步 包含有丨5 Ppm _5000ppm之聚合抑制劑（p〇iymerizati〇n inhibitor)。該聚合抑制劑包括有Mehq(對苯二料甲⑹ 及HQ(對苯二紛）其中之一，以進_步提高儲存安定性。 以上之實施說明及圖式所示，係本創作較佳實施 例之-者’並非以此侷限本創作，是以，舉凡與本創 作之構造、裝置、特徵等近似或相雷同者，均應屬本 創作之創設目的及申請專利範圍之内，僅此聲明。 M288301 【圖式簡單說明】 第一圖係無線射頻辨識系統運用在智慧卡上的系統 示意圖。 第二圖係本創作導電基材的結構示意圖。 【主要元件符號說明】 智慧卡............10 _ 晶片.............11 天線.............12 讀取器............20 讀取器天線..........21 微處理器...........22 導電基材...........3 0 隔離層............4 0 導電層............5 0 保護層............60 •Irgacure-8 19 (Bis(2,4,6_trimethylbenzoyl)-phenylphosphineoxide), ITX (isopropyl thioxanthone, CAS No. 5495-84-1 and 83846-86-0), CPTX (1 -Chloro-4-propoxythioxanthone repair l- Chloro-4-propoxythioxanthone 1-chloro-4-propoxy-9H-thioxanthen_9-one, CAS No. 142770-42-1), EPD (ethyl 4-(dimethylamino) benzoate ethyl p-(dimethylamino) benzoate, CAS No. 10287 -53-3), etc. to increase the efficiency of hardening. The above-mentioned "radiation-curable conductive ink" component further includes an inorganic anti-settling agent or an organic weight-dispersing M288301 which is less than 10% by weight based on the total weight of the radiation-curable conductive ink. f. The inorganic anti-precipitant is sodium silicate, and the organic quaternary dispersant is interfacial activity such as β 成 成 、 ... ... ... 性 性 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 彳 彳 彳 彳 彳Stop or slow down the speed of the sinking chamber, so that the conductive ink after light-curing hardening has better conductivity and conductive stability. · In the above-mentioned "radiation-curable conductive ink" component, there are more than one coupling agent of I 3 . The coupling agent content accounts for less than 25% by weight of the total conductive ink, so as to improve the conductivity after the radiation hardening, the ink property and the adhesion strength to the inorganic materials (such as glass, ceramics, etc.). The above-mentioned "light-curing type conductive ink" component further contains an antioxidant having a total weight of 5% or less, further improving the heat conductivity, durability and electrical conductivity of the conductive ink, especially in a high-temperature, high-humidity or rot environment. in. The above-mentioned "light-curing type conductive ink" component further contains 聚合5 Ppm _5000 ppm of a polymerization inhibitor (p〇iymerizati〇n inhibitor). The polymerization inhibitor includes one of Mehq (p-benzoic acid (6) and HQ (p-benzoic acid) to improve storage stability. The above description and the drawings show that the present invention is preferred. The embodiment of the present invention is not limited to this creation. Therefore, any similarity or similarity to the structure, device, features, etc. of the creation should be within the creation purpose and patent application scope of the creation. Statement M288301 [Simple description of the diagram] The first diagram is a schematic diagram of the system used by the RFID system on the smart card. The second diagram is a schematic diagram of the structure of the conductive substrate. [Main component symbol description] Smart card... .........10 _ Wafer.............11 Antenna.............12 Reader... ...20 reader antenna..........21 microprocessor...........22 conductive substrate.......... .3 0 Isolation layer............4 0 Conductive layer............5 0 Protective layer............60 •
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