JP3872925B2 - 研磨装置および半導体装置の製造方法 - Google Patents

研磨装置および半導体装置の製造方法 Download PDF

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Publication number
JP3872925B2
JP3872925B2 JP2000016951A JP2000016951A JP3872925B2 JP 3872925 B2 JP3872925 B2 JP 3872925B2 JP 2000016951 A JP2000016951 A JP 2000016951A JP 2000016951 A JP2000016951 A JP 2000016951A JP 3872925 B2 JP3872925 B2 JP 3872925B2
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Japan
Prior art keywords
functional group
semiconductor device
polishing pad
abrasive grains
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2000016951A
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English (en)
Japanese (ja)
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JP2001205554A (ja
JP2001205554A5 (https=
Inventor
大 福島
博之 矢野
学 南幅
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Toshiba Corp
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Toshiba Corp
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Publication date
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Priority to JP2000016951A priority Critical patent/JP3872925B2/ja
Priority to US09/494,656 priority patent/US6312321B1/en
Publication of JP2001205554A publication Critical patent/JP2001205554A/ja
Publication of JP2001205554A5 publication Critical patent/JP2001205554A5/ja
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Publication of JP3872925B2 publication Critical patent/JP3872925B2/ja
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Expired - Fee Related legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B24D3/346—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties utilised during polishing, or grinding operation

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2000016951A 2000-01-26 2000-01-26 研磨装置および半導体装置の製造方法 Expired - Fee Related JP3872925B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000016951A JP3872925B2 (ja) 2000-01-26 2000-01-26 研磨装置および半導体装置の製造方法
US09/494,656 US6312321B1 (en) 2000-01-26 2000-01-31 Polishing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000016951A JP3872925B2 (ja) 2000-01-26 2000-01-26 研磨装置および半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2001205554A JP2001205554A (ja) 2001-07-31
JP2001205554A5 JP2001205554A5 (https=) 2005-06-16
JP3872925B2 true JP3872925B2 (ja) 2007-01-24

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Family Applications (1)

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JP2000016951A Expired - Fee Related JP3872925B2 (ja) 2000-01-26 2000-01-26 研磨装置および半導体装置の製造方法

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Country Link
US (1) US6312321B1 (https=)
JP (1) JP3872925B2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9902038B2 (en) 2015-02-05 2018-02-27 Toshiba Memory Corporation Polishing apparatus, polishing method, and semiconductor manufacturing method

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6773337B1 (en) * 2000-11-07 2004-08-10 Planar Labs Corporation Method and apparatus to recondition an ion exchange polish pad
JP2002164307A (ja) * 2000-11-24 2002-06-07 Fujimi Inc 研磨用組成物およびそれを用いた研磨方法
JP2002200554A (ja) * 2000-12-28 2002-07-16 Sumitomo Chem Co Ltd 研磨パッド、それを用いた研磨装置及び研磨方法
CN1209662C (zh) * 2001-12-17 2005-07-06 精工爱普生株式会社 显示装置及电子机器
US7097541B2 (en) * 2002-01-22 2006-08-29 Cabot Microelectronics Corporation CMP method for noble metals
US7316603B2 (en) * 2002-01-22 2008-01-08 Cabot Microelectronics Corporation Compositions and methods for tantalum CMP
US6899596B2 (en) 2002-02-22 2005-05-31 Agere Systems, Inc. Chemical mechanical polishing of dual orientation polycrystalline materials
US7087187B2 (en) * 2002-06-06 2006-08-08 Grumbine Steven K Meta oxide coated carbon black for CMP
US7803203B2 (en) 2005-09-26 2010-09-28 Cabot Microelectronics Corporation Compositions and methods for CMP of semiconductor materials
JP4868840B2 (ja) * 2005-11-30 2012-02-01 Ｊｓｒ株式会社 半導体装置の製造方法
JP2016004903A (ja) 2014-06-17 2016-01-12 株式会社東芝 研磨装置、研磨方法、及び半導体装置の製造方法
CN117532492A (zh) * 2023-11-17 2024-02-09 华侨大学 一种用于二维材料高取向生长的蓝宝石衬底的加工方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5658183A (en) * 1993-08-25 1997-08-19 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing including optical monitoring
JPH0982668A (ja) * 1995-09-20 1997-03-28 Sony Corp 研磨用スラリー及びこの研磨用スラリーを用いる研磨方法
US5807165A (en) * 1997-03-26 1998-09-15 International Business Machines Corporation Method of electrochemical mechanical planarization

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9902038B2 (en) 2015-02-05 2018-02-27 Toshiba Memory Corporation Polishing apparatus, polishing method, and semiconductor manufacturing method

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Publication number Publication date
US6312321B1 (en) 2001-11-06
JP2001205554A (ja) 2001-07-31

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