JP3854931B2 - 樹脂組成物 - Google Patents
樹脂組成物 Download PDFInfo
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- JP3854931B2 JP3854931B2 JP2003026331A JP2003026331A JP3854931B2 JP 3854931 B2 JP3854931 B2 JP 3854931B2 JP 2003026331 A JP2003026331 A JP 2003026331A JP 2003026331 A JP2003026331 A JP 2003026331A JP 3854931 B2 JP3854931 B2 JP 3854931B2
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- 125000006222 dimethylaminomethyl group Chemical group [H]C([H])([H])N(C([H])([H])[H])C([H])([H])* 0.000 description 1
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- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
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- 125000000623 heterocyclic group Chemical group 0.000 description 1
- CZWLNMOIEMTDJY-UHFFFAOYSA-N hexyl(trimethoxy)silane Chemical compound CCCCCC[Si](OC)(OC)OC CZWLNMOIEMTDJY-UHFFFAOYSA-N 0.000 description 1
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- 239000003112 inhibitor Substances 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- DLAPQHBZCAAVPQ-UHFFFAOYSA-N iron;pentane-2,4-dione Chemical compound [Fe].CC(=O)CC(C)=O DLAPQHBZCAAVPQ-UHFFFAOYSA-N 0.000 description 1
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- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
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- 150000004706 metal oxides Chemical class 0.000 description 1
- POPACFLNWGUDSR-UHFFFAOYSA-N methoxy(trimethyl)silane Chemical compound CO[Si](C)(C)C POPACFLNWGUDSR-UHFFFAOYSA-N 0.000 description 1
- NCHMPORHGFKNSI-UHFFFAOYSA-N methoxy-dimethyl-propylsilane Chemical compound CCC[Si](C)(C)OC NCHMPORHGFKNSI-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- AZFQCTBZOPUVOW-UHFFFAOYSA-N methyl(triphenyl)phosphanium Chemical class C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(C)C1=CC=CC=C1 AZFQCTBZOPUVOW-UHFFFAOYSA-N 0.000 description 1
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- SLYCYWCVSGPDFR-UHFFFAOYSA-N octadecyltrimethoxysilane Chemical compound CCCCCCCCCCCCCCCCCC[Si](OC)(OC)OC SLYCYWCVSGPDFR-UHFFFAOYSA-N 0.000 description 1
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- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
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- LGRFSURHDFAFJT-UHFFFAOYSA-N phthalic anhydride Chemical compound C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
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- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- BTURAGWYSMTVOW-UHFFFAOYSA-M sodium dodecanoate Chemical compound [Na+].CCCCCCCCCCCC([O-])=O BTURAGWYSMTVOW-UHFFFAOYSA-M 0.000 description 1
- 229940082004 sodium laurate Drugs 0.000 description 1
- RYYKJJJTJZKILX-UHFFFAOYSA-M sodium octadecanoate Chemical compound [Na+].CCCCCCCCCCCCCCCCCC([O-])=O RYYKJJJTJZKILX-UHFFFAOYSA-M 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
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- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
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- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- WUMSTCDLAYQDNO-UHFFFAOYSA-N triethoxy(hexyl)silane Chemical compound CCCCCC[Si](OCC)(OCC)OCC WUMSTCDLAYQDNO-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- FZMJEGJVKFTGMU-UHFFFAOYSA-N triethoxy(octadecyl)silane Chemical compound CCCCCCCCCCCCCCCCCC[Si](OCC)(OCC)OCC FZMJEGJVKFTGMU-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- PDSVZUAJOIQXRK-UHFFFAOYSA-N trimethyl(octadecyl)azanium Chemical class CCCCCCCCCCCCCCCCCC[N+](C)(C)C PDSVZUAJOIQXRK-UHFFFAOYSA-N 0.000 description 1
- IKANSXQHJXBNIN-UHFFFAOYSA-N trimethyl(octadecyl)phosphanium Chemical class CCCCCCCCCCCCCCCCCC[P+](C)(C)C IKANSXQHJXBNIN-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| JP2003026331A JP3854931B2 (ja) | 2002-02-06 | 2003-02-03 | 樹脂組成物 |
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| JP2002029783 | 2002-02-06 | ||
| JP2002139090 | 2002-05-14 | ||
| JP2002158211 | 2002-05-30 | ||
| JP2002158210 | 2002-05-30 | ||
| JP2002287005 | 2002-09-30 | ||
| JP2003026331A JP3854931B2 (ja) | 2002-02-06 | 2003-02-03 | 樹脂組成物 |
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| JP2004176031A JP2004176031A (ja) | 2004-06-24 |
| JP2004176031A5 JP2004176031A5 (enrdf_load_stackoverflow) | 2005-09-22 |
| JP3854931B2 true JP3854931B2 (ja) | 2006-12-06 |
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| JP2003026331A Expired - Fee Related JP3854931B2 (ja) | 2002-02-06 | 2003-02-03 | 樹脂組成物 |
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Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2474693A1 (en) | 2002-02-06 | 2003-08-14 | Sekisui Chemical Co., Ltd. | Resin composition and products containing the same |
| CN1333015C (zh) | 2002-02-06 | 2007-08-22 | 积水化学工业株式会社 | 树脂组合物 |
| EP1693395A4 (en) * | 2003-12-08 | 2007-04-25 | Sekisui Chemical Co Ltd | HOT-RESISTANT RESIN COMPOSITION, RESIN SURFACES AND RESIN SURFACES FOR ISOLATED SUBSTRATE |
| JP4476646B2 (ja) * | 2004-03-03 | 2010-06-09 | 株式会社東芝 | 高電圧機器用の絶縁樹脂組成物、絶縁材料とその製造方法、および絶縁構造体 |
| JP2006100463A (ja) * | 2004-09-29 | 2006-04-13 | Ibiden Co Ltd | プリント配線板用層間絶縁層、プリント配線板およびその製造方法 |
| US20090104429A1 (en) * | 2005-09-15 | 2009-04-23 | Sekisui Chemical Co., Ltd. | Resin composition, sheet-like formed body, prepreg, cured body, laminate, and multilayer laminate |
| JP2007099945A (ja) * | 2005-10-05 | 2007-04-19 | Nikko Kasei Kk | 熱硬化性オルガノポリシロキサン組成物、並びにそれを用いて製造される熱硬化性オルガノポリシロキサン積層板およびその製造方法 |
| KR101500791B1 (ko) * | 2007-12-14 | 2015-03-09 | 데쿠세리아루즈 가부시키가이샤 | 광 반도체 패키지 밀봉 수지 재료 |
| WO2010055899A1 (ja) * | 2008-11-14 | 2010-05-20 | 日清紡ホールディングス株式会社 | 樹脂組成物とそれを用いた透明な樹脂成形体および塗膜 |
| JP5799490B2 (ja) * | 2009-08-27 | 2015-10-28 | 住友化学株式会社 | 膨張抑制用組成物、多層構造体および基材の膨張の抑制方法 |
| TWI597306B (zh) * | 2012-01-20 | 2017-09-01 | 旭化成電子材料股份有限公司 | Multilayer printed circuit board |
| TW201538599A (zh) * | 2014-01-29 | 2015-10-16 | Nippon Synthetic Chem Ind | 樹脂成形體及其用途 |
| JP6311399B2 (ja) * | 2014-03-28 | 2018-04-18 | 三菱ケミカル株式会社 | 熱硬化性樹脂組成物、およびその成形体 |
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