JP3854931B2 - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
JP3854931B2
JP3854931B2 JP2003026331A JP2003026331A JP3854931B2 JP 3854931 B2 JP3854931 B2 JP 3854931B2 JP 2003026331 A JP2003026331 A JP 2003026331A JP 2003026331 A JP2003026331 A JP 2003026331A JP 3854931 B2 JP3854931 B2 JP 3854931B2
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JP
Japan
Prior art keywords
resin composition
resin
cured product
linear expansion
expansion coefficient
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003026331A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004176031A5 (cg-RX-API-DMAC7.html
JP2004176031A (ja
Inventor
和則 赤穂
光治 米澤
元裕 八木
昭彦 藤原
晃一 柴山
英寛 出口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to JP2003026331A priority Critical patent/JP3854931B2/ja
Publication of JP2004176031A publication Critical patent/JP2004176031A/ja
Publication of JP2004176031A5 publication Critical patent/JP2004176031A5/ja
Application granted granted Critical
Publication of JP3854931B2 publication Critical patent/JP3854931B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Landscapes

  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2003026331A 2002-02-06 2003-02-03 樹脂組成物 Expired - Fee Related JP3854931B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003026331A JP3854931B2 (ja) 2002-02-06 2003-02-03 樹脂組成物

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2002029783 2002-02-06
JP2002139090 2002-05-14
JP2002158211 2002-05-30
JP2002158210 2002-05-30
JP2002287005 2002-09-30
JP2003026331A JP3854931B2 (ja) 2002-02-06 2003-02-03 樹脂組成物

Publications (3)

Publication Number Publication Date
JP2004176031A JP2004176031A (ja) 2004-06-24
JP2004176031A5 JP2004176031A5 (cg-RX-API-DMAC7.html) 2005-09-22
JP3854931B2 true JP3854931B2 (ja) 2006-12-06

Family

ID=32719678

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003026331A Expired - Fee Related JP3854931B2 (ja) 2002-02-06 2003-02-03 樹脂組成物

Country Status (1)

Country Link
JP (1) JP3854931B2 (cg-RX-API-DMAC7.html)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7682691B2 (en) 2002-02-06 2010-03-23 Sekisui Chemical Co., Ltd. Resin composition of layered silicate
CA2474693A1 (en) 2002-02-06 2003-08-14 Sekisui Chemical Co., Ltd. Resin composition and products containing the same
US7709085B2 (en) 2003-12-08 2010-05-04 Sekisui Chemical Co., Ltd. Thermosetting resin composition, resin sheet and resin sheet for insulated substrate
JP4476646B2 (ja) * 2004-03-03 2010-06-09 株式会社東芝 高電圧機器用の絶縁樹脂組成物、絶縁材料とその製造方法、および絶縁構造体
JP2006100463A (ja) * 2004-09-29 2006-04-13 Ibiden Co Ltd プリント配線板用層間絶縁層、プリント配線板およびその製造方法
US20090104429A1 (en) * 2005-09-15 2009-04-23 Sekisui Chemical Co., Ltd. Resin composition, sheet-like formed body, prepreg, cured body, laminate, and multilayer laminate
JP2007099945A (ja) * 2005-10-05 2007-04-19 Nikko Kasei Kk 熱硬化性オルガノポリシロキサン組成物、並びにそれを用いて製造される熱硬化性オルガノポリシロキサン積層板およびその製造方法
JP2009161742A (ja) * 2007-12-14 2009-07-23 Sony Chemical & Information Device Corp 光半導体パッケージ封止樹脂材料
TWI461476B (zh) * 2008-11-14 2014-11-21 Nisshinbo Holdings Inc A resin composition, and a transparent resin molded article and a coating film using the same
JP5799490B2 (ja) * 2009-08-27 2015-10-28 住友化学株式会社 膨張抑制用組成物、多層構造体および基材の膨張の抑制方法
KR101597478B1 (ko) * 2012-01-20 2016-02-24 아사히 가세이 이-매터리얼즈 가부시키가이샤 수지 조성물, 적층체, 다층 프린트 배선판 및 다층 플렉시블 배선판 및 그 제조 방법
JP2015163684A (ja) * 2014-01-29 2015-09-10 日本合成化学工業株式会社 樹脂成形体、及びその用途
JP6311399B2 (ja) * 2014-03-28 2018-04-18 三菱ケミカル株式会社 熱硬化性樹脂組成物、およびその成形体

Also Published As

Publication number Publication date
JP2004176031A (ja) 2004-06-24

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