JP3853822B2 - Mounted component, liquid crystal display panel using the same, and method of manufacturing the liquid crystal display panel - Google Patents

Description

  The present invention relates to a mounting component, a liquid crystal display panel using the same, and a method for manufacturing the liquid crystal display panel, and in particular, an electrical and mechanical connection between a printed wiring board connected to the liquid crystal display panel and a flexible film. There is a characteristic in connection.

  Since the density of the liquid crystal display panel is increased due to high definition, the pitch of wiring terminals connected to an external circuit is required to be reduced. Further, along with the portability of the liquid crystal display panel, it is necessary to make the periphery of the liquid crystal display panel circuit compact. In order to cope with such a technology trend, a TAB mounting method is adopted as a mounting technology. This is a TCP (Tape Carrier Package) in which a driver LSI is mounted on a flexible film (flexible substrate) by bonding, and a printed wiring board that plays a role of signal input / output between a liquid crystal display panel and a personal computer (PC). Hereinafter, this is a system in which “PWB (Printed Wiring Board)” and TAB (Tape Automated Bonding) are connected.

  By TAB mounting, as will be described later, the connection pitch can be miniaturized and the degree of freedom of the connection structure can be obtained.

  Further, since it is necessary to form a connection pitch finely, a film called an anisotropic conductive film (ACF (Anisotoropic Conductive Film)) is generally used for connection. ACF is one of the members that connect the driver LSI mounted on the TAB and the electrode of the liquid crystal display panel, and has a transparency of 15-40 μm with conductive particles dispersed in an adhesive (for example, epoxy binder). It is a thick film. As the conductive particles, for example, metal particles (Ni), molten metal particles (solder), particles obtained by plating nickel (Ni) gold (Au) on plastic beads, and the like are used. By heating and pressing the ACF between the two electrodes, only the heated and pressurized part can be electrically connected between the electrodes via the conductive particles in the ACF, and a thermosetting adhesive can be used. The two electrodes can be fixedly held. Therefore, if ACF is used, a large number of wiring terminals can be electrically connected together at a fine pitch (for details, see Nikkei Microdevices Flat Panel Display 93 (issued on December 10, 1992) P.218-P 219).

  FIG. 8 is a plan view for explaining a connection portion between PWB and TCP. According to FIG. 8, the ACF 22 is provided on the wiring terminal (not shown) of the PWB 1, thereby connecting the PWB 1 and the TCP 2 on which the driver LSI 3 is mounted electrically and mechanically. Here, a conductive layer 5 connected to a ground potential that functions as an electrostatic shield is formed on the PWB 1 in order to reduce electromagnetic noise emission.

  In order to securely bond the ACF 22 to the PWB 1, it is necessary to temporarily fix the ACF 22 as described below. However, in this temporary fixing process, there arises a problem that the adhesion failure of the ACF 22 is caused. Hereinafter, after describing the contents of the temporary fixing step, problems occurring in this step will be described.

  In order to mount TCP2 and PWB1 by ACF22, before electrically connecting and mechanically bonding TCP2 and PWB1, as a preparatory step, ACF22 is heated to a wiring terminal formed on PWB1 at a predetermined temperature. It is necessary to provide a step of pressing (pressing) this at a predetermined pressure to temporarily fix it and performing a treatment (adhesion) to prevent the displacement (this step is referred to as “temporary fixing step of ACF 22”). In the temporary fixing process of the ACF 22, in consideration of productivity improvement, the ACF 22 having a predetermined width (about 1.5 mm to 2.0 mm) is formed on the PWB 1 regardless of whether the PWB 1 has a wiring terminal. Adhere temporarily. FIG. 7 is a plan view showing a state where the ACF 22 is temporarily fixed to the PWB 1. In FIG. 7, wiring terminal blocks (4a to 4h) corresponding to the necessary number (eight) of TCPs 2 are formed. In addition, the number of wiring terminals 4 included in each wiring terminal block (4a to 4h) is 51 to 80 (in the drawing, the wiring terminals 4 are omitted), and the wiring pitch of the wiring terminals 4 is as follows. Is 250 μm to 350 μm. Further, about 50 to 80 of the plurality of wiring terminals 4 are gathered to form a plurality of wiring terminal blocks (4a to 4h) on the PWB 1 and between the wiring terminal blocks adjacent to each other. There is a region without wiring terminals. In this region, as described above, the ground potential conductive layer 5 that functions as an electrostatic shield is formed for the purpose of reducing radiated electromagnetic noise, and it is necessary to adhere the ACF 22 to this conductive layer 5 as well. The temporary fixing method will be described later in detail.

  In this temporary fixing process, due to the heat radiation effect of the conductive layer 5, there is a possibility that the subsequent process may be performed despite the insufficient adhesion between the ACF 22 and the conductive layer 5. Therefore, after the ACF 22 is temporarily fixed, the ACF 22 is peeled off from the vicinity of the conductive layer 5, so that the ACF 22 is peeled off from the PWB 1 in the wiring terminal block (4 a to 4 h) region as well as the conductive layer 5 region. Will occur.

  The present invention has been made mainly for solving the above-described problems, and the object of the present invention will be described below.

  It is an object of the present invention to solve the above-mentioned problems and to provide a mounting component that can securely fix the ACF temporarily.

  The inventions described in claims 4, 5 and 6 provide a mounting component that solves the above-described problems, can reliably perform temporary fixing of the ACF, and can also avoid a malfunction of the position recognition device for TCP connection. Objective.

  In addition to the object described above, an object of the present invention is to provide a mounting component having a wide conductive layer with a margin in consideration of the bonding accuracy of the ACF to the conductive layer.

  It is an object of the present invention to solve the above problems and provide a liquid crystal display panel having a mounting component that can securely fix the ACF temporarily.

  The invention described in claims 11, 12 and 13 is a liquid crystal display provided with a mounting component that solves the above-mentioned problems, can securely fix the ACF, and can avoid malfunction of the position recognition device for TCP connection. The purpose is to provide a panel.

  In addition to the object described above, the invention described in claim 14 provides a liquid crystal display panel including a mounting component having a wide conductive layer with a margin in consideration of the bonding accuracy of the ACF to the conductive layer. The purpose is to do.

  The object of the present invention is to provide a method of manufacturing a liquid crystal display panel having a mounting component that can solve the above-mentioned problems and can securely fix the ACF.

  The invention according to claim 18, 19 and 20 is a liquid crystal display panel having a mounting part that solves the above-mentioned problems, can securely fix the ACF, and can avoid malfunction of the TCP connection position confirmation device. It aims at providing the manufacturing method of.

  In addition to the object described above, the invention described in claim 21 is a manufacturing of a liquid crystal display panel including a mounting component having a wide conductive layer with a margin in consideration of the bonding accuracy of the ACF to the conductive layer. It aims to provide a method.

  In addition to the object described above, an object of the invention described in claim 22 is to provide a method for manufacturing a liquid crystal display panel including an inexpensive mounting component.

  In the mounting component of the present invention, a board, a plurality of wiring terminal blocks composed of a plurality of first wiring terminals arranged on the board with a space therebetween, and a plurality of slits positioned between the wiring terminal blocks are provided. A conductive layer having a predetermined pattern, a resin film containing conductive particles bonded together on the first wiring terminal and the conductive layer, and a second wiring terminal connected to the integrated circuit And a flexible substrate disposed so that the first wiring terminal and the second wiring terminal face each other with a resin film interposed therebetween.

  Here, as long as the predetermined pattern of the conductive layer can reduce the heat transfer coefficient of the conductive layer, it is possible to exert its effect. It may be a stripe formed by a strip-shaped wiring, and is composed of two horizontal wirings extending in the longitudinal direction of the conductive layer and a plurality of vertical wirings extending in the width direction by electrically connecting the horizontal wirings to each other. It may be a ladder. Furthermore, as in the invention described in claim 4, the pattern of the conductive layer may be formed by repeating a plurality of slits with a predetermined period length in the conductive layer. “Repeating with this predetermined cycle length” means that slits are repeatedly provided at regular intervals. Further, the phase of the first slit array is shifted from the phase of the second slit array adjacent to the first slit array by a half of a predetermined period length, so that the first slit array is It may be formed.

  The crossing angle of the vertical wiring with respect to the horizontal wiring of the ladder-type conductive layer may be an acute angle.

  Moreover, it is preferable that the length in the width direction of the conductive layer is larger than the length in the width direction of the resin film.

  When the conductive layer is formed in a predetermined pattern in this manner, the heat dissipation action of the conductive layer is lowered, so that the conductive layer can be temporarily fixed.

  In the liquid crystal display panel of the present invention, a gate wiring and a source wiring formed perpendicular to each other on a glass substrate, a thin film transistor connected to the gate wiring and the source wiring at the intersection of the gate wiring and the source wiring, and a glass substrate A liquid crystal display panel including a mounting component electrically connected to a gate wiring or a source wiring at an end of the substrate, wherein the mounting component is a plurality of first components arranged on the substrate with a space therebetween. A plurality of wiring terminal blocks comprising a plurality of wiring terminals, a conductive layer having a predetermined pattern located between the wiring terminal blocks, and having a plurality of slits, and bonded together on the first wiring terminal and the conductive layer A resin film containing conductive particles, an integrated circuit, and a second wiring terminal connected to the integrated circuit, wherein the first wiring terminal and the second wiring terminal are connected to the resin film. To and a arranged flexible substrate so as to face each other.

  Here, the predetermined pattern of the conductive layer of the liquid crystal display panel can exert its effect as long as the heat transfer coefficient of the conductive layer can be reduced. As described above, the stripes may be formed by a plurality of strip-shaped wirings, and the two horizontal wirings and the horizontal wirings extending in the longitudinal direction of the conductive layer are electrically connected to each other, and the plurality of vertical wirings extending in the width direction are connected. It may be a ladder formed of wiring. In the ladder-like conductive layer, for example, the crossing angle of the vertical wiring with respect to the horizontal wiring may be an acute angle. Further, a predetermined pattern may be formed by repeating a plurality of slits with a predetermined period length with respect to the conductive layer. For example, the phase of the first slit array is changed to the second adjacent to the first slit array. The first slit array can also be formed by shifting the phase of the slit array by a half of the predetermined period length. Moreover, it is preferable that the length in the width direction of the conductive layer is larger than the length in the width direction of the resin film.

  In the method for manufacturing a liquid crystal display panel according to the present invention, in a method for manufacturing a liquid crystal display panel including a mounting component for connecting an integrated circuit to gate wirings or source wirings arranged perpendicular to each other on a glass substrate, Forming a plurality of wiring terminal blocks composed of a plurality of first wiring terminals arranged at intervals, and a conductive layer having a predetermined pattern having a plurality of slits positioned between the wiring terminal blocks. A resin film containing particles is collectively installed on the first wiring terminal and the conductive layer, and is temporarily fixed by being pressed at a predetermined pressure while maintaining a predetermined temperature. A second wiring terminal formed on the flexible substrate and connected to the integrated circuit is electrically and mechanically connected. Note that the temporary fixing means that the resin film is temporarily adhered to the wiring and the conductive layer by heating the resin film at a temperature lower than the thermosetting temperature of the resin.

  Here, it is possible to achieve the effect of the invention by forming the predetermined pattern of the conductive layer so that the heat transfer coefficient of the conductive layer can be lowered, but as in the inventions according to claims 15 and 16 In addition, it may be divided into a plurality of strips and formed in a stripe shape, and is composed of a plurality of vertical wires extending in the width direction by electrically connecting two horizontal wires extending in the longitudinal direction of the conductive layer and the horizontal wires. It may be formed in a ladder shape. The crossing angle of the vertical wiring with respect to the horizontal wiring of the ladder-like conductive layer may be an acute angle. Furthermore, it is also possible to pattern the conductive layer by repeating a plurality of slits with a predetermined period length. The phase of the first slit arrangement is the phase of the second slit arrangement adjacent to the first slit arrangement. On the other hand, the first slits can be arranged by shifting the length by a half of the predetermined period length.

  In addition, it is preferable to temporarily fix the wiring and the conductive layer while keeping the temperature of the resin film at 70 ° C. or more and 90 ° C. or less for 3 seconds or more.

Further, the surface of the resin film on the conductive layer 2 kgf / cm ² or more, it is preferred to carry out the tacking against the wiring and the conductive layer 3 kgf / cm ² or less pressure.

  Moreover, it is preferable that the length in the width direction of the conductive layer is larger than the length in the width direction of the resin film. Furthermore, it is preferable to apply nickel (Ni) gold (Au) plating to the conductive layer.

  According to the first, second, and third aspects of the invention, it is possible to obtain a mounting component that can reliably perform temporary fastening of the ACF.

  According to the invention described in claims 4, 5, and 6, it is possible to obtain a mounting component that can securely fix the ACF and can avoid malfunction of the position recognition device for TCP connection.

  According to the seventh aspect of the present invention, in addition to the effects described above, a mounting component having a conductive layer with a bonding position margin in consideration of the bonding accuracy of the ACF can be obtained.

  According to the eighth, ninth, and tenth aspects of the invention, a liquid crystal display panel having a mounting component that can securely fix the ACF temporarily can be obtained.

  According to the invention described in claims 11, 12, and 13, it is possible to obtain a liquid crystal display panel having a mounting component that can securely fix the ACF and avoid malfunction of the position recognition device for TCP connection.

  According to the invention described in claim 14, in addition to the effects described above, a liquid crystal display panel provided with a mounting component having a conductive layer having a bonding position margin in consideration of the bonding accuracy of the ACF can be obtained. .

  According to the inventions of the fifteenth, sixteenth and seventeenth aspects, it is possible to obtain a method of manufacturing a liquid crystal display panel having a mounting component that can securely fix the ACF.

  According to the invention described in claims 18, 19 and 20, there is provided a method of manufacturing a liquid crystal display panel having a mounting part that can securely fix the ACF and avoid malfunction of the position confirmation device for TCP connection. can get.

  The invention according to claim 21 is a method of manufacturing a liquid crystal display panel having a mounting part having a wide conductive layer with a margin in consideration of the accuracy of bonding of the ACF to the conductive layer in addition to the effects described above. Is obtained.

  According to the invention described in claim 22, in addition to the effects described above, a method for manufacturing a liquid crystal display panel including an inexpensive mounting component can be obtained.

  First, the outline of TAB mounting will be described with reference to FIG. The mounting of the liquid crystal display panel 6 refers to connecting the liquid crystal display panel and the system, and particularly refers to the connection between the liquid crystal display panel 6 and the driver LSI 3.

  The TAB mounting means that the LSI 3 is mounted on a polyimide film by bump connection as shown in FIG. 8, and the output of the LSI is connected to the panel and the lead-out electrode via the ACF. If ACF is used, conductivity can be imparted only in the thickness direction by thermocompression bonding, and connection with a fine pitch of 15 pieces / mm (65 μm pitch) is possible. In addition, since the LSI-mounted substrate is a flexible film, the film can be bent in addition to being used in a form in which the film spreads horizontally around the liquid crystal display panel 6 around the panel. However, TAB mounting also has a high advantage.

  Next, the TAB mounting of the liquid crystal display panel 6 will be described more specifically with reference to the drawings.

  FIG. 6 shows a cross section of a portion where the liquid crystal display panel 6 is mounted with the TCP 2. A thin film transistor (TFT) (not shown) is formed on the surface of the transparent glass substrate 11, and a color filter (not shown) is formed on the transparent glass substrate 12 facing the TFT. Then, these substrates 11 and 12 are arranged so as to face each other while maintaining the gap space 18, and a liquid crystal material is injected into the gap space 18. Note that polarizing plates 19 and 20 are attached to the back surfaces of the substrates 11 and 12 so that the light transmission axis and the light blocking can be controlled by utilizing the optical rotation of the nematic liquid crystal. It has been. Further, in order to transmit a signal for driving the liquid crystal display panel 6 from the driver LSI 3, the TCP 2 on which the driver LSI 3 is mounted and the substrate 11 of the liquid crystal display panel 6 are electrically connected via the ACF 22. Furthermore, PWB1 and TCP2 are also electrically connected via the ACF 22 for the purpose of enabling input / output of electric signals of the PC. In recent years, in order to refine the signal input / output wiring pitch of TCP2 and strengthen the strength of the connection terminal portion, the connection method between PWB1 and TCP2 has been changed from the existing connection method using solder connection as described above to ACF22. The connection method using is being shifted.

  FIG. 11 is an equivalent circuit diagram of the TFT-LCD, and FIG. 12 is an enlarged view of a region indicated by a circle X in FIG. 11, showing a pixel equivalent circuit diagram of the TFT-LCD. In FIG. 11, SP indicates a signal processing circuit, CLR indicates a controller, GS indicates a gradation power source, SCD indicates a scanning driver, and SD indicates a signal driver. On the substrate 11, a plurality of gate wirings 100 and a plurality of source wirings 200 (see FIG. 12) perpendicular to each other, a pixel electrode in a region surrounded by these wirings, and a thin film transistor near the intersection of these wirings (See FIG. 11). The gate wiring and the source wiring are electrically connected to the thin film transistor. Further, as shown in FIG. 6, the gate signal or source signal from the LSI 3 is transmitted to the gate wiring or source wiring connected to the driver LSI 3 via the TCP 2 at the end of the substrate 11, and the gate signal Thus, the switching of the thin film transistor is controlled, and the display luminance and display gradation of the liquid crystal display panel 6 are controlled by the source wiring signal.

  Hereinafter, embodiments of the present invention will be specifically described.

  FIG. 1 (a) is a plan view showing a part of a mounting component showing an embodiment of the present invention, and FIG. 1 (b) is a cross-sectional view taken along line AA of FIG. 1 (a). The implementation of PWB1 and TCP2 will be described. According to FIG. 1, the wiring terminal 4 and the conductive layer 5 are formed on the PWB 1 together. Also, the TCP2 wiring terminal (see FIG. 1B) connected with the drive LSI 3 is electrically connected to the wiring terminal 4 via the ACF 22 (see FIG. 1B). The The mounted component of FIG. 1 is manufactured as follows.

  FIG. 9 shows a conceptual configuration diagram of the ACF temporary fixing device. A predetermined tension is maintained between the material setting roller 31 and the take-up roller 32 for the PET film 30 with ACF, and the film 30 of the roller 31 is taken up by the roller 32. FIG. 10 is a cross-sectional view of the portion of the film 30 indicated by the XX line in FIG. 9. The ACF 22 is predetermined on the base film 29 in order to temporarily fix the ACF 22 of a predetermined length on the PWB 1. Adhered at intervals. The width of the ACF 22 is 1.5 mm to 2.0 mm, and the thickness of the ACF 22 is 35 μm.

  According to FIG. 9, a guide roller 33 and a temporary fixing bar 34 are provided on the back side of the base film 29. Further, a peeling roller 35 for peeling the ACF 22 from the base film 29 is provided in the vicinity of the guide roller 33.

In order to temporarily fix the ACF 22 to the WB 1, the interface temperature between the ACF 22 and the PWB 1 is set to 70 ° C. to 90 ° C., the temporary fixing bar 34 is lowered, and 2 to 3 kgf between the temporary fixing bar 34 and the PWB 1. A pressure of about / cm ^{2 is} generated for about 3 seconds, whereby the ACF 22 adheres to the PWB 1 with a predetermined strength. Note that if the temperature is set too low, the adhesive strength of the temporary fixing cannot be secured. On the other hand, if the temperature is set too high, the thermosetting of the resin film is promoted, and the TCP2 and the wiring terminal blocks (4a to 4h) Connection cannot be made smoothly by curing the resin film. After pressurization and heating under such conditions, the temporary fixing bar 34 is raised and the peeling roller 35 is moved in the horizontal direction so that the adhesive strength between the ACF 22 and the PWB 1 becomes the adhesive strength between the base film 29 and the ACF 22. The ACF 22 having a predetermined length can be peeled off from the base film 29 by winning.

After the temporary fixing step, in the final ACF bonding, the interface temperature between the ACF 22 and the PWB 1 is set to 160 ° C. to 180 ° C., and the TCP is pressed against the PWB 1 for 20 seconds at a pressure of about 30 kg / cm ^2. Then, the adhesive material of ACF 22 is thermally cured, and the wiring terminal 4 of PWB 1 and the wiring terminal (not shown) of TCP 2 connected to the driver LSI 3 are electrically connected stably (this is referred to as “main bonding process”). ").

  The feature of this embodiment is that the cause of the ACF 22 peeling from the PWB 1 after the temporary fixing and before the removal of the base film 29 is analyzed by the heat dissipation of the conductive layer 5, and the temporary fixing peeling of the ACF 22 is prevented. As a result, the conductive layer 5 is formed in a predetermined pattern. The pattern formation of the conductive layer 5 can be performed by an electroless plating process.

  That is, in order to maintain a sufficient adhesive force, there are minimum requirements for the bonding temperature, bonding pressure, and bonding time of the temporary fixing. If the conductive layer 5 is formed uniformly by gold (Au) plating, the heat transfer coefficient of the conductive layer 5 is large. Therefore, the heat applied to the ACF 22 is dissipated by the heat transfer function of the conductive layer 5, and the ACF 22 is temporarily fixed. It may not be possible to ensure the required minimum temperature (70 ° C.) of ACF 22.

  Therefore, an object of the present invention is to form a slit having a predetermined pattern without uniformly forming the conductive layer 5, relax the heat radiation action of the conductive layer 5, and secure the temperature condition necessary for the temporary fixing adhesion of the ACF 22. There is in point to do.

Example 1
The pattern shape of the conductive layer 5 will be specifically described with reference to the drawings.

  FIG. 2 is a plan view showing a pattern formed by a plurality of strip-like conductive layers 5a. According to FIG. 2, a pattern made of a strip-like conductive layer 5a made of a conductive material and slits 15 in which the conductive layer 5a is not formed is provided (hereinafter, this shape is referred to as a “striped shape”). Here, the length t = 2 to 3.5 mm of the slit 15, the width w of the conductive layer 5a = 150 to 250 μm, the width s of the slit 15 = 150 to 250 μm, the thickness of the conductive layer 5a is 20 μm or less, and the conductive layer 5 The material is nickel (Ni) gold (Au) plating. Thus, by making the length t (2 to 3.5 mm) of the slit 15 approximately 1.2 times larger than the width (1.5 to 2.0 mm) of the ACF 22, the ACF 22 relative to the conductive layer 5 can be obtained. In consideration of bonding errors (occurrence of misalignment of about several tens of μm of ACF 22 due to pasting and occurrence of waviness of ACF 22 due to pasting), the conductive layer 5 can have a margin for the pasting position.

  For the purpose of electrically connecting the two longitudinal horizontal wirings 5b of the conductive layer 5 of the conductive material to each other, a vertical wiring 5c in the width direction is provided to form a ladder, and the conductive layer 5 of FIG. The vertical wiring 5c may be short-circuited by the horizontal wiring 5b (the shape of the conductive layer 5 is referred to as a “ladder type”). The width l of the horizontal wiring 5b = 0.1 to 0.3 mm, the width w of the vertical wiring 5c = 150 to 250 μm, the width s = 150 to 250 μm of the slit 15, the length t = 2 to 3 mm of the slit 15, and the conductive layer 5 The conductive layer 5 is made of nickel (Ni) gold (Au) plating. By forming the conductive layer 5 in a ladder shape in this way, in addition to the effect brought about by the stripe pattern shown in FIG. 1, another effect shown below is also expected. The purpose of providing the conductive layer 5 is that the grounded conductive layer 5 serves as an electrostatic shield and prevents electromagnetic wave noise radiation. There is a concern that the area of the layer 5 decreases and the effect of the electromagnetic wave noise radiation prevention of the conductive layer 5 is reduced. Therefore, if the ladder-type conductive layer 5 is used, an effect that electromagnetic wave noise radiation can be prevented more effectively than the stripe-shaped conductive layer 5 can be obtained.

Example 2
FIG. 4 is a plan view showing another embodiment of the conductive layer 5 of FIG.

  According to FIG. 4, the conductive layer 5 has a plurality of slits 15 having a predetermined period length (specific numerical values will be described later) in both the vertical direction (longitudinal direction of the slits 15) and the horizontal direction (the vertical direction and the vertical direction). ) Repeatedly. And in order to avoid that each slit 15 interferes and these mutually couple | bond together, about the relative relationship of the arrangement position of the slit 15 adjacent up and down and right and left, the phase of the repeating arrangement | positioning of the slit 15 mutually The interval is shifted by about ½ of the period length (hereinafter, this arrangement is referred to as “staggered arrangement”). Here, the slit 15 has a length t = 0.2 to 0.5 mm in the longitudinal direction and a width s = 150 to 250 μm. In addition, the vertical and horizontal periods of the slit 15 are P1 = 300 to 500 μm and P2 = 500 to 1000 μm, respectively. The material and thickness of the conductive layer 5 are the same as those of the conductive layer 5 shown in FIG. By adopting such a staggered arrangement instead of the pattern of the stripe-like conductive layer 5, still another effect shown below can be obtained. Similar to the pattern shape of the wiring terminals 4, if the conductive layer 5 is also formed in a stripe shape, there is a problem in that the TCP 2 is mounted on the conductive layer 5 due to a malfunction of the alignment recognition of the attaching device. It becomes easy to do. Therefore, by adopting the staggered arrangement shown in FIG. 4, it is possible to avoid a malfunction of a TCP connection position recognition device (not shown) and to realize a highly reliable TCP implementation.

Example 3
FIG. 5 is a plan view showing another embodiment of the conductive layer 5 shown in FIG. 1, and is an enlarged view showing an improved embodiment of the ladder-type conductive layer 5 shown in FIG.

  According to FIG. 5, the slit 16 is formed to be inclined (hereinafter, this slit 16 is referred to as “inclined slit 16”). Here, the width l of the horizontal wiring 5b is 0.1 to 0.3 mm, the width w of the vertical wiring 5c is 150 to 250 μm, the width s of the slit 15 is 150 to 250 μm, and the slit length t is 2 to 3 mm. The material and thickness of the conductive layer 5 are the same as those of the conductive layer 5 shown in FIG. Further, the crossing angle θ between the horizontal wiring (longitudinal direction) and the vertical wiring (width direction) due to this inclination is 5 to 45 °. That is, the present embodiment is characterized in that the crossing angle of the vertical wiring with respect to the horizontal wiring is made an acute angle.

  When the inclined slit 16 is inclined in this way, the positioning of the TCP connection position recognition device can be accurately recognized as in the pattern pattern of the conductive layer 5 shown in FIG. .

It is a top view explaining mounting of TCP mounted on PWB. It is a figure explaining a stripe-like conductive layer. It is a figure explaining a ladder type conductive layer. It is a figure explaining a slit zigzag arrangement conductive layer. It is a figure explaining an inclination slit conductive layer. It is sectional drawing of the mounting module part of a liquid crystal display panel. It is a top view explaining the state which temporarily fixed ACF to PWB. It is a top view of the connection part of PWB and TCP. It is a conceptual diagram of an ACF temporary fixing device. It is sectional drawing of a PET film with ACF. It is an equivalent circuit diagram of TFT-LCD. FIG. 12 is a pixel equivalent circuit diagram of the TFT-LCD of FIG. 11.

Explanation of symbols

1 PWB
2 TCP
3 Driver LSI
4 Wiring terminals
5 Conductive layer
6 Liquid crystal display panel 11, 12 Transparent glass substrate 15 Slit 16 Inclined slit 18 Gap space 19, 20 Polarizing plate 22 ACF
29 Base film 30 PET film 31 Material setting roller 32 Rolling roller 33 Guide roller 34 Temporary fixing bar 35 Peeling roller 36 TCP input terminal

Claims (22)

A conductive layer having a predetermined pattern having a substrate, a plurality of wiring terminal blocks each including a plurality of first wiring terminals arranged on the substrate at intervals, and a plurality of slits positioned between the wiring terminal blocks A resin film containing conductive particles bonded together on the first wiring terminal and the conductive layer, and a second wiring terminal connected to an integrated circuit, the first wiring terminal A mounting component comprising: a flexible substrate arranged so that a wiring terminal and the second wiring terminal face each other with the resin film interposed therebetween. 2. The mounting component according to claim 1, wherein the predetermined pattern of the conductive layer is a stripe formed by a plurality of strip-shaped wirings. The predetermined pattern of the conductive layer is a ladder configured by a plurality of vertical wirings extending in the width direction of the conductive layer by electrically connecting the two horizontal wirings extending in the longitudinal direction of the conductive layer and the horizontal wiring. The mounting component according to claim 1, wherein the mounting component is in a shape. The mounting component according to claim 1, wherein the predetermined pattern is formed by repeating a plurality of slits with a predetermined period length with respect to the conductive layer. The phase of the first slit array is shifted from the phase of the second slit array adjacent to the first slit array by a length that is ½ of the predetermined period length. The mounting component according to claim 4, wherein an array of one slit is formed. 4. The mounting component according to claim 3, wherein an intersection angle of the vertical wiring with respect to the horizontal wiring is an acute angle. The mounting component according to claim 1, wherein a length of the conductive layer in a width direction is larger than a length of the resin film in a width direction. A gate wiring and a source wiring formed orthogonal to each other on the glass substrate; a thin film transistor connected to the gate wiring and the source wiring at an intersection of the gate wiring and the source wiring; and an end of the glass substrate A liquid crystal display panel comprising a mounting component electrically connected to the gate wiring or the source wiring, wherein the mounting component includes a substrate and a plurality of components arranged on the substrate with a gap therebetween. A plurality of wiring terminal blocks comprising first wiring terminals, a conductive layer having a predetermined pattern located between the wiring terminal blocks and having a plurality of slits, and collectively on the first wiring terminals and the conductive layer A resin film containing conductive particles adhered to each other and a second wiring terminal connected to an integrated circuit, and the first wiring terminal and the second wiring terminal are The liquid crystal display panel, characterized in that through the Aburamaku and an arranged flexible substrate so as to face each other. 9. The liquid crystal display panel according to claim 8, wherein the predetermined pattern of the conductive layer is a stripe formed by a plurality of strip-like wirings. The predetermined pattern of the conductive layer is a ladder configured by a plurality of vertical wirings extending in the width direction of the conductive layer by electrically connecting the two horizontal wirings extending in the longitudinal direction of the conductive layer and the horizontal wiring. The liquid crystal display panel according to claim 8, wherein the liquid crystal display panel is in the shape of a liquid crystal display. 9. The liquid crystal display panel according to claim 8, wherein the predetermined pattern is formed by repeating a plurality of slits with a predetermined period length with respect to the conductive layer. The phase of the first slit array is shifted from the phase of the second slit array adjacent to the first slit array by a length that is ½ of the predetermined period length. 12. The liquid crystal display panel according to claim 11, wherein an array of one slit is formed. 11. The liquid crystal display panel according to claim 10, wherein an intersection angle of the vertical wiring with respect to the horizontal wiring is an acute angle. 14. The liquid crystal display panel according to claim 8, wherein a length of the conductive layer in a width direction is larger than a length of the resin film in a width direction. . In a method of manufacturing a liquid crystal display panel in which mounting components for connecting an integrated circuit are connected to gate wirings or source wirings arranged perpendicular to each other on a glass substrate, a plurality of wirings arranged on a printed wiring board with a space therebetween A plurality of wiring terminal blocks made of the first wiring terminals, a conductive layer having a predetermined pattern located between the wiring terminal blocks and having a plurality of slits, and a resin film containing conductive particles formed on the first wiring terminals. Are collectively installed on the wiring terminals and the conductive layer, and are temporarily fixed by pressing at a predetermined pressure while maintaining a predetermined temperature, and are contained in the resin film at a temperature equal to or higher than the predetermined temperature and a pressure equal to or higher than the predetermined pressure. Electrically connecting the first wiring terminal to the second wiring terminal formed on the flexible substrate and connected to the integrated circuit via conductive particles; of Method of manufacturing a liquid crystal display panel to mechanically connects the second wiring terminal and the first wiring terminals by reduction. The method of manufacturing a liquid crystal display panel according to claim 15, wherein the conductive layer is formed in a stripe shape divided into a plurality of strip-like wirings. 16. The method of manufacturing a liquid crystal display panel according to claim 15, wherein the conductive layer is formed in a ladder shape including two horizontal wirings extending in the longitudinal direction and a plurality of vertical wirings electrically connecting the horizontal wirings. The method of manufacturing a liquid crystal display panel according to claim 15, wherein the conductive layer is patterned by repeating a plurality of slits with a predetermined period length. The phase of the first slit array is shifted from the phase of the second slit array adjacent to the first slit array by ½ of the predetermined period length, The manufacturing method of the liquid crystal display device of Claim 18 which arranges 1 slit. The method of manufacturing a liquid crystal display panel according to claim 17, wherein an intersection angle of the vertical wiring with respect to the horizontal wiring is an acute angle. 21. The liquid crystal display panel according to claim 15, wherein a length in the width direction of the conductive layer is made larger than a length in the width direction of the resin film. Manufacturing method. The method for manufacturing a liquid crystal display panel according to any one of claims 15, 16, 17, 18, 19, 20, and 21, wherein the conductive layer is plated with nickel (Ni) gold (Au).

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