JP3849582B2 - 研磨パッド及び複層型研磨パッド - Google Patents

研磨パッド及び複層型研磨パッド Download PDF

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Publication number
JP3849582B2
JP3849582B2 JP2002162142A JP2002162142A JP3849582B2 JP 3849582 B2 JP3849582 B2 JP 3849582B2 JP 2002162142 A JP2002162142 A JP 2002162142A JP 2002162142 A JP2002162142 A JP 2002162142A JP 3849582 B2 JP3849582 B2 JP 3849582B2
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JP
Japan
Prior art keywords
polishing
polishing pad
water
groove
grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2002162142A
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English (en)
Japanese (ja)
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JP2004009156A (ja
JP2004009156A5 (https=
Inventor
浩司 志保
亨 長谷川
信夫 川橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
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JSR Corp
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Publication date
Priority to JP2002162142A priority Critical patent/JP3849582B2/ja
Application filed by JSR Corp filed Critical JSR Corp
Priority to EP03012509A priority patent/EP1369204B1/en
Priority to TW092114938A priority patent/TWI250572B/zh
Priority to KR1020030035237A priority patent/KR100669301B1/ko
Priority to US10/449,196 priority patent/US20040014413A1/en
Priority to DE60308946T priority patent/DE60308946T2/de
Priority to CNB031406815A priority patent/CN100492597C/zh
Publication of JP2004009156A publication Critical patent/JP2004009156A/ja
Publication of JP2004009156A5 publication Critical patent/JP2004009156A5/ja
Application granted granted Critical
Publication of JP3849582B2 publication Critical patent/JP3849582B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2002162142A 2002-06-03 2002-06-03 研磨パッド及び複層型研磨パッド Expired - Lifetime JP3849582B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2002162142A JP3849582B2 (ja) 2002-06-03 2002-06-03 研磨パッド及び複層型研磨パッド
TW092114938A TWI250572B (en) 2002-06-03 2003-06-02 Polishing pad and multi-layer polishing pad
KR1020030035237A KR100669301B1 (ko) 2002-06-03 2003-06-02 연마 패드 및 복층형 연마 패드
US10/449,196 US20040014413A1 (en) 2002-06-03 2003-06-02 Polishing pad and multi-layer polishing pad
EP03012509A EP1369204B1 (en) 2002-06-03 2003-06-02 Polishing pad and process for manufacturing a polishing pad
DE60308946T DE60308946T2 (de) 2002-06-03 2003-06-02 Polierkissen und Verfahren zur Herstellung eines Polierkissens
CNB031406815A CN100492597C (zh) 2002-06-03 2003-06-03 抛光垫及其制备、使用方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002162142A JP3849582B2 (ja) 2002-06-03 2002-06-03 研磨パッド及び複層型研磨パッド

Publications (3)

Publication Number Publication Date
JP2004009156A JP2004009156A (ja) 2004-01-15
JP2004009156A5 JP2004009156A5 (https=) 2005-05-26
JP3849582B2 true JP3849582B2 (ja) 2006-11-22

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Application Number Title Priority Date Filing Date
JP2002162142A Expired - Lifetime JP3849582B2 (ja) 2002-06-03 2002-06-03 研磨パッド及び複層型研磨パッド

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JP (1) JP3849582B2 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4616571B2 (ja) * 2004-03-31 2011-01-19 東洋ゴム工業株式会社 研磨パッド
JP2006114885A (ja) * 2004-09-17 2006-04-27 Jsr Corp 化学機械研磨パッド及び化学機械研磨方法
JP3769581B1 (ja) 2005-05-18 2006-04-26 東洋ゴム工業株式会社 研磨パッドおよびその製造方法
KR100721196B1 (ko) * 2005-05-24 2007-05-23 주식회사 하이닉스반도체 연마패드 및 이를 이용한 화학적기계적연마장치
CN102498549A (zh) * 2009-07-16 2012-06-13 嘉柏微电子材料股份公司 沟槽式化学机械抛光抛光垫
US9211628B2 (en) * 2011-01-26 2015-12-15 Nexplanar Corporation Polishing pad with concentric or approximately concentric polygon groove pattern
TWI599447B (zh) * 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊
US10625393B2 (en) * 2017-06-08 2020-04-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pads having offset circumferential grooves for improved removal rate and polishing uniformity
CN113547450B (zh) * 2021-09-22 2022-01-07 湖北鼎汇微电子材料有限公司 抛光垫、研磨设备及半导体器件的制造方法

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Publication number Publication date
JP2004009156A (ja) 2004-01-15

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