JP2004009156A5 - - Google Patents
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- Publication number
- JP2004009156A5 JP2004009156A5 JP2002162142A JP2002162142A JP2004009156A5 JP 2004009156 A5 JP2004009156 A5 JP 2004009156A5 JP 2002162142 A JP2002162142 A JP 2002162142A JP 2002162142 A JP2002162142 A JP 2002162142A JP 2004009156 A5 JP2004009156 A5 JP 2004009156A5
- Authority
- JP
- Japan
- Prior art keywords
- width
- groove
- depth
- minimum distance
- preferable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 description 1
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002162142A JP3849582B2 (ja) | 2002-06-03 | 2002-06-03 | 研磨パッド及び複層型研磨パッド |
| TW092114938A TWI250572B (en) | 2002-06-03 | 2003-06-02 | Polishing pad and multi-layer polishing pad |
| KR1020030035237A KR100669301B1 (ko) | 2002-06-03 | 2003-06-02 | 연마 패드 및 복층형 연마 패드 |
| US10/449,196 US20040014413A1 (en) | 2002-06-03 | 2003-06-02 | Polishing pad and multi-layer polishing pad |
| EP03012509A EP1369204B1 (en) | 2002-06-03 | 2003-06-02 | Polishing pad and process for manufacturing a polishing pad |
| DE60308946T DE60308946T2 (de) | 2002-06-03 | 2003-06-02 | Polierkissen und Verfahren zur Herstellung eines Polierkissens |
| CNB031406815A CN100492597C (zh) | 2002-06-03 | 2003-06-03 | 抛光垫及其制备、使用方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002162142A JP3849582B2 (ja) | 2002-06-03 | 2002-06-03 | 研磨パッド及び複層型研磨パッド |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004009156A JP2004009156A (ja) | 2004-01-15 |
| JP2004009156A5 true JP2004009156A5 (https=) | 2005-05-26 |
| JP3849582B2 JP3849582B2 (ja) | 2006-11-22 |
Family
ID=30430993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002162142A Expired - Lifetime JP3849582B2 (ja) | 2002-06-03 | 2002-06-03 | 研磨パッド及び複層型研磨パッド |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3849582B2 (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4616571B2 (ja) * | 2004-03-31 | 2011-01-19 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP2006114885A (ja) * | 2004-09-17 | 2006-04-27 | Jsr Corp | 化学機械研磨パッド及び化学機械研磨方法 |
| JP3769581B1 (ja) | 2005-05-18 | 2006-04-26 | 東洋ゴム工業株式会社 | 研磨パッドおよびその製造方法 |
| KR100721196B1 (ko) * | 2005-05-24 | 2007-05-23 | 주식회사 하이닉스반도체 | 연마패드 및 이를 이용한 화학적기계적연마장치 |
| CN102498549A (zh) * | 2009-07-16 | 2012-06-13 | 嘉柏微电子材料股份公司 | 沟槽式化学机械抛光抛光垫 |
| US9211628B2 (en) * | 2011-01-26 | 2015-12-15 | Nexplanar Corporation | Polishing pad with concentric or approximately concentric polygon groove pattern |
| TWI599447B (zh) * | 2013-10-18 | 2017-09-21 | 卡博特微電子公司 | 具有偏移同心溝槽圖樣之邊緣排除區的cmp拋光墊 |
| US10625393B2 (en) * | 2017-06-08 | 2020-04-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pads having offset circumferential grooves for improved removal rate and polishing uniformity |
| CN113547450B (zh) * | 2021-09-22 | 2022-01-07 | 湖北鼎汇微电子材料有限公司 | 抛光垫、研磨设备及半导体器件的制造方法 |
-
2002
- 2002-06-03 JP JP2002162142A patent/JP3849582B2/ja not_active Expired - Lifetime
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