JP3842286B2 - 制御装置のためのケーシング - Google Patents

制御装置のためのケーシング Download PDF

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Publication number
JP3842286B2
JP3842286B2 JP51443393A JP51443393A JP3842286B2 JP 3842286 B2 JP3842286 B2 JP 3842286B2 JP 51443393 A JP51443393 A JP 51443393A JP 51443393 A JP51443393 A JP 51443393A JP 3842286 B2 JP3842286 B2 JP 3842286B2
Authority
JP
Japan
Prior art keywords
casing
substrate
coating
web
flange
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP51443393A
Other languages
English (en)
Japanese (ja)
Other versions
JPH06507049A (ja
Inventor
ディーター フスマン，
トーマス イェスベルガー，
ディーター カル，
カール シュプ，
ペーター ヤレス，
ディーター ノイハウス，
マルクス ハルシュ，
ベルント ヴェーバー，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of JPH06507049A publication Critical patent/JPH06507049A/ja
Application granted granted Critical
Publication of JP3842286B2 publication Critical patent/JP3842286B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0049—Casings being metallic containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09354—Ground conductor along edge of main surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10553—Component over metal, i.e. metal plate in between bottom of component and surface of PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Casings For Electric Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
JP51443393A 1992-02-21 1993-02-05 制御装置のためのケーシング Expired - Fee Related JP3842286B2 (ja)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
DE4205388 1992-02-21
DE4224008.5 1992-07-21
DE4224008 1992-07-21
DE4243180A DE4243180A1 (enExample) 1992-02-21 1992-12-19
DE4243180.8 1992-12-19
PCT/DE1993/000095 WO1993017535A1 (de) 1992-02-21 1993-02-05 Gehäuse für steuergeräte

Publications (2)

Publication Number Publication Date
JPH06507049A JPH06507049A (ja) 1994-08-04
JP3842286B2 true JP3842286B2 (ja) 2006-11-08

Family

ID=27203437

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51443393A Expired - Fee Related JP3842286B2 (ja) 1992-02-21 1993-02-05 制御装置のためのケーシング

Country Status (5)

Country Link
EP (1) EP0581919B1 (enExample)
JP (1) JP3842286B2 (enExample)
DE (2) DE4243180A1 (enExample)
ES (1) ES2087710T3 (enExample)
WO (1) WO1993017535A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013243228A (ja) * 2012-05-21 2013-12-05 Nippon Seiki Co Ltd 電子回路装置
JP2016105507A (ja) * 2016-02-26 2016-06-09 日本精機株式会社 電子回路装置

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4337866A1 (de) * 1993-11-05 1995-05-11 Siemens Ag Steuergerät, insbesondere für ein Kraftfahrzeug
DE4436547A1 (de) * 1994-10-13 1996-04-18 Telefunken Microelectron Gehäuse für Elektronikbaugruppen
US5594199A (en) * 1995-03-23 1997-01-14 Ford Motor Company EMI baffle for electronic control
DE19528632A1 (de) * 1995-08-04 1997-02-06 Bosch Gmbh Robert Steuergerät bestehend aus mindestens zwei Gehäuseteilen
DE59702466D1 (de) 1996-08-29 2000-11-16 Bosch Gmbh Robert Gehäuse für ein elektrisches steuergerät mit fallempfindlichen bauelementen, insbesondere sensor(en) zum auslösen von schutzvorrichtungen in kraftfahrzeugen
DE29701502U1 (de) * 1997-01-30 1998-05-28 Robert Bosch Gmbh, 70469 Stuttgart Elektrisches Gerät, insbesondere Schalt- und Steuergerät für Kraftfahrzeuge
EP0872396B1 (de) * 1997-04-16 2003-05-21 Siemens Aktiengesellschaft Ventilsteuergerät
DE10120715A1 (de) * 2001-04-27 2002-11-28 Bosch Gmbh Robert Gehäuse für ein elektrisches Gerät
DE10205816A1 (de) * 2002-02-13 2003-08-14 Bosch Gmbh Robert Gehäuse für ein elektrisches Gerät
DE102005039706A1 (de) * 2005-08-23 2007-03-01 Hella Kgaa Hueck & Co. Leiterplattenanordnung
DE102007032510A1 (de) * 2007-07-12 2009-01-15 Robert Bosch Gmbh Elektrisches Gerät und Verfahren zur Herstellung eines elektrischen Geräts
DE102008003787B4 (de) 2008-01-10 2021-08-19 Robert Bosch Gmbh Leiterplattenanordnung
JP5290379B2 (ja) * 2011-10-14 2013-09-18 三菱電機株式会社 無線装置及びリモートキーレスエントリー装置
JP5808703B2 (ja) * 2012-03-21 2015-11-10 日立オートモティブシステムズ株式会社 電子制御装置
JP6108957B2 (ja) * 2013-05-24 2017-04-05 本田技研工業株式会社 電子装置
DE102013227224A1 (de) 2013-12-30 2015-07-02 Robert Bosch Gmbh Leiterplattenanordnung
DE102015122913B4 (de) * 2015-12-29 2017-09-14 Kathrein-Werke Kg Hochfrequenzverstärker für Koaxialnetzwerke
JP6427550B2 (ja) * 2016-12-27 2018-11-21 本田技研工業株式会社 電子装置
US12219744B2 (en) 2020-09-18 2025-02-04 Hitachi Astemo, Ltd. Electronic control device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3128856A1 (de) * 1981-07-22 1983-02-10 Oelsch KG, 1000 Berlin Vorrichtung zum befestigen elektronischer bauteile auf einer leiterplatte
GB2239739A (en) * 1989-11-16 1991-07-10 Motorola Gmbh Electronic circuit assemblies
DE4023319C1 (enExample) * 1990-07-21 1991-12-12 Robert Bosch Gmbh, 7000 Stuttgart, De

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013243228A (ja) * 2012-05-21 2013-12-05 Nippon Seiki Co Ltd 電子回路装置
JP2016105507A (ja) * 2016-02-26 2016-06-09 日本精機株式会社 電子回路装置

Also Published As

Publication number Publication date
WO1993017535A1 (de) 1993-09-02
JPH06507049A (ja) 1994-08-04
EP0581919B1 (de) 1996-05-22
ES2087710T3 (es) 1996-07-16
DE4243180A1 (enExample) 1993-08-26
EP0581919A1 (de) 1994-02-09
DE59302666D1 (de) 1996-06-27

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Effective date: 20060810

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