JP3835949B2 - 熱伝導樹脂組成物構造体及びその製造方法、並びに、それを用いた熱伝導基板の製造方法 - Google Patents

熱伝導樹脂組成物構造体及びその製造方法、並びに、それを用いた熱伝導基板の製造方法 Download PDF

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Publication number
JP3835949B2
JP3835949B2 JP16509099A JP16509099A JP3835949B2 JP 3835949 B2 JP3835949 B2 JP 3835949B2 JP 16509099 A JP16509099 A JP 16509099A JP 16509099 A JP16509099 A JP 16509099A JP 3835949 B2 JP3835949 B2 JP 3835949B2
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JP
Japan
Prior art keywords
resin composition
heat conductive
conductive resin
metal plate
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP16509099A
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English (en)
Japanese (ja)
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JP2000353772A (ja
JP2000353772A5 (enExample
Inventor
浩一 平野
誠一 中谷
光洋 松尾
浩之 半田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP16509099A priority Critical patent/JP3835949B2/ja
Publication of JP2000353772A publication Critical patent/JP2000353772A/ja
Publication of JP2000353772A5 publication Critical patent/JP2000353772A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

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  • Manufacturing Of Printed Wiring (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
JP16509099A 1999-06-11 1999-06-11 熱伝導樹脂組成物構造体及びその製造方法、並びに、それを用いた熱伝導基板の製造方法 Expired - Fee Related JP3835949B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16509099A JP3835949B2 (ja) 1999-06-11 1999-06-11 熱伝導樹脂組成物構造体及びその製造方法、並びに、それを用いた熱伝導基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16509099A JP3835949B2 (ja) 1999-06-11 1999-06-11 熱伝導樹脂組成物構造体及びその製造方法、並びに、それを用いた熱伝導基板の製造方法

Publications (3)

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JP2000353772A JP2000353772A (ja) 2000-12-19
JP2000353772A5 JP2000353772A5 (enExample) 2006-07-20
JP3835949B2 true JP3835949B2 (ja) 2006-10-18

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190115968A (ko) * 2018-04-04 2019-10-14 엘지이노텍 주식회사 방열시트와 이를 포함하는 휴대 장치 및 무선 충전 장치

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3830726B2 (ja) * 2000-04-26 2006-10-11 松下電器産業株式会社 熱伝導基板とその製造方法およびパワーモジュール
CN1204790C (zh) 2000-12-27 2005-06-01 松下电器产业株式会社 引线框及其制造方法和导热性基板的制造方法
JP4719990B2 (ja) * 2001-03-02 2011-07-06 パナソニック電工株式会社 電子部品の製造方法
JP4459470B2 (ja) * 2001-04-06 2010-04-28 信越化学工業株式会社 電子部品の放熱構造体及びそれに用いる放熱シート
JP4581655B2 (ja) * 2004-11-30 2010-11-17 パナソニック株式会社 放熱板
JP4581656B2 (ja) * 2004-11-30 2010-11-17 パナソニック株式会社 放熱板の製造方法
US8008756B2 (en) * 2006-06-14 2011-08-30 Panasonic Corporation Heat dissipating wiring board and method for manufacturing same
KR101271965B1 (ko) 2011-07-13 2013-06-07 주식회사 노루코일코팅 표면 처리용 수지 조성물 및 이에 의해 코팅된 강판
CN120570070A (zh) * 2023-01-10 2025-08-29 日本发条株式会社 电路基板的制造装置及电路基板的制造方法
EP4651640A4 (en) * 2023-01-10 2026-04-01 Nhk Spring Co Ltd TRANSPORT TEMPLATE, PRINTED CIRCUIT BOARD MANUFACTURING DEVICE AND PRINTED CIRCUIT BOARD MANUFACTURING METHOD
JPWO2024150537A1 (enExample) * 2023-01-10 2024-07-18

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS522282A (en) * 1975-06-24 1977-01-08 Hitachi Ltd Semiconductor device
JP3351852B2 (ja) * 1992-04-20 2002-12-03 電気化学工業株式会社 絶縁材及びそれを用いた回路基板
JPH06120657A (ja) * 1992-10-01 1994-04-28 Hitachi Chem Co Ltd 金属ベース基板の製造法
JP3201277B2 (ja) * 1996-09-11 2001-08-20 株式会社日立製作所 半導体装置
JP3312723B2 (ja) * 1996-10-09 2002-08-12 松下電器産業株式会社 熱伝導シート状物とその製造方法及びそれを用いた熱伝導基板とその製造方法
JPH1146049A (ja) * 1997-07-25 1999-02-16 Matsushita Electric Ind Co Ltd 放熱性樹脂基板およびその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190115968A (ko) * 2018-04-04 2019-10-14 엘지이노텍 주식회사 방열시트와 이를 포함하는 휴대 장치 및 무선 충전 장치
KR102551743B1 (ko) 2018-04-04 2023-07-06 엘지이노텍 주식회사 방열시트와 이를 포함하는 휴대 장치 및 무선 충전 장치

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