JP3833938B2 - リードフレームおよびその製造方法、ならびに熱伝導性基板の製造方法 - Google Patents

リードフレームおよびその製造方法、ならびに熱伝導性基板の製造方法 Download PDF

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Publication number
JP3833938B2
JP3833938B2 JP2001397578A JP2001397578A JP3833938B2 JP 3833938 B2 JP3833938 B2 JP 3833938B2 JP 2001397578 A JP2001397578 A JP 2001397578A JP 2001397578 A JP2001397578 A JP 2001397578A JP 3833938 B2 JP3833938 B2 JP 3833938B2
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JP
Japan
Prior art keywords
sheet member
resin sheet
lead frame
conductive resin
thermally conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2001397578A
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English (en)
Japanese (ja)
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JP2002270744A5 (enExample
JP2002270744A (ja
Inventor
嘉久 山下
浩一 平野
誠一 中谷
政毅 鈴村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2001397578A priority Critical patent/JP3833938B2/ja
Publication of JP2002270744A publication Critical patent/JP2002270744A/ja
Publication of JP2002270744A5 publication Critical patent/JP2002270744A5/ja
Application granted granted Critical
Publication of JP3833938B2 publication Critical patent/JP3833938B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2001397578A 2000-12-27 2001-12-27 リードフレームおよびその製造方法、ならびに熱伝導性基板の製造方法 Expired - Fee Related JP3833938B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001397578A JP3833938B2 (ja) 2000-12-27 2001-12-27 リードフレームおよびその製造方法、ならびに熱伝導性基板の製造方法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2000-397651 2000-12-27
JP2000-397650 2000-12-27
JP2000397650 2000-12-27
JP2000397651 2000-12-27
JP2001397578A JP3833938B2 (ja) 2000-12-27 2001-12-27 リードフレームおよびその製造方法、ならびに熱伝導性基板の製造方法

Publications (3)

Publication Number Publication Date
JP2002270744A JP2002270744A (ja) 2002-09-20
JP2002270744A5 JP2002270744A5 (enExample) 2006-07-20
JP3833938B2 true JP3833938B2 (ja) 2006-10-18

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001397578A Expired - Fee Related JP3833938B2 (ja) 2000-12-27 2001-12-27 リードフレームおよびその製造方法、ならびに熱伝導性基板の製造方法

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JP (1) JP3833938B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4581722B2 (ja) * 2005-02-07 2010-11-17 パナソニック株式会社 熱伝導性基板の製造方法
WO2007145237A1 (ja) * 2006-06-14 2007-12-21 Panasonic Corporation 放熱配線基板とその製造方法
JP4862601B2 (ja) * 2006-10-13 2012-01-25 パナソニック株式会社 熱伝導基板とその製造方法及び回路モジュール
JP4854571B2 (ja) * 2007-04-06 2012-01-18 三菱電機株式会社 半導体レーザ装置
JP6050975B2 (ja) * 2012-03-27 2016-12-21 新光電気工業株式会社 リードフレーム、半導体装置及びリードフレームの製造方法
TWI841359B (zh) * 2023-04-24 2024-05-01 健策精密工業股份有限公司 封裝結構及其製造方法

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Publication number Publication date
JP2002270744A (ja) 2002-09-20

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