JP3799830B2 - Semiconductor device package - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a package of a semiconductor device intended for a power transistor module applied to an inverter device.
[0002]
[Prior art]
FIG. 3 shows a configuration diagram of a conventional example. In FIG. 3, 1 is a wiring pattern (not shown) printed, and a metal base substrate for heat dissipation or the like on which a circuit assembly such as a rectifier circuit element, an inverse conversion circuit element, and control circuit parts thereof is mounted. A wiring board 2 is surface-mounted on the wiring board 1 and is a connector for collecting control wiring of the circuit assembly and pulling it out from the package. 2a is a positioning pin provided on an insulating substrate (not shown) of the connector 2. 2b is a positioning guide hole that is provided on the wiring board 1 and engages with the positioning pin 2a of the connector 2, and 3 is a resin-made affixed to the heat dissipation base plate 1 that surrounds the periphery of the heat dissipation base plate 1. Module covers 3 a indicate positioning marks when the module cover 3 is fixed to the base plate 1 for heat dissipation.
[0003]
In FIG. 3, a wiring board 1 on which a rectifier circuit element, an inverse conversion circuit element, their control circuit components, and the like (not shown) are mounted is secured by aligning the periphery with positioning marks 3a. One of the males and females fixed to the package side of the semiconductor device of the connector 2 in which the control wiring drawn out from the circuit assembly is collected is drawn out on the wiring board 1 (see FIG. A guide hole 2b of the wiring board 1 is inserted into a positioning pin 2a provided in the connector 2 so that a lead portion (not shown) corresponding to the connector 2 corresponding to the connector 2 side matches with the wiring board 1. A lead portion (not shown) on the connector 2 side corresponding to a lead wire (not shown) wired and printed is soldered and fixed. In the figure, for example, when using the connector 2 in which several tens of leads arranged at a pitch of 2 mm are arranged in two rows in the front and rear, the lead wires (not shown) printed on the wiring board 1 are arranged on the front side. A wire to be wired to the lead portion of the lead and a lead wire to be wired to the lead portion on the back side through the wire to be wired to the front lead portion are printed, and the solder width for solder connection needs to be less than 1 mm. Therefore, in order to avoid contact between the solder and the lead wire wired to the rear lead portion, the connector 2 is accurately positioned and attached to the wiring board 1 using the positioning pins 2a and the guide holes 2b. Yes. The inside surrounded by the module cover 3 is filled with a filler such as silicone gel to seal the circuit element with resin.
[0004]
[Problems to be solved by the invention]
By the way, in the conventional configuration, when the connector is attached to the wiring board, the positioning pin and the guide hole are used for positioning. Therefore, when the guide hole is inserted into the pin, an inadvertent lateral force may be applied. In addition, there is a problem that a crack is generated in the wiring board. In addition, it takes time and labor to open the guide hole in the wiring board, and a crack may be generated in the insulating film of the wiring board when the guide hole is opened. Therefore, it may be possible not to provide positioning pins and guide holes. However, in this case, it is necessary to position the connector in addition to positioning the module cover.
[0005]
SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a package for a semiconductor device that reduces the trouble of positioning a connector and does not cause defects such as cracks in an insulating film. It is in.
[0006]
[Means for Solving the Problems]
In order to solve the above-mentioned problem, the invention according to claim 1 is characterized in that a resin module cover is overlapped so as to form a flange on the periphery of the heat dissipation base plate on which the circuit assembly mounted on the insulating substrate is mounted. In the package of the semiconductor device joined, the module cover is mounted on the insulating substrate with one of the male and female fixed to the package side of the semiconductor device of the connector in which the control wiring drawn out from the circuit assembly is gathered. In this case, a positioning jig is provided that is fitted and held between arms having a U-shaped cross section facing each other at a position where the connector is fixed.
[0007]
By fitting and holding the connector in a positioning jig constituted by U-shaped cross-section arms facing each other with the above configuration, the connector can be mounted at a normal position. Here, since the module cover is positioned on the wiring board according to the positioning mark, the positioning jig provided on the module cover is also automatically positioned, and the connector is positioned on the heat radiating base plate without pins and guide holes. It becomes possible.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 shows a configuration diagram of a main part of an embodiment of the present invention, FIG. 2 shows a configuration diagram of an embodiment of the present invention, (a) is an exploded perspective view before assembly, and (b) is an assembled state. The external appearance perspective view of is shown. In FIG. 1 and FIG. 2, members having the same reference numerals as those of the conventional example have approximately the same functions, and thus the description thereof is omitted. In FIG. 1 and FIG. 2, reference numeral 1 denotes a heat dissipating metal base substrate on which a wiring pattern (not shown) is printed and a circuit assembly such as a rectifier circuit element, an inverse conversion circuit element, and control circuit parts thereof is mounted. The wiring board 2 is surface-mounted on the wiring board 1 and the control wiring of the circuit assembly is collected from the package to the outside. 2c and 2d are connector leads, and 4 is the peripheral edge of the heat dissipation base board 1. Resin module covers 1a and 4a affixed to the surrounding wiring board 1 are provided on the wiring board 1 and the module cover 4, respectively, and positioning marks such as screw holes for fixing to heat radiation fins (not shown), 4b Is a molding jig formed integrally with the module cover 4 and is composed of U-shaped cross-sectional arms facing each other. It is molded Rukaba 4 integral with the lead block for a main circuit for connection with external wiring. In FIG. 1 and FIG. 2, the wiring board 1 on which a rectifier circuit element, an inverse conversion circuit element, and their control circuit components, not shown, are mounted is aligned with the positioning marks 1a and 4a. The module cover 4 is surrounded by a module cover 4 fixed by screws or the like (not shown), and the module cover 4 is a positioning jig for fitting and holding the connector 2, which is composed of U-shaped arms protruding inward and facing each other. The tool 4b is integrally formed. Then, either one of the male and female fixed to the package side of the semiconductor device of the connector 2 in which the control wiring drawn out from the circuit assembly is gathered is positioned and fixed to the wiring board 1, and then the module cover 4 is inserted into the positioning jig 4b so that the lead portion 2d on the connector 2 side corresponding to the lead-out line (not shown) printed and wired on the wiring board 1 is aligned with the wiring board 1. The lead portion 2d on the connector 2 side corresponding to the lead wire (not shown) wired and printed is soldered and fixed.
[0009]
In this way, the connector can be attached to the normal position of the wiring board 1 simply by inserting the connector 2 into the positioning jig 4b formed integrally with the module cover 4.
The lead 2c of the connector 2 is connected to a control circuit wiring board (not shown) on which a control circuit placed on the leg 4d of the module cover 4 is mounted.
[0010]
In the figure, for example, when using the connector 2 in which several tens of leads arranged at a pitch of 2 mm are arranged in two rows in the front and rear, the lead wires (not shown) printed on the wiring board 1 are arranged on the front side. Since the wire to be wired to the lead portion and the lead wire to be wired to the rear lead portion through between the wires to be wired to the front lead portion are printed, the solder width for solder connection is less than 1 mm. Since it is necessary, in order to avoid contact between the solder and the lead wire to be wired to the rear lead portion, the connector 2 is fitted to the wiring board 1 by inserting the connector 2 into the positioning jig positioning jig 4b of the module cover 4. It is positioned and mounted accurately. The inside surrounded by the module cover 4 is filled with a filler such as silicone gel to seal the circuit element with resin.
[0011]
【The invention's effect】
According to the present invention, since the wiring board does not require a connector positioning guide hole, the insulating film is not cracked when the connector is mounted, and the quality of the wiring board is improved.
[Brief description of the drawings]
FIG. 1 is a configuration diagram of a main part of an embodiment of the present invention. FIG. 2 is a configuration diagram of an embodiment of the present invention, (a) is an exploded perspective view before assembly, and (b) is an assembled state. External perspective view [Fig. 3] Configuration diagram of conventional example [Explanation of symbols]
1 Wiring board 2 Connector 4 Module cover 4a Positioning mark 4b Positioning jig

Claims (1)

In a package of a semiconductor device in which a resin module cover is overlaid on the periphery of a circuit board on which a circuit assembly is mounted so as to form a ridge, and both are joined, the module cover is controlled to be pulled out from the circuit assembly. One of the males and females fixed to the package side of the semiconductor device of the connector in which the wiring is integrated is fitted between the arms having a U-shaped cross section facing each other at the position where the connector is fixed when the wiring board is mounted. A package of a semiconductor device, comprising a positioning jig for holding.

Images