JP3798715B2 - Semiconductor circuit device and manufacturing method thereof - Google Patents

Description

[0001]
[Technical field to which the invention belongs]
The present invention relates to a semiconductor circuit device that performs a function verification test and a manufacturing method thereof.
[0002]
[Prior art]
Conventionally, in the inspection such as operation check of the semiconductor circuit device, non-contact type function check has been performed as follows.
[0003]
FIG. 11 is a diagram illustrating a manufacturing process of the semiconductor circuit device. Inspections such as operation confirmation of the semiconductor circuit device may be performed after the wafer generation process, as shown in FIG. FIG. 12 shows an example in which a coil-on-chip semiconductor circuit device in which a non-contact communication antenna is integrally formed on an IC chip is inspected by a conventional non-contact type semiconductor inspection device. The inspection of the non-contact type semiconductor circuit device is performed by inspecting a semiconductor circuit which is equipped with a communication coil and can input and output signals externally and wirelessly. In the inspection of the conventional non-contact type semiconductor circuit device shown in FIG. 12, the semiconductor circuit devices 1a and 1b are in a wafer state at the time of the inspection, and the inspection is executed at a stage before dicing. Therefore, it is necessary to inspect in a very narrow wafer state where the interval is about 110 μm.
[0004]
In the inspection of the semiconductor circuit device by this non-contact type semiconductor inspection device, the head 4 is used to wirelessly transmit an inspection signal to the semiconductor circuit devices 1a and 1b, and the output from the semiconductor circuit devices 1a and 1b corresponding thereto. By receiving the signal, the functions of the semiconductor circuit devices 1a and 1b are inspected. Here, the communication distance of the non-contact type semiconductor circuit devices 1a and 1b is usually 1.5 mm or more. For this reason, when the inspection signal is transmitted from the head 4 to the semiconductor circuit device 1a in the wafer state where the interval is narrow as described above, the inspection signal is also received up to the semiconductor circuit device 1b adjacent thereto. Therefore, not only the semiconductor circuit device 1a but also the adjacent semiconductor circuit device 1b transmits an output signal to the head 4. Therefore, the head 4 cannot receive only the signal of the semiconductor circuit device 1a to be inspected, which hinders the inspection. That is, there has been a problem that the function confirmation for each semiconductor circuit device cannot be performed with high accuracy.
[0005]
[Problems to be solved by the invention]
As described above, the inspection of the semiconductor circuit device by the conventional non-contact type semiconductor inspection device has various problems.
[0006]
The present invention has been made in consideration of the above points, and it is an object of the present invention to provide a semiconductor circuit device that can be inspected accurately and efficiently.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, a semiconductor circuit device according to the present invention is a semiconductor circuit device formed on a wafer, and is electrically connected to a communication antenna having a wireless communication function and the communication antenna. And an additional circuit that shortens the communication distance of the communication antenna, and the additional circuit is provided on a line cut out in a chip shape . With such a configuration, since the communication distance of the communication antenna is shortened, there is no interference by the output signal from the adjacent semiconductor circuit device, and the operation check can be performed with high accuracy. Moreover, since the additional circuit is scraped off in the dicing process, the communication distance of the communication antenna is restored. Furthermore, it is not necessary to perform the work of removing the additional circuit, and the inspection can be performed efficiently.
[0008]
Another semiconductor circuit device according to the present invention is a semiconductor circuit device formed on a wafer, the communication antenna having a wireless communication function, and the communication antenna electrically connected to the communication antenna. And an additional circuit that shortens the communication distance, and a part of the wiring circuit that connects the additional circuit and the communication antenna is provided on a line cut out in a chip shape. With such a configuration, since the communication distance of the communication antenna is shortened, there is no interference by the output signal from the adjacent semiconductor circuit device, and the operation check can be performed with high accuracy. Further, the wiring circuit is scraped off in the dicing process, and the electrical connection state between the additional circuit and the communication antenna is disconnected, so that the communication distance of the communication antenna is restored. Furthermore, it is not necessary to remove the additional circuit or to disconnect the electrical connection between the additional circuit and the communication antenna, and the inspection can be performed efficiently.
[0009]
Instead of the above-described additional circuit, an antenna having a wireless communication function (for example, the test coil 3 in the second embodiment) may be provided. With such a configuration, the semiconductor circuit device can be inspected by checking the operation of the antenna.
[0010]
Another semiconductor circuit device according to the present invention is a semiconductor circuit device formed on a wafer, the communication antenna having a wireless communication function, and the communication electrically connected to the communication antenna. And an antenna having a wireless communication function for shortening the communication distance of the antenna. With such a configuration, since the communication distance of the communication antenna is shortened, there is no interference by the output signal from the adjacent semiconductor circuit device, and the operation check can be performed with high accuracy.
[0012]
Furthermore, in the method for manufacturing a semiconductor circuit device in which the antenna for wireless communication according to the present invention is integrally formed, an additional circuit for shortening the communication distance of the antenna for wireless communication is formed on a line cut out in a chip shape, The method includes a step of confirming the operation of the semiconductor circuit device, and a step of cutting the semiconductor circuit device into a chip shape. As a result, there is no interference due to the output signal from the adjacent semiconductor circuit device, and there is no need to perform the work of removing the additional circuit, so that the inspection can be performed with high accuracy and efficiency.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to FIGS.
Embodiment 1 of the Invention
First, the overall configuration of the semiconductor circuit device according to the first embodiment will be described. FIG. 1 shows the configuration of the semiconductor circuit device according to the first embodiment. A plurality of semiconductor circuit devices such as semiconductor circuit devices 1a and 1b are formed on a wafer. The configuration of the semiconductor circuit devices 1a and 1b is as follows.
[0014]
As the semiconductor circuit device 1, for example, a semiconductor circuit device including an antenna such as a coil or a T-type antenna is used. The semiconductor circuit device 1 is the same as the IC element disclosed in, for example, Japanese Patent Laid-Open No. 2000-323643.
[0015]
The configuration of the semiconductor circuit device 1 is as follows. As shown in FIGS. 2 and 3, the semiconductor circuit device 1 has an insulating surface protection film 100 such as a silicon oxide film or a resin film on the surface where the input / output terminal 101 of the semiconductor circuit device 1 is formed. A rectangular spiral coil 102 is integrally formed.
[0016]
The semiconductor circuit device 1 of FIG. 2 has a coil 102 formed only on the outer peripheral portion excluding the circuit forming portion 103, and stray capacitance is generated between the circuit formed in the semiconductor circuit device 1 and the coil 102. Although it is possible to prevent this, it is preferable to dispose part or all of the coil 102 so as to overlap the circuit forming portion 103 in order to reduce the cost. Power is supplied to the circuit forming unit 103 through the coil 102.
[0017]
In order to receive practically sufficient power supply and ensure communication characteristics with the supply unit, the coil 102 has a line width of 7 μm or more, a distance between lines of 5 μm or less, and a number of turns of 20 turns. The above is preferable.
[0018]
The connection between the input / output terminal 101 of the semiconductor circuit device 1 and the coil 102 is made through a through-hole 104 provided in the surface protective film 100 as shown in FIG. In this case, as shown in FIG. 3, the diameter or width of the through hole 104 is set to a coil so that the connection between the input / output terminal 101 and the coil 102 is ensured even when the formation position of the coil 102 is slightly shifted. More preferably, the line width is smaller than 102.
[0019]
As shown in FIG. 3, the conductor constituting the coil 102 has a multilayer structure including a metal vapor deposition layer 105 and a metal plating layer 106. The metal vapor deposition layer 105 and the metal plating layer 106 can be formed of any conductive metal, but the metal vapor deposition layer 105 is made of aluminum, nickel, copper, and chromium because it is relatively inexpensive and has high conductivity. It is preferably formed of an alloy of two or more kinds of metals selected from the selected metal or a group of these metals, and in addition to a homogeneous single layer structure, other layer structure in which different metal layers or alloy layers are laminated in multiple layers It can also be. On the other hand, the metal plating layer 106 is preferably formed of copper, and can be formed by an electroless plating method, an electroplating method, or a precision electroforming method.
[0020]
As described above, each of the semiconductor circuit devices 1a, 1b, and the like includes the coil configured on the circuit, that is, the communication coil 11. As shown in FIG. It is electrically connected to the additional circuit 2 that shortens the distance. The additional circuit 2 is arranged on a line for cutting the semiconductor circuit devices 1a, 1b and the like in a chip shape, that is, on a scribe line. It is supposed to be. In addition to the semiconductor circuit devices 1a and 1b and the additional circuit 2, a plurality of semiconductor circuit devices are formed on the wafer and have various configurations such as an inspection device and a transfer device. Description is omitted.
[0021]
FIG. 4 is a block diagram showing the configuration of each semiconductor circuit device 1a, 1b, and the like. As shown in FIG. 4, each of the semiconductor circuit devices 1a, 1b, etc. is composed of a communication coil 11 and an IC chip circuit 12, and the additional circuit 2 is, for example, a resistance circuit having a predetermined resistance value. 11 is connected in parallel. By providing the additional circuit 2, the current value flowing through the communication coil 11 is reduced by the amount of the current value flowing through the additional circuit 2. For this reason, the magnetic field which generate | occur | produces when an electric current flows into the coil 11 for communication falls, and the communication distance of the coil 11 for communication is shortened. The additional circuit 2 may be a circuit including only reactance, only capacitance, or a combination of these elements, not a circuit including only resistors.
[0022]
FIG. 5 is a diagram showing a circuit configuration of each of the semiconductor circuit devices 1a and 1b. As shown in FIG. 5, each semiconductor circuit device 1 a, 1 b, etc. is composed of a communication coil 11 and an IC chip circuit 12, and these communication coil 11 and IC chip circuit 12 are connected via an LA terminal 121 and an LB terminal 122. Connected. Further, the IC chip circuit 12 includes a ground circuit 123.
[0023]
FIG. 6 is a table showing the communication distance corresponding to the resistance value between the LA terminal 121 and the ground circuit 123. As shown in FIG. 6, the additional circuit 2 is electrically connected to the communication coil 11, and the resistance value between the LA terminal 121 and the ground circuit 123 is reduced from 100Ω to 80Ω, for example, to be generated from the communication coil 11. Thus, the communication distance of the communication coil 11 is shortened from 2.5 mm to 0.05 mm.
[0024]
Next, functions and effects produced by the semiconductor circuit device according to the first embodiment having the above-described configuration will be described. First, since the additional circuit 2 is electrically connected to the communication coil 11 of each semiconductor circuit device 1a, 1b, etc., the communication distance of the communication coil 11 is shortened from 2.5 mm to 0.05 mm. Even if, for example, a head of a non-contact type inspection apparatus is brought close to the semiconductor circuit device 1a in the wafer state and the operation is confirmed, the inspection signal output from the head is not received by the adjacent semiconductor circuit device 1b. The semiconductor circuit device 1b does not transmit an output signal. Therefore, the output signal from the semiconductor circuit device 1a is not disturbed, and the function of the semiconductor chip 1a can be confirmed with high accuracy. In addition, since the inspection is based on a non-contact method, the semiconductor chip is not damaged by pin handling or the like, and the operation can be confirmed safely.
[0025]
Further, when the semiconductor circuit devices 1a, 1b, etc. are cut into chips in the dicing process of the process diagram shown in FIG. 11, the additional circuit 2 is scraped together with the portion along the scribe line of the wafer as shown in FIG. Therefore, the resistance value between the LA terminal 121 and the ground circuit 123 is restored to 100Ω, for example. For this reason, the communication coil 11 recovers the communication distance to 2.5 mm. Therefore, it is not necessary to separately perform an operation for removing the additional circuit 2, and it is possible to efficiently inspect the operation check of the semiconductor circuit device.
[0026]
According to the semiconductor operating device in the first embodiment as described above, the additional circuit 2 is electrically connected to the communication coil 11 and the communication distance of the communication coil 11 is shortened. The operation check can be performed with high accuracy without being obstructed by the output signal from the adjacent semiconductor circuit device. In addition, by providing the additional circuit 2 on the scribe line, the additional circuit 2 is scraped off along with the portion along the scribe line in the dicing process, so there is no need to remove the additional circuit 2 and the operation check is efficiently performed. It can be performed.
[0027]
Embodiment 2. FIG.
A semiconductor circuit device according to the second embodiment will be described. FIG. 8 shows the configuration of the semiconductor circuit device according to the second embodiment. The semiconductor circuit device according to the second embodiment is substantially the same as that according to the first embodiment, and the additional circuit 2 is replaced with a test coil 3 as shown in FIG. The test coil 3 has a wireless communication function. The test coil 3 is disposed on a line for cutting out each semiconductor circuit device 1a, 1b, etc., that is, on a scribe line. When the semiconductor circuit device is cut into a chip shape, the test coil 3 is aligned with the scribe line. It will be scraped off with the part.
[0028]
FIG. 9 is a block diagram showing the configuration of each semiconductor circuit device 1a, 1b, and the like. The test coil 3 has a predetermined resistance value, for example, and as shown in FIG. 9, the current value flowing through the communication coil 11 is changed by connecting the communication coil 11 in parallel with the communication coil 11. Decreases by the amount of current flowing through the. For this reason, the resistance value between the both ends of the coil 11 for communication falls, and the magnetic field which generate | occur | produces from the coil 11 for communication falls, The communication distance of the coil 11 for communication is shortened. In addition, the communication distance of the communication coil 11 is configured to be shorter than the communication distance of the test coil 3.
[0029]
Next, functions and effects produced by the semiconductor circuit device according to the second embodiment having the above-described configuration will be described. First, since the test coil 3 is electrically connected to the communication coil 11 of each semiconductor circuit device 1a, 1b, etc., for example, with respect to the test coil 3 connected to the communication coil 11 of the semiconductor circuit device 1a. For example, the operation check of the semiconductor circuit device 1a can be inspected by moving the head of a non-contact type semiconductor inspection device close to the head and performing the operation check inspection. At this time, since the communication coils 11 of the semiconductor circuit devices 1a, 1b, etc. have a short communication distance, they do not receive an inspection signal from the head and do not transmit an output signal. Therefore, the operation check of the semiconductor circuit device 1a can be accurately inspected without being obstructed by the output signal from the communication coil 11. In addition, since the inspection is based on a non-contact method, the semiconductor chip is not damaged by pin handling or the like, and the operation can be confirmed safely.
[0030]
Moreover, since the test coil 3 is scraped off in the dicing process of the process diagram shown in FIG. 11 similarly to the communication coil 11 in the first embodiment, the communication distance of the communication coil 11 is restored. Therefore, it is not necessary to separately perform a work for removing the test coil 3, and it is possible to efficiently inspect the operation check of the semiconductor circuit device.
[0031]
According to the semiconductor operating device in the second embodiment as described above, the test coil 3 having a wireless communication function is electrically connected to the communication coil 11 and the operation check inspection is performed on the test coil 3. By performing the above, it is possible to perform an operation check with high accuracy without being disturbed by an output signal from an adjacent semiconductor circuit device. Also, by providing the test coil 3 on the scribe line, the test coil 3 is scraped off along with the portion along the scribe line in the dicing process, so that there is no need to remove the test coil 3 and it operates efficiently. Confirmation inspection can be performed.
[0032]
Embodiment 3 FIG.
A semiconductor circuit device according to the third embodiment will be described. FIG. 10 shows the configuration of the semiconductor circuit device according to the third embodiment. The semiconductor circuit device in the third embodiment is substantially the same as that in the first embodiment. As shown in FIG. 10, the additional circuit 2 is provided on a circuit such as each of the semiconductor circuit devices 1a and 1b. The wiring circuit is connected to the communication coil 11 via a line for cutting the semiconductor circuit devices 1a, 1b and the like into a chip shape, that is, a scribe line. For this reason, this wiring circuit is cut off together with the portion along the scribe line when each semiconductor circuit device is cut into chips.
[0033]
The semiconductor circuit device according to the third embodiment has the above-described configuration, and the additional circuit 2 is electrically connected to the communication coil 11 of each of the semiconductor circuit devices 1a, 1b, etc. 1 produces the same effect.
[0034]
Further, when the semiconductor circuit devices 1a, 1b and the like are cut into chips in the dicing process of the process diagram shown in FIG. 11, a part of the wiring circuit of the additional circuit 2 is scraped off along with the part along the scribe line of the wafer. Therefore, the electrical connection state between the additional circuit 2 and the communication coil 11 is disconnected, and the resistance value between both ends of the communication coil 11 is restored to, for example, 100Ω. For this reason, the communication coil 11 recovers the communication distance to 2.5 mm. Therefore, it is not necessary to remove the additional circuit 2 separately or to perform an operation for disconnecting the electrical connection between the additional circuit 2 and the communication coil 11, and it is possible to efficiently check the operation of the semiconductor circuit device. It is.
[0035]
According to the semiconductor operating device in the present third embodiment as described above, the additional circuit 2 is electrically connected to the communication coil 11 and thus is disturbed by the output signal from the adjacent semiconductor circuit device. The operation check can be performed with high accuracy. Further, by connecting the wiring circuit of the additional circuit 2 to the communication coil 11 via the scribe line, the wiring circuit is scraped off together with the portion along the scribe line in the dicing process, so that the additional circuit 2 is removed or There is no need for work such as disconnecting the electrical connection between the additional circuit 2 and the communication coil 11, and the operation check can be performed efficiently.
[0036]
Other embodiments.
Although the inspection in each of the above-described embodiments is performed by a non-contact type, in addition to the non-contact type inspection, a contact type inspection may be further performed.
[0037]
【The invention's effect】
As described above, according to the present invention, it is possible to provide a semiconductor circuit device that can be accurately and efficiently inspected.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram showing a semiconductor circuit device according to a first embodiment of the invention.
FIG. 2 is a configuration diagram showing a semiconductor circuit device according to a first embodiment of the invention.
FIG. 3 is a configuration diagram showing a semiconductor circuit device according to a first embodiment of the invention.
FIG. 4 is a block diagram showing a semiconductor circuit device in the first embodiment of the invention.
FIG. 5 is a circuit diagram showing the semiconductor circuit device according to the first embodiment of the invention.
6 is a diagram showing a resistance value and a communication distance of a communication coil 11 of the semiconductor circuit device according to the first embodiment of the present invention. FIG.
FIG. 7 is a configuration diagram showing the semiconductor circuit device in a dicing process of the semiconductor circuit device in the first embodiment of the invention;
FIG. 8 is a schematic configuration diagram showing a semiconductor circuit device according to a second embodiment of the invention.
FIG. 9 is a block diagram showing a semiconductor circuit device in a second embodiment of the invention.
FIG. 10 is a schematic configuration diagram showing a semiconductor circuit device according to a third embodiment of the invention.
FIG. 11 is a diagram showing a manufacturing process of a semiconductor circuit device in the prior art.
FIG. 12 is a configuration diagram showing an operation check inspection of a semiconductor circuit device by a non-contact type semiconductor inspection device in the prior art.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1, 1a, 1b Semiconductor circuit device 2 Additional circuit 3 Test coil 4 Head 5 Pin 11 Communication coil 12 IC chip circuit 100 Surface protective film 101 Input / output terminal 102 Coil 103 Circuit formation part 104 Through-hole 105 Metal vapor deposition layer 106 Metal Plating layer 121 LA terminal 122 LB terminal 123 Ground circuit

Claims (5)

A semiconductor circuit device formed on a wafer,
A communication antenna having a wireless communication function;
A semiconductor circuit device comprising: an additional circuit that is electrically connected to the communication antenna and shortens a communication distance of the communication antenna, and the additional circuit is provided on a line cut out in a chip shape . A semiconductor circuit device formed on a wafer,
A communication antenna having a wireless communication function;
An additional circuit that is electrically connected to the communication antenna and shortens a communication distance of the communication antenna, and a line in which a part of a wiring circuit that connects the additional circuit and the communication antenna is cut out in a chip shape A semiconductor circuit device provided above.   3. The semiconductor device circuit according to claim 1, wherein an antenna having a wireless communication function is provided instead of the additional circuit. A semiconductor circuit device formed on a wafer,
  A communication antenna having a wireless communication function;
A semiconductor circuit device comprising: an antenna having a wireless communication function that is electrically connected to the communication antenna and shortens a communication distance of the communication antenna. A method of manufacturing a semiconductor circuit device in which a radio communication antenna is integrally formed,
Forming an additional circuit for shortening the communication distance of the antenna for wireless communication on a line cut out in a chip shape;
Checking the operation of the semiconductor circuit device;
And a step of cutting the semiconductor circuit device into a chip shape.

Images