CN115902596B - Non-contact chip quality detection device and detection method - Google Patents
Non-contact chip quality detection device and detection method Download PDFInfo
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- CN115902596B CN115902596B CN202310170034.4A CN202310170034A CN115902596B CN 115902596 B CN115902596 B CN 115902596B CN 202310170034 A CN202310170034 A CN 202310170034A CN 115902596 B CN115902596 B CN 115902596B
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Abstract
The invention relates to the technical field of chip detection, in particular to a non-contact chip quality detection device and a detection method.
Description
Technical Field
The invention relates to the technical field of chip detection, in particular to a non-contact chip quality detection device and a detection method.
Background
High efficiency and high stability are often sought after in industrial production environments. In the traditional gravity chip sorting machine, whether the chip functions normally or not and whether the chip packaging quality meets the standard or not can be generally detected. In the conventional method, an industrial camera is used to shoot and compare the appearance of the chip to determine whether the appearance of the chip meets the requirement, but the detection of the chip package by an image mode also slows down the whole detection speed besides adding extra burden to the production cost.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a non-contact chip quality detection device and a detection method, which are used for performing non-contact detection on a chip passing through a magnetic field provided by a fixed coil and a movable coil.
In order to achieve the above purpose, the present invention provides the following technical solutions:
the non-contact type chip quality detection device comprises a non-contact type detection cylinder, an upper transmission device, a lower transmission device, a lifting grabbing device, a clamping supporting plate, a chip bearing component and a supporting plate releasing device, wherein the non-contact type detection cylinder comprises a detection cylinder body, a fixed coil and a movable coil which are wound on the outer side of the detection cylinder body, and a chip to be detected passes through a detection channel in the middle of the detection cylinder body in a free falling manner;
the fixed coils at the two ends of the detection cylinder body operate in a high-frequency self-excitation mode, pulse signals are sent outwards when a chip to be detected with a metal object passes through, and meanwhile, the fixed coils can make corresponding pulse width reactions to the size of a metal bracket of the passing chip and can be used as a calibration basis for the overall quality of a subsequent chip;
the movable coil is fixed on the pressure sensor through a spring connecting piece, the movable coil provides a fixed magnetic field, when a chip to be tested with a metal object passes through the movable coil, an interaction force is generated with the fixed magnetic field, and the interaction force is obtained through the pressure sensor;
the upper transmission device is positioned above the non-contact detection cylinder, the lower transmission device is positioned below the non-contact detection cylinder, the structures of the upper transmission device and the lower transmission device are approximate, and clamping supporting plates are arranged on the upper transmission device and the lower transmission device and bear the chip to be detected through the clamping supporting plates;
the upper transmission device transmits the chip to be tested to the upper end of the detection channel of the non-contact detection cylinder, and releases the chip to be tested from the clamping support plate through the support plate release device;
the lower conveying device receives the chip to be detected falling from the non-contact detection barrel, the chip to be detected is accommodated in the chip bearing assembly, and the lifting grabbing device achieves circulating conveying of the chip bearing assembly between the lower conveying device and the upper conveying device.
Further, the fixed coil comprises a first fixed coil and a second fixed coil, the movable coil comprises a constant magnetic field movable coil, and the non-contact detection cylinder further comprises an upper support plate, a lower support plate, a force measuring spring and a pressure detection support plate;
the upper support plate is fixedly connected to the upper end of the detection cylinder, the lower support plate is fixedly connected to the lower end of the detection cylinder, the first fixed coil is located on the outer side of the upper portion of the detection cylinder, the second fixed coil is located on the outer side of the lower portion of the detection cylinder, and the distance between the first fixed coil and the second fixed coil is fixed;
a pressure detection supporting plate is arranged at the outer side of the detection cylinder and positioned at the middle position of the first fixed coil and the second fixed coil, and a constant magnetic field movable coil is connected to the pressure detection supporting plate through a force measuring spring;
the first fixed coil and the second fixed coil can detect the speed of the chip to be detected with metal in free falling motion, and whether the process of detecting the quality of the contactless chip is abnormal or not is verified through the detection of the speed;
after the chip to be tested passes through the constant magnetic field movable coil, the pressure difference value generated by the constant magnetic field movable coil on the force measuring spring is read by the pressure sensor, and the pressure difference value can be used for detecting the metal support in the chip to be tested and the plastic package material which is molded on the metal support.
Further, the upper conveying device and the lower conveying device are similar in structure and comprise a first conveying belt, a second conveying belt, a conveying belt supporting frame and a conveying belt driving assembly;
the first conveyor belt and the second conveyor belt are arranged side by side, the first conveyor belt and the second conveyor belt are arranged on the supporting frame through the conveyor belt supporting frame, and clamping supporting plates are arranged at positions, corresponding to the second conveyor belt, of the first conveyor belt;
the first and second conveyors are driven by the conveyor drive assembly to achieve a synchronous drive.
Further, the clamping supporting plate comprises a first supporting plate, a second supporting plate, a sliding supporting seat, a reset spring, a sliding guide rail and a sliding seat;
the bottoms of the first supporting plate and the second supporting plate are fixed on the sliding seat, the sliding seat is slidably arranged on the sliding supporting seat through a sliding guide rail, and a reset spring is arranged between the sliding seat and the sliding supporting seat;
the sliding support seat is fixed at the corresponding positions of the first conveyor belt and the second conveyor belt and synchronously moves along with the first conveyor belt and the second conveyor belt;
the chip bearing assembly comprises a bearing disc, a vent hole and a chip accommodating part, wherein the chip to be tested can be accommodated in the chip accommodating part;
the first supporting plate and the second supporting plate are respectively provided with a containing groove for containing the bearing plate, and can move towards/away from each other so as to grasp and release the bearing plate;
the vent holes can allow air to pass through and ensure balance of the bearing disc when the bearing disc passes through the detection channel of the non-contact detection cylinder.
Further, the supporting plate release device comprises a first poking cylinder, a second poking cylinder, a first poking piece and a second poking piece;
the upper support plate and the lower support plate of the non-contact detection cylinder are respectively and fixedly arranged on the support frame, the first stirring cylinder and the second stirring cylinder are fixedly arranged on the support frame and are positioned above the upper support plate, a first stirring piece is arranged on a movable rod of the first stirring cylinder, a second stirring piece is arranged on a movable rod of the second stirring cylinder, and the first stirring piece and the second stirring piece can stir the movement of the first supporting plate and the second supporting plate away from each other so as to release the bearing disc, and the bearing disc enters a detection channel of the non-contact detection cylinder.
Further, the lifting grabbing device comprises a lifting supporting column, a lifting transmission belt, a supporting fork, a rotating seat, a rotary driving assembly and a lifting driving assembly;
the lifting support column is rotatably arranged on the support frame through a rotating seat, a lifting transmission belt is supported by a roller in the extending direction of the lifting support column, and a supporting fork is arranged on the lifting transmission belt;
the rotary driving assembly drives the rotary seat and the lifting support column to rotate so as to realize the change of the orientation of the support fork; the lifting driving assembly drives the lifting driving belt to rotate so as to realize lifting of the supporting fork;
and a gap exists between the first supporting plate and the second supporting plate, and when the supporting fork takes down the chip bearing assembly from the clamping supporting plate on the lower conveying device, the lifting supporting column can pass through the gap between the first supporting plate and the second supporting plate.
The non-contact chip quality detection method, the detection device comprises the following steps:
step a, a chip to be detected is placed on a chip bearing component on an upper transmission device by a feeding device, and the upper transmission device transmits the chip bearing component to the upper end of the non-contact detection cylinder;
b, the supporting plate releasing device toggles the clamping supporting plate to release the chip bearing assembly, and a chip to be tested enters a detection channel of the non-contact detection cylinder;
step c, the first fixed coil and the second fixed coil at the two ends of the detection cylinder body operate in a high-frequency self-excitation mode, pulse signals are sent outwards when a chip to be detected with a metal object passes through, and meanwhile, the first fixed coil and the second fixed coil can make corresponding pulse width reactions to the size of a metal bracket of the passing chip and can serve as a calibration basis for the overall quality of a subsequent chip; the first fixed coil and the second fixed coil can detect the speed of the chip to be detected with metal in free falling motion), and whether the process of detecting the quality of the contactless chip is abnormal or not is verified through the detection of the speed;
step d, a fixed magnetic field is provided by a constant magnetic field movable coil, when a chip to be tested with a metal object passes through the constant magnetic field movable coil, an interaction force is generated between the chip to be tested and the fixed magnetic field, and after a pressure difference value generated by the constant magnetic field movable coil on the force measuring spring is read by a pressure sensor, the pressure difference value can detect a metal bracket in the chip to be tested and a plastic package material which is packaged on the metal bracket;
step e, the non-contact detection cylinder measures and acquires a relative detection value for chips of the same packaging type, and before formal detection starts, the chips in a normal state with a certain sample size pass through the non-contact detection cylinder, so that the non-contact detection cylinder learns the metal bracket material and the size of the chips in the normal state, simultaneously measures the weight of plastic packaging materials which are plastically packaged on the metal bracket, and performs non-contact quality detection on the chips to be detected in batches according to sample data obtained by actual testing after learning;
and f, after the chip bearing component passes through the noncontact detection cylinder and is accommodated in the clamping supporting plate on the lower conveying device, the lifting grabbing device moves the bearing disc from the lower conveying device to the upper conveying device after the material taking device takes down the chip to be detected from the chip bearing component.
Compared with the prior art, the invention provides a non-contact chip quality detection device and a detection method, which have the following beneficial effects:
1. according to the scheme, the magnetic levitation detection mode is used for carrying out non-contact quality detection on the chip, the chip falls from a hollow tube in a free falling mode, three coils are wound on the hollow tube, the coil intervals at two ends are a fixed distance, the circuit is used for enabling the coils at two ends to operate in a high-frequency self-excitation mode, the effect that the circuit sends a pulse signal outwards when a metal object passes through the circuit is achieved, meanwhile, the exciting coil can respond to the corresponding pulse width of the size of the passing chip metal support to calibrate the whole quality of the chip at the back, the two coils act as falling speed detection on the metal support passing through the free falling mode, the falling speed of the free falling body is constant in normal condition, the falling speed is influenced when the chip collides with the tube wall or any other object in the middle of the free falling body, and whether the non-contact quality detection process is normal or not is verified through the detection on the passing speed.
2. The third coil is fixed at the middle part of the coils at two ends, the coils can move up and down freely and are fixed on the pressure sensor through the spring connecting piece, the coils constantly provide a fixed magnetic field, when a metal object passes through the coils, interaction force is generated between the coils and the magnetic field, so that corresponding values are obtained on the pressure sensor, and the measured values comprise a chip metal bracket and a plastic package material which is molded on the metal bracket.
3. The value obtained by measurement of the whole device is a relative value, and the detection of the chip is only limited to chips of the same packaging type. Before starting the test, the device needs to learn the material and the size of the metal bracket under the normal condition of the chip to be tested and measure the weight of the plastic package material which is molded on the metal bracket. And after learning is completed, carrying out non-contact quality detection on the chips to be detected in batches according to sample data obtained by testing.
Drawings
FIG. 1 is a schematic diagram of the whole structure of a noncontact chip quality inspection device according to the present invention;
FIG. 2 is a schematic structural view of a contactless detection cartridge according to the present invention;
FIG. 3 is a cross-sectional view of a noncontact testing cartridge of the present invention;
fig. 4 is a schematic structural view of an up-and-down transmission device according to the present invention;
FIG. 5 is a schematic view of a clamping pallet according to the present invention;
FIG. 6 is a schematic view of a sliding structure of a clamping pallet according to the present invention;
FIG. 7 is a schematic diagram of a chip carrier assembly according to the present invention;
FIG. 8 is a schematic view of the pallet release arrangement of the present invention;
FIG. 9 is a schematic diagram of a lifting grabbing device according to the present invention;
description of the reference numerals:
the non-contact type detection cylinder 1, a detection cylinder 11, an upper support plate 12, a lower support plate 13, a first fixed coil 14, a second fixed coil 15, a constant magnetic field movable coil 16, a force measuring spring 17, a pressure detection support plate 18 and a detection channel 19;
an upper conveyor 2, a first conveyor 21, a second conveyor 22, a conveyor support 23, and a conveyor drive assembly 24;
a lower conveying device 3;
the lifting grabbing device 4, the lifting supporting column 41, the lifting transmission belt 42, the supporting fork 43, the rotating seat 44, the rotating driving assembly 45 and the lifting driving assembly 46;
the clamping support plate 5, the first support plate 51, the accommodating groove 511, the second support plate 52, the sliding support seat 53, the return spring 54, the sliding guide rail 55 and the sliding seat 56;
the chip bearing assembly 6, the bearing disc 61, the vent holes 62, the chip accommodating part 63 and the chip 64 to be tested;
a support frame 7;
the device comprises a pallet release device 8, a first poking cylinder 81, a second poking cylinder 82, a first poking piece 83 and a second poking piece 84;
description of the embodiments
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The invention is described in detail below with reference to fig. 1-9, and the device for detecting the quality of a contactless chip of the invention comprises a contactless detection cylinder 1, an upper transmission device 2, a lower transmission device 3, a lifting grasping device 4, a clamping supporting plate 5, a chip bearing component 6 and a supporting plate releasing device 8, wherein the contactless detection cylinder 1 comprises a detection cylinder 11, a fixed coil and a movable coil which are wound on the outer side of the detection cylinder 11, and a chip 64 to be detected passes through a detection channel 19 in the middle of the detection cylinder 11 in a free falling manner;
the fixed coils at the two ends of the detection cylinder 11 operate in a high-frequency self-excitation mode, pulse signals are sent outwards when the chip 64 to be detected with the metal object passes through, and meanwhile, the fixed coils can make corresponding pulse width response to the size of the metal bracket of the passing chip and can be used as a calibration basis for the overall quality of the subsequent chip;
the movable coil is fixed on the pressure sensor through a spring connecting piece, the movable coil provides a fixed magnetic field, when the chip 64 to be tested with a metal object passes through the movable coil, an interaction force is generated with the fixed magnetic field, and the interaction force is obtained through the pressure sensor;
the upper transmission device 2 is positioned above the non-contact detection cylinder 1, the lower transmission device 3 is positioned below the non-contact detection cylinder 1, the structures of the upper transmission device 2 and the lower transmission device 3 are approximate, the upper transmission device 2 and the lower transmission device 3 are provided with clamping supporting plates 5, and the chip 64 to be detected is borne by the clamping supporting plates 5;
the upper conveying device 2 conveys the chip 64 to be tested to the upper end of the detection channel 19 of the contactless detection cylinder 1, and releases the chip 64 to be tested from the clamping support plate 5 through the support plate releasing device 8;
the lower conveying device 3 receives a chip 64 to be tested falling from the contactless detection cylinder 1, the chip 64 to be tested is accommodated in the chip bearing component 6, and the lifting grabbing device 4 realizes the cyclic conveying of the chip bearing component 6 between the lower conveying device 3 and the upper conveying device 2.
Further, the fixed coils comprise a first fixed coil 14 and a second fixed coil 15, the movable coil comprises a constant magnetic field movable coil 16, and the contactless detection cylinder 1 further comprises an upper support plate 12, a lower support plate 13, a force measuring spring 17 and a pressure detection support plate 18;
the upper support plate 12 is fixedly connected to the upper end of the detection cylinder 11, the lower support plate 13 is fixedly connected to the lower end of the detection cylinder 11, the first fixed coil 14 is positioned on the outer side of the upper portion of the detection cylinder 11, the second fixed coil 15 is positioned on the outer side of the lower portion of the detection cylinder 11, and the distance between the first fixed coil 14 and the second fixed coil 15 is fixed;
a pressure detection supporting plate 18 is arranged at the outer side of the detection cylinder 11 and positioned at the middle position of the first fixed coil 14 and the second fixed coil 15, and a constant magnetic field movable coil 16 is connected to the pressure detection supporting plate 18 through a force measuring spring 17;
the first fixed coil 14 and the second fixed coil 15 can detect the speed of the chip 64 with metal, which moves freely and is to be detected, and the speed is detected to verify whether the process of detecting the quality of the contactless chip is abnormal;
after the chip 64 to be tested passes through the movable coil 16 with a constant magnetic field, the pressure difference value generated by the movable coil 16 with a constant magnetic field on the force measuring spring 17 is read by a pressure sensor, and the pressure difference value can detect the metal bracket in the chip 64 to be tested and the plastic package material which is molded on the metal bracket.
Further, the upper conveyor 2 and the lower conveyor 3 are similar in structure and each include a first conveyor 21, a second conveyor 22, a conveyor support 23, and a conveyor drive assembly 24;
the first conveyor belt 21 and the second conveyor belt 22 are arranged side by side, the first conveyor belt 21 and the second conveyor belt 22 are arranged on the supporting frame 7 through the conveyor belt supporting frame 23, and the clamping supporting plate 5 is arranged at the position of the first conveyor belt 21 corresponding to the second conveyor belt 22;
the first conveyor belt 21 and the second conveyor belt 22 are driven by the conveyor belt drive assembly 24 to achieve a synchronous drive.
Further, the clamping pallet 5 comprises a first pallet 51, a second pallet 52, a sliding support seat 53, a return spring 54, a sliding guide rail 55 and a sliding seat 56;
the bottoms of the first supporting plate 51 and the second supporting plate 52 are fixed on the sliding seat 56, the sliding seat 56 is slidably arranged on the sliding supporting seat 53 through a sliding guide rail 55, and a return spring 54 is arranged between the sliding seat 56 and the sliding supporting seat 53;
the sliding support seat 53 is fixed at the corresponding positions of the first conveyor belt 21 and the second conveyor belt 22, and moves synchronously with the first conveyor belt 21 and the second conveyor belt 22;
the chip carrier assembly 6 includes a carrier tray 61, a vent hole 62, and a chip accommodating portion 63, where the chip 64 to be tested can be accommodated in the chip accommodating portion 63;
the first supporting plate 51 and the second supporting plate 52 are respectively provided with a containing groove 511 for containing the bearing disc 61, and the first supporting plate 51 and the second supporting plate 52 can move towards each other or away from each other so as to grasp and release the bearing disc 61;
the vent holes 62 allow air to pass through and ensure balance of the carrier plate 61 when the carrier plate 61 passes through the detection channel 19 of the noncontact detection cartridge 1.
Further, the pallet release device 8 comprises a first poking cylinder 81, a second poking cylinder 82, a first poking piece 83 and a second poking piece 84;
the upper support plate 12 and the lower support plate 13 of the non-contact detection cylinder 1 are respectively and fixedly arranged on the support frame 7, the first stirring cylinder 81 and the second stirring cylinder 82 are fixedly arranged on the support frame 7 and are positioned above the upper support plate 12, a first stirring piece 83 is arranged on a movable rod of the first stirring cylinder 81, a second stirring piece 84 is arranged on a movable rod of the second stirring cylinder 82, and the first stirring piece 83 and the second stirring piece 84 can stir the movement of the first supporting plate 51 and the second supporting plate 52 away from each other so as to release the bearing disc 61, and enable the bearing disc 61 to enter the detection channel 19 of the non-contact detection cylinder 1.
Further, the lifting grabbing device 4 comprises a lifting supporting column 41, a lifting driving belt 42, a supporting fork 43, a rotating seat 44, a rotating driving assembly 45 and a lifting driving assembly 46;
the lifting support column 41 is rotatably arranged on the support frame 7 through a rotating seat 44, a lifting transmission belt 42 is supported by rollers in the extending direction of the lifting support column 41, and a supporting fork 43 is arranged on the lifting transmission belt 42;
the rotation driving assembly 45 drives the rotation seat 44 and the lifting support column 41 to rotate so as to realize the change of the orientation of the fork 43; the lifting driving assembly 46 drives the lifting driving belt 42 to rotate so as to realize lifting of the supporting fork 43;
a gap exists between the first pallet 51 and the second pallet 52, and the lifting support column 41 can pass through the gap between the first pallet 51 and the second pallet 52 after the pallet fork 43 removes the chip carrier assembly 6 from the clamping pallet 5 on the lower conveyor 3.
The non-contact chip quality detection method, the detection device comprises the following steps:
step a, a feeding device places a chip 64 to be tested on a chip bearing component 6 on an upper conveying device 2, and the upper conveying device 2 conveys the chip bearing component 6 to the upper end of the non-contact detection cylinder 1;
step b, the pallet releasing device 8 toggles the clamping pallet 5 to release the chip carrying assembly 6, and the chip 64 to be tested enters the detection channel 19 of the contactless detection cylinder 1;
step c, the first fixed coil 14 and the second fixed coil 15 at the two ends of the detection cylinder 11 operate in a high-frequency self-excitation mode, pulse signals are sent outwards when the chip 64 with the metal object to be detected passes through, and meanwhile, the first fixed coil 14 and the second fixed coil 15 can make corresponding pulse width reactions to the size of the metal bracket of the chip passing through and can be used as a calibration basis for the whole quality of the subsequent chip; the first fixed coil 14 and the second fixed coil 15 can detect the speed of the chip 6 to be detected with metal, which moves freely, and the speed is detected to verify whether the process of detecting the quality of the contactless chip is abnormal or not;
step d, the constant magnetic field movable coil 16 provides a fixed magnetic field, when the chip 64 to be tested with a metal object passes through the constant magnetic field movable coil 16, an interaction force is generated between the chip and the fixed magnetic field, and after the pressure difference value generated by the constant magnetic field movable coil 16 on the force measuring spring 17 is read by a pressure sensor, the pressure difference value can detect the metal bracket in the chip 64 to be tested and the plastic package material which is molded on the metal bracket;
step e, the non-contact detection cylinder 1 measures and obtains a relative detection value for chips of the same packaging type, before formal detection starts, the chips in a normal state with a certain sample size pass through the non-contact detection cylinder 1, the non-contact detection cylinder 1 learns the material and the size of a metal bracket in the normal state of the chips, simultaneously measures the weight of plastic packaging materials which are packaged on the metal bracket, and performs non-contact quality detection on the chips 64 to be detected according to sample data obtained by actual test after learning;
and f, after the chip bearing assembly 6 passes through the noncontact detection cylinder 1 and is accommodated in the clamping supporting plate 5 on the lower conveying device 3, the lifting grabbing device 4 moves the bearing disc 61 from the lower conveying device 3 to the upper conveying device 2 after the material taking device takes the chip 64 to be detected off the chip bearing assembly 6.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a contactless chip quality detection device, includes that contactless detects section of thick bamboo (1), goes up transmission device (2), lower transmission device (3), goes up and down grabbing device (4), centre gripping layer board (5), chip carrier assembly (6) and layer board release (8), its characterized in that:
the non-contact detection cylinder (1) comprises a detection cylinder body (11), and a fixed coil and a movable coil which are wound on the outer side of the detection cylinder body (11), wherein a chip (64) to be detected passes through a detection channel (19) in the middle of the detection cylinder body (11) in a free falling manner;
the fixed coils at the two ends of the detection cylinder (11) operate in a high-frequency self-excitation mode, pulse signals are sent outwards when a chip (64) to be detected with a metal object passes through, and meanwhile, the fixed coils can make corresponding pulse width reactions to the size of a metal bracket of the passing chip and can be used as a calibration basis for the overall quality of a subsequent chip;
the movable coil is fixed on the pressure sensor through a spring connecting piece, the movable coil provides a fixed magnetic field, when a chip (64) to be tested with a metal object passes through the movable coil, an interaction force is generated with the fixed magnetic field, and the interaction force is obtained through the pressure sensor;
the upper transmission device (2) is positioned above the non-contact detection cylinder (1), the lower transmission device (3) is positioned below the non-contact detection cylinder (1), the structures of the upper transmission device (2) and the lower transmission device (3) are approximate, the upper transmission device (2) and the lower transmission device (3) are provided with clamping support plates (5), and the chip (64) to be detected is borne by the clamping support plates (5);
the upper conveying device (2) conveys the chip (64) to be detected to the upper end of a detection channel (19) of the non-contact detection cylinder (1), and releases the chip (64) to be detected from the clamping support plate (5) through the support plate releasing device (8);
the lower conveying device (3) receives a chip (64) to be detected falling from the non-contact detection barrel (1), the chip (64) to be detected is accommodated in the chip bearing component (6), and the lifting grabbing device (4) achieves circulating conveying of the chip bearing component (6) between the lower conveying device (3) and the upper conveying device (2).
2. The contactless chip quality detection device according to claim 1, wherein:
the fixed coil comprises a first fixed coil (14) and a second fixed coil (15), the movable coil comprises a constant magnetic field movable coil (16), and the non-contact detection cylinder (1) further comprises an upper support plate (12), a lower support plate (13), a force measuring spring (17) and a pressure detection support plate (18);
the upper support plate (12) is fixedly connected to the upper end of the detection cylinder (11), the lower support plate (13) is fixedly connected to the lower end of the detection cylinder (11), the first fixed coil (14) is positioned on the outer side of the upper portion of the detection cylinder (11), the second fixed coil (15) is positioned on the outer side of the lower portion of the detection cylinder (11), and the distance between the first fixed coil (14) and the second fixed coil (15) is fixed;
a pressure detection supporting plate (18) is arranged at the outer side of the detection cylinder body (11) and positioned at the middle position of the first fixed coil (14) and the second fixed coil (15), and a constant magnetic field movable coil (16) is connected to the pressure detection supporting plate (18) through a force measuring spring (17);
the first fixed coil (14) and the second fixed coil (15) can detect the speed of the chip (64) to be detected with metal, which moves freely, and the speed is detected to verify whether the process of the quality detection of the contactless chip is abnormal or not;
after the chip (64) to be tested passes through the constant magnetic field movable coil (16), the pressure difference value generated by the constant magnetic field movable coil (16) on the force measuring spring (17) is read through the pressure sensor, and the pressure difference value can be used for detecting the metal support in the chip (64) to be tested and the plastic package material which is molded on the metal support.
3. The contactless chip quality detection device according to claim 2, wherein:
the upper conveying device (2) and the lower conveying device (3) are similar in structure and comprise a first conveying belt (21), a second conveying belt (22), a conveying belt supporting frame (23) and a conveying belt driving assembly (24);
the first conveyor belt (21) and the second conveyor belt (22) are arranged side by side, the first conveyor belt (21) and the second conveyor belt (22) are arranged on the supporting frame (7) through the conveyor belt supporting frame (23), and the clamping supporting plate (5) is arranged at the position of the first conveyor belt (21) corresponding to the second conveyor belt (22);
the first conveyor belt (21) and the second conveyor belt (22) are driven by the conveyor belt driving assembly (24) to achieve synchronous transmission.
4. A contactless chip quality inspection device according to claim 3, wherein:
the clamping support plate (5) comprises a first support plate (51), a second support plate (52), a sliding support seat (53), a return spring (54), a sliding guide rail (55) and a sliding seat (56);
the bottoms of the first supporting plate (51) and the second supporting plate (52) are fixed on the sliding seat (56), the sliding seat (56) is slidably arranged on the sliding supporting seat (53) through a sliding guide rail (55), and a reset spring (54) is arranged between the sliding seat (56) and the sliding supporting seat (53);
the sliding support seat (53) is fixed at the corresponding positions of the first conveyor belt (21) and the second conveyor belt (22) and synchronously moves along with the first conveyor belt (21) and the second conveyor belt (22);
the chip bearing assembly (6) comprises a bearing disc (61), a vent hole (62) and a chip accommodating part (63), wherein the chip (64) to be tested can be accommodated in the chip accommodating part (63);
the first supporting plate (51) and the second supporting plate (52) are respectively provided with a containing groove (511) for containing the bearing disc (61), and the first supporting plate (51) and the second supporting plate (52) can move towards each other or away from each other so as to grasp and release the bearing disc (61);
the vent holes (62) allow air to pass through and ensure balance of the carrying disc (61) when the carrying disc (61) passes through the detection channel (19) of the non-contact detection cylinder (1).
5. The contactless chip quality detection device according to claim 4, wherein:
the supporting plate release device (8) comprises a first poking cylinder (81), a second poking cylinder (82), a first poking piece (83) and a second poking piece (84);
the utility model provides a contactless detection section of thick bamboo (1) go up backup pad (12), lower backup pad (13) fixed set up respectively in support frame (7), first stir jar (81), second stir jar (82) fixed set up in support frame (7) and be located go up the top of backup pad (12), be provided with first plectrum (83) on the movable rod of first stirring jar (81), be provided with second plectrum (84) on the movable rod of second stirring jar (82), first plectrum (83), second plectrum (84) can stir the removal that first layer board (51), second layer board (52) kept away from each other is in order to release loading tray (61), and make loading tray (61) get into detection passageway (19) of contactless detection section of thick bamboo (1).
6. The contactless chip quality detection device according to claim 5, wherein:
the lifting grabbing device (4) comprises a lifting supporting column (41), a lifting transmission belt (42), a supporting fork (43), a rotating seat (44), a rotary driving assembly (45) and a lifting driving assembly (46);
the lifting support column (41) is rotatably arranged on the support frame (7) through a rotating seat (44), a lifting transmission belt (42) is supported by rollers in the extending direction of the lifting support column (41), and a supporting fork (43) is arranged on the lifting transmission belt (42);
the rotary driving assembly (45) drives the rotary seat (44) and the lifting support column (41) to rotate so as to realize the change of the orientation of the supporting fork (43); the lifting driving assembly (46) drives the lifting driving belt (42) to rotate so as to realize lifting of the supporting fork (43);
a gap exists between the first supporting plate (51) and the second supporting plate (52), and after the supporting fork (43) removes the chip bearing assembly (6) from the clamping supporting plate (5) on the lower conveying device (3), the lifting supporting column (41) can pass through the gap between the first supporting plate (51) and the second supporting plate (52).
7. A method for detecting the quality of a contactless chip by using the detecting device according to any one of claims 1 to 6, characterized by comprising the steps of:
step a, a chip (64) to be detected is placed on a chip bearing component (6) on an upper conveying device (2) by a feeding device, and the upper conveying device (2) conveys the chip bearing component (6) to the upper end of the non-contact detection cylinder (1);
step b, the supporting plate releasing device (8) toggles the clamping supporting plate (5) to release the chip bearing assembly (6), and a chip (64) to be tested enters a detection channel (19) of the non-contact detection cylinder (1);
step c, the first fixed coil (14) and the second fixed coil (15) at the two ends of the detection cylinder (11) operate in a high-frequency self-excitation mode, pulse signals are sent outwards when a chip (64) to be detected with a metal object passes through, and meanwhile, the first fixed coil (14) and the second fixed coil (15) can make corresponding pulse width reactions on the size of a chip metal bracket passing through and can serve as a calibration basis for the overall quality of a subsequent chip; the first fixed coil (14) and the second fixed coil (15) can detect the speed of the chip (64) to be detected with metal, which moves freely, and the speed is detected to verify whether the process of the non-contact chip quality detection is abnormal or not;
step d, a fixed magnetic field is provided by a constant magnetic field movable coil (16), when a chip (64) to be tested with a metal object passes through the constant magnetic field movable coil (16), interaction force is generated between the chip and the fixed magnetic field, and after a pressure difference value generated by the constant magnetic field movable coil (16) on the force measuring spring (17) is read by a pressure sensor, the pressure difference value can detect a metal bracket in the chip (64) to be tested and a plastic package material which is molded on the metal bracket;
step e, the non-contact detection cylinder (1) measures and obtains a relative detection value aiming at chips of the same packaging type, before formal detection starts, the chips in a normal state with a certain sample quantity pass through the non-contact detection cylinder (1), the non-contact detection cylinder (1) learns the metal bracket material and the size of the chips in the normal state, simultaneously measures the weight of plastic packaging materials which are molded on the metal bracket, and performs non-contact quality detection on the chips (64) to be detected according to sample data obtained by actual test in batches after the learning is completed;
and f, after the chip bearing component (6) passes through the clamping supporting plate (5) which is accommodated on the lower conveying device (3) after the non-contact detection cylinder (1), and after the taking device takes the chip (64) to be detected off from the chip bearing component (6), the lifting grabbing device (4) moves the bearing disc (61) from the lower conveying device (3) to the upper conveying device (2).
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