JP3787644B2 - シリコンウエファ素子の処理条件の検出装置、モニター用素子及び検出方法 - Google Patents

シリコンウエファ素子の処理条件の検出装置、モニター用素子及び検出方法 Download PDF

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Publication number
JP3787644B2
JP3787644B2 JP20001094A JP20001094A JP3787644B2 JP 3787644 B2 JP3787644 B2 JP 3787644B2 JP 20001094 A JP20001094 A JP 20001094A JP 20001094 A JP20001094 A JP 20001094A JP 3787644 B2 JP3787644 B2 JP 3787644B2
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Japan
Prior art keywords
silicon wafer
manufacturing process
temperature
primary coil
detecting
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JP20001094A
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English (en)
Japanese (ja)
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JPH07106392A (ja
Inventor
ピー．ヤクラ ジェイムズ
ケイ．コール リチャード
エス．ボン ザン マスュー
ジェイ．ハス クリスタル
ディー．ジェイ．オールマン デリル
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NCR International Inc
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NCR International Inc
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Publication of JPH07106392A publication Critical patent/JPH07106392A/ja
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    • H10P72/0602—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/02—Means for indicating or recording specially adapted for thermometers
    • G01K1/024—Means for indicating or recording specially adapted for thermometers for remote indication
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H10P72/0432—

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)
JP20001094A 1993-09-20 1994-08-25 シリコンウエファ素子の処理条件の検出装置、モニター用素子及び検出方法 Expired - Lifetime JP3787644B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/123,664 1993-09-20
US08/123,664 US5466614A (en) 1993-09-20 1993-09-20 Structure and method for remotely measuring process data

Publications (2)

Publication Number Publication Date
JPH07106392A JPH07106392A (ja) 1995-04-21
JP3787644B2 true JP3787644B2 (ja) 2006-06-21

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ID=22410077

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20001094A Expired - Lifetime JP3787644B2 (ja) 1993-09-20 1994-08-25 シリコンウエファ素子の処理条件の検出装置、モニター用素子及び検出方法

Country Status (4)

Country Link
US (2) US5466614A (member.php)
EP (1) EP0644409B1 (member.php)
JP (1) JP3787644B2 (member.php)
DE (1) DE69428086T2 (member.php)

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US6030877A (en) * 1997-10-06 2000-02-29 Industrial Technology Research Institute Electroless gold plating method for forming inductor structures
US6278379B1 (en) * 1998-04-02 2001-08-21 Georgia Tech Research Corporation System, method, and sensors for sensing physical properties
DE19910983A1 (de) * 1999-03-12 2000-09-21 Bosch Gmbh Robert Vorrichtung und Verfahren zur Bestimmung der lateralen Unterätzung einer strukturierten Oberflächenschicht
JP4776783B2 (ja) 1999-05-07 2011-09-21 東京エレクトロン株式会社 基板処理方法及び基板処理装置
JP2001242014A (ja) * 2000-02-29 2001-09-07 Tokyo Electron Ltd 基板の温度測定方法および処理方法
US20020045237A1 (en) * 2000-03-29 2002-04-18 Gouzel Karimova Bacterial two-hybrid system for protein-protein interaction screening, new strains for use therein, and their applications
CA2414724C (en) * 2002-12-18 2011-02-22 Cashcode Company Inc. Induction sensor using printed circuit
TWI268429B (en) * 2003-11-29 2006-12-11 Onwafer Technologies Inc Systems, maintenance units and substrate processing systems for wirelessly charging and wirelessly communicating with sensor apparatus as well as methods for wirelessly charging and communicating with sensor apparatus
KR100601956B1 (ko) * 2004-06-28 2006-07-14 삼성전자주식회사 자기장의 변화를 이용한 온도측정장치
JP4859610B2 (ja) 2006-09-29 2012-01-25 富士通セミコンダクター株式会社 バッファ回路及びその制御方法
JP5049018B2 (ja) * 2007-01-09 2012-10-17 ソニーモバイルコミュニケーションズ株式会社 非接触充電装置
JP5478874B2 (ja) * 2008-12-02 2014-04-23 株式会社フィルテック 基板、基板保持装置、解析装置、プログラム、検出システム、半導体デバイス、表示装置、および半導体製造装置
US8226294B2 (en) * 2009-08-31 2012-07-24 Arizant Healthcare Inc. Flexible deep tissue temperature measurement devices
US8292495B2 (en) 2010-04-07 2012-10-23 Arizant Healthcare Inc. Zero-heat-flux, deep tissue temperature measurement devices with thermal sensor calibration
US8292502B2 (en) * 2010-04-07 2012-10-23 Arizant Healthcare Inc. Constructions for zero-heat-flux, deep tissue temperature measurement devices
US9354122B2 (en) 2011-05-10 2016-05-31 3M Innovative Properties Company Zero-heat-flux, deep tissue temperature measurement system
AU2013388629A1 (en) * 2013-05-03 2015-11-19 3M Innovative Properties Company System for monitoring temperature of electrical conductor
US20240201022A1 (en) * 2021-11-17 2024-06-20 Caretech Services Pty Ltd Temperature detector for a heat sensitive material

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Also Published As

Publication number Publication date
EP0644409B1 (en) 2001-08-29
DE69428086D1 (de) 2001-10-04
US5466614A (en) 1995-11-14
DE69428086T2 (de) 2002-03-28
JPH07106392A (ja) 1995-04-21
EP0644409A3 (member.php) 1995-04-19
EP0644409A2 (en) 1995-03-22
US5576224A (en) 1996-11-19

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