JP3784934B2 - Electronic component mounting method and apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting method and apparatus for mounting an electronic component on a printed circuit board or the like.
[0002]
[Prior art]
The so-called chip component is the most common electronic component mounted on the printed circuit board. As an aspect of mounting this chip component on a printed circuit board, the component is vacuum-sucked by a suction nozzle, and the suction nozzle position and rotation are controlled so that the component is transported to a predetermined location on the printed circuit board in an appropriate arrangement state. A device for mounting is known in the art.
[0003]
FIG. 6 shows the internal structure of such a component mounting apparatus. In the apparatus, there is provided a substrate transport unit 1 for transporting and positioning a printed circuit board, and a component in which chip components (hereinafter simply referred to as components) to be mounted on the transported printed circuit board (not shown) are stored. The supply unit 2 is fixed to the supply unit mounting base 3. Although one component supply unit 2 is shown in the figure, the number of component supply units corresponding to the type of component to be mounted is actually attached. The components are vacuum-sucked by a suction nozzle 5 provided at the lower part of the suction head 4. For this reason, an XY robot for moving the suction head 4 in the horizontal direction is provided, and although not shown in the drawing, a vertical moving means for moving the suction head 4 in the vertical direction is provided.
[0004]
FIG. 7 is a block diagram showing a system configuration of the electronic component mounting apparatus shown in FIG. The control unit 7 controls the suction controller 8, the X-axis controller 9, the Y-axis controller 10, the Z-axis controller 11, and the θ-axis controller 12 to drive the suction head drive unit 13 to control the position and rotation of the suction nozzle 5. I do. Then, the component 14 of the component supply unit 2 is transported and the component 14 is mounted on the printed circuit board 15 transported to a predetermined position by the printed circuit board transport unit 1. The controller 7 also controls the laser alignment sensor controller 17 connected by the RS422 interface 16 to drive the laser unit 18. The laser unit 18 includes a light emitting unit 18a that emits parallel belt-shaped laser beams and a light receiving unit 18b that receives the laser beams. Therefore, when the sucked component 14 is at the position where the laser beam passes, a projection image of the component 14 can be obtained in the light receiving unit 18b.
[0005]
FIG. 8 is a diagram illustrating a state in which the component 14 sucked by the suction nozzle 5 is lifted to a position where the laser beam of the laser unit 18 passes by the Z-axis controller and rotated along the θ axis around the Z axis. By this rotation, the minimum value of the length in the predetermined direction (horizontal direction) of the projection image of the component 14 is detected, and the position and rotation angle at that time are measured, whereby the X-axis direction and Y-axis direction of the component 14 are detected. And a deviation in the θ-axis direction is detected.
[0006]
Next, the processing procedure of the control unit 7 will be described with reference to the flowcharts shown in FIGS. For simplification of description, the mounting angle of the component 14 with respect to the substrate 15 is assumed to be 0 °.
[0007]
In FIG. 9, the control unit 7 performs a component suction control process of the suction nozzle 5 (step S1). More specifically, first, the Z-axis controller 11 is instructed to lower the suction head 4 from the home position along the Z-axis. When the tip of the suction nozzle 5 reaches the suction position, the Z-axis lowering is stopped, and the suction controller is stopped. 8 is instructed to suck the component 14.
[0008]
After the component suction, the Z-axis controller 11 is instructed to raise the Z-axis (step S2), and then whether or not the position of the sucked component 14 in the Z-axis direction has reached the detection area of the laser unit 18 by the laser beam. Is determined (step S3). When it does not reach the detection area, the suction head 4 continues to rise, and when it reaches the detection area, it instructs the Z-axis controller 11 to stop the Z-axis rise (step S4).
[0009]
Next, the control unit 7 resets the register (θ) that stores the value of the rotation angle of the suction nozzle 5 (step S5), and instructs the θ-axis controller 12 to rotate the suction nozzle 5 around the θ axis. (Step S6). The value of θ is controlled so as to change according to the rotation angle of the suction nozzle 5. The rotation in step S6 is performed in the direction corresponding to the reverse rotation, that is, in the direction in which the value of θ becomes negative, and is continued until the value of θ reaches −30 ° (step S7). When θ = −30 °, the controller 7 instructs the θ-axis controller 12 to stop the rotation of the suction nozzle 5 about the θ-axis (step S8).
[0010]
Thereafter, the control unit 7 starts detection of the width w of the component 14 by the laser unit 18 (step S9), and this time the suction head 5 rotates forward around the θ axis with respect to the θ axis controller 12, that is, the value of θ. Is instructed to perform rotation in the direction in which becomes positive (step S10). In FIG. 10, the control unit 7 determines the first minimum value and the second minimum value of the detection width w while performing the positive rotation around the θ axis of the suction nozzle 5 (steps S <b> 11 and S <b> 12). The forward rotation of the suction nozzle 5 around the θ axis is continued until the value reaches 120 ° (step S13). When the value of θ reaches 120 °, the rotation is stopped (step S14), the detection of the detection width w is ended (step S15), and the deflection angle (angular deviation) of the component 14 when sucked with respect to the reference direction, That is, the angle of the component 14 to be corrected (hereinafter referred to as a correction amount α) is finally obtained (step S16).
[0011]
Here, the manner of discriminating the first minimum value and the second minimum value and the manner of calculating the correction amount α will be described in detail with reference to FIG. 11, FIG. 12, and FIG.
First, when the correction amount α is 0 °, that is, when the component 14 is attracted by the suction nozzle 5 in a state matching the reference angle, the laser beam is generated as shown by the solid line in FIG. The component 14 is arranged in the detection area in a state parallel to the light beam bm. In this example, the laser beam passing direction is the reference angle direction, the clockwise direction in FIG. 11 is the forward rotation, and the counterclockwise direction is the reverse rotation. From this state, the component 14 is rotated reversely by −30 ° as shown by the arrow in steps S6 to S8, and is shown by a solid line in FIG.
[0012]
After the detection of the width w in step S8, the component 14 rotates forward as indicated by the arrows in FIGS. 11B, 11C, and 11D in steps S9 to S13, and the value of θ is The angle reaches 120 ° and the state as shown in FIG.
[0013]
FIG. 12 shows the relationship between the width w and θ of the component 14 obtained in the light receiving portion 18b in association with each state of the component 14 in FIGS. 11A to 11F, and the correction amount α = In this case of 0 °, w becomes the first minimum value wa in the state shown in FIG. 11A (θ = 0 °) where θ is reset in step S5. In the state of FIG. 11B (θ = −30 °), w becomes larger than the minimum value wa, and in the state of FIG. 11C, w again becomes the first minimum value wa. Further, in the state of FIG. 11D, w reaches the vicinity of the maximum value, and in the state of FIG. 11E, w becomes the second minimum value wb. In the state of FIG. 11F, w becomes larger than the minimum value wb.
[0014]
As can be seen from the above, when the component 14 is attracted by the suction nozzle 5 in a state matching the reference direction, θ is 0 ° when the first minimum value wa is detected during the forward rotation of the component 14. It is a habit of presenting. Therefore, the value of θ at the time when the first minimum value is detected in step S11 can be calculated as the correction amount α (that is, 0 ° in this case). In this case, the value of θ corresponding to the second minimum value should be 90 °, and the correction amount α is 0 when the value of θ at the time when the second minimum value is detected in step S12 is 90 °. It can be reconfirmed that it corresponds to °.
[0015]
On the other hand, when the correction amount α is a value other than 0 °, for example, when the component 14 is sucked by the suction nozzle 5 while being deviated by a predetermined angle in the counterclockwise direction from the reference direction, FIG. The component 14 is disposed in the detection area of the laser unit 18 in a state inclined with respect to the laser beam, as indicated by a one-dot chain line in A). From this state, the component 14 is reversely rotated by −30 ° as indicated by the arrow in steps S6 to S8, and is indicated by a one-dot chain line in FIG. Similarly, in steps S9 to S13, the component 14 rotates forward as indicated by the arrows in FIGS. 11B, 11C, and 11D, and the value of θ reaches 120 °, and FIG. It becomes a state as shown in.
[0016]
FIG. 13 shows the relationship between the width w and θ of the component 14 obtained in the light receiving unit 18b in association with the states of the component 14 in FIGS. 11A to 11F in this case, and the correction amount In this case of α ≠ 0 ° (α> 0 °), in the state shown in FIG. 11A where θ is first reset in step S5 (θ = 0 °), w is a component smaller than the first minimum value wa. The value is increased by 14 deviation angles. Then, from this value, w becomes a larger value in the state of FIG. 11B (θ = −30 °), w gradually decreases due to the forward rotation, and when in the state of FIG. 11C, w becomes the first value again. The minimum value wa of. Further, in the state of FIG. 11D, w reaches the vicinity of the maximum value, and in the state of FIG. 11E, w becomes the second minimum value wb. In the state of FIG. 11 (F), w becomes a value larger than the minimum value wb.
[0017]
As can be seen from the above, when the component 14 is sucked by the suction nozzle 5 while being tilted from the reference direction, θ is not 0 ° when the first minimum value wa is detected, and the tilt of the component is not detected. It should exhibit a value corresponding to the angle. Therefore, the value of θ at the time when the first minimum value is detected in step S11 can be calculated as the correction amount α. In this case, the value of θ corresponding to the second minimum value should be α + 90 °, and the correction amount α is reconfirmed by subtracting 90 ° from the value of θ when the second minimum value is detected in step S12. You can also
Assuming that θ at the time when the first and second minimum values are detected is a reference angle, by detecting this reference angle, the amount of deviation (X, Y) in the X direction, Y direction, and θ direction of the component 14 when picked up is detected. Y, θ) can be measured.
[0018]
Even when α <0 °, the value of α can be obtained in the same manner as the principle described with reference to FIG.
[0019]
The first and second minimum values can be determined by looking at changes in the sample value of the light reception output of the light receiving unit 18b. Before and after the detection of the first and second minimum values, the component 14 is rotated until θ = −30 °, or rotated until θ = 120 °. This is because the empirical rule indicates that the range is less than ± 30 °, and thus the first and second minimum values can be reliably detected by rotation in the angle range of −30 ° to 120 °.
[0020]
Returning to the flowchart of FIG. 5 again, when the correction amount α is obtained as described above, the control unit 7 moves the suction nozzle 5 to the θ-axis controller 12 from the state of FIG. Instructed to rotate backward (step S17), and θ = −120 ° + α to make the component 14 have a mounting angle (0 ° in this case) according to the correction amount α obtained in step S16. The reverse rotation is continued until it reaches θ = −120 ° + α (step S19).
[0021]
After step S21, although not shown in the flow, the control unit 7 instructs the Z-axis controller 11 to lower the Z-axis, and when the component 14 reaches a predetermined mounting position, the controller 14 stops the lowering of the Z-axis. Complete the installation.
[0022]
[Problems to be solved by the invention]
In the mounting apparatus as described above, as a preliminary rotation operation, the suction nozzle 5 is reversely rotated by −30 ° by the steps S6 and S7 (first stroke), and then the steps S10 and S10 are performed to detect the first and second minimum values. The suction nozzle 5 is normally rotated over + 150 ° by S13 (second stroke), and the suction nozzle 5 is reversely rotated by −120 ° + α by steps S17 and S18 to return the component 14 to the mounting angle (third stroke). ), A series of rotation control is performed. However, when such a reversing operation is performed, the control of the motor that drives the suction nozzle 5 in the θ-axis direction becomes complicated, and the overall time required until the component 14 finally reaches a desired angle is increased. There is a problem that it takes a lot.
[0023]
More specifically, in any of the first to third strokes, the motor must first be accelerated and then decelerated after passing through a constant speed region, and in principle, the motor is controlled. It takes a long time to finish. For example, when the rotation angle of the correction amount α in the third stroke is controlled separately from the reverse rotation control of −120 ° when the mounting angle of the component to the board is 0 °, 80 msec in the first stroke, The second stroke takes 130 msec, the -120 ° reverse rotation control in the third stroke takes -110 msec, and the rotation control takes a correction amount α (for example, + 5 °) in the third stroke. A total of 360 msec is used from the start to the determination of the angle of the component with respect to the board.
[0024]
An object of the present invention is to reduce the time required for such component mounting.
[0025]
[Means for Solving the Problems]
The method according to the present invention is a mounting method for an electronic component that uses a suction nozzle that sucks an electronic component, controls the position and rotation of the suction nozzle, and mounts the electronic component at a predetermined position on a substrate at a reference angle. In the process of rotating the sucked electronic component in the same direction, the projection width of the electronic component is detected, and the deviation angle between the reference angle and the sucked electronic component mounting angle is determined based on the detected projection width. A correction amount to be corrected is calculated, and the calculated correction amount is included in the rotation.
[0026]
An apparatus according to the present invention is a mounting device for an electronic component that includes a suction nozzle that sucks an electronic component, controls the position and rotation of the suction nozzle, and mounts the electronic component at a predetermined position on a substrate at a reference angle. The rotation control means for rotating the electronic component sucked by the nozzle in the same direction, the detection means for detecting the projection width of the electronic component rotated by the rotation control means, and the projection width of the electronic component detected by the detection means And a calculation means for calculating a correction amount for correcting a deviation angle between the reference angle and the mounted electronic component mounting angle based on the rotation angle, and the rotation control means includes the correction amount calculated by the calculation means in the rotation. Features.
[0027]
According to the present invention, when the electronic component is mounted at a predetermined angle on the substrate at a reference angle by controlling the position and rotation of the suction nozzle, the electronic component is rotated while rotating the electronic component sucked by the suction nozzle in the same direction. A correction amount for correcting a deviation angle between the reference angle and the attached electronic component mounting angle is calculated based on the detected projection width, and the correction amount is included in the rotation. Therefore, it is possible to eliminate the switching of the rotation direction of the suction nozzle accompanied by acceleration or deceleration that requires a long time, and to reduce the time required for component mounting.
[0028]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 shows a procedure of a component mounting method according to an embodiment of the present invention. In practice, the control unit 7 executes software processing of such a procedure. Note that the hardware configuration in the present embodiment is the same as that shown in FIGS. 1 to 3, and the following description will be made on the assumption of the relationship between the control unit 7 and its related controlled object.
[0029]
In FIG. 1, the control unit 7 performs a component suction control process of the suction nozzle 5 (step S21). This process is the same as step S1 described above.
[0030]
After the component suction, the control unit 7 resets the register (θ) that stores the value of the rotation angle of the suction nozzle 5 (step S22) and instructs the Z-axis controller 11 to raise the Z-axis of the suction nozzle 5 ( Step S23). The value of θ is controlled so as to change according to the rotation angle of the suction nozzle 5. The control unit 7 instructs the θ-axis controller 12 to rotate the suction nozzle 5 around the θ-axis together with the Z-axis raising control of the suction nozzle 5 (step S24), and the position of the sucked component 14 in the Z-axis direction is determined. It is determined whether or not the detection area by the laser beam of the laser unit 18 has been reached (step S25). When the detection area has not been reached, the suction head 4 continues to be raised and rotated. When the detection area has been reached, the Z-axis controller 11 is instructed to stop raising the Z-axis (step S26).
[0031]
Here, the rotation in step S24 is performed in a direction corresponding to the positive rotation, that is, a direction in which the value of θ is positive.
[0032]
After step S26, the control unit 7 in FIG. 2 starts detection of the projection width w of the component 14 by the laser unit 18 (step S27), and continues the positive rotation around the θ axis of the suction nozzle 5 while continuing the projection width. The first minimum value and the second minimum value of w are discriminated (steps S28 and S29). When the value of θ reaches 210 ° (step S30), the detection of the projection width w is ended (step S31), and the reference direction is determined. The eccentric angle (angle deviation) of the component 14 when sucked is detected, and the angle (correction amount α) of the component 14 to be corrected is obtained by calculation from the detection result (step S32).
[0033]
Here, the manner of discriminating the first minimum value and the second minimum value and the manner of calculating the correction amount α will be described in detail with reference to FIG. 3, FIG. 4 and FIG.
[0034]
First, when the correction amount α is 0 °, that is, when the component 14 is sucked by the suction nozzle 5 in a state that matches the reference angle, the laser beam is generated as shown by the solid line in FIG. The component 14 is arranged in the detection area in a state parallel to the light beam bm. In this example, the laser beam passing direction is the reference angle direction, and the clockwise direction in FIG. This reference angle corresponds to the mounting angle 0 ° of the component 14 with respect to the board.
[0035]
In this state shown in FIG. 3A, θ = 0 °. From this state, the component 14 is rotated as indicated by an arrow in step S24, and it is determined in step S25 that the component 14 has entered the detection area. In this case, θ = 60 °, and the component 14 is indicated by a solid line in FIG.
[0036]
Then, even after the start of detection of the projection width w in step S27, the forward rotation is continued, and the component 14 rotates forward as indicated by the arrows in FIGS. 3B, 3C, and 3D by the steps S28 to S30. Then, when the value of θ reaches 210 °, the state shown in FIG.
[0037]
FIG. 4 shows the relationship between the width w and θ of the component 14 obtained in the light receiving portion 18b in association with each state of the component 14 in FIGS. 3A to 3E, and the correction amount α = In this case of 0 °, w becomes the second minimum value wa in the state of FIG. 3A (θ = 0 °) where θ is reset in step S22. In the state of FIG. 3B (θ = 60 °), w approaches the first minimum value wa, and in the state of FIG. 3C, w becomes the first minimum value wa. Further, in the state of FIG. 3D, w becomes the second minimum value wb, and in the state of FIG. 3E, w becomes larger than the second minimum value wb.
[0038]
As can be seen from the above, when the component 14 is sucked by the suction nozzle 5 in a state matching the reference direction, the first minimum value wa is detected first from the start of detection of w during the forward rotation of the component 14. The angle θ should be 90 °. Therefore, a value obtained by subtracting 90 ° from the value of θ at the time when the first minimum value is detected in step S28 can be calculated as the correction amount α (that is, 0 ° in this case). In this case, the value of θ when the second minimum value is first detected from the start of detection of w should be 180 °, and the value of θ at the time when the second minimum value is detected in step S29 is 180. It can be reconfirmed that the correction amount α corresponds to 0 ° when the angle is °.
[0039]
On the other hand, when the correction amount α is a value other than 0 °, for example, when the component 14 is sucked by the suction nozzle 5 while being deviated by a predetermined angle in the counterclockwise direction from the reference direction, FIG. The component 14 is disposed in the detection area of the laser unit 18 in a state inclined with respect to the laser beam, as indicated by a one-dot chain line in A). From this state, the component 14 is rotated as indicated by the arrow in step S24, and similarly, the component 14 is rotated forward as indicated by the arrows in FIGS. 3B, 3C, and 3D by steps S27 to S30. , Θ reaches 210 °, resulting in a state as shown in FIG.
[0040]
FIG. 5 shows the relationship between the projection width w and θ of the component 14 obtained in the light receiving unit 18b in association with each state of the component 14 in FIGS. 3A to 3E in this case. In this case where the amount α ≠ 0 ° (α> 0 °), first, in the state shown in FIG. 3A (θ = 0 °) in which θ is reset in step S22, w is the same as the deviation angle of the component 14. The value is out of the two minimum values wb. From this value, w approaches the first minimum value wa in the state of FIG. 3B (θ = 60 °), and in the state of FIG. 3C, w becomes the first minimum value wa. Further, in the state of FIG. 3D, w becomes the second minimum value wb, and in the state of FIG. 3E (θ = 210 °), w passes through the second minimum value wb.
[0041]
As can be seen from the above, when the component 14 is attracted by the suction nozzle 5 while being inclined from the reference direction, θ does not become 0 ° when the component 14 exhibits the first minimum value wa. It should have a value corresponding to the inclination angle. Therefore, a value obtained by subtracting 90 ° from the value of θ at the time when the first minimum value is detected in step S28 can be calculated as the correction amount α. In this case, the value of θ corresponding to the second minimum value detected in step S29 should be α + 180 °, and the correction amount α can be reconfirmed by subtracting 180 ° from the value of θ.
[0042]
Assuming that θ at the time when the first and second minimum values are detected is a reference angle, by detecting this reference angle, the amount of deviation (X, Y) in the X direction, Y direction, and θ direction of the component 14 when picked up is detected. Y, θ) can be measured.
[0043]
Even when α <0 °, the value of α can be obtained in the same manner as the principle described with reference to FIG.
[0044]
The first and second minimum values can be determined by looking at changes in the sample value of the light reception output of the light receiving unit 18b.
[0045]
The detection of the first and second minimum values is started after θ = 60 °, and the detection is terminated after θ = 210 ° is reached. This is because the empirical rule indicates that the range is less than ± 30 °, and therefore the first and second minimum values can be reliably detected by rotation in the angle range of θ = 60 ° to 210 °.
[0046]
Returning to the flowchart of FIG. 2 again, when the correction amount α is obtained as described above, the control unit 7 sets the component 14 to the mounting angle θs with respect to the board in accordance with the correction amount α obtained in step S32. The rotation is further continued until θ = 360 ° + θs + α is reached (step S33), and when θ = 360 ° + θs + α is reached, the rotation is stopped (step S34).
[0047]
Although not shown in the flow after step S34, the control unit 7 instructs the Z-axis controller 11 to lower the Z-axis, and when the component 14 reaches a predetermined mounting position, the control unit 7 stops the lowering of the Z-axis. 14 is completed.
[0048]
FIG. 3 (F) and FIGS. 4 and 5 show the case where θs is 0 °. In FIG. 4 where the correction amount α = 0 °, the component 14 satisfies the mounting angle θs (0 °) when θ = 360 °. In FIG. 5 where the correction amount α> 0 °, the component 14 satisfies the mounting angle θs (0 °) when θ = α + 360 °. Both are finally led to the state shown in FIG.
[0049]
In step S33, processing is performed when θs is 0 °. However, when θs is 90 °, when the angle reaches θ = α + 360 ° + 90 °, the component 14 is mounted at the mounting angle θs ( 90 °) and θs is 210 °, the component 14 satisfies the mounting angle θs (210 °) when θ = α + 360 ° + 210 °. When θs is −150 °, when θ = α + 360 ° −150 °, that is, θ = α + 210 °, the component 14 satisfies the mounting angle θs (150 °), and when θs is −90 °, When θ = α + 360 ° −90 °, that is, when θ = α + 270 ° is reached, the component 14 satisfies the mounting angle θs (−90 °). Thus, the final rotation angle for stopping the rotation of the suction nozzle is determined according to θs, and the value is set to a value that does not cause unnecessary rotation. The same applies to values of θs other than those described above.
[0050]
As described above, the control unit 7 detects the rotation control unit that rotates the suction nozzle 5 in a predetermined direction, the detection unit that detects the projection width w of the component 14 in the rotation state of the sucked component 14 in the predetermined direction, Based on the projection width, a calculation means for calculating a correction amount for accurately mounting the component 14 at a predetermined position on the printed circuit board 15 is configured. Then, by continuously rotating the suction nozzle 5 from start to finish without rotating the component 14 in the reverse direction, the projection width w of the component 14 is detected and returned to the mounting direction with respect to the substrate. This simplifies the control mode by eliminating the reversing operation of the motor that drives the suction nozzle 5 in the θ-axis direction. Therefore, in this embodiment, the overall time required until the component 14 finally reaches a desired angle can be reduced.
[0051]
Explaining in detail in comparison with the above-described conventional example, in the period from the suction of the component to the stop of the rotation of the suction nozzle, the rotation drive motor of the suction nozzle is accelerated only once in the first period. The deceleration control is also performed only once at the end of the period, and the opportunity to reduce the speed is fundamentally minimized, so that the end of the motor control can be accelerated. For example, when the mounting angle of the component with respect to the board is 0 ° and the correction amount α is + 5 °, in this embodiment, the time required for the entire control from the start to the stop of the motor is 220 msec. Have gained. In the conventional example, as described above, the time of 360 msec is required, so that the time required for component mounting can be greatly reduced. That is, since the required time is reduced by 140 msec per mounting of one component, for example, if such mounting is performed sequentially in time series, the number of all components to be mounted on one board is 1000 Since the time of 140 seconds is reduced, and this reduction is effective for each substrate, it is extremely beneficial from the viewpoint of so-called manufacturing cost.
[0052]
In addition, in the said embodiment, although the aspect which rotates a suction nozzle forward was described, this invention is applicable also to the aspect rotated reversely. In short, one of the features of the present invention is that the suction nozzle is continuously rotated in the same predetermined direction after the projection width of the component is detected, and a correction amount is added during the rotation.
[0053]
【The invention's effect】
As described above in detail, according to the present invention, it is possible to eliminate the switching of the rotation direction of the suction nozzle and reduce the time required for component mounting.
[Brief description of the drawings]
FIG. 1 is a first half flowchart illustrating a processing procedure of suction nozzle rotation control executed by a control unit in a component mounting apparatus according to an embodiment of the present invention.
FIG. 2 is a second half flowchart showing a processing procedure of suction nozzle rotation control executed by a control unit in the component mounting apparatus according to the embodiment of the present invention.
FIG. 3 is a plan view showing a rotation mode in a detection area of a mounted component in an embodiment according to the present invention.
FIG. 4 is a graph showing the relationship between the width w of the mounted component and the rotation angle θ obtained in the light receiving unit when the correction amount α = 0 ° in one embodiment of the present invention.
FIG. 5 is a graph showing the relationship between the width w of the mounted component and the rotation angle θ obtained in the light receiving unit when the correction amount α ≠ 0 ° in the embodiment according to the present invention.
FIG. 6 is a perspective view showing an internal structure of a component mounting apparatus according to an embodiment of the present invention and a conventional example.
7 is a block diagram showing a system configuration of the mounting apparatus shown in FIG. 6;
FIG. 8 is an enlarged perspective view of an adsorption nozzle and a laser unit that adsorb components.
FIG. 9 is a first half flowchart illustrating a procedure of a conventional electronic component mounting process.
FIG. 10 is a second half flowchart illustrating a procedure of a conventional electronic component mounting process.
FIG. 11 is a plan view showing a rotation mode in a detection area of a mounted part in a conventional example.
FIG. 12 is a graph showing the relationship between the width w of the mounted component and the rotation angle θ obtained in the light receiving unit when the correction amount α = 0 ° in the conventional example.
FIG. 13 is a graph showing the relationship between the width w of the mounted component and the rotation angle θ obtained in the light receiving unit when the correction amount α ≠ 0 ° in the conventional example.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Board | substrate conveyance part 2 Component supply part 3 Supply part mounting stand 4 Suction head 4
5 Suction nozzle 5
6 XY Robot 7 Control Unit 8 Suction Controller 9 X-axis Controller 10 Y-axis Controller 11 Z-axis Controller 12 θ-axis Controller 13 Suction Head Drive Unit 14 Component 15 Printed Circuit Board 16 RS422 Interface 17 Laser Alignment Sensor Controller 18 Laser Unit 18a Light Emitting Unit 18b Light receiving section

Claims (3)

A mounting method for an electronic component that uses a suction nozzle that sucks an electronic component, controls the position and rotation of the suction nozzle, and mounts the electronic component on a predetermined position of a substrate at a reference angle,
In the process of rotating the electronic component sucked by the suction nozzle in the same direction, the projection width of the electronic component is detected, and the reference angle of the electronic component sucked by the reference angle is detected based on the detected projection width. An electronic component mounting method comprising: calculating a correction amount for correcting a deviation angle from an angle, and including the calculated correction amount in rotation. An electronic component mounting device that includes a suction nozzle that sucks an electronic component, controls the position and rotation of the suction nozzle, and mounts the electronic component on a predetermined position of a substrate at a reference angle.
Rotation control means for rotating the electronic component sucked by the suction nozzle in the same direction;
Detecting means for detecting a projection width of the electronic component rotated by the rotation control means;
Calculation means for calculating a correction amount for correcting a deviation angle between the reference angle and the angle of the sucked electronic component based on the projection width of the electronic component detected by the detection means;
The electronic component mounting apparatus, wherein the rotation control means includes the correction amount calculated by the calculation means in the rotation.   3. The electronic component mounting apparatus according to claim 2, wherein the rotation control unit starts rotation of the suction nozzle immediately after suction of the electronic component by the suction nozzle.

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