JP3774716B2 - 超音波ボンディング装置、その装置に使用する多周波超音波発生器、その多周波超音波発生方法 - Google Patents
超音波ボンディング装置、その装置に使用する多周波超音波発生器、その多周波超音波発生方法 Download PDFInfo
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- JP3774716B2 JP3774716B2 JP2003413142A JP2003413142A JP3774716B2 JP 3774716 B2 JP3774716 B2 JP 3774716B2 JP 2003413142 A JP2003413142 A JP 2003413142A JP 2003413142 A JP2003413142 A JP 2003413142A JP 3774716 B2 JP3774716 B2 JP 3774716B2
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- 238000000034 method Methods 0.000 title claims description 16
- 238000002604 ultrasonography Methods 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 description 11
- 230000008569 process Effects 0.000 description 9
- 230000008901 benefit Effects 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000010355 oscillation Effects 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000011295 pitch Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
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- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
- Wire Bonding (AREA)
Description
11 超音波ホーン
12 キャピラリ
13 超音波振動子
14 取付フランジ
15 超音波発振器
16,16′ インダクタンス成分
161〜16n コイル(インダクタンス成分)
17 制御部
181〜18n スイッチ
18a,18b 切替スイッチ
Claims (4)
- キャピラリを設けた超音波ホーンに超音波振動子が設けられ、超音波発振器から該超音波振動子に超音波電圧を加える超音波ボンディング装置において、
多数のコイルが前記超音波発振器と前記超音波振動子との間に設けられ、該超音波発振器からの超音波電圧を、前記多数のコイルから選択されて得られたインダクタンス成分を通して前記超音波振動子に印加することによって、該超音波振動子の機械的共振点とは異なる周波数に電気的共振点を発生させ、ボンディングに適した電気的共振点に設定することを特徴とする超音波ボンディング装置。 - 前記超音波電圧を、制御部により前記多数のコイルから選択して得られたインダクタンス成分を通して前記超音波振動子に印加し、ボンディング時のリードの共振を防止することを特徴とする請求項1に記載の超音波ボンディング装置。
- 超音波発振器の一電極がインダクタンス成分として作用する機能部品の一端に接続され、該機能部品の他端が超音波振動子の一電極に接続され、該超音波振動子の他電極が前記超音波発振器の他電極に接続され、かつ前記機能部品のインダクタンス値を選択する制御部を有し、前記超音波発振器からの超音波電圧を前記機能部品を通して該超音波振動子に印加し、該超音波振動子が該超音波振動子の機械的共振点以外の電気的共振点を発生させることを特徴とする超音波ボンディング装置の多周波超音波発生器。
- 超音波発振器からの超音波電圧が、超音波発振器と超音波振動子とに直列に設けられた多数のコイルから選択されて得られたインダクタンス成分を通して超音波振動子に印加され、該超音波振動子の機械的共振点の周波数とは異なる電気的共振周波数を発生させることを特徴とする多周波超音波発生方法。
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JP2003413142A JP3774716B2 (ja) | 2003-12-11 | 2003-12-11 | 超音波ボンディング装置、その装置に使用する多周波超音波発生器、その多周波超音波発生方法 |
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JP2003413142A JP3774716B2 (ja) | 2003-12-11 | 2003-12-11 | 超音波ボンディング装置、その装置に使用する多周波超音波発生器、その多周波超音波発生方法 |
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JP2005175201A JP2005175201A (ja) | 2005-06-30 |
JP3774716B2 true JP3774716B2 (ja) | 2006-05-17 |
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JP2003413142A Expired - Lifetime JP3774716B2 (ja) | 2003-12-11 | 2003-12-11 | 超音波ボンディング装置、その装置に使用する多周波超音波発生器、その多周波超音波発生方法 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021143970A1 (de) * | 2020-01-13 | 2021-07-22 | Hesse Gmbh | Vorrichtung und verfahren für das ultraschallbonden |
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- 2003-12-11 JP JP2003413142A patent/JP3774716B2/ja not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021143970A1 (de) * | 2020-01-13 | 2021-07-22 | Hesse Gmbh | Vorrichtung und verfahren für das ultraschallbonden |
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