JP3722731B2 - レーザ加工方法 - Google Patents

レーザ加工方法 Download PDF

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Publication number
JP3722731B2
JP3722731B2 JP2001278752A JP2001278752A JP3722731B2 JP 3722731 B2 JP3722731 B2 JP 3722731B2 JP 2001278752 A JP2001278752 A JP 2001278752A JP 2001278752 A JP2001278752 A JP 2001278752A JP 3722731 B2 JP3722731 B2 JP 3722731B2
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Japan
Prior art keywords
workpiece
laser
along
region
laser beam
Prior art date
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Expired - Lifetime
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JP2001278752A
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English (en)
Japanese (ja)
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JP2002192369A (ja
JP2002192369A5 (enrdf_load_stackoverflow
Inventor
文嗣 福世
憲志 福満
直己 内山
敏光 和久田
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Hamamatsu Photonics KK
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Hamamatsu Photonics KK
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Publication date
Application filed by Hamamatsu Photonics KK filed Critical Hamamatsu Photonics KK
Priority to JP2001278752A priority Critical patent/JP3722731B2/ja
Publication of JP2002192369A publication Critical patent/JP2002192369A/ja
Publication of JP2002192369A5 publication Critical patent/JP2002192369A5/ja
Application granted granted Critical
Publication of JP3722731B2 publication Critical patent/JP3722731B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
JP2001278752A 2000-09-13 2001-09-13 レーザ加工方法 Expired - Lifetime JP3722731B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001278752A JP3722731B2 (ja) 2000-09-13 2001-09-13 レーザ加工方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000278306 2000-09-13
JP2000-278306 2000-09-13
JP2001278752A JP3722731B2 (ja) 2000-09-13 2001-09-13 レーザ加工方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2002097725A Division JP3867003B2 (ja) 2000-09-13 2002-03-29 レーザ加工方法
JP2005207559A Division JP4837320B2 (ja) 2000-09-13 2005-07-15 加工対象物切断方法

Publications (3)

Publication Number Publication Date
JP2002192369A JP2002192369A (ja) 2002-07-10
JP2002192369A5 JP2002192369A5 (enrdf_load_stackoverflow) 2005-09-02
JP3722731B2 true JP3722731B2 (ja) 2005-11-30

Family

ID=26599877

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001278752A Expired - Lifetime JP3722731B2 (ja) 2000-09-13 2001-09-13 レーザ加工方法

Country Status (1)

Country Link
JP (1) JP3722731B2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8314013B2 (en) 2002-03-12 2012-11-20 Hamamatsu Photonics K.K. Semiconductor chip manufacturing method

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4659300B2 (ja) 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
WO2003038880A1 (fr) 2001-10-31 2003-05-08 Mitsuboshi Diamond Industrial Co., Ltd. Procede de formation de chemin de decoupe sur une tranche de semi-conducteur, et dispositif pour former un chemin de decoupe
TWI326626B (en) 2002-03-12 2010-07-01 Hamamatsu Photonics Kk Laser processing method
ES2356817T3 (es) 2002-03-12 2011-04-13 Hamamatsu Photonics K.K. Método de corte de un objeto procesado.
TWI520269B (zh) 2002-12-03 2016-02-01 Hamamatsu Photonics Kk Cutting method of semiconductor substrate
FR2852250B1 (fr) 2003-03-11 2009-07-24 Jean Luc Jouvin Fourreau de protection pour canule, un ensemble d'injection comportant un tel fourreau et aiguille equipee d'un tel fourreau
EP1609559B1 (en) 2003-03-12 2007-08-08 Hamamatsu Photonics K. K. Laser beam machining method
JP2004299969A (ja) * 2003-03-31 2004-10-28 Toshiba Ceramics Co Ltd シリカガラスのスライス方法
KR101121495B1 (ko) * 2003-05-12 2012-03-15 가부시키가이샤 토쿄 세이미쯔 판상부재의 분할방법 및 분할장치
JP4640174B2 (ja) * 2003-05-22 2011-03-02 株式会社東京精密 レーザーダイシング装置
JP4563097B2 (ja) 2003-09-10 2010-10-13 浜松ホトニクス株式会社 半導体基板の切断方法
JP2007235068A (ja) 2006-03-03 2007-09-13 Tokyo Seimitsu Co Ltd ウェーハ加工方法
JP2007235069A (ja) 2006-03-03 2007-09-13 Tokyo Seimitsu Co Ltd ウェーハ加工方法
US9346130B2 (en) 2008-12-17 2016-05-24 Electro Scientific Industries, Inc. Method for laser processing glass with a chamfered edge
US8341976B2 (en) 2009-02-19 2013-01-01 Corning Incorporated Method of separating strengthened glass
US8327666B2 (en) 2009-02-19 2012-12-11 Corning Incorporated Method of separating strengthened glass
WO2010098186A1 (ja) 2009-02-25 2010-09-02 日亜化学工業株式会社 半導体素子の製造方法
JP5340807B2 (ja) * 2009-05-21 2013-11-13 株式会社ディスコ 半導体ウエーハの加工方法
JP5340806B2 (ja) * 2009-05-21 2013-11-13 株式会社ディスコ 半導体ウエーハのレーザ加工方法
JP5340808B2 (ja) * 2009-05-21 2013-11-13 株式会社ディスコ 半導体ウエーハのレーザ加工方法
EP2480507A1 (en) 2009-08-28 2012-08-01 Corning Incorporated Methods for laser cutting articles from chemically strengthened glass substrates
US9828278B2 (en) 2012-02-28 2017-11-28 Electro Scientific Industries, Inc. Method and apparatus for separation of strengthened glass and articles produced thereby
WO2013130549A1 (en) 2012-02-28 2013-09-06 Electro Scientific Industries, Inc. Method and apparatus for separation of strengthened glass and articles produced thereby
US10357850B2 (en) * 2012-09-24 2019-07-23 Electro Scientific Industries, Inc. Method and apparatus for machining a workpiece
US20130221053A1 (en) * 2012-02-28 2013-08-29 Electro Scientific Industries, Inc. Method and apparatus for separation of strengthened glass and articles produced thereby
WO2013130608A1 (en) * 2012-02-29 2013-09-06 Electro Scientific Industries, Inc. Methods and apparatus for machining strengthened glass and articles produced thereby
US9776906B2 (en) 2014-03-28 2017-10-03 Electro Scientific Industries, Inc. Laser machining strengthened glass
JP2016058429A (ja) * 2014-09-05 2016-04-21 株式会社ディスコ ウエーハの加工方法
JP6783374B2 (ja) * 2016-07-15 2020-11-11 テラダイオード， インコーポレーテッド 可変ビーム形状を有するレーザを利用する材料処理
CN114227957B (zh) * 2021-12-20 2024-03-26 常州时创能源股份有限公司 硅棒切割方法

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8314013B2 (en) 2002-03-12 2012-11-20 Hamamatsu Photonics K.K. Semiconductor chip manufacturing method
US8518801B2 (en) 2002-03-12 2013-08-27 Hamamatsu Photonics K.K. Substrate dividing method
US8519511B2 (en) 2002-03-12 2013-08-27 Hamamatsu Photonics K.K. Substrate dividing method
US8518800B2 (en) 2002-03-12 2013-08-27 Hamamatsu Photonics K.K. Substrate dividing method
US8889525B2 (en) 2002-03-12 2014-11-18 Hamamatsu Photonics K.K. Substrate dividing method
US9142458B2 (en) 2002-03-12 2015-09-22 Hamamatsu Photonics K.K. Substrate dividing method
US9287177B2 (en) 2002-03-12 2016-03-15 Hamamatsu Photonics K.K. Substrate dividing method
US9543256B2 (en) 2002-03-12 2017-01-10 Hamamatsu Photonics K.K. Substrate dividing method
US9543207B2 (en) 2002-03-12 2017-01-10 Hamamatsu Photonics K.K. Substrate dividing method
US9548246B2 (en) 2002-03-12 2017-01-17 Hamamatsu Photonics K.K. Substrate dividing method
US9553023B2 (en) 2002-03-12 2017-01-24 Hamamatsu Photonics K.K. Substrate dividing method
US9711405B2 (en) 2002-03-12 2017-07-18 Hamamatsu Photonics K.K. Substrate dividing method
US10068801B2 (en) 2002-03-12 2018-09-04 Hamamatsu Photonics K.K. Substrate dividing method
US10622255B2 (en) 2002-03-12 2020-04-14 Hamamatsu Photonics K.K. Substrate dividing method
US11424162B2 (en) 2002-03-12 2022-08-23 Hamamatsu Photonics K.K. Substrate dividing method

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Publication number Publication date
JP2002192369A (ja) 2002-07-10

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