JP3692122B2 - Bonding system - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a bonding system in which a plurality of bonding apparatuses are arranged along a production line.
[0002]
[Prior art]
A semiconductor device is manufactured by bonding an IC (integrated circuit) chip of an electronic component such as a semiconductor wafer to a substrate.
[0003]
When a belt-like substrate is used, a conductive film is attached on the substrate, and an IC chip is bonded to the conductive film. This bonding is divided into provisional pressure bonding for positioning and mounting the IC chip and main pressure bonding for securely fixing the IC chip. A bonding apparatus for temporary pressure bonding (referred to as a temporary pressure bonding machine) and a bonding apparatus for final pressure bonding (referred to as a main pressure bonding machine) are arranged along a production line.
[0004]
In this case, since the time required for the main pressure bonding is longer than the time required for the temporary pressure bonding, the IC chip that has undergone the temporary pressure bonding becomes congested before the main pressure bonding, and the throughput of the production line cannot be secured.
[0005]
Therefore, one temporary crimping machine and a plurality of final crimping machines are arranged along the production line, and each IC chip temporarily crimped by the temporary crimping machine is shared by each final crimping machine and finally crimped. . For example, if the processing time of the temporary pressure bonding machine is 3 seconds and the processing time of the main pressure bonding machine is 12 seconds, four temporary pressure bonding machines are arranged after one temporary pressure bonding machine. As a result, the IC chips that have passed through the temporary crimping machine are processed one after another by each main crimping machine without congestion, and the throughput of the production line is ensured.
[0006]
An outline of the configuration of each main crimping machine is shown in FIG. That is, the present crimping machines 1, 2, 3, and 4 are required for controlling the controller having a mechanism unit including a bonding mechanism and a transport mechanism, a plurality of control boards for driving and controlling each mechanism of the mechanism unit, and the controller. A program memory storing various control programs, a data memory storing operating conditions, and the like.
[0007]
Instead of employing a plurality of main crimping machines, a main crimping machine having a plurality of bonding heads or a main crimping machine capable of increasing or decreasing the number of bonding heads may be employed.
[0008]
[Problems to be solved by the invention]
When a plurality of main crimping machines are employed, there is a problem that the throughput is ensured, but the equipment cost increases, and the maintenance of the control program takes time.
[0009]
Increase or decrease in the number of bonding heads and bonding heads with multiple bonding heads But When adopting a possible main crimping machine, there is a tendency that the number of bonding heads is set in advance so that the shape of the main crimping machine increases.
[0010]
The present invention takes the above circumstances into consideration, and its purpose is to prevent the increase in equipment cost, facilitate the maintenance of the control program, and further ensure the throughput of the production line while avoiding the enlargement of the shape. It is to provide a bonding system that can perform the above.
[0011]
[Means for Solving the Problems]
The bonding system of the invention according to claim 1 comprises: Equipped with N main crimping machines connected in series to the temporary crimping machine, one of which is the final crimping machine Is equipped with a controller and storage means. Each storage means includes A first control program for a predetermined main crimping machine among the main crimping machines and an operation condition data file for each main crimping machine are stored. The controller combines the N-th control program for the N-th non-predetermined main crimping machine among the main-compression bonding machines with the first control program and the operating condition data file for the non-predetermined main-crimping machines. Generate each book crimping machine To control.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
[1] A first embodiment of the present invention will be described below with reference to the drawings.
As shown in FIG. 1, a plurality of, for example, six bonding apparatuses 11, 12, 13, 14, 15, and 16 are arranged along the production line.
[0013]
The bonding apparatus 11 attaches an anisotropic conductive film (ACF) to a strip-shaped substrate. This bonding apparatus 11 is called a sticking machine. The bonding apparatus 12 positions and temporarily presses (places) the IC chip on the anisotropic conductive film of the substrate sent from the sticking machine 11. This bonding apparatus 12 is called a temporary crimping machine. The bonding devices 13, 14, 15, and 16 press-bond (fix) the IC chip temporarily bonded by the temporary bonding machine 12 onto the substrate. The bonding devices 13, 14, 15, 16 are referred to as the present crimping machine.
[0014]
FIG. 2 shows the state of pasting with the pasting machine 11, provisional crimping with the temporary crimping machine 12, and final crimping with the final crimping machines 13, 14, 15, and 16.
[0015]
The affixing machine 11 conveys the belt-like substrate 21, interposes the anisotropic conductive film 23 between the substrate 21 and the bonding head 22, and passes the anisotropic conductive film 23 along the conveyance direction of the substrate 21. While feeding forward, the anisotropic conductive film 23 is pressed against the substrate 21 by the lowering of the bonding head 22, and a part of the anisotropic conductive film 23 is attached to the upper surface of the substrate 21.
[0016]
The temporary crimping machine 12 conveys the substrate 21 that has passed through the pasting machine 11 and aligns the IC chip 25 held on the bonding head 24 with the anisotropic conductive film 23 on the substrate 21 while lowering the bonding head 24 and bonding. The IC chip 25 is temporarily pressure-bonded to the substrate 21 (on the anisotropic conductive film 23) by the heater heat generation in the head 24 and the heater heat generation on the bonding stage (not shown) side.
[0017]
The main crimping machine 13, 14, 15, 16 conveys the substrate 21, interposes the Teflon sheet 27 between the substrate 21 and the bonding head 26, and sequentially feeds the Teflon sheet 27 along the conveyance direction of the substrate 21. However, the IC chip 25 is finally pressure-bonded to the substrate 21 by the lowering of the bonding head 26, the heater heat generation in the bonding head 26, and the heater heat generation on the bonding stage (not shown) side. At this time, the anisotropic conductive film 23 between the IC chip 25 and the substrate 21 receives heat from the heater and melts to become an adhesive.
When the melted portion of the anisotropic conductive film 23 protrudes from the side of the IC chip 25 by the pressing force of the bonding head 26 and rises up, the raised portion adheres only to the lower surface side of the Teflon sheet 27 and is attached to the bonding head 26. Does not adhere. The Teflon sheet 27 is fed forward so that the adhesion to the Teflon sheet 27 does not adhere to the next IC chip 25.
[0018]
On the other hand, the structure of the principal part of the temporary crimping machine 12 is shown in FIG.
A wafer stage 31 has a base 32, an XY direction table 33 provided on the base 32, and a θ direction table 34 provided on the XY direction table 33. The θ direction is a direction that rotates about an axis along the Z direction.
[0019]
On the θ-direction table 34, a semiconductor wafer 35, which is an electronic component, is placed. The semiconductor wafer 35 is divided into a large number of IC (integrated circuit) chips 25.
[0020]
Each IC chip 25 is taken out one by one by a pickup reversing unit 37. The pickup reversing unit 37 includes a Z-direction guide 38, a Z-direction table 39 that is movably provided on the Z-direction guide 38, a rotary rod 40 that is rotatably provided on the Z-direction table 39, An L-shaped pickup reversing tool 41 provided at the tip is provided. The pick-up reversing tool 41 has a nozzle 42 for vacuum-sucking the IC chip 25 at its tip, and reciprocates between a state indicated by a solid line and a state indicated by a broken line in response to the rotation of the rotating rod 40. .
[0021]
A wafer recognition camera (CCD camera) 43 that images the semiconductor wafer 35 is disposed above the semiconductor wafer 35. Based on the image captured by the wafer recognition camera 43, one of the IC chips 25 is designated as a bonding target, and the nozzle 42 of the pickup reversing tool 41 can come into contact with the designated IC chip 25. The θ direction table 34 moves in the X, Y, and θ directions.
[0022]
The IC chip 25 adsorbed by the nozzle 42 is imaged by a delivery recognition camera (CCD camera) 44 after the pickup reversing tool 41 is rotated to a state indicated by a solid line in the drawing. Based on the image picked up by the transfer recognition camera 44, the IC chip 25 on the nozzle 42 is transferred to the bonding head 24.
[0023]
The bonding head 24 can freely move in the X, Y, and Z directions, receives the IC chip 25 of the pick-up reversing tool 41 at the lower end surface, and holds the suctioned IC chip 25 on the substrate 21 in an anisotropic direction. Temporary pressure bonding to the position of the conductive film 23. The bonding head 24 incorporates an electric heater that generates heat during temporary pressure bonding.
[0024]
Transport rails 51a and 51b are disposed below the bonding head 24, and the substrate 21 is transported in the direction of the arrow by the transport rails 51a and 51b. The board 21 has a large number of engagement holes 21a on both sides, and the transport rails 51a and 51b engage with the engagement holes 21a.
[0025]
A bonding stage 52 is disposed below the substrate 21. The bonding stage 52 comes into contact with the lower surface of the substrate 21 as it rises, and receives pressure from the bonding head 24. The bonding stage 52 also includes an electric heater that generates heat during temporary pressure bonding.
[0026]
A camera table 53 is provided between the bonding head 24 and the substrate 21 so as to be movable in the X and Y directions. A chip recognition camera (CCD camera) 54 is provided on the upper surface of the camera table 53, and a substrate recognition camera (CCD camera) 55 is provided on the lower surface of the camera table 53. The chip recognition camera 54 images the IC chip 25 sucked and held by the bonding head 24. The board recognition camera 55 images the board 21. In accordance with the images captured by the chip recognition camera 54 and the substrate recognition camera 55, alignment control between the substrate 21 and the IC chip 25 is executed.
[0027]
FIG. 4 shows the configuration of the main parts of the crimping machines 13, 14, 15, and 16.
The bonding head 26 pressure-bonds the IC chip 25 temporarily bonded to the substrate 21 via a Teflon sheet 27. The bonding head 26 incorporates an electric heater that generates heat during the main pressure bonding. The Teflon sheet 27 is unwound from the roller 63a and wound around the roller 63b.
[0028]
Transport rails 61a and 61b are disposed below the bonding head 26, and the substrate 21 that has passed through the temporary crimping machine 12 is transported by the transport rails 61a and 61b.
[0029]
A bonding stage 62 is disposed at a position facing the bonding head 26 across the substrate 21. The bonding stage 62 comes into contact with the lower surface of the substrate 21 by being lifted, and receives the pressure of the bonding head 26. The bonding stage 62 also incorporates an electric heater that generates heat during the main pressure bonding.
[0030]
Among the main crimping machines 13, 14, 15, 16 having such a configuration, a predetermined, for example, main crimping machine 13 includes a mechanical unit 70, a controller 80, a program memory (storage means) 81, and A data memory (storage means) 82 is provided. The remaining main crimping machines 14, 15, and 16 are provided with only the mechanism unit 70.
[0031]
The mechanism unit 70 includes a bonding mechanism 71 and a transport mechanism 72. The bonding mechanism 71 includes bonding parts such as the bonding head 26 and a drive motor thereof. The transport mechanism 72 includes transport rails 61a and 61b and their drive motors.
[0032]
The controller 80 controls the main crimping machines 13, 14, 15, and 16 according to each control program in the program memory 81 and operating conditions described later in the data memory 82. A plurality of control boards for driving and controlling the transport mechanisms 72 are provided.
[0033]
As shown in FIG. 6, the program memory 81 stores a main control program 81m, and a control program 81a for the first unit for the main crimping machine 13 and a control program 81b for the second unit for the main crimping machine 14. A third unit control program 81c for the main crimping machine 15 and a fourth unit control program 81d for the main crimping machine 16 are stored.
[0034]
The control programs 81a, 81b, 81c, 81d are so-called package programs, a bonding control program for controlling the bonding mechanism 71 of the present crimping machine to be controlled, a conveyance control program for controlling the conveyance mechanism 72, and a Teflon sheet. A Teflon sheet control program for controlling the feeding of 27 is integrated into one.
[0035]
As shown in FIG. 7, the data memory 82 stores a main control data file 82 s necessary for overall control of the controller 80, and an operation condition data file for the first unit that summarizes the operation conditions of the crimping machine 13. 82a, the second operating condition data file 82b that summarizes the operating conditions of the main crimping machine 14, the third operating condition data file 82c that summarizes the operating conditions of the main crimping machine 15, and the operating conditions of the main crimping machine 16. The collected fourth operating condition data file 82d is stored.
[0036]
In the main control data file 82s, as main control data, the number of each crimping machine used, the number of each control board in the controller 80, and the correspondence between each control board and each crimping machine are indicated. Express Stores control board addresses and other information.
[0037]
The operation condition data files 82a, 82b, 82c, and 82d store bonding conditions, transport conditions, drive motor speed, drive motor resolution, and the like as operation conditions.
[0038]
Next, the operation of the above configuration will be described.
First, the anisotropic conductive film 23 is sequentially attached to the upper surface of the substrate 21 by the attaching machine 11. The substrate 21 that has been pasted is sent to the temporary crimping machine 12.
[0039]
In the temporary bonding machine 12, the IC chips 25 are sequentially temporarily bonded to the anisotropic conductive films 23 attached on the substrate 21. The substrate 21 that has been temporarily bonded is sent to the main bonding machines 13, 14, 15, and 16.
[0040]
In the main crimping machines 13, 14, 15, and 16, each IC chip 25 that is temporarily crimped onto the substrate 21 is finally crimped. The operations of the main crimping machines 13, 14, 15 and 16 in this case are controlled by the controller 80 of the main crimping machine 13. That is, the controller 80 controls the operation of the crimping machine 13 based on the control program 81a for the first unit in the program memory 81 and by referring to the operation condition data file 82a for the first unit in the data memory 82. Similarly, the controller 80 is based on the control programs 81b, 81c, 81d in the program memory 81 and by referring to the operation condition data files 82d, 81c, 81d in the data memory 82, Control the behavior.
[0041]
As described above, the throughput of the production line can be ensured by arranging a plurality of main crimping machines 13, 14, 15, 16 subsequent to the temporary crimping machine 12. Since this is a configuration that does not employ a main crimping machine having a plurality of bonding heads or a main crimping machine that can increase or decrease the number of bonding heads, avoid unnecessary enlargement associated with setting a large number of bonding heads in advance. Can do.
[0042]
In particular, the controller 80, the program memory 81, and the data memory 82 mounted on one main crimping machine 13 are used to control all the main crimping machines 13, 14, 15, and 16, so that the second and subsequent main crimping machines 14, Controllers, memories and the like can be deleted from 15, 16, and an increase in equipment cost can be prevented.
[0043]
Since centralized control is performed by the controller 80, the wiring connection between the main crimping machines 13, 14, 15, and 16 can be greatly reduced, and the installation work of each main crimping machine is facilitated.
[0044]
When maintenance such as remodeling or correction is added to the control program, it is only necessary to perform the procedure for the program memory 81 of the main crimping machine 13, and the maintenance is easier compared to the conventional case where all the main crimping machines are treated. Become.
[0045]
[2] Second embodiment
A second embodiment will be described with reference to FIGS.
[0046]
As shown in FIG. 8, the program memory 81 always stores a main control program 81m, and always stores a first control program 81a for the crimping machine 13 as a first control program. The second control program 81b, the third control program 81c, and the fourth control program 81d, which are indicated by broken lines, are sequentially generated and stored as a second control program when the bonding system is turned on. .
[0047]
This generation and update storage is controlled based on the main control program 81m of the controller 80 of the main crimping machine 13. That is, the controller 80 has the following means (1) to (3) as a control function based on the main control program 81m.
[0048]
(1) When the power of the bonding system is turned on, the main control data in the main control data file 82s in the data memory 82 based on the control program 81a for the first unit in the program memory 81 (for each crimping machine) Number of units used, number of each control board in controller 80, correspondence between each control board and each crimping machine Express Generation means for generating control programs 81b, 81c, 81d for the second and subsequent main crimping machines 14, 15, 16 using a control board address or the like as a parameter.
[0049]
(2) Control means for updating and storing the generated control programs 81b, 81c, 81d in the program memory 81.
[0050]
(3) Based on the control programs 81a, 81b, 81c, 81d in the program memory 81 and by referring to the operating condition data files 82a, 82b, 82c, 82d in the data memory 82, the crimping machines 13, 14, 15, Control means for controlling 16 operations.
[0051]
Next, the operation will be described with reference to the flowchart of FIG.
When the power of the bonding system is turned on (YES in step 101), the first control program 81a is copied for three units corresponding to the second and subsequent main crimping machines 14, 15, and 16, The control program for the second and subsequent crimping machines 14, 15 and 16 is added to the control program for the three units in such a manner that the main control data in the main control data file 82s of the data memory 82 is changed as a parameter. Control programs 81b, 81c, 81d are generated (step 102).
[0052]
The generated control programs 81b, 81c, 81d are updated and stored in the program memory 81 (step 103).
[0053]
The crimping machines 13 and 14 are based on the control programs 81a, 81b, 81c and 81d for the four units in the program memory 81 and by referring to the operation condition data files 82a, 82b, 82c and 82d in the data memory 82. , 15, 16 are controlled (step 104).
[0054]
Other configurations and operations are the same as those of the first embodiment.
[0055]
As described above, the throughput of the production line can be ensured by arranging a plurality of main crimping machines 13, 14, 15, 16 subsequent to the temporary crimping machine 12. Since this is a configuration that does not employ a main crimping machine having a plurality of bonding heads or a main crimping machine that can increase or decrease the number of bonding heads, avoid unnecessary enlargement associated with setting a large number of bonding heads in advance. Can do.
[0056]
In addition, the controller 80, the program memory 81, and the data memory 82 mounted on one main crimping machine 13 are used to control all the main crimping machines 13, 14, 15, and 16, so that the second and subsequent main crimping machines 14, Controllers, memories and the like can be deleted from 15, 16, and an increase in equipment costs associated with the use of a plurality of main crimping machines can be prevented.
[0057]
Since centralized control is performed by the controller 80, the wiring connection between the main crimping machines 13, 14, 15, 16 can be greatly reduced, and the installation work of the main crimping machines 13, 14, 15, 16 is easy. become.
[0058]
In particular, the program memory 81 stores only the first control program 81a in advance, and the second and subsequent control programs 81b, 81c, 81d are automatically generated when the system power is turned on. When performing maintenance such as correction or correction, it is only necessary to perform a procedure for the packaged first control program 81a, and the maintenance becomes easier than when all the control programs are processed.
[0059]
[3] Third embodiment
A third embodiment will be described.
[0060]
The controller 80 has a predetermined maximum use It has a large number of control boards for driving and controlling all the possible number n of the present crimping machines.
[0061]
As shown in FIG. 10, the program memory 81 always stores a main control program 81m, and always stores a first control program 81a for the crimping machine 13 as a first control program. The control programs 81b,... 81n indicated by broken lines are sequentially generated and updated and stored as the second control program for the second and subsequent main crimping machines 14,.
[0062]
The main control data file 82s in the data memory 82 includes, as main control data, the maximum usable number n of the present crimping machine, the number of control boards corresponding to all the present crimping machines of the maximum usable number n, Correspondence between each control board and each main crimping machine Express The control board address and the like are stored, and the actual number X used of the present crimping machine is stored by the operator's data input operation at the time of installation.
[0063]
Further, as shown in FIG. 11, the data memory 82 stores operation condition data files 82a,... 82n corresponding to all the maximum number n of the present crimping machines. The operation condition data files 82a,... 82n store bonding conditions, transport conditions, drive motor speed, drive motor resolution, and the like as operation conditions.
[0064]
The controller 80 of the present crimping machine 13 has the following means (11) to (14) as control functions based on the main control program 81m.
[0065]
(11) When the power of the bonding system is turned on, the main control data (maximum usable number n, the maximum usable number) based on the control program 81a for the first unit and in the main control data file 82s in the data memory 82 The number of each control board corresponding to the second and subsequent main crimping machines out of the number n, and the correspondence between each control board and each main crimping machine Express Generating means for generating control programs 81b,... 81n for the second and subsequent crimping machines using a control board address and the like as parameters.
[0066]
(12) Control means for updating and storing the generated control program 81b,... 81n in the program memory 81.
[0067]
(13) The actual used number X is read from the main control data file 82s of the data memory 82, and the control program 81a corresponding to the read used number X among the control programs 81a, 81b,. , 81b,...
[0068]
(14) The crimping machine 13, 14, 15, 16 actually used based on the selected control program 81a, 81b,... And by referring to the operation condition data files 82a, 82b,. Control means for controlling the operation of the.
[0069]
Next, the operation will be described with reference to the flowchart of FIG.
When the power of the bonding system is turned on (YES in step 201), the first unit control program 81a is copied for the second and subsequent main crimping machines out of the maximum usable number n. A control program 81b for the second and subsequent crimping machines is added to each of the control programs for several units in such a manner that the main control data in the main control data file 82s of the data memory 82 is changed as a parameter. ... 81n is generated (step 202).
[0070]
The generated control programs 81b,... 81n are updated and stored in the program memory 81 (step 203).
[0071]
Then, among the control programs 81a, 81b,... 81n in the program memory 81, control programs 81a, 81b,... Corresponding to the actual number X used are selected (step 204). A flag “1” is set for the selected control program, and a flag “0” is set for the unselected control program.
[0072]
Thereafter, based on the selected control programs 81a, 81b,... And by referring to the operation condition data files 82a, 82b,. Are controlled (step 205).
[0073]
Other configurations and operations are the same as those of the second embodiment.
[0074]
As described above, the throughput of the production line can be ensured by arranging a plurality of main crimping machines 13, 14, 15, 16 subsequent to the temporary crimping machine 12. Since this is a configuration that does not employ a main crimping machine having a plurality of bonding heads or a main crimping machine that can increase or decrease the number of bonding heads, avoid unnecessary enlargement associated with setting a large number of bonding heads in advance. Can do.
[0075]
In addition, the controller 80, the program memory 81, and the data memory 82 mounted on one main crimping machine 13 are used to control all the main crimping machines 13, 14, 15, and 16, so that the second and subsequent main crimping machines 14, Controllers, memories and the like can be deleted from 15, 16, and an increase in equipment costs associated with the use of a plurality of main crimping machines can be prevented.
[0076]
Since centralized control is performed by the controller 80, the wiring connection between the main crimping machines 13, 14, 15, 16 can be greatly reduced, and the installation work of the main crimping machines 13, 14, 15, 16 is easy. become.
[0077]
In particular, only the first control program 81a is stored in the program memory 81 in advance, and the second and subsequent control programs 81b,... 81n are automatically generated when the system power is turned on. Since the control programs 81b,... Corresponding to the number X used are selected, when performing maintenance such as modification or correction to the control program, it is only necessary to take measures for the first control program 81a packaged. Maintenance is even easier than when all control programs are treated.
[0078]
In addition, this invention is not limited to said each embodiment, A various deformation | transformation implementation is possible in the range which does not change a summary.
[0079]
【The invention's effect】
As described above, according to the present invention, there is provided a bonding system capable of preventing an increase in equipment cost, facilitating maintenance of a control program, and further ensuring a production line throughput while avoiding an increase in shape. Can be provided.
[Brief description of the drawings]
FIG. 1 is a diagram illustrating an arrangement state of a pasting machine, a temporary crimping machine, and a main crimping machine according to each embodiment.
FIG. 2 is a diagram showing a state of pasting, provisional pressure bonding, and main pressure bonding in each embodiment.
FIG. 3 is a diagram illustrating a configuration of a main part of a temporary pressure bonding machine according to each embodiment.
FIG. 4 is a diagram illustrating a configuration of a main part of the crimping machine according to each embodiment.
FIG. 5 is a block diagram showing an outline of the configuration of each main crimping machine in each embodiment.
FIG. 6 is a view showing stored contents of a program memory in the first embodiment.
FIG. 7 is a view showing storage contents of a data memory in the first embodiment.
FIG. 8 is a view showing the storage contents of a program memory in the second embodiment.
FIG. 9 is a flowchart for explaining the operation of the second embodiment.
FIG. 10 is a view showing stored contents of a program memory in the third embodiment.
FIG. 11 is a diagram showing storage contents of a data memory in a third embodiment.
FIG. 12 is a flowchart for explaining the operation of the third embodiment.
FIG. 13 is a block diagram showing an outline of the configuration of each conventional main crimping machine.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 11 ... Pasting machine, 12 ... Temporary crimping machine, 13, 14, 15, 16 ... This crimping machine, 21 ... Substrate, 23 ... Anisotropic conductive film, 25 ... IC chip, 22, 24, 26 ... Bonding head, 27 ... Teflon sheet, 51a, 51b, 61a, 61b ... Conveying rail, 70 ... Mechanical part, 71 ... Bonding mechanism, 72 ... Conveying mechanism, 80 ... Controller, 81 ... Program memory, 82 ... Data memory

Claims (3)

N main crimping machines connected in series to the temporary crimping machine ;
A first control program for a predetermined main crimping machine among the main crimping machines , and storage means for storing operating condition data files of the respective main crimping machines ;
The N-th control program for the N-th of the crimping machine other than the predetermined one of the present crimping machine, generated by combining the operation condition data file for the first control program and the predetermined other of the crimping machine and a controller for controlling the respective the crimping machine,
And a storage system and the controller are provided in one of the main crimping machines . N main crimping machines connected in series to the temporary crimping machine ;
A first control program for a predetermined main crimping machine among the main crimping machines , and storage means for storing operating condition data files of the respective main crimping machines ;
The remaining operating conditions data for the first N control program, said first control program and the predetermined other of the crimping machine for number excluding the predetermined the crimping machine of the maximum available number of the respective the crimping machine generated by combining the files, and a controller which selects the partial N-th control program corresponding to the crimping machine which is actually used among the first N control program this generated, controls the respective main bonding machine ,
And a storage system and the controller are provided in one of the main crimping machines .   The bonding system according to claim 1, wherein the controller generates a second control program when the bonding system is activated.

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