JP3671355B2 - Printed wiring board - Google Patents

Printed wiring board Download PDF

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Publication number
JP3671355B2
JP3671355B2 JP21452794A JP21452794A JP3671355B2 JP 3671355 B2 JP3671355 B2 JP 3671355B2 JP 21452794 A JP21452794 A JP 21452794A JP 21452794 A JP21452794 A JP 21452794A JP 3671355 B2 JP3671355 B2 JP 3671355B2
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Japan
Prior art keywords
solder
wiring board
printed wiring
component mounting
connection terminal
Prior art date
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Expired - Lifetime
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JP21452794A
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JPH0878850A (en
Inventor
隆 坂井
彰浩 出村
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Ibiden Co Ltd
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Ibiden Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof

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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)

Description

【０００１】
【産業上の利用分野】
本各発明は、プリント配線板に関し、特に、基板の表面に、はんだを介して電子部品が実装される部品実装用パッドを備えたプリント配線板の改良に関する。
【０００２】
【従来の技術】
基板の表面に電子部品実装用のパッド（以下部品実装用パッドという）を備えたプリント配線板がある。このようなプリント配線板においては、一般に、その部品実装用パッドにはんだを介して電子部品が実装されるのであるが、その実装の際には、ペースト状のはんだを印刷する等して部品実装用パッドの表面にはんだ層を予め形成しておき、この部品実装用パッドに電子部品の接続端子を位置合わせして、電子部品を基板に押し付けながらはんだを溶融させる。
【０００３】
【発明が解決しようとする課題】
しかしながら、電子部品実装の際に、電子部品を基板に押し付けながらはんだを溶融させるため、部品実装用パッドの上面と接続端子の下面との間のはんだが接続端子の側面側へと流出してしまい、実装された電子部品は、例えば図８及び図９に示すように、その接続端子の側面部分のみがはんだによって部品実装用パッドに固持されたものとなる。よって、実装された電子部品は、その接続端子が部品実装用パッドに充分堅固に固持されたものとならず、振動等によって外れる虞があった。
【０００４】
ここで、部品実装用パッドに接続端子を充分堅固に固持させるためには、充分なはんだ量を確保すればよいのであるが、はんだ量が多すぎると、隣設された部品実装用パッド間にはんだブリッジが形成されて短絡する虞がある。これを解決するために、例えば特開平６−１６９１７５号公報に開示されているように、部品実装用パッドに凹部を設け、この凹部によって所望量のはんだを確実に確保することができるようにしたものがある。
【０００５】
ところが、このプリント配線板においては、部品実装用パッドの凹部に電子部品の接続端子をはめ込むものであるため、はんだを溶融した際に、部品実装用パッドの上面（凹部の底の上面）と接続端子の下面との間のはんだが接続端子の側面側に流出するものである。よって、このプリント配線板にあっても、実装された電子部品は、その接続端子の側面部分のみがはんだによって部品実装用パッドに固持されたものとなり、充分堅固に固持されたものとならなかった。
【０００６】
本各発明は、このような実状を鑑みてなされたものであり、その目的とするところは、電子部品の接続端子を基板の部品実装用パッドに充分堅固に固持させることができるプリント配線板を、簡単な構造によって提供することである。
【０００７】
特に、請求項２の発明においては、電子部品の接続端子を基板の部品実装用パッドに、より一層堅固に固持させることができるプリント配線板を、簡単な構造によって提供することである。
【０００８】
【課題を解決するための手段】
以上の課題を解決するために本各発明の採った手段を、図面に使用する符号を付して説明すると、まず、請求項１の発明は、
「基板５０の表面に、はんだ４０を介して電子部品が実装される部品実装用パッド１０と、基板５０の内部に、内層の導体回路６１とを備えたプリント配線板において、
前記部品実装用パッド１０に、実装される電子部品の接続端子２０の真下に位置すべく配設されて、前記内層の導体回路６１に達し、前記はんだ４０が充填されるフォトソルダーレジストを用いて形成した凹部３０を設けたことを特徴とするプリント配線板」
である。
【０００９】
そして、請求項２の発明は、
「前記凹部３０を、その一部が前記接続端子２０から露呈するものとしたことを特徴とする請求項１記載のプリント配線板」
である。
【００１０】
【発明の作用】
このように構成された本各発明に係るプリント配線板は、次のように作用する。
【００１１】
まず、請求項１の発明に係るプリント配線板は、部品実装用パッド１０に、実装される電子部品の接続端子２０の真下に位置すべく配設されて、はんだ４０が充填される凹部３０を設けたものである。よって、例えば図１及び図２に示すように、このプリント配線板に実装された電子部品は、その接続端子２０の側面部分がはんだ４０によって部品実装用パッド１０に固持されるばかりでなく、加えて、その下面においても、凹部３０に充填されたはんだによって部品実装用パッド１０に固持されることになり、従来に比して、部品実装用パッド１０に、より堅固に固持されることになる。
【００１２】
また、メタルマスクによるはんだ印刷等によってはんだをプリント配線板に供給した場合であっても、少量を塗布する際に比較して均一多量に塗布されたはんだ４０が凹部３０に充填されて、部品実装用パッド１０上において必要以上にはんだ層が厚くなることを防止する。
【００１３】
一方、凹部３０は、内層の導体回路６１に達しており、はんだ４０が充填されるものであるため、電子部品から生じた熱を、電子部品の接続端子２０から部品実装用パッド１０、凹部３０に充填されたはんだ４０を経て、内層の導体回路６１へと放熱させ得ることになる。
【００１４】
また、凹部３０に充填されるはんだ４０によって、部品実装用パッド１０と内層の導体回路６１との電気的接続が確実になされることになる。
【００１５】
次に、請求項２の発明に係るプリント配線板は、前述した請求項１の発明に係るプリント配線板の凹部３０を、その一部が電子部品の接続端子２０から露呈するものとしたものである。よって、例えば図３及び図４に示すように、接続端子２０の側面部分を固持する部分のはんだ４０と、凹部３０に充填され接続端子２０の下面部分を固持するはんだ４０とが一体的となり、このはんだ４０によって接続端子２０の側面と下面との角の部分が固持されることになるため、実装された電子部品は、その接続端子２０が部品実装用パッド１０に、より一層堅固に固持されることになる。
【００１６】
また、部品実装用パッド１０表面のはんだ４０の量が不足する際においても、凹部３０内から容易にはんだ４０が補給されることになる。
【００１７】
【実施例】
次に、本各発明に係るプリント配線板の実施例を、図面に従って詳細に説明する。
【００１８】
まず、図１には、請求項１の発明に係るプリント配線板の一実施例を示してある。このプリント配線板においては、基板５０の表面に、外層の導体回路６０とこれに接続された部品実装用パッド１０とが形成されており、部品実装用パッド１０の領域内には、凹部３０が設けられている。ここで、凹部３０は、実装される電子部品の接続端子２０の真下に位置すべく配設されており、電子部品を実装した際には、図２に示すように、電子部品の接続端子２０の下面部分が、凹部３０に充填されたはんだ４０によって固持され、電子部品の接続端子２０の側面部分が、部品実装用パッド１０の上面と接続端子２０の下面との間から流出したはんだ４０によって固持される。
【００１９】
一方、凹部３０は、基板５０の内部の内層の導体回路６１に達するように形成されており、部品実装用パッド１０と内層の導体回路６１とを電気的に接続する非貫通のスルーホール、所謂ブラインドスルーホールとなっている。このように凹部３０としてのブラインドスルーホールを部品実装用パッド１０に設けることによって、外層の導体回路６０と内層の導体回路６１とを接続するブラインドスルーホールを、部品実装用パッド１０外の他の領域に別途形成することが省略され、導体回路の高密度化が図られている。ここで、部品実装用パッド１０から内層の導体回路６１に達する凹部３０には、はんだ４０が充填されるため、部品実装用パッド１０と内層の導体回路６１との電気的接続が確実に行われる。よって、この凹部３０の内周面のめっき、所謂スルーホールめっきを省略することもできる。
【００２０】
なお、本実施例においては、凹部３０が、フォトソルダーレジストを用いて最外層の絶縁材における凹部３０となる部分を除去した後、めっきによって外層の導体回路６０及び部品実装用パッド１０と共に形成されており、このような方法によれば、部品実装用パッド１０が微少なものであっても、部品実装用パッド１０の領域内に微細な凹部３０を確実に形成することができる。
【００２１】
次に、図３には、請求項２の発明に係るプリント配線板の一実施例を示してある。このプリント配線板においては、凹部３０の一部が、実装される電子部品の接続端子２０から露呈するものとしてある。このプリント配線板に電子部品を実装した際には、図４に示すように、接続端子２０の側面部分と下面部分とを固持するはんだ４０が一体的となり、このはんだ４０によって接続端子２０の側面と下面との角部が固持されるため、実装された電子部品は、部品実装用パッド１０に、より堅固に固持される。ここで、凹部３０を、図３の如く、接続端子２０の幅方向に対となるように設けると、実装の際に、接続端子２０の幅方向の捻れ応力が生じ難く都合がよい。
【００２２】
また、図５に示すように、一つの凹部３０が接続端子２０の両幅から露呈するようにすると、図６に示すように、凹部３０に充填されたはんだ４０によって接続端子２０の下面全幅に渡って部品実装用パッド１０に堅固に固持することができ、しかも、実装の際に、接続端子２０の幅方向の捻れ応力がより一層生じ難くすることができ都合がよい。
【００２３】
さらに、図７に示すように、凹部３０を、接続端子２０の幅方向に長穴状に形成すると、前述の如く、接続端子２０の下面全幅に渡って堅固に固持することができるばかりか、加えて、部品実装用パッド１０の表面における接続端子２０の設置面積を充分に確保することができる。
【００２４】
【発明の効果】
以上詳細に説明したように、本各発明に係るプリント配線板は、部品実装用パッドに、実装される電子部品の接続端子の真下に位置すべく配設され、内層の導体回路に達し、はんだが充填されるフォトソルダーレジストを用いて形成した凹部を設けたものであり、実装された電子部品を、その接続端子の下面部分においても、はんだによって部品実装用パッドに固持させるようにしたものである。
【００２５】
そして、特に、請求項２の発明に係るプリント配線板においては、凹部の一部を接続端子から露呈させたものであり、実装された電子部品の接続端子の側面部分を固持するはんだと、下面部分を固持するはんだとが一体的となり、このはんだによって接続端子の側面と下面との角部を固持させるようにしたものである。
【００２６】
従って、本各発明によれば、電子部品の接続端子を基板の部品実装用パッドに充分堅固に固持させることができるプリント配線板を、簡単な構造によって提供することができ、しかも、凹部はフォトソルダーレジストを用いて形成されているために、部品実装用パッド１０が微少なものであっても、部品実装用パッド１０の領域内に微細な凹部３０を確実に形成することができる。
【００２７】
また、搭載部品の放熱設計に関しても、部品実装用パッドから基板内部に、異形状もしくは多数の穴を設けることができるため、放熱設計の自由度を向上させることができるという効果を奏する。
【００２８】
さらに、特に、請求項２の発明によれば、電子部品の接続端子を基板の部品実装用パッドに、より一層堅固に固持させることができるプリント配線板を、簡単な構造によって提供することができる。
【図面の簡単な説明】
【図１】本各発明に係るプリント配線板の一実施例を示す部分平面図である。
【図２】図１におけるＡ−Ａ断面図である。
【図３】請求項２の発明に係るプリント配線板の一実施例を示す部分平面図である。
【図４】図３におけるＢ−Ｂ断面図である。
【図５】請求項２の発明に係るプリント配線板の別の実施例を示す部分平面図である。
【図６】図５におけるＣ−Ｃ断面図である。
【図７】請求項２の発明に係るプリント配線板のさらに別の実施例を示す部分平面図である。
【図８】従来のプリント配線板を示す部分平面図である。
【図９】図８におけるＤ−Ｄ断面図である。
【符号の説明】
１０ 部品実装用パッド
２０ 接続端子
３０ 凹部
４０ はんだ
５０ 基板
６０ 外層の導体回路
６１ 内層の導体回路[0001]
[Industrial application fields]
The present invention relates to a printed wiring board, and more particularly to an improvement of a printed wiring board provided with a component mounting pad on the surface of a substrate on which an electronic component is mounted via solder.
[0002]
[Prior art]
There is a printed wiring board having electronic component mounting pads (hereinafter referred to as component mounting pads) on the surface of a substrate. In such a printed wiring board, electronic components are generally mounted on the component mounting pads via solder. However, when mounting the components, the paste mounting solder is printed. A solder layer is formed in advance on the surface of the pad, the connection terminals of the electronic component are aligned with the component mounting pad, and the solder is melted while pressing the electronic component against the substrate.
[0003]
[Problems to be solved by the invention]
However, when the electronic component is mounted, the solder is melted while pressing the electronic component against the board, so that the solder between the upper surface of the component mounting pad and the lower surface of the connection terminal flows out to the side surface of the connection terminal. For example, as shown in FIGS. 8 and 9, the mounted electronic component is such that only the side surface portion of the connection terminal is fixed to the component mounting pad by solder. Therefore, the mounted electronic component does not have its connection terminal firmly fixed to the component mounting pad, and may be detached due to vibration or the like.
[0004]
Here, in order to firmly and firmly hold the connection terminals on the component mounting pads, it is sufficient to secure a sufficient amount of solder. However, if the amount of solder is too large, the adjacent component mounting pads are used. There is a risk that a solder bridge is formed and short-circuited. In order to solve this problem, for example, as disclosed in Japanese Patent Laid-Open No. 6-169175, a concave portion is provided in a component mounting pad so that a desired amount of solder can be reliably secured by this concave portion. There is something.
[0005]
However, in this printed wiring board, since the connection terminal of the electronic component is inserted into the concave portion of the component mounting pad, when the solder is melted, it is connected to the upper surface of the component mounting pad (the upper surface of the bottom of the concave portion). Solder between the lower surface of the terminal flows out to the side surface side of the connection terminal. Therefore, even in this printed wiring board, the mounted electronic component is a component in which only the side surface portion of the connection terminal is fixed to the component mounting pad by solder, and is not sufficiently firmly fixed. .
[0006]
Each of the present inventions has been made in view of such a situation, and an object of the present invention is to provide a printed wiring board capable of firmly and firmly holding a connection terminal of an electronic component on a component mounting pad of a substrate. It is to be provided by a simple structure.
[0007]
In particular, according to the second aspect of the present invention, a printed wiring board capable of more firmly and firmly holding the connection terminal of the electronic component to the component mounting pad of the board is provided with a simple structure.
[0008]
[Means for Solving the Problems]
Means taken by the present invention to solve the above problems will be described with reference numerals used in the drawings.
“In a printed wiring board provided with component mounting pads 10 on which electronic components are mounted on the surface of the substrate 50 via the solder 40, and an inner layer conductor circuit 61 inside the substrate 50,
A photo solder resist that is disposed on the component mounting pad 10 so as to be positioned directly below the connection terminal 20 of the electronic component to be mounted, reaches the conductor circuit 61 on the inner layer, and is filled with the solder 40 is used. Printed wiring board characterized by providing formed recess 30 "
It is.
[0009]
The invention of claim 2
“The printed wiring board according to claim 1, wherein a part of the recess 30 is exposed from the connection terminal 20.
It is.
[0010]
[Effects of the Invention]
The printed wiring board according to each of the present inventions configured as described above operates as follows.
[0011]
First, the printed wiring board according to the first aspect of the present invention is provided with a recess 30 that is disposed on the component mounting pad 10 so as to be positioned directly below the connection terminal 20 of the electronic component to be mounted, and is filled with the solder 40. It is provided. Therefore, for example, as shown in FIGS. 1 and 2, the electronic component mounted on the printed wiring board has not only the side surface portion of the connection terminal 20 held by the solder mounting 40 but also the component mounting pad 10. Also, the lower surface of the component mounting pad 10 is firmly fixed to the component mounting pad 10 by the solder filled in the concave portion 30, and the component mounting pad 10 is more firmly fixed to the lower surface. .
[0012]
Further, even when the solder is supplied to the printed wiring board by solder printing using a metal mask or the like, the solder 40 applied in a uniform and large amount is filled in the concave portion 30 as compared with the case where a small amount is applied, and the component mounting is performed. The solder layer is prevented from becoming thicker than necessary on the pad 10 for use.
[0013]
On the other hand, since the recess 30 reaches the inner-layer conductor circuit 61 and is filled with the solder 40, heat generated from the electronic component is transferred from the connection terminal 20 of the electronic component to the component mounting pad 10 and the recess 30. It is possible to dissipate heat to the inner layer conductor circuit 61 through the solder 40 filled therein.
[0014]
In addition, the solder 40 filled in the recess 30 ensures the electrical connection between the component mounting pad 10 and the inner-layer conductor circuit 61.
[0015]
Next, in the printed wiring board according to the invention of claim 2, a part of the concave portion 30 of the printed wiring board according to the invention of claim 1 is exposed from the connection terminal 20 of the electronic component. is there. Therefore, for example, as shown in FIGS. 3 and 4, the solder 40 that holds the side surface portion of the connection terminal 20 and the solder 40 that fills the recess 30 and holds the lower surface portion of the connection terminal 20 are integrated. Since the corner portions of the side surface and the lower surface of the connection terminal 20 are fixed by the solder 40, the mounted electronic component is more firmly fixed to the component mounting pad 10 by the connection terminal 20. Will be.
[0016]
Further, even when the amount of solder 40 on the surface of the component mounting pad 10 is insufficient, the solder 40 is easily supplied from within the recess 30.
[0017]
【Example】
Next, embodiments of the printed wiring board according to the present invention will be described in detail with reference to the drawings.
[0018]
First, FIG. 1 shows an embodiment of a printed wiring board according to the invention of claim 1. In this printed wiring board, an outer layer conductor circuit 60 and a component mounting pad 10 connected thereto are formed on the surface of the substrate 50, and a recess 30 is formed in the region of the component mounting pad 10. Is provided. Here, the recess 30 is disposed so as to be positioned directly below the connection terminal 20 of the electronic component to be mounted. When the electronic component is mounted, as shown in FIG. 2, the connection terminal 20 of the electronic component is provided. The lower surface portion of the electronic component is held by the solder 40 filled in the recess 30, and the side surface portion of the connection terminal 20 of the electronic component is fixed by the solder 40 that has flowed out between the upper surface of the component mounting pad 10 and the lower surface of the connection terminal 20. It is held.
[0019]
On the other hand, the recess 30 is formed so as to reach the inner layer conductor circuit 61 inside the substrate 50, and is a non-through hole that electrically connects the component mounting pad 10 and the inner layer conductor circuit 61. It is a blind through hole. Thus, by providing the component mounting pad 10 with the blind through hole as the recess 30, the blind through hole for connecting the outer layer conductor circuit 60 and the inner layer conductor circuit 61 is provided to other parts outside the component mounting pad 10. A separate formation in the region is omitted, and the density of the conductor circuit is increased. Here, the recess 30 reaching the inner layer conductor circuit 61 from the component mounting pad 10 is filled with the solder 40, so that the electrical connection between the component mounting pad 10 and the inner layer conductor circuit 61 is ensured. . Therefore, plating of the inner peripheral surface of the recess 30, so-called through hole plating, can be omitted.
[0020]
In this embodiment, the concave portion 30 is formed together with the outer layer conductor circuit 60 and the component mounting pad 10 by plating after removing the portion to be the concave portion 30 in the outermost insulating material using a photo solder resist. Thus, according to such a method, even if the component mounting pad 10 is very small, it is possible to reliably form the fine recess 30 in the region of the component mounting pad 10.
[0021]
Next, FIG. 3 shows an embodiment of a printed wiring board according to the invention of claim 2. In this printed wiring board, a part of the recess 30 is exposed from the connection terminal 20 of the electronic component to be mounted. When the electronic component is mounted on the printed wiring board, as shown in FIG. 4, the solder 40 that firmly holds the side surface portion and the lower surface portion of the connection terminal 20 is integrated. Since the corner portion between the lower surface and the lower surface is fixed, the mounted electronic component is more firmly fixed to the component mounting pad 10. Here, if the recesses 30 are provided so as to be paired in the width direction of the connection terminals 20 as shown in FIG. 3, it is convenient that twisting stress in the width direction of the connection terminals 20 hardly occurs during mounting.
[0022]
Further, as shown in FIG. 5, when one recess 30 is exposed from both widths of the connection terminal 20, the entire width of the lower surface of the connection terminal 20 is formed by the solder 40 filled in the recess 30 as shown in FIG. 6. The component mounting pads 10 can be firmly fixed to each other, and the twisting stress in the width direction of the connection terminals 20 can be further hardly generated at the time of mounting.
[0023]
Furthermore, as shown in FIG. 7, when the recess 30 is formed in the shape of a long hole in the width direction of the connection terminal 20, as described above, it can be firmly fixed over the entire lower surface of the connection terminal 20. In addition, the installation area of the connection terminal 20 on the surface of the component mounting pad 10 can be sufficiently secured.
[0024]
【The invention's effect】
As described above in detail, the printed wiring board according to each of the present invention is disposed on the component mounting pad so as to be positioned directly below the connection terminal of the electronic component to be mounted, reaches the inner layer conductor circuit, and is soldered. A concave part formed using a photo solder resist filled with is used , and the mounted electronic component is fixed to the component mounting pad with solder even on the lower surface portion of the connection terminal. is there.
[0025]
In particular, in the printed wiring board according to the invention of claim 2, a part of the recess is exposed from the connection terminal, and the solder that holds the side surface portion of the connection terminal of the mounted electronic component, and the lower surface The solder that holds the part is integrated, and the corners of the side surface and the lower surface of the connection terminal are fixed by this solder.
[0026]
Therefore, according to the present invention, it is possible to provide a printed wiring board capable of firmly and firmly holding the connection terminals of the electronic components to the component mounting pads of the board with a simple structure , and the recesses are formed of photo. Since it is formed using the solder resist, even if the component mounting pad 10 is very small, the fine recess 30 can be reliably formed in the region of the component mounting pad 10.
[0027]
In addition, regarding the heat radiation design of the mounted component, since an irregular shape or a large number of holes can be provided from the component mounting pad to the inside of the substrate, there is an effect that the degree of freedom of the heat radiation design can be improved.
[0028]
Furthermore, in particular, according to the invention of claim 2, it is possible to provide a printed wiring board capable of firmly and firmly holding the connection terminal of the electronic component to the component mounting pad of the substrate with a simple structure. .
[Brief description of the drawings]
FIG. 1 is a partial plan view showing an embodiment of a printed wiring board according to each invention.
FIG. 2 is a cross-sectional view taken along the line AA in FIG.
FIG. 3 is a partial plan view showing an embodiment of a printed wiring board according to the invention of claim 2;
4 is a cross-sectional view taken along line BB in FIG.
5 is a partial plan view showing another embodiment of the printed wiring board according to the invention of claim 2. FIG.
6 is a cross-sectional view taken along the line CC in FIG.
7 is a partial plan view showing still another embodiment of the printed wiring board according to the invention of claim 2. FIG.
FIG. 8 is a partial plan view showing a conventional printed wiring board.
FIG. 9 is a cross-sectional view taken along the line DD in FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Component mounting pad 20 Connection terminal 30 Recess 40 Solder 50 Substrate 60 Outer layer conductor circuit 61 Inner layer conductor circuit

Claims (2)

基板の表面に、はんだを介して電子部品が実装される部品実装用パッドと、基板の内部に、内層の導体回路とを備えたプリント配線板において、
前記部品実装用パッドに、実装される電子部品の接続端子の真下に位置すべく配設され、前記内層の導体回路に達し、前記はんだが充填されるフォトソルダーレジストを用いて形成した凹部を設けてあり、実装された前記電子部品が、前記接続端子の下面においても、凹部に充填された半田によって固持されることを特徴とするプリント配線板。In a printed wiring board provided with a component mounting pad on which electronic components are mounted via solder on the surface of the substrate and an inner layer conductor circuit inside the substrate,
The component mounting pad is provided with a recess formed using a photo solder resist that is disposed to be located directly below the connection terminal of the electronic component to be mounted, reaches the conductor circuit of the inner layer, and is filled with the solder. The printed wiring board is characterized in that the mounted electronic component is fixed to the lower surface of the connection terminal by solder filled in the recess . 前記凹部を、その一部が前記接続端子から露呈するものとしたことを特徴とする請求項１記載のプリント配線板。The printed wiring board according to claim 1, wherein a part of the concave portion is exposed from the connection terminal.
JP21452794A 1994-09-08 1994-09-08 Printed wiring board Expired - Lifetime JP3671355B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21452794A JP3671355B2 (en) 1994-09-08 1994-09-08 Printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21452794A JP3671355B2 (en) 1994-09-08 1994-09-08 Printed wiring board

Publications (2)

Publication Number Publication Date
JPH0878850A JPH0878850A (en) 1996-03-22
JP3671355B2 true JP3671355B2 (en) 2005-07-13

Family

ID=16657206

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21452794A Expired - Lifetime JP3671355B2 (en) 1994-09-08 1994-09-08 Printed wiring board

Country Status (1)

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JP (1) JP3671355B2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2790124B2 (en) * 1996-06-11 1998-08-27 日本電気株式会社 Wiring board pad structure
JP2009200212A (en) * 2008-02-21 2009-09-03 Keihin Corp Heat radiation structure of printed circuit board
JP4825919B1 (en) * 2010-05-31 2011-11-30 株式会社東芝 Electronics
JP4902005B2 (en) * 2011-06-22 2012-03-21 株式会社東芝 Television apparatus and electronic device
WO2019026198A1 (en) * 2017-08-02 2019-02-07 三菱電機株式会社 Base board assembly

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