JP3636564B2 - Circuit board device and manufacturing method thereof - Google Patents

Circuit board device and manufacturing method thereof Download PDF

Info

Publication number
JP3636564B2
JP3636564B2 JP05883297A JP5883297A JP3636564B2 JP 3636564 B2 JP3636564 B2 JP 3636564B2 JP 05883297 A JP05883297 A JP 05883297A JP 5883297 A JP5883297 A JP 5883297A JP 3636564 B2 JP3636564 B2 JP 3636564B2
Authority
JP
Japan
Prior art keywords
substrate
pins
main plane
circuit board
flange
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP05883297A
Other languages
Japanese (ja)
Other versions
JPH10256723A (en
Inventor
真 上野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eye Lighting Systems Corp
Original Assignee
Eye Lighting Systems Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eye Lighting Systems Corp filed Critical Eye Lighting Systems Corp
Priority to JP05883297A priority Critical patent/JP3636564B2/en
Publication of JPH10256723A publication Critical patent/JPH10256723A/en
Application granted granted Critical
Publication of JP3636564B2 publication Critical patent/JP3636564B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/366Assembling printed circuits with other printed circuits substantially perpendicularly to each other

Description

【0001】
【発明の属する技術分野】
本発明は組立が容易にできる回路基板装置及びその製造方法に関する。
【0002】
【従来の技術】
第5図に示すように、従来、通電されることにより高温になる半導体等が設けられた基板31は、その他の素子が設けられた基板33と接続される際、基板31の複数のピン37(充電部)を基板33の複数の孔35に通して半田付けされた後、接着剤やネジ等を用いてケース41に収納されていた。その後、基板31、33が装着されたケース41に蓋(図示せず)がネジ等で取り付けられていた。
【0003】
【発明が解決しようとする課題】
しかしながら、上記従来のように基板33に基板31をとりつける際、複数のピン37がばらけて複数の孔35にうまく入らないことが起こるため作業の煩雑化を招くことがあった。また、基板31、33をケース41に固定する際及びケース41に蓋をとりつける際に多数のネジを使用する必要があった。
【0004】
本発明は、上記問題点を解決することを課題としてなされたものであり、その目的は少ない固定作業により完成され、少ないネジ数による固定で基板のたわみを防止することを目的とするものである。
【0005】
【課題を解決するための手段】
前記課題を解決するために本発明の回路基板装置及びその製造方法は提供される。
そこで本発明では少ない行程で確実に基板を固定しケースに収納できるように工夫している。ピンを有する基板と接続される他の基板は、従来の技術では孔が設けられていたが、本発明では切り込みを設けて複数のピンがばらけている際にも他の基板との接合ができる。また、放熱用アルミフィンに他の基板を挿入するための溝を形成する事により他の基板の端部を固定するためのネジの数を減らすことができる。更にコ字状のケースに収納される際、コ字状のケースの内方に向いた開口部の両端を広げた後該両端部をアルミフィンに密着するように取り付けることにより容易にケースに収納することが可能となる。
【0007】
【実施例】
実施例の回路基板装置は放電灯を点灯する安定器である。以下図面により本発明の第1実施例について図1を用いて説明する。
この安定器はメイン半導体等を装着した基板1、その他の素子を装着した基板3、基板1及び基板3を固定する放熱用アルミフィン5とにより構成される。
まず、メイン半導体等を装着した基板1は接着剤等の適当な固定手段を用いてアルミフィン5に固着される。この際、絶縁距離を保つために基板1に設けられたピン7(充電部)とアルミフィン5との距離が3mm以上有ることが必要である。そのために基板1の端部が一定の位置に収まるようにアルミフィンの基板1を接地する面にガイド9あるいはエンボスを設けてもよい。尚、必要な際は基板1とアルミフィン5の間に絶縁体を設けてもよい。
その後、ピン7を挿入するための櫛形状に形成された複数の切り込み11が形成された基板3がアルミフィン5にネジ15を用いて固定される。そしてピン7が基板3に半田付けされる。切り込み11にピン7を挿入する際の端部13の形状にピン7が更に挿入しやすいように丸み等を持たせてもよい。また、端部13と端部21との段差はピン7を端部13側から容易に挿入するために設けられている。基板3は図1に示すようにネジ15でアルミフィン5に形成されたフランジ17に固定される。フランジ19はフランジ17と溝を形成して基板3の端部21を挟むように形成される。
【0008】
本発明の第2実施例について、図2を用いて説明する。第1実施例と同じ番号を付したものについては説明を省略する。
図2において、凸部23を除いて第1実施例と同じである。凸部23の端部
25は端部21と同様にフランジ17とフランジ19とで形成される溝に挟まれて固定される。この凸部23は基板1に設けられたピン7の配置により適宜に設けることができる。即ち、ピン7の配置により複数の凸部23を設ける様にしてもよい。これにより基板3のたわみが防止できる。
【0009】
本発明の第3の実施例について、図3を用いて説明する。第1実施例と同じ番号を付したものについては説明を省略する。
図3において、第1実施例と異なる点は図1における端部13を端部21と揃えて切り込み11を深くした点である。図3において複数の端部14は端部21と同様にフランジ17とフランジ19とで形成される溝に挟まれて固定される。第2実施例は凸部23を基板1に設けられたピン7の配置により適宜に設ける例であるのに対して、第3実施例は汎用型である。
【0010】
本発明の第4の実施例について、図4を用いて説明する。
ケース27本体はその側面から見て略コ字状に形成されている。アルミフィン5の両端との接合部の密着性を高めるためにケース27の両脚部は内方に傾けられている(図示せず)。基板1、3が固定されたアルミフィン5をケース27に収納する際にはケース27の両端部よりなる開口部を広げて収納される。この際、図4に示されるようにフランジより形成される溝29を設けて基板3を固定するようにしてもよい。これにより基板のたわみが防止される。
【0011】
【発明の効果】
以上のように、本発明によるとピンを有する基板を他の基板に接合する際、他の基板に切り込みを設けることにより容易に接合ができる。他の基板の切り込みが設けられた端部をアルミフィンに設けられた溝に挿入することによりたわみを防止し他の基板を固定するためのネジの数を減らすことができる。コ字状のケースの開口部の両端がアルミフィンに密着するように取り付けらるため安定器の冷却効果が高まる。コ字状のケースの内方に向いた開口部の両端を広げた後該両端部をアルミフィンに密着するように取り付けるためケースへの収納も容易にできる。このように構造が簡単で部品点数が少なくなり作業効率を上げることができる。
【図面の簡単な説明】
【図1】本発明の第1の実施例の正面図、側面図及び底面図である。
【図2】本発明の第2の実施例の正面図、側面図及び底面図である。
【図3】本発明の第3の実施例の正面図、側面図及び底面図である。
【図4】本発明の第4の実施例の正面図及び側面図である。
【図5】従来技術の正面図、側面図及び底面図である。
【符号の説明】
1 基板
3 基板
5 アルミフィン
7 ピン
9 エンボス
11 切り込み
13 端部
14 端部
15 ネジ
17 フランジ
19 フランジ
21 端部
23 凸部
25 端部
27 ケース
29 溝
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a circuit board device that can be easily assembled and a manufacturing method thereof.
[0002]
[Prior art]
As shown in FIG. 5, when a substrate 31 provided with a semiconductor or the like that becomes high temperature when energized is connected to a substrate 33 provided with other elements, a plurality of pins 37 of the substrate 31 are conventionally provided. After the (charging part) was soldered through the plurality of holes 35 of the substrate 33, it was housed in the case 41 using an adhesive, screws, or the like. Thereafter, a lid (not shown) was attached to the case 41 on which the substrates 31 and 33 were mounted with screws or the like.
[0003]
[Problems to be solved by the invention]
However, when the substrate 31 is attached to the substrate 33 as in the conventional case, the plurality of pins 37 may be scattered and not fit into the plurality of holes 35, which may complicate the work. Further, when fixing the substrates 31 and 33 to the case 41 and attaching a lid to the case 41, it is necessary to use a large number of screws.
[0004]
The present invention has been made in order to solve the above-mentioned problems, and the object thereof is completed by a small number of fixing operations, and an object thereof is to prevent the substrate from being bent by fixing with a small number of screws. .
[0005]
[Means for Solving the Problems]
In order to solve the above problems, a circuit board device and a manufacturing method thereof according to the present invention are provided.
Therefore, the present invention is devised so that the substrate can be securely fixed and stored in the case with a small number of steps. The other substrate connected to the substrate having the pins is provided with holes in the prior art, but in the present invention, even when a plurality of pins are scattered by providing a notch, the bonding with the other substrate is possible. it can. Further, by forming a groove for inserting another substrate in the heat radiating aluminum fin, the number of screws for fixing the end of the other substrate can be reduced. When storing in a U-shaped case, it can be easily stored in the case by expanding both ends of the opening facing inward of the U-shaped case and attaching the both ends so that they are in close contact with the aluminum fins. It becomes possible to do.
[0007]
【Example】
The circuit board device of the embodiment is a ballast for lighting a discharge lamp. Hereinafter, a first embodiment of the present invention will be described with reference to FIG.
This ballast is composed of a substrate 1 on which a main semiconductor or the like is mounted, a substrate 3 on which other elements are mounted, a substrate 1 and a heat-dissipating aluminum fin 5 that fixes the substrate 3.
First, the substrate 1 on which the main semiconductor or the like is mounted is fixed to the aluminum fin 5 using an appropriate fixing means such as an adhesive. At this time, in order to maintain the insulation distance, it is necessary that the distance between the pin 7 (charging portion) provided on the substrate 1 and the aluminum fin 5 is 3 mm or more. Therefore, a guide 9 or an emboss may be provided on the surface of the aluminum fin substrate 1 that contacts the ground so that the end portion of the substrate 1 is kept at a certain position. If necessary, an insulator may be provided between the substrate 1 and the aluminum fin 5.
Then, the board | substrate 3 in which the some notch 11 formed in the comb shape for inserting the pin 7 was formed is fixed to the aluminum fin 5 using the screw | thread 15. FIG. Then, the pin 7 is soldered to the substrate 3. The shape of the end portion 13 when the pin 7 is inserted into the notch 11 may be rounded so that the pin 7 can be inserted more easily. Further, the step between the end 13 and the end 21 is provided to easily insert the pin 7 from the end 13 side. The substrate 3 is fixed to a flange 17 formed on the aluminum fin 5 with screws 15 as shown in FIG. The flange 19 is formed so as to sandwich the end 21 of the substrate 3 by forming a groove with the flange 17.
[0008]
A second embodiment of the present invention will be described with reference to FIG. A description of the components having the same numbers as those in the first embodiment will be omitted.
2 is the same as the first embodiment except for the convex portion 23. Similarly to the end portion 21, the end portion 25 of the convex portion 23 is sandwiched and fixed by a groove formed by the flange 17 and the flange 19. The convex portion 23 can be appropriately provided depending on the arrangement of the pins 7 provided on the substrate 1. That is, a plurality of convex portions 23 may be provided by arranging the pins 7. Thereby, the bending of the substrate 3 can be prevented.
[0009]
A third embodiment of the present invention will be described with reference to FIG. A description of the components having the same numbers as those in the first embodiment will be omitted.
3 is different from the first embodiment in that the notch 11 is deepened by aligning the end 13 in FIG. 1 with the end 21. In FIG. 3, the plurality of end portions 14 are fixed by being sandwiched between grooves formed by the flange 17 and the flange 19, similarly to the end portion 21. The second embodiment is an example in which the convex portion 23 is appropriately provided by the arrangement of the pins 7 provided on the substrate 1, whereas the third embodiment is a general-purpose type.
[0010]
A fourth embodiment of the present invention will be described with reference to FIG.
The case 27 main body is formed in a substantially U-shape when viewed from the side. The legs of the case 27 are inclined inward (not shown) in order to improve the adhesion of the joints with both ends of the aluminum fin 5. When the aluminum fins 5 to which the substrates 1 and 3 are fixed are stored in the case 27, the openings formed by both ends of the case 27 are expanded and stored. At this time, as shown in FIG. 4, a groove 29 formed by a flange may be provided to fix the substrate 3. This prevents the substrate from being bent.
[0011]
【The invention's effect】
As described above, according to the present invention, when a substrate having pins is bonded to another substrate, the other substrate can be easily bonded by providing a cut. By inserting the end portion where the notch of the other substrate is provided into the groove provided in the aluminum fin, the deflection can be prevented and the number of screws for fixing the other substrate can be reduced. Since the both ends of the opening of the U-shaped case are attached so as to be in close contact with the aluminum fin, the cooling effect of the ballast is enhanced. Since both ends of the opening portion facing the inward of the U-shaped case are widened, the both end portions are attached so as to be in close contact with the aluminum fin, so that the case can be easily accommodated. Thus, the structure is simple, the number of parts is reduced, and work efficiency can be increased.
[Brief description of the drawings]
FIG. 1 is a front view, a side view, and a bottom view of a first embodiment of the present invention.
FIG. 2 is a front view, a side view, and a bottom view of a second embodiment of the present invention.
FIG. 3 is a front view, a side view, and a bottom view of a third embodiment of the present invention.
FIGS. 4A and 4B are a front view and a side view of a fourth embodiment of the present invention. FIGS.
FIG. 5 is a front view, a side view, and a bottom view of the prior art.
[Explanation of symbols]
1 Substrate 3 Substrate 5 Aluminum fin 7 Pin 9 Emboss 11 Notch 13 End 14 End 15 Screw 17 Flange 19 Flange 21 End 23 Projection 25 End 27 Case 29 Groove

Claims (2)

複数のピンを有する基板であって、該ピンは該基板の主平面と略平行に該基板端部から突出している基板
該基板の主平面に固定された放熱用フィン;及び
該基板のピン個々挿入するための複数の切込みが形成されている端部を有する他の基板とからなり、
該他の基板の切込みを有する端部が、該フィンに設けられた該基板の主平面に直角方向に延在するフランジを有する溝に挿入され、該フランジにネジ止めされており、
該基板の主平面と該他の基板の主平面とは互いに直交して配置され、該基板のピンの個々が該他の基板の切込みの対応する個々に挿入されている回路基板装置。
A substrate having a plurality of pins , wherein the pins protrude from the end of the substrate substantially parallel to a main plane of the substrate ;
A heat dissipating fin fixed to the main plane of the substrate; and another substrate having an end portion in which a plurality of cuts for inserting individual pins of the substrate are formed ,
An end having a notch in the other substrate is inserted into a groove having a flange extending in a direction perpendicular to a main plane of the substrate provided in the fin and screwed to the flange;
A circuit board device in which a main plane of the board and a main plane of the other board are arranged orthogonal to each other, and each of the pins of the board is inserted individually corresponding to the cut of the other board.
請求項1に記載の装置において、コ字状のケースの開口部の両端が該アルミフィンの両端に密着するように取り付けられている回路基板装置。2. The circuit board device according to claim 1, wherein both ends of the opening of the U-shaped case are attached so as to be in close contact with both ends of the aluminum fin.
JP05883297A 1997-03-13 1997-03-13 Circuit board device and manufacturing method thereof Expired - Lifetime JP3636564B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP05883297A JP3636564B2 (en) 1997-03-13 1997-03-13 Circuit board device and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP05883297A JP3636564B2 (en) 1997-03-13 1997-03-13 Circuit board device and manufacturing method thereof

Publications (2)

Publication Number Publication Date
JPH10256723A JPH10256723A (en) 1998-09-25
JP3636564B2 true JP3636564B2 (en) 2005-04-06

Family

ID=13095632

Family Applications (1)

Application Number Title Priority Date Filing Date
JP05883297A Expired - Lifetime JP3636564B2 (en) 1997-03-13 1997-03-13 Circuit board device and manufacturing method thereof

Country Status (1)

Country Link
JP (1) JP3636564B2 (en)

Also Published As

Publication number Publication date
JPH10256723A (en) 1998-09-25

Similar Documents

Publication Publication Date Title
US4596433A (en) Lampholder having internal cooling passages
US5991154A (en) Attachment of electronic device packages to heat sinks
JPWO2004038289A1 (en) Light emitting module
US20010050844A1 (en) Structure for mounting radiating plate
US20020093092A1 (en) Power semiconductor module and cooling element for holding the power semiconductor module
JP2005072600A (en) Led lamp with insertable led substrate and manufacturing method therefor
JP2001358482A (en) Heat radiative module
US10634309B2 (en) Motor vehicle lighting module with cooling member
US6917482B2 (en) Optical module mounted body and securing method of optical module
JPH11330564A (en) Optical module
JP3636564B2 (en) Circuit board device and manufacturing method thereof
JP2001110958A (en) Heat sink for electronic component
JP2001015186A (en) Grounding structure for integrated circuit
JP2005203385A (en) Heat sink
JP3670113B2 (en) Self-supporting terminal and radiator using the same
KR200151238Y1 (en) Haet sink fixing device
JP4681469B2 (en) Electronic device and lighting apparatus
JP2000133977A (en) Heat sink for electronic equipment
KR930004876Y1 (en) Flyback transformer
JPH0677364A (en) Radiation fin
JP2001250895A (en) Fixing structure for heat radiator to cpu device
JPH0569995U (en) Heat sink for semiconductor
JPH07221470A (en) Circuit module fitting constitution
JP4626061B2 (en) Assembly structure of discharge lamp lighting device
KR101416895B1 (en) Led lamp

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20040813

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20040825

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20041025

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20041213

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20050105

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090114

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090114

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100114

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100114

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110114

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110114

Year of fee payment: 6

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110114

Year of fee payment: 6

R370 Written measure of declining of transfer procedure

Free format text: JAPANESE INTERMEDIATE CODE: R370

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120114

Year of fee payment: 7

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120114

Year of fee payment: 7

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120114

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130114

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130114

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140114

Year of fee payment: 9

EXPY Cancellation because of completion of term