JP3608682B2 - Manufacturing method of semiconductor integrated circuit device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of manufacturing a semiconductor integrated circuit element suitable for use in manufacturing a semiconductor integrated circuit element suitable for a specific application.
[0002]
[Prior art]
When semiconductor integrated circuit elements are classified according to applications, they can be classified into general-purpose elements and elements for specific applications. Examples of the general-purpose element include a digital circuit element typified by a digital memory. Moreover, as an element suitable for a specific application, for example, an integrated circuit element for an analog circuit can be given.
[0003]
In other words, the specifications of analog circuit elements are determined for each product used, and for this reason, a variety of products are produced in small quantities. In addition, every time a new device is developed, the design of an analog circuit element portion integrated into an integrated circuit must be newly changed.
Under such a demand, a custom manufacturing method has been conventionally employed. Custom methods include full-custom methods and semi-custom methods.
[0004]
The full custom method is designed for each target product (analog measuring instrument, mobile phone, TV, etc.) taking into consideration the circuit configuration and component arrangement suitable for the product, and developing integrated circuit elements. It is a technique.
The semi-custom method is to prepare a semiconductor chip on which frequently used circuit elements (capacitors, resistors, diodes, transistors, etc.) are formed, and connect these circuit elements in accordance with the purpose. Is a method of constructing.
[0005]
As another method of the semi-custom method, the elements prepared in the semiconductor chip are not circuit elements, but circuit function blocks (amplifiers, gate circuits, switching circuits, etc.) are prepared in the semiconductor chip in advance, and these circuit function blocks are intended. There is also a method of configuring the target circuit device by combining and connecting according to the above.
[0006]
[Problems to be solved by the invention]
When the full custom method is adopted, there is a drawback that it takes time from design to completion. In addition, since development takes time, there is a disadvantage that costs are increased.
According to the former method of the semi-custom method, components such as capacitors, resistors, diodes, and transistors formed on a semiconductor chip are formed in a regular array pattern, for example, in a lattice shape, and an appropriate one is selected from these arrays. Since a part is selected and a wiring pattern is formed and connected to the semiconductor chip to form a circuit, the manufacturing process of the part can be omitted. In this respect, cost reduction can be expected. However, since the components prepared in the semiconductor chip are simply arranged regularly without considering the function of the target product, the configured circuit does not necessarily satisfy the performance of the target circuit. Inconveniences that cannot be made often occur.
[0007]
Even in the latter method of the semi-custom method, circuit function blocks such as amplifiers, gates, and switching circuits prepared in the semiconductor chip are arranged in accordance with a regular pattern, which is suitable for configuring the target device. Blocks with different functions and their arrangement are not considered.
As a result, it is difficult to obtain performance suitable for the target device.
[0008]
In other words, according to the conventional semi-custom method, a semiconductor chip on which a highly versatile component or a highly versatile circuit function block is prepared in advance is provided. Reduction can be expected. However, since this semiconductor chip is versatile in order to satisfy all requirements, the types of components and circuit function blocks are limited to those with high versatility, and the arrangement of components and circuit functions are limited. The arrangement of the blocks is simply arranged regularly, and the types of components, the types and arrangement of circuit function blocks suitable for each target device are not given. In this respect, there is a disadvantage that an apparatus requiring high performance, for example, a high precision DC analog circuit used for a measuring instrument or the like cannot be manufactured by a conventional semi-custom method.
[0009]
SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor integrated circuit element manufacturing method capable of forming a circuit satisfying the performance of a target circuit device while adopting a semi-custom method in which circuit function blocks or circuit elements to be used are prepared in advance on a semiconductor chip. This is a proposal.
[0010]
[Means for Solving the Problems]
In the present invention, circuit function blocks (including circuit function blocks specially designed for each purpose) required for the target device are arranged and formed in a positional relationship that should satisfy the performance of the target device. Prepared a semiconductor chip, a mask for providing a wiring pattern suitable for the target circuit device to the semiconductor chip, and a resistance mask for forming a resistor for determining accuracy and characteristics of the device. The present invention proposes a method for manufacturing a semiconductor integrated circuit device, which forms a target semiconductor integrated circuit device using the mask.
[0011]
According to the method for manufacturing a semiconductor integrated circuit device according to the present invention, a semiconductor chip provided in advance has an arrangement suitable for configuring a circuit for a specific application, and a circuit function block suitable for a target device. Thus, a circuit satisfying the performance for a specific application can be formed simply by connecting these circuit function blocks with a wiring pattern or a resistor.
[0012]
In addition, it is possible to make circuit devices having slightly different functions by slightly changing the wiring pattern connecting each circuit functional block. In addition, since the resistance value of the resistor that determines the accuracy and characteristics of the device can be freely set, it is possible to manufacture semiconductor integrated circuit elements having various precisions and characteristics.
Therefore, there is obtained an advantage that a semiconductor integrated circuit element having a target circuit performance can be obtained while taking advantage of the semi-custom method.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
A method for manufacturing a semiconductor integrated circuit device according to the present invention will be described with reference to FIG. In the figure, reference numeral 10 denotes a semiconductor chip. The semiconductor chip 10 is prepared with circuit function blocks 10A, 10B, 10C, 10D... 10K necessary for a target circuit device. Here, the circuit function block 10A is, for example, a preamplifier, 10B is a differential amplifier, 10C is an absolute value circuit, 10D is a window comparator, 10E is a buffer amplifier, 10F is an inverting amplifier, 10G is an instrumentation amplifier, and 10H is a differential amplifier. Reference numeral 10I denotes a buffer amplifier, 10J denotes a switch circuit, 10K denotes a multiplexer, and 10L denotes a switch element. All or some of these circuit function blocks 10A to 10L are designed specifically for the target device. Reference numeral 10M denotes a terminal for external connection. These circuit function blocks 10A to 10L are formed only by function blocks, and wirings connecting between them, resistors for determining accuracy and characteristics of circuits, and the like are not formed. Furthermore, each circuit functional block 10A-10L shall be arrange | positioned at the positional relationship suitable for comprising a direct-current system analog circuit, for example.
[0014]
In the present invention, a large number of such semiconductor chips 10 are manufactured and prepared in advance, and when a device having different specifications is manufactured, a wiring pattern forming mask 20 for configuring the target device, and the semiconductor chip Various resistor masks 30 for forming resistors (resistors for determining circuit accuracy and characteristics) that are insufficient for the circuit 10 are prepared. Using these masks 20 and 30, a wiring pattern and a mask are formed on the semiconductor chip 10. Resistors are formed to construct the desired circuit.
[0015]
In order to create a circuit with different specifications, various types of resistance masks 30 are prepared, and a circuit having the desired accuracy or characteristics is created by varying the resistance values of resistors that determine the accuracy and characteristics of the circuit. Can do. In addition, by changing a part of the wiring pattern formed by the wiring pattern mask 20 and changing the connection between the circuit function blocks, it is possible to make a circuit with a partially different operation. In other words, by simply changing the resistance value of the resistor that determines the wiring pattern, accuracy, and characteristics, a circuit with various characteristics and accuracy can be manufactured even for a specific application, and the operation can be partially different. can do.
[0016]
【The invention's effect】
As described above, according to the method for manufacturing a semiconductor integrated circuit element according to the present invention, a semiconductor chip on which a necessary circuit function block or circuit element is formed is prepared, although a so-called semi-custom method is adopted. The positional relationship of the circuit function blocks prepared on the semiconductor chip is selected so that the performance required by the target circuit device can be satisfied. Therefore, if the circuit function blocks are connected to each other, the target performance can be achieved. The circuit it has can be easily manufactured. In addition, since the resistor for determining the wiring pattern and accuracy or characteristics can be formed by arbitrarily selecting a resistance value, a semiconductor integrated circuit having different specifications can be easily manufactured. As a result, it is possible to save the cost of developing a semiconductor chip, and to obtain an advantage that it is possible to manufacture a semiconductor integrated circuit element having a variety of products and having desired accuracy and characteristics in a short period of time.
[Brief description of the drawings]
FIG. 1 is a view for explaining a method of manufacturing a semiconductor integrated circuit device according to the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Semiconductor chip 10A-10L Circuit functional block 20 Wiring pattern mask 30 Resistance mask

Claims (1)

A semiconductor chip in which circuit function blocks and circuit elements are formed so as to have a circuit function and a positional relationship that can satisfy the performance required by the target circuit device is prepared, and the target device is configured on the semiconductor chip. For this purpose, various types of masks for wiring patterns for connecting circuit function blocks and resistors for forming resistors for determining accuracy and characteristics of the device are prepared. A method of manufacturing a semiconductor integrated circuit device, comprising: forming a wiring pattern having different interconnections and resistors having different resistance values to manufacture semiconductor integrated circuit devices having different specifications.

Images