JP3600626B2

JP3600626B2 - Electronic components and their manufacturing method

Info

Publication number: JP3600626B2
Application number: JP01987694A
Authority: JP
Inventors: 正中川; 陽三小原; 守男多田
Original assignee: Hokuriku Electric Industry Co Ltd
Current assignee: Hokuriku Electric Industry Co Ltd
Priority date: 1994-01-20
Filing date: 1994-01-20
Publication date: 2004-12-15
Anticipated expiration: 2019-12-15
Also published as: JPH07211175A

Description

【０００１】
【産業上の利用分野】
この発明は、操作パネルやキーボード等に用いられるプッシュスイッチや接点付き基板等の接点を有した電子部品とその製造方法に関する。
【０００２】
【従来の技術】
従来、例えばプッシュスイッチは、本願出願人による実開平５−２３３６７号公報に開示されているように、絶縁基板に導体部を形成し、この絶縁基板表面の接点と接続する金属製のタクト板を載置し、この絶縁基板及びタクト板に粘着層を介して耐熱性フィルムを密着させ互いに固定していた。そして、絶縁基板表面の接点は、回路パターンの銅箔をそのまま利用したものや、金属鋲を打ち込んでタクト板との接点を形成している。
【０００３】
【発明が解決しようとする課題】
上記従来の技術の電子部品の接点は、回路パターンを形成する銅箔をそのまま接点として残しているものであり、表面がほぼ絶縁基板と面一の平面であるので、例えばプッシュスイッチにおいて、タクト板との接触し際して、確実な接触状態が得られず、接点としての信頼性が高くないものであった。また、金属鋲を接点として取り付けるものは、金属鋲と回路パターンとの接続を図る必要があり、金属鋲の打ち込みも難しく、特に、きわめて小さい接点には用いることができないものである。
【０００４】
この発明は上記従来の技術の問題点に鑑みてなされたもので、構造が簡単で、薄く形成され、電気的接続の信頼性の高い接点を有した電子部品とその製造方法を提供することを目的とする。
【０００５】
【課題を解決するための手段】
この発明は、ガラスエポキシ系の基板やフェノール系樹脂基板等の絶縁基板の表面に銅箔や銅箔とアルミ箔等の金属箔で導体部が形成され、この導体部の裏面側の上記絶縁基板の所定位置に透孔が形成され、この透孔の上方の上記導体部が上記絶縁基板側から外方に向けて膨出した接点が形成され、この接点の裏面側の上記透孔内に樹脂が充填され少なくとも上記接点の裏面に付着して補強している電子部品である。この樹脂は、銀塗料やカーボン塗料等の導電性樹脂塗料であり、上記絶縁基板の裏面にも上記金属箔やメッキ、または導電性樹脂塗料等による導体部が形成され、上記接点下部の透孔とこの裏面側の導体部とが、上記透孔に充填された導電性樹脂塗料により電気的に接続されているものである。また、上記接点の頂部に小孔が形成され、上記透孔に充填される樹脂がこの小孔を除いて上記接点裏面及び上記透孔内に充填され、上記絶縁基板の表裏がこの小孔及び透孔を介して連通しているものである。
【０００６】
さらにこの発明は、ガラスエポキシ系の基板やフェノール系樹脂基板等の絶縁基板の表面及び裏面に銅箔や銅箔とアルミ箔等の金属箔で導体部が形成され、この導体部の裏面側の上記絶縁基板の所定位置に透孔が形成され、この透孔を覆った上記導体部が上記絶縁基板側から外方に向けて膨出して接点が形成され、この接点の裏面側の上記透孔内に樹脂が充填され少なくとも上記接点の裏面に付着してこの接点を補強し、この接点にタクト板等の可動接点部品が対面して位置し、この可動接点部品を絶縁性フィルムが覆っている電子部品である。この樹脂は、銀塗料やカーボン塗料等の導電性樹脂塗料であり、上記接点の反対側の面の導体部とが、上記透孔に充填された導電性樹脂塗料により接続されているものである。また、この絶縁性フィルムは、粘着層と導電層が形成され、この絶縁性フィルムの導電層の一部が、上記絶縁基板に形成されたアース端子に接続されているものである。
【０００７】
さらにこの発明は、ガラスエポキシ系の基板やフェノール系樹脂基板等の絶縁基板の表面に銅箔や銅箔とアルミ箔等の金属箔を貼り付けて導体部を形成し、この導体部の裏面側の上記絶縁基板の所定位置にドリルにより透孔を形成するとともに、上記導体部を上記絶縁基板側から外方に向けて膨出させて接点を形成し、この接点の裏面側の上記透孔内の少なくとも上記接点の裏面側にエポキシ樹脂等の絶縁性樹脂や銀塗料等の導電性樹脂塗料を充填し上記接点を補強する電子部品の製造方法である。また、上記接点の頂部に小孔が形成される程度に上記ドリルにより透孔を形成し、上記透孔に充填される樹脂をこの小孔を除いて上記接点の裏面及び上記透孔内に充填するものである。
【０００８】
上記絶縁基板に表裏面に上記導体部を形成し、この導体部に向かってその反対側から上記絶縁基板にドリルにより透孔を形成するとともに、上記導体部を上記絶縁基板側から外方に向けて膨出させて接点を形成し、上記透孔内に導電性樹脂塗料を充填して上記接点の反対側の導体部に上記導電性樹脂塗料を介して接続する電子部品の製造方法である。また、液晶ポリマーやポリエステル、ポリイミド等の熱可塑性の絶縁性樹脂の基板表面に、展性の良い金属薄板が積層されるようにインサート成形等によって一体成形し、この金属薄板による導体部を形成しても良いものである。
【０００９】
【作用】
この発明の電子部品は、導体部として金属箔が貼り付けられた絶縁基板に、この金属箔とは反対側の面からドリルで透孔を形成し、この透孔形成時に上記導体部の金属箔を外側に変形させて外方に膨出した接点を形成したものである。そしてこの接点の裏面側に樹脂を充填して、接点の強度を保持し、押圧にも耐え得るようにしたものである。また、この樹脂に導電性樹脂塗料を用いることにより、表裏の導体部を接続するスルーホールを容易に形成することができるものである。
【００１０】
【実施例】
以下この発明の実施例について図面に基づいて説明する。図１〜図４はこの発明の第一実施例を示すもので、この実施例の電子部品は、プッシュスイッチについてものである。このプッシュスイッチは、ガラスエポキシ製の積層板やフェノール系樹脂基板等の絶縁基板１０の表面に、銅箔や、アルミニウムをキャリアにした銅箔、アルミ箔その他金属箔が貼り付けられた導体部１２が形成されている。この導体部は、絶縁基板１０の表面に一様に貼り付けられた銅箔等の金属箔を、所定の回路パターン状にエッチングして形成するものである。金属箔の厚さは、１８〜１０５μｍの厚さであり、さらに厚い１３０μｍ程度のものでも良い。また、貼り付け強度の高いものであれば、より薄い金属箔例えば１０μｍ程度のものでも良く、この場合、金属箔の裏面に樹脂フィルム等の補強部材が設けられたものでも良い。
【００１１】
絶縁基板１０上の導体部１２の一端部には、図３、図４に示すように、導体部１２の表面が外方に膨出した接点１４が形成されている。さらに、絶縁基板１４の中央部にも、導体部１２を外方に膨出させて形成した接点１５が形成されている。この接点１４，１５の裏面側の絶縁基板１０には、透孔１６が形成されている。そして、この透孔１６内に銀塗料やカーボン塗料等の導電性樹脂塗料１８が充填されている。また、接点１４の裏面側の絶縁基板１０の裏面にも、金属箔を貼り付けた導体部２０が形成され、この導体部２０に透孔１６内の導電性樹脂塗料１８が接続し、表裏の導体部１２，２０を接続するスルーホールを形成している。
【００１２】
導体部１２の他端部には、絶縁基板１０の透孔１６と等しい内径の透孔２２が形成され、この透孔２２及びその裏面側の絶縁基板１０の透孔１６内に導電性樹脂塗料１８が中空状に充填塗布されている。さらに、この透孔２２に対向する裏面側の導体部２０には、裏面側に膨出した接点２４が形成され、その中央部には、小孔２６が形成され、この小孔２６を介して絶縁基板１０の表裏が連通している。
【００１３】
この絶縁基板１０の表面には、接点１４に接触するように、可動接点部材であるタクト金属板３０が載せられる。タクト金属板３０の接点１４に対応する部分には、長孔３２が形成され、接点１４と長孔３２の周縁部とが広い面積で接触するように形成されている。タクト金属板３０の中央部には、上方に膨らんだ可動接点部３４が形成されている。そして、タクト金属板３０を覆うように、図示しない耐熱性粘着剤の粘着層を有したポリイミド樹脂等の耐熱性の絶縁性フィルムが絶縁基板１０を覆っている。
【００１４】
この実施例のプッシュスイッチである電子部品の製造方法は、銅箔等の導体部１２が貼り付けられた絶縁基板１０の所定個所に、図２に示すように、導体部１２の反対側の面から、ドリル４０で、絶縁基板に透孔１６を形成する。この時ドリル４０の先端が、導体部１２に裏面に当接したところで、ドリル４０の送り速度を落として、導体部１２に穴を明けないようにして、導体部１２を裏面側から外方に押し出す。この押出作業は、ドリルを回転しながら行っても良く、一旦ドリルを停止させてから行っても良い。そして、導体部１２が外方に膨出し適度の高さになったところで、ドリルを後退させて、接点１４，１５の膨出が成される。ドリル４０の直径及び先端部の角度は適宜選択できるものであり、このドリル４０の形状により接点１４，１５の形状が決定されるものである。
【００１５】
また、接点２４の頂部の小孔２６の形成に際しては、透孔１６が貫通した後もドリル４０を回転させて小孔２６を形成する。この時、接点２４全体に穴が開かないように、ドリル４０の先端部の角度がより鋭角のドリルに切り替えても良い。
【００１６】
この後、透孔１６に導電性樹脂塗料１８を塗布する。この塗布は、印刷により容易かつ正確に行われる。また、表側の導体部１２の透孔２２からは、透孔１６の内壁面に塗布するだけの導電性樹脂塗料１８を透孔１６内に塗布し、接点２４の小孔２６を塞がないようにする。
【００１７】
この後、タクト板３０を絶縁基板１０上に載せ、接点１４の位置に長孔３２が位置するようにして、その上にポリイミド樹脂等の耐熱性の絶縁性フィルムを装着し、プッシュスイッチが完成する。
【００１８】
この実施例のプッシュスイッチである電子部品は、導体部１２を膨出させた接点１４，１５により電気的接続部を形成しているので、この接点１４，１５に接続する他の部材が、確実に接点１４，１５に接触可能であり、接点１４，１５の電気的信頼性がきわめて高いものとなるものである。しかも、この実施例のプッシュスイッチは、容易に薄型化することができるものであり、部品点数も最小限のものである。また、プッシュスイッチの接点内部の空気を、導体部１２の透孔２２を介して、絶縁基板１０の透孔１６及び接点２２の小孔２６により外部に逃がすこともできるものである。
【００１９】
ここで、絶縁基板１０の裏面側の導体部２０は、メッキまたは導電性樹脂塗料を印刷して形成しても良く、外方に膨出した接点を形成する導体部１２のみを、金属箔により形成しても良いものである。また、導電性樹脂塗料１８は、スルーホールを形成する個所以外はエポキシ樹脂等の絶縁性樹脂でも良く、接点１４，１５を裏面から支持し、接点１４，１５にかかる押圧力に対して、接点１４，１５を補強するものであれば良い。
【００２０】
次にこの発明の第二実施例について図５〜図７を基にして説明する。ここで上記実施例と同様の部材は同一符号を付して説明を省略する。この実施例の電子部品もプッシュスイッチについてのもので、基板１０の表面に形成された接点１４にドーム状のタクト板３０の周縁部が接続し、接点１４の透孔１６には導電性樹脂塗料１８が充填されて、スルーホールが形成されている。このタクト板３０は、シールド付き絶縁性フィルム５０により覆われ位置決め固定されている。
【００２１】
この絶縁性フィルム５０は、図７に示すように、ポリイミド樹脂等の耐熱性フィルム５２の裏面側に粘着層５４が形成され、表面側に、アルミニウム等の金属薄膜の導電層５６が形成されている。この粘着層５４により、タクト板３０を保持し、絶縁基板１０に固定しているものである。また、この絶縁性フィルム５０の一側縁部には、図５に示すように、アース接続片５８が形成され、このアース接続片５８の端部が、絶縁基板１０のアース端子６０に接続している。この接続は、絶縁性フィルム５０の導電層５６を、アース端子６０に接触するようにアース接続片５８を折曲げ、導電性樹脂塗料等の導電性接着剤で固定している。
【００２２】
この実施例によれば、プッシュスイッチのシールドとアースを確実かつ容易に達成することができ、しかも、プッシュスイッチを薄型化することができるものである。
【００２３】
尚、この発明の電子部品の絶縁性基板と導体部は、絶縁性樹脂に銅やアルミ、その他の合金であって、展性の良い金属による金属薄板をインサート成形して形成しても良いものである。基板用の絶縁性樹脂しては、芳香族ポリエステル、ポリアミド、ポリアセタール、ポリフェニレンサルファイド、ポリサルホン、ポリフェニレンオキサイド、ポリイミド、ポリエーテルケトン、ポリアリレート等の熱可塑性樹脂、特に耐熱性及び寸法安定性の優れた完全芳香族ポリエステル、特に射出成形性の優れた液晶ポリエステル、ポリエステルアミド、ポリフェニレンサルファイド等の熱可塑性樹脂である。そして、金属薄板と樹脂基板をインサート成形により一体成形した場合、例えば、接点や端子を基板と一体成形した可変抵抗器、スイッチ用接点等の電子部品にこの発明を利用することができる。さらに、金属薄板と基板を一体成形した場合、金属薄板に複数の基板を成形し、端子やキャップその他の部品を取り付け後、各基板毎に金属薄板による端子または連結部を切断して、個々の電子部品にしても良いものである。これにより、電子部品の自動組立化をさらに進めることができる。
【００２４】
尚、この発明の電子部品は、プッシュスイッチ以外に、接点付きの可変抵抗器スイッチ基板、端子板等、基板上に接点を有した電子部品全てに利用可能なものである。また、この発明の金属箔には、接点を膨出させることが可能な金属薄板を含むものである。
【００２５】
【発明の効果】
この発明の電子部品とその製造方法は、絶縁基板に形成される端子を、その表面の導体部を裏面側から膨出させて形成し、その裏面側の絶縁基板に透孔を形成して、その中に樹脂を充填し導体部による接点を補強したので、電気的接続の信頼性が高い接点を、容易に形成することができ、しかも、部品点数も少なく、電子部品の薄型化にも寄与するものである。また、この発明の電子部品とその製造方法によれば、電子部品のシールドとアースを確実かつ容易に達成することができ、薄型化にも寄与する。
【図面の簡単な説明】
【図１】この発明の第一実施例の電子部品の分解斜視図である。
【図２】この発明の第一実施例の電子部品の製造方法を示す縦断面図である。
【図３】図１のＸ−Ｘ断面図である。
【図４】図１のＹ−Ｙ断面図である。
【図５】この発明の第二実施例の電子部品の斜視図である。
【図６】図５の電子部品のＺ−Ｚ断面図である。
【図７】この発明の第二実施例の電子部品絶縁性フィルムの縦断面図である。
【符号の説明】
１０基板
１２，２０導体部
１４，１５接点
１６透孔
１８導電性樹脂塗料
２２小孔[0001]
[Industrial applications]
The present invention relates to an electronic component having contacts, such as a push switch and a contact board, used for an operation panel, a keyboard, and the like, and a method for manufacturing the same.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, for example, as disclosed in Japanese Utility Model Application Laid-Open No. 5-23367 by the present applicant, a conductor part is formed on an insulating substrate, and a metal tact plate connected to a contact on the surface of the insulating substrate is used. The heat-resistant films were placed on the insulating substrate and the tact plate via an adhesive layer, and were fixed to each other. The contact on the surface of the insulating substrate is formed by directly using the copper foil of the circuit pattern or by driving a metal stud to form a contact with the tact plate.
[0003]
[Problems to be solved by the invention]
The contacts of the above-described conventional electronic components are those in which the copper foil forming the circuit pattern is left as a contact as it is, and the surface is substantially flush with the insulating substrate. When the contact was made, a reliable contact state could not be obtained, and the reliability as a contact was not high. Further, when a metal stud is attached as a contact, it is necessary to establish a connection between the metal stud and the circuit pattern, and it is difficult to drive the metal stud. In particular, it cannot be used for an extremely small contact.
[0004]
SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems of the related art, and has as its object to provide an electronic component having a contact that has a simple structure, is formed thin, and has a highly reliable electrical connection, and a method of manufacturing the same. Aim.
[0005]
[Means for Solving the Problems]
According to the present invention, a conductor portion is formed on the surface of an insulating substrate such as a glass epoxy substrate or a phenolic resin substrate by using a copper foil or a metal foil such as a copper foil and an aluminum foil. A contact is formed at a predetermined position of the contact, and a contact is formed in which the conductor portion above the through-hole bulges outward from the insulating substrate side, and a resin is provided in the through-hole on the back side of the contact. Is an electronic component which is filled and adheres to at least the back surface of the contact to reinforce it. This resin is a conductive resin paint such as a silver paint or a carbon paint, and a conductor portion is formed on the back surface of the insulating substrate by the metal foil or plating, or a conductive resin paint, etc. And the conductor on the back side are electrically connected by a conductive resin paint filled in the through holes. In addition, a small hole is formed at the top of the contact, and the resin filling the through hole is filled into the back surface of the contact and the inside of the through hole except for the small hole. They communicate with each other through the through holes.
[0006]
Further, according to the present invention, a conductor portion is formed of a metal foil such as a copper foil or a copper foil and an aluminum foil on a front surface and a back surface of an insulating substrate such as a glass epoxy substrate or a phenolic resin substrate. A through-hole is formed at a predetermined position on the insulating substrate, and the conductor covering the through-hole bulges outward from the insulating substrate side to form a contact, and the through-hole on the back side of the contact is formed. The inside is filled with a resin and adheres to at least the back surface of the contact to reinforce the contact. A movable contact component such as a tact plate is positioned facing the contact, and the movable contact component is covered with an insulating film. Electronic components. This resin is a conductive resin paint such as a silver paint or a carbon paint, and is connected to the conductor on the surface opposite to the contact by a conductive resin paint filled in the through-hole. . Further, the insulating film has an adhesive layer and a conductive layer formed thereon, and a part of the conductive layer of the insulating film is connected to a ground terminal formed on the insulating substrate.
[0007]
Furthermore, the present invention forms a conductor by attaching a metal foil such as a copper foil or a copper foil and an aluminum foil to the surface of an insulating substrate such as a glass epoxy substrate or a phenolic resin substrate. A drilled hole is formed at a predetermined position of the insulating substrate by drilling, and the conductor portion is bulged outward from the insulating substrate side to form a contact. A method of manufacturing an electronic component in which at least the back surface of the contact is filled with an insulating resin such as an epoxy resin or a conductive resin paint such as a silver paint to reinforce the contact. Further, a through hole is formed by the drill to such an extent that a small hole is formed at the top of the contact, and the resin filling the through hole is filled into the back surface of the contact and the inside of the through hole except for the small hole. Is what you do.
[0008]
The conductor portion is formed on the front and back surfaces of the insulating substrate, and a through hole is formed in the insulating substrate from the opposite side toward the conductor portion by drilling, and the conductor portion is directed outward from the insulating substrate side. A method of manufacturing an electronic component in which a contact is formed by swelling to form a contact, a conductive resin paint is filled in the through-hole, and a conductive portion opposite to the contact is connected via the conductive resin paint. In addition, on a substrate surface of a thermoplastic insulating resin such as a liquid crystal polymer, polyester, or polyimide, a metal plate having good malleability is integrally formed by insert molding or the like so as to be laminated, and a conductor portion is formed by the metal thin plate. It is a good thing.
[0009]
[Action]
An electronic component according to the present invention is characterized in that a through hole is formed by drilling from a surface opposite to the metal foil on an insulating substrate to which a metal foil is adhered as a conductor, and the metal foil of the conductor is formed at the time of forming the hole. Are deformed outward to form outwardly bulging contacts. A resin is filled on the back side of the contact so as to maintain the strength of the contact and withstand pressure. Further, by using a conductive resin paint for this resin, a through hole for connecting the conductor portions on the front and back can be easily formed.
[0010]
【Example】
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIGS. 1 to 4 show a first embodiment of the present invention. The electronic component of this embodiment relates to a push switch. This push switch is composed of a conductor portion 12 in which a copper foil, a copper foil using aluminum as a carrier, an aluminum foil or other metal foil is adhered to the surface of an insulating substrate 10 such as a laminated board made of glass epoxy or a phenolic resin substrate. Is formed. The conductor portion is formed by etching a metal foil such as a copper foil uniformly attached to the surface of the insulating substrate 10 into a predetermined circuit pattern. The thickness of the metal foil is 18 to 105 μm, and may be as thick as about 130 μm. Further, as long as the bonding strength is high, a thinner metal foil, for example, about 10 μm may be used. In this case, a reinforcing member such as a resin film may be provided on the back surface of the metal foil.
[0011]
As shown in FIGS. 3 and 4, a contact 14 is formed at one end of the conductor portion 12 on the insulating substrate 10 so that the surface of the conductor portion 12 bulges outward. Further, a contact 15 formed by bulging the conductor 12 outward is also formed at the center of the insulating substrate 14. Through holes 16 are formed in the insulating substrate 10 on the back side of the contacts 14 and 15. Then, conductive resin paint 18 such as silver paint or carbon paint is filled in the through holes 16. In addition, a conductor portion 20 to which a metal foil is adhered is also formed on the back surface of the insulating substrate 10 on the back surface side of the contact 14, and the conductive resin paint 18 in the through hole 16 is connected to the conductor portion 20. A through hole for connecting the conductors 12 and 20 is formed.
[0012]
At the other end of the conductor portion 12, a through-hole 22 having an inner diameter equal to the through-hole 16 of the insulating substrate 10 is formed, and a conductive resin paint is formed in the through-hole 22 and the through-hole 16 of the insulating substrate 10 on the back side thereof. 18 is filled and applied in a hollow shape. Further, a contact 24 swelling to the rear surface side is formed in the conductor portion 20 on the rear surface side facing the through hole 22, and a small hole 26 is formed in the center thereof, and the small hole 26 is formed through the small hole 26. The front and back of the insulating substrate 10 are in communication.
[0013]
A tact metal plate 30 serving as a movable contact member is placed on the surface of the insulating substrate 10 so as to contact the contact 14. A long hole 32 is formed in a portion corresponding to the contact 14 of the tact metal plate 30, and the contact 14 and the peripheral portion of the long hole 32 are formed so as to contact with each other over a wide area. At the center of the tact metal plate 30, a movable contact portion 34 bulging upward is formed. Then, a heat-resistant insulating film such as a polyimide resin having an adhesive layer of a heat-resistant adhesive (not shown) covers the insulating substrate 10 so as to cover the tact metal plate 30.
[0014]
As shown in FIG. 2, a method of manufacturing an electronic component, which is a push switch according to this embodiment, is performed at a predetermined position on an insulating substrate 10 to which a conductor 12 such as a copper foil is attached, as shown in FIG. Then, the through holes 16 are formed in the insulating substrate with a drill 40. At this time, when the tip of the drill 40 abuts on the back surface of the conductor portion 12, the feed speed of the drill 40 is reduced so that a hole is not made in the conductor portion 12, and the conductor portion 12 is moved outward from the back surface side. Extrude. This extrusion operation may be performed while rotating the drill, or may be performed after the drill is once stopped. Then, when the conductor portion 12 bulges outward and reaches an appropriate height, the drill is retracted to bulge the contacts 14 and 15. The diameter of the drill 40 and the angle of the tip can be appropriately selected, and the shape of the contacts 40 and 15 is determined by the shape of the drill 40.
[0015]
When forming the small hole 26 at the top of the contact 24, the drill 40 is rotated to form the small hole 26 even after the through hole 16 has penetrated. At this time, the angle of the tip of the drill 40 may be switched to a drill having a sharper angle so that a hole is not formed in the entire contact 24.
[0016]
Thereafter, a conductive resin paint 18 is applied to the through holes 16. This application is easily and accurately performed by printing. In addition, from the through hole 22 of the conductor portion 12 on the front side, the conductive resin paint 18 that is applied only to the inner wall surface of the through hole 16 is applied to the inside of the through hole 16 so that the small hole 26 of the contact 24 is not blocked. To
[0017]
Thereafter, the tact plate 30 is placed on the insulating substrate 10, the long holes 32 are positioned at the positions of the contacts 14, and a heat-resistant insulating film such as a polyimide resin is mounted thereon, thereby completing the push switch. I do.
[0018]
In the electronic component which is the push switch of this embodiment, the electrical connection is formed by the contacts 14 and 15 with the conductor portion 12 bulging out. The contacts 14 and 15 can be brought into contact with each other, and the electrical reliability of the contacts 14 and 15 is extremely high. Moreover, the push switch of this embodiment can be easily made thinner and has a minimum number of parts. Further, the air inside the contact of the push switch can be released to the outside through the through hole 22 of the conductor portion 12 and the through hole 16 of the insulating substrate 10 and the small hole 26 of the contact 22.
[0019]
Here, the conductor portion 20 on the back surface side of the insulating substrate 10 may be formed by plating or printing a conductive resin paint, and only the conductor portion 12 forming an outwardly swelling contact is made of metal foil. It may be formed. The conductive resin paint 18 may be an insulating resin such as an epoxy resin other than the portion where the through holes are formed. The conductive resin paint 18 supports the contacts 14 and 15 from the back surface. What is necessary is just to reinforce 14,15.
[0020]
Next, a second embodiment of the present invention will be described with reference to FIGS. Here, the same members as those in the above embodiment are denoted by the same reference numerals, and description thereof will be omitted. The electronic component of this embodiment is also related to a push switch, and a peripheral portion of a dome-shaped tact plate 30 is connected to a contact 14 formed on the surface of the substrate 10, and a conductive resin paint is connected to a through hole 16 of the contact 14. 18 are filled to form through holes. The tact plate 30 is positioned and fixed by being covered with a shielded insulating film 50.
[0021]
As shown in FIG. 7, the insulating film 50 has an adhesive layer 54 formed on the back surface of a heat-resistant film 52 such as a polyimide resin, and a conductive layer 56 of a metal thin film such as aluminum formed on the front surface. I have. The tact plate 30 is held by the adhesive layer 54 and fixed to the insulating substrate 10. As shown in FIG. 5, a ground connection piece 58 is formed on one side edge of the insulating film 50, and an end of the ground connection piece 58 is connected to a ground terminal 60 of the insulating substrate 10. ing. In this connection, the conductive layer 56 of the insulating film 50 is fixed by a conductive adhesive such as a conductive resin paint by bending the ground connection piece 58 so as to contact the ground terminal 60.
[0022]
According to this embodiment, the shield and ground of the push switch can be reliably and easily achieved, and the push switch can be made thinner.
[0023]
The insulating substrate and the conductor of the electronic component according to the present invention may be made of an insulating resin such as copper, aluminum, or another alloy, and may be formed by insert-molding a thin metal plate having good malleability. It is. As insulating resins for substrates, thermoplastic resins such as aromatic polyesters, polyamides, polyacetals, polyphenylene sulfides, polysulfones, polyphenylene oxides, polyimides, polyether ketones, and polyarylates, especially have excellent heat resistance and dimensional stability. It is a thermoplastic resin such as a completely aromatic polyester, particularly a liquid crystal polyester, polyester amide, and polyphenylene sulfide which are excellent in injection moldability. When the thin metal plate and the resin substrate are integrally formed by insert molding, for example, the present invention can be applied to electronic components such as a variable resistor and a switch contact in which contacts and terminals are integrally formed with the substrate. Furthermore, when a metal thin plate and a substrate are integrally formed, a plurality of substrates are formed on the metal thin plate, and terminals and caps and other components are attached. It may be an electronic component. Thereby, the automatic assembly of the electronic component can be further advanced.
[0024]
The electronic component of the present invention can be used for all electronic components having a contact on a substrate, such as a variable resistor switch substrate with contacts and a terminal plate, in addition to the push switch. Further, the metal foil of the present invention includes a thin metal plate capable of expanding the contact.
[0025]
【The invention's effect】
The electronic component and the method of manufacturing the electronic component according to the present invention include forming a terminal formed on an insulating substrate by swelling a conductor portion on the front surface from the rear surface side, and forming a through hole in the insulating substrate on the rear surface side. Filled with resin, the contacts are reinforced by conductors, so contacts with high electrical connection reliability can be easily formed, and the number of components is small, contributing to the thinning of electronic components. Is what you do. Further, according to the electronic component and the method of manufacturing the same of the present invention, shielding and grounding of the electronic component can be reliably and easily achieved, which contributes to the reduction in thickness .
[Brief description of the drawings]
FIG. 1 is an exploded perspective view of an electronic component according to a first embodiment of the present invention.
FIG. 2 is a longitudinal sectional view showing a method for manufacturing an electronic component according to the first embodiment of the present invention.
FIG. 3 is a sectional view taken along line XX of FIG. 1;
FIG. 4 is a sectional view taken along line YY of FIG. 1;
FIG. 5 is a perspective view of an electronic component according to a second embodiment of the present invention.
FIG. 6 is a sectional view of the electronic component taken along line ZZ of FIG. 5;
FIG. 7 is a longitudinal sectional view of an electronic component insulating film according to a second embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Substrate 12, 20 Conductor part 14, 15 Contact 16 Through hole 18 Conductive resin paint 22 Small hole

Claims

A conductor portion is formed by a metal foil or a thin metal plate on the surface of the insulating substrate, a through hole is formed at a predetermined position of the insulating substrate on the back side of the conductor portion, and the conductor portion above the through hole is the insulating substrate. Bulging outward from the side, the bulged portion is formed as a contact, a conductive resin paint is filled in the through-hole on the back side of the contact and adheres to the back of the contact to reinforce, On the surface of the insulating substrate, a tact metal plate that is a movable contact member is placed so as to contact the contact, and on the surface of the tact metal plate, an adhesive layer is formed on the back side, and on the front side, A heat-resistant insulating film on which a conductive layer of a metal thin film is formed is affixed, and the tact plate is held and fixed to the insulating substrate by the adhesive layer, and one side edge of the insulating film is grounded. A piece is formed and this ground connection Piece is a conductive layer of the insulating film, electronic components, characterized in that the ground connection piece so as to contact the ground terminal of the insulating substrate bent and fixed with a conductive adhesive.

The conductor portion is also formed on the back surface of the insulating substrate, and the conductor portion covering a through hole at a predetermined position of the insulating substrate on the back surface side of the conductor portion bulges outward from the insulating substrate side. The electronic component according to claim 1, wherein a contact is formed.

A conductor is formed by attaching a thin metal plate to the surface of the insulating substrate, and a through hole is formed at a predetermined position of the insulating substrate on the back side of the conductor, and the conductor is moved outward from the insulating substrate side. Bulging toward the contact, forming a contact, in contact with at least the back side of the contact in the through hole on the back side of the contact and filling the resin to reinforce the contact, the surface of the insulating substrate, A tact metal plate, which is a movable contact member, is placed so as to be in contact with the contact, and an adhesive layer is formed on the back side on the surface of the tact metal plate, and a conductive layer of a metal thin film is formed on the front side. An adhesive insulating film is attached, the tact plate is held by the adhesive layer, the tact metal plate is fixed to the insulating substrate, and a conductive layer of a ground connection piece formed on one side edge of the insulating film. To the ground terminal on the insulating board. Folding the earth connection piece into contact, a method of manufacturing an electronic component, characterized by connecting and fixing the the ground terminal the ground connecting piece.

The through hole is formed by drilling the insulating substrate from the opposite side toward the conductor portion, and the drill is used to form the through hole and swell the conductor portion outward from the insulating substrate side. 4. The method for manufacturing an electronic component according to claim 3, wherein a contact is formed by bonding the ground connection piece and the ground terminal with a conductive adhesive.

5. The method for manufacturing an electronic component according to claim 3, wherein the conductor is integrally formed by laminating a metal thin plate on the substrate surface.