CN114793314A - Microphone reinforcing flexible circuit board and preparation method thereof - Google Patents

Microphone reinforcing flexible circuit board and preparation method thereof Download PDF

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Publication number
CN114793314A
CN114793314A CN202210306792.XA CN202210306792A CN114793314A CN 114793314 A CN114793314 A CN 114793314A CN 202210306792 A CN202210306792 A CN 202210306792A CN 114793314 A CN114793314 A CN 114793314A
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CN
China
Prior art keywords
microphone
flexible circuit
conductive
circuit board
microphone hole
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Pending
Application number
CN202210306792.XA
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Chinese (zh)
Inventor
陆云凤
金小健
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Yancheng Weixin Electronics Co Ltd
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Yancheng Weixin Electronics Co Ltd
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Priority to CN202210306792.XA priority Critical patent/CN114793314A/en
Publication of CN114793314A publication Critical patent/CN114793314A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers, loudspeakers or microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/08—Mouthpieces; Microphones; Attachments therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005—Punching of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention discloses a microphone reinforcing flexible circuit board and a preparation method thereof, wherein the preparation method comprises the following steps: respectively providing a metal reinforcing plate and a flexible circuit substrate; forming at least one first conductive through hole on the metal reinforcing plate, and forming at least one second conductive through hole on the flexible circuit substrate; conducting treatment is carried out on the metal reinforcing plate and the flexible circuit substrate by using conductive adhesive according to all the first conductive through holes and all the second conductive through holes to form a conducting circuit board; and punching at least one microphone hole penetrating through the conducting circuit board on the conducting circuit board except for the areas of all the first conducting through holes and all the second conducting through holes to form the microphone reinforced flexible circuit board. The invention realizes the electrical conduction between the metal reinforcing plate and the flexible circuit substrate, effectively isolates the metal between the microphone hole and the metal reinforcing plate as well as the metal between the metal reinforcing plate and the flexible circuit substrate through the conductive adhesive, and simultaneously meets the requirement of reinforcing and grounding the back of the microphone and avoids the problem of sound leakage of the microphone hole.

Description

Microphone reinforcing flexible circuit board and preparation method thereof
Technical Field
The invention relates to the technical field of manufacturing of flexible circuit boards, in particular to a microphone reinforcing flexible circuit board and a preparation method thereof.
Background
A Flexible Printed Circuit (FPC) is a Flexible Printed Circuit board with high reliability and excellent performance, which is made of Polyimide (PI) or polyester film as a base material. Flexible circuit boards are widely used in electronic products because of their high wiring density, light weight, thin thickness, and good flexibility.
Due to the light and thin characteristics of the flexible circuit board, in the use process of the electronic product, operations such as hitting, folding, and scratching are easy to occur, the mechanical strength is low, and cracks are easy to occur, so when the electronic component is assembled on the surface of the flexible circuit board, a material with higher hardness is generally used for supporting the component on the back surface of the electronic component, and the strength of the component area is enhanced (reinforcement for short). Three materials are commonly used as support materials in the industry: polyimide reinforcement, epoxy resin plate reinforcement and metal reinforcement. When the flexible circuit board has a grounding requirement, a metal reinforcement is generally used as a support on the back surface of the electronic component. However, as electronic products are upgraded, flexible circuit boards, which are one of the important components of many electronic products, need to integrate more and more functions, and the abundant functions require better design support for the back of electronic components. For metal reinforcement of the microphone, the microphone is provided with a microphone hole, the common metal reinforcement needs to retract the microphone hole and the appearance of the flexible circuit board, and if the metal reinforcement through hole and the appearance of the flexible circuit board are punched together, metal burrs are generated, so that the problem of sound leakage of the microphone is caused, and the function and the quality of the microphone are influenced.
Therefore, the flexible circuit board for reinforcing the back surface of the microphone needs to meet the grounding requirement of the microphone and avoid sound leakage of the microphone hole, which becomes a problem to be solved urgently.
Disclosure of Invention
In view of this, embodiments of the present invention provide a microphone reinforcing flexible circuit board and a method for manufacturing the same, so as to solve the problem that the flexible circuit board in the prior art needs to meet the requirement of microphone back reinforcing grounding and avoid microphone hole noise leakage.
The invention provides a preparation method of a microphone reinforced flexible circuit board, which comprises the following steps:
respectively providing a metal reinforcing plate and a flexible circuit substrate;
forming at least one first conductive through hole on the metal reinforcing plate, and forming at least one second conductive through hole on the flexible circuit substrate;
conducting treatment is carried out on the metal reinforcing plate and the flexible circuit substrate by using conductive adhesive according to all the first conductive through holes and all the second conductive through holes to form a conducting circuit board;
and punching at least one microphone hole penetrating through the conducting circuit board on the conducting circuit board except for the first conducting through holes and the second conducting through holes to form a microphone reinforcing flexible circuit board.
Optionally, before forming at least one first conductive via on the metal reinforcing plate and at least one second conductive via on the flexible circuit substrate, the method further includes:
reserving at least one first microphone hole area on the metal reinforcing plate according to the position and the size of a preset microphone hole;
reserving at least one second microphone hole area on the flexible circuit substrate according to the position of the preset microphone hole and the size of the preset microphone hole;
the number of the first microphone hole areas is the same as that of the second microphone hole areas, and all the first microphone hole areas correspond to all the second microphone hole areas in a one-to-one mode.
Optionally, the size of each first microphone aperture area and the size of each second microphone aperture area are both larger than the preset microphone aperture size.
Optionally, the difference between the size of each first microphone hole area and the preset microphone hole size is greater than or equal to 0.5 mm; the difference between the size of each second microphone hole area and the preset microphone hole size is greater than or equal to 0.5 mm.
Optionally, the forming at least one first conductive via on the metal reinforcing plate and at least one second conductive via on the flexible circuit substrate includes:
forming at least one first conductive through hole penetrating through the metal reinforcing plate on the area of the metal reinforcing plate except all the first microphone hole areas through laser and copper plating processes;
and forming at least one second conductive through hole penetrating through the flexible circuit substrate on the area of the flexible circuit substrate except all the second microphone hole areas by laser and copper plating processes.
Optionally, after the forming of the at least one first conductive via on the metal reinforcing plate, the method further includes:
etching the metal reinforcing plate according to a preset etching size;
after the forming of the at least one second conductive via on the flexible circuit substrate, further comprising:
etching the flexible circuit substrate according to the preset etching size;
and the size of each first microphone hole area and the size of each second microphone hole area are both larger than the preset etching size, and the preset etching size is larger than the preset microphone size.
Optionally, conducting, by using a conductive adhesive, the metal reinforcing plate and the flexible circuit board according to all the first conductive through holes and all the second conductive through holes to form a conductive circuit board, including:
attaching the conductive adhesive to the area of the flexible circuit substrate except for the area of all the second microphone holes;
positioning the metal reinforcing plate and the flexible circuit substrate according to all the first microphone hole areas and all the second microphone hole areas;
attaching the metal reinforcing plate to the flexible circuit substrate through the conductive adhesive;
and pressing the attached metal reinforcing plate and the flexible circuit substrate by adopting a quick pressing method.
Optionally, the punching at least one microphone hole penetrating through the conducting circuit board on the conducting circuit board to form a microphone reinforcing flexible circuit board includes:
and punching out corresponding microphone holes penetrating through the conducting circuit board on each first microphone hole area or each second microphone hole area of the conducting circuit board according to the position and the size of the preset microphone hole to form the microphone reinforcing flexible circuit board.
Optionally, the number of the first conductive vias is the same as the number of the second conductive vias, and all the first conductive vias correspond to all the second conductive vias one to one.
In addition, the invention also provides a microphone reinforcing flexible circuit board which is prepared by adopting the preparation method.
The invention has the beneficial effects that: the metal reinforcing plate is provided with at least one first conductive through hole, the flexible circuit substrate is provided with at least one second conductive through hole, and therefore electrical conduction between the inside of the metal reinforcing plate and the inside of the flexible circuit substrate can be realized respectively, electrical conduction between the inside of the metal reinforcing plate and the inside of the flexible circuit substrate can be realized conveniently, a supporting effect on the microphone is achieved, functional metal reinforcement is realized, and the requirement of back reinforcement grounding of the microphone is met; use all first electrically conductive through-holes and all second electrically conductive through-holes as the basis, utilize the conducting resin to switch on metal stiffening plate and flexible circuit base plate and handle, realized the two electric of metal stiffening plate and flexible circuit base plate and switched on, still be convenient for simultaneously through the conducting resin, when follow-up die-cut microphone hole, effectively keep apart the metal between microphone hole and metal stiffening plate and the flexible circuit base plate, and then effectively avoided the die-cut microphone hole that produces the metal burr and bring to leak the problem of sound, the high performance and the high yield of microphone have been guaranteed.
Drawings
The features and advantages of the present invention will be more clearly understood by reference to the accompanying drawings, which are schematic and are not to be understood as limiting the invention in any way, and in which:
fig. 1 shows a flowchart of a method for manufacturing a microphone reinforced flexible circuit board according to a first embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a metal reinforcing plate according to a first embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a flexible circuit substrate according to a first embodiment of the invention;
FIG. 4 is a schematic structural diagram of a metal stiffener for forming at least one first conductive via according to a first embodiment of the present invention;
FIG. 5 is a diagram illustrating a structure of a flexible circuit substrate having at least one second conductive via formed therein according to a first embodiment of the present invention;
fig. 6 is a flowchart illustrating a conducting process performed on a metal reinforcing plate and a flexible circuit board according to a first embodiment of the present invention;
fig. 7 is a schematic structural diagram of a conducting circuit board formed in the first embodiment of the present invention;
fig. 8 is a schematic structural diagram of a microphone reinforcing flexible circuit board formed in the first embodiment of the present invention.
The reference numerals are illustrated below:
100. a microphone reinforcement flexible circuit board;
10. the microphone comprises a metal reinforcing plate 11, a first insulating substrate 12, first copper foils 13, second copper foils 14, first conductive through holes 15 and a first microphone hole area;
20. a flexible circuit substrate 21, a second insulating substrate 22, a third copper foil 23, a fourth copper foil 24, a second conductive through hole 25 and a second microphone hole area;
30. conductive adhesive 40, microphone hole.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.
In the present invention, unless stated to the contrary, the use of directional terms such as "upper, lower, top, bottom" or the like, generally refers to the orientation of the components as shown in the drawings, or to the vertical, perpendicular, or gravitational orientation of the components themselves; likewise, for ease of understanding and description, "inner and outer" refer to the inner and outer relative to the profile of the components themselves, but the above directional words are not intended to limit the invention.
The first embodiment,
The embodiment provides a method for preparing a microphone reinforced flexible circuit board, as shown in fig. 1, which includes the following steps:
s1: respectively providing a metal reinforcing plate and a flexible circuit substrate;
s2: forming at least one first conductive through hole on the metal reinforcing plate, and forming at least one second conductive through hole on the flexible circuit substrate;
s3: conducting treatment is carried out on the metal reinforcing plate and the flexible circuit substrate by using conductive adhesive according to all the first conductive through holes and all the second conductive through holes to form a conducting circuit board;
s4: and punching at least one microphone hole penetrating through the conducting circuit board on the conducting circuit board except for the areas of all the first conducting through holes and all the second conducting through holes to form the microphone reinforcing flexible circuit board.
The metal reinforcing plate is provided with at least one first conductive through hole, the flexible circuit substrate is provided with at least one second conductive through hole, and therefore electrical conduction between the inside of the metal reinforcing plate and the inside of the flexible circuit substrate can be realized respectively, electrical conduction between the inside of the metal reinforcing plate and the inside of the flexible circuit substrate can be realized conveniently, a supporting effect on the microphone is achieved, functional metal reinforcement is realized, and the requirement of back reinforcement grounding of the microphone is met; use all first electrically conductive through-holes and all second electrically conductive through-holes as the basis, utilize conducting resin to switch on metal stiffening plate and flexible circuit base plate and handle, realized the electrical switch-on of metal stiffening plate and flexible circuit base plate the two, still be convenient for simultaneously through conducting resin, when follow-up die-cut microphone hole, effectively keep apart the metal between microphone hole and metal stiffening plate and the flexible circuit base plate, and then effectively avoided the die-cut microphone hole that produces the metal burr and brought to leak the problem of sound, the high performance and the high yield of microphone have been guaranteed.
Specifically, the metal reinforcing plate of the present embodiment may be a three-layer board including a polyimide substrate and two layers of copper foils, or may be a multilayer circuit board including the above structure; the flexible circuit substrate can be a three-layer board comprising a polyimide substrate and two layers of copper foils, and can also be a multilayer circuit board comprising the structure; the structures of the metal reinforcing plate and the flexible circuit board can be the same or different.
For convenience of description, this embodiment will be described by taking a three-layer board including a polyimide substrate and two copper foils as a metal reinforcing plate, and a three-layer board including a polyimide substrate and two copper foils as a flexible circuit board, where the metal reinforcing plate is shown in fig. 2, and the flexible circuit board is shown in fig. 3. In fig. 2, the metal reinforcing plate 10 includes a first insulating substrate 11, and first and second copper foils 12 and 13 provided on upper and lower surfaces of the first insulating substrate 11; in fig. 3, the flexible circuit board 20 includes a second insulating substrate 21, and third and fourth copper foils 22 and 23 provided on upper and lower surfaces of the second insulating substrate 21. The first insulating substrate 11 and the second insulating substrate 21 are both polyimide substrates.
Preferably, before S2, the method further includes:
reserving at least one first microphone hole area on the metal reinforcing plate according to the position and the size of a preset microphone hole;
reserving at least one second microphone hole area on the flexible circuit substrate according to the position and the size of the preset microphone hole;
the number of the first microphone hole areas is the same as that of the second microphone hole areas, and all the first microphone hole areas correspond to all the second microphone hole areas in a one-to-one mode.
Microphone hole areas (including at least one first microphone hole area and at least one second microphone hole area) are reserved on the metal reinforcing plate and the flexible circuit substrate respectively according to the preset microphone hole positions and the preset microphone hole sizes, wherein the number of the first microphone hole areas is the same as that of the second microphone hole areas, all the first microphone hole areas correspond to all the second microphone hole areas one by one, a subsequent integrated punching process can be facilitated, and the microphone sound leakage problem caused by metal burrs is avoided.
Preferably, the size of each first microphone aperture area and the size of each second microphone aperture area are both greater than a preset microphone aperture size.
Because at least one microphone hole is punched on the metal reinforcing plate and the flexible circuit substrate of the conducting circuit board simultaneously according to the size of the preset microphone hole after the conducting circuit board is formed subsequently, a certain protection area can be reserved around each microphone hole according to the size of the first microphone hole area and the size of the second microphone hole area which are larger than the size of the preset microphone hole, the adverse effect on each microphone hole caused by the punching process is effectively avoided, the microphone holes are protected, and the function and the yield of the microphone are further ensured. For example, if the size of each first microphone hole area and the size of each second microphone hole area are both exactly equal to the preset size of the microphone hole, it means that a certain protection area is not reserved around each microphone hole, and when the conductive adhesive overflows, the overflowing conductive adhesive directly overflows into the microphone hole in the punching process, and the performance of the conductive adhesive is affected.
Specifically, the difference between the size of each first microphone hole area and the preset microphone hole size is greater than or equal to 0.5 mm; the difference between the size of each second microphone hole area and the preset microphone hole size is greater than or equal to 0.5 mm.
Through the size difference in the range, each microphone hole can be protected, and adverse effects on each microphone hole in the punching process are effectively avoided; but also can maximize the metal reinforcing effect, play a better supporting effect on the microphone and ensure that the mechanical strength of the finally obtained microphone reinforcing flexible circuit board reaches the best to the maximum.
Specifically, the preset microphone hole size may be determined as the case may be. In the present embodiment, the preset microphone hole size is set to 0.55mm, and the size of each reserved first microphone hole area and the size of each reserved second microphone hole area are both set to 1.05 mm.
Preferably, S2 includes:
forming at least one first conductive through hole penetrating through the metal reinforcing plate on the area of the metal reinforcing plate except all the first microphone hole areas through laser and copper plating processes;
and forming at least one second conductive through hole penetrating through the flexible circuit substrate on the area of the flexible circuit substrate except all the second microphone hole areas by laser and copper plating processes.
Through the steps, the interior of the metal reinforcing plate, the flexible circuit substrate and the good electrical conduction between the flexible circuit substrate and the metal reinforcing plate can be realized, and the metal reinforcing grounding requirement of the microphone is met.
Preferably, in S2, after forming the at least one first conductive via on the metal reinforcing plate, the method further includes:
etching the metal reinforcing plate according to a preset etching size;
after forming at least one second conductive via on the flexible circuit substrate, further comprising:
etching the flexible circuit substrate according to a preset etching size;
wherein the size of each first microphone aperture area and the size of each second microphone aperture area are both greater than a predetermined etched size, and the predetermined etched size is greater than the predetermined microphone size.
Through etching, the metal reinforcing plate and the flexible circuit substrate can realize respective functions conveniently, so that the requirement of reinforcing and grounding the back of the microphone can be met conveniently, and the sound leakage of a microphone hole can be avoided; when the size of the first microphone hole area and the size of the second microphone hole area are both larger than the preset etching size, and the preset etching size is larger than the preset microphone size, the metal layer in the metal reinforcing plate and the metal layer in the flexible circuit substrate can be effectively prevented from generating metal burrs during subsequent punching so as to cause the microphone sound leakage problem when the subsequent microphone holes are punched, the adverse effect of conductive adhesive on the microphone holes in the punching process can be effectively avoided, and the high performance and high yield of the microphone are fully ensured.
Preferably, the difference between the size of each first microphone hole area and the preset etching size is greater than or equal to 0.1 mm; the difference between the size of each second microphone hole area and the preset etching size is greater than or equal to 0.1 mm.
Preferably, the difference between the preset etched size and the preset microphone size is greater than or equal to 0.4 mm.
Specifically, the preset etching size is determined on a case-by-case basis. In the present embodiment, when the predetermined microphone hole size is set to 0.55mm, and the size of the first microphone hole region and the size of the second microphone hole region are both set to 1.05mm, the predetermined etching size is set to 0.95 mm.
It should be noted that the above laser, copper plating and etching processes all adopt conventional processes, and details are not described herein. Of course, after the metal reinforcing plate and the flexible circuit substrate are etched, the metal reinforcing plate and the flexible circuit substrate can be respectively processed according to the conventional manufacturing process of the flexible circuit board, the conventional manufacturing process includes the manufacturing processes of attaching a protective film, printing solder resist ink, gold deposition, printing characters, electrical measurement and the like, and specific details are not described herein again.
The metal reinforcing plate after the step S2 is shown in fig. 4, and the flexible circuit board after the step S2 is shown in fig. 5. Only 2 first conductive through holes are shown in the metal reinforcing plate shown in fig. 4, and only 2 second conductive through holes are shown in the flexible circuit board shown in fig. 5, however, other numbers of first conductive through holes and second conductive through holes may be provided, which are not specifically shown and described here.
In fig. 4, the metal reinforcing plate 10 includes a first insulating substrate 11, and a first copper foil 12 and a second copper foil 13 disposed on the upper and lower surfaces of the first insulating substrate 11, and further includes two first conductive vias 14 penetrating through the first copper foil 12, the first insulating substrate 11, and the second copper foil 13; in fig. 5, the flexible circuit board 20 includes a second insulating substrate 21, a third copper foil 22 and a fourth copper foil 23 disposed on the upper and lower surfaces of the second insulating substrate 21, and two second conductive vias 24 penetrating through the third copper foil 22, the second insulating substrate 21 and the fourth copper foil 23. The dashed area in fig. 4 represents the first microphone hole area 15, and the dashed area in fig. 5 represents the second microphone hole area 25.
Preferably, as shown in fig. 6, S3 includes:
s31: attaching conductive adhesive to the flexible circuit substrate except for the area of all the second microphone hole areas;
s32: positioning the metal reinforcing plate and the flexible circuit substrate according to all the first microphone hole areas and all the second microphone hole areas;
s33: attaching the metal reinforcing plate to the flexible circuit substrate through the conductive adhesive;
s34: and pressing the attached metal reinforcing plate and the flexible circuit substrate by adopting a quick pressing method.
Because the second microphone hole area is used for punching the subsequent microphone holes, the conductive adhesive is attached to the area of the flexible circuit substrate except for all the second microphone hole areas, so that the electrical conduction between the metal reinforcing plate and the flexible circuit substrate is facilitated on one hand, and on the other hand, the conductive adhesive and the metal are not existed at the position of the subsequent punching; therefore, the adverse effect of conductive adhesive overflow on the quality of the microphone is avoided, the microphone sound leakage problem caused by metal burrs is effectively avoided, and the high performance and the high quality of the microphone are fully ensured. The specific processes of the conductive adhesive attaching method in S31 and S33 and the fast pressing method in S34 both adopt conventional process methods, and the specific details are not described herein.
Specifically, the conductive circuit board obtained by pressing in this embodiment is shown in fig. 7. In fig. 8, a microphone reinforcing flexible circuit board 100 includes a metal reinforcing plate 10, a flexible circuit substrate 20, and a conductive paste 30;
the metal reinforcing plate 10 comprises a first insulating substrate 11, a first copper foil 12 and a second copper foil 13 which are arranged on the upper surface and the lower surface of the first insulating substrate 11, and two first conductive through holes 14 which penetrate through the first copper foil 12, the first insulating substrate 11 and the second copper foil 13; the flexible circuit substrate 20 comprises a second insulating substrate 21, a third copper foil 22 and a fourth copper foil 23 which are arranged on the upper surface and the lower surface of the second insulating substrate 21, and two second conductive through holes 24 which penetrate through the third copper foil 22, the second insulating substrate 21 and the fourth copper foil 23; the metal reinforcing plate 10 is attached to the flexible circuit substrate 20 through the conductive adhesive 30;
a first microphone hole area 15 is reserved on the metal reinforcing plate 10, a second microphone hole area 25 is reserved on the flexible circuit substrate 20, the second microphone hole area 25 corresponds to the first microphone hole area 15, and the first microphone hole area 15 and the second microphone hole area 25 are dotted line areas in fig. 7.
Preferably, S4 includes:
and punching a corresponding microphone hole penetrating through the conducting circuit board on each first microphone hole area or each second microphone hole area of the conducting circuit board according to the position and the size of the preset microphone hole to form the microphone reinforcing flexible circuit board.
Because the inside of the conducting circuit board is in a conducting state, the method for integrally punching at least one microphone hole on the conducting circuit board achieves the purposes of meeting the requirement of reinforcing and grounding the back of a microphone and avoiding sound leakage of the microphone hole at the same time.
Preferably, the number of the first conductive through holes is the same as that of the second conductive through holes, and all the first conductive through holes correspond to all the second conductive through holes one to one.
Through the first electrically conductive through-hole and the electrically conductive through-hole of second of the same quantity and one-to-one, can be so that inside the metal reinforcement board, inside the flexible circuit base board and these better electric intercommunication between the two, and then the whole microphone reinforcement flexible circuit board of being convenient for satisfies microphone back reinforcement ground connection demand better.
Specifically, the microphone reinforcing flexible circuit board formed in the present embodiment is as shown in fig. 8. Only 1 microphone hole is shown in the microphone reinforcing flexible circuit board shown in fig. 8, but of course, other numbers of microphone holes may be provided, which are not specifically illustrated and shown here.
In fig. 8, the microphone reinforcing flexible printed circuit board 100 includes a metal reinforcing plate 10, a flexible printed circuit board 20, a conductive paste 30, and a microphone hole 40 penetrating through the metal reinforcing plate 10, the flexible printed circuit board 20, and the conductive paste 30;
the metal reinforcing plate 10 comprises a first insulating substrate 11, a first copper foil 12 and a second copper foil 13 which are arranged on the upper surface and the lower surface of the first insulating substrate 11, and two first conductive through holes 14 which penetrate through the first copper foil 12, the first insulating substrate 11 and the second copper foil 13; the flexible circuit substrate 20 comprises a second insulating substrate 21, a third copper foil 22 and a fourth copper foil 23 which are arranged on the upper surface and the lower surface of the second insulating substrate 21, and two second conductive through holes 24 which penetrate through the third copper foil 22, the second insulating substrate 21 and the fourth copper foil 23; the metal reinforcing plate 10 is attached to the flexible circuit substrate 20 through the conductive adhesive 30;
a first microphone hole area 15 is reserved on the metal reinforcing plate 10, a second microphone hole area 25 is reserved on the flexible circuit substrate 20, the second microphone hole area 25 corresponds to the first microphone hole area 15, and the first microphone hole area 15 and the second microphone hole area 25 are dotted line areas in fig. 8.
Example II,
The embodiment provides a microphone reinforcing flexible circuit board which is prepared by the preparation method of the embodiment I.
Through the microphone reinforcement flexible circuit board of this embodiment, can satisfy microphone back reinforcement ground connection demand, avoid the microphone hole to leak the sound problem again, guaranteed the high performance and the high yield of microphone.
The method for manufacturing the microphone-reinforced flexible circuit board in this embodiment is the same as the method for manufacturing the microphone-reinforced flexible circuit board in the first embodiment, details of which are not described in detail in the first embodiment and the specific descriptions in fig. 1 to 8 are omitted here for brevity.
Although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations fall within the scope defined by the appended claims.

Claims (10)

1. A preparation method of a microphone reinforcing flexible circuit board is characterized by comprising the following steps:
respectively providing a metal reinforcing plate and a flexible circuit substrate;
forming at least one first conductive through hole on the metal reinforcing plate, and forming at least one second conductive through hole on the flexible circuit substrate;
conducting treatment is carried out on the metal reinforcing plate and the flexible circuit substrate by using conductive adhesive according to all the first conductive through holes and all the second conductive through holes to form a conducting circuit board;
and punching at least one microphone hole penetrating through the conducting circuit board on the conducting circuit board except for the first conducting through holes and the second conducting through holes to form a microphone reinforcing flexible circuit board.
2. The method of claim 1, wherein the forming at least one first conductive via on the metal stiffener and before forming at least one second conductive via on the flexible circuit substrate further comprises:
reserving at least one first microphone hole area on the metal reinforcing plate according to the position and the size of a preset microphone hole;
reserving at least one second microphone hole area on the flexible circuit substrate according to the position of the preset microphone hole and the size of the preset microphone hole;
the number of the first microphone hole areas is the same as that of the second microphone hole areas, and all the first microphone hole areas correspond to all the second microphone hole areas in a one-to-one mode.
3. The method of manufacturing a microphone reinforcing flexible circuit board according to claim 2, wherein the size of each of the first microphone hole regions and the size of each of the second microphone hole regions are larger than the preset microphone hole size.
4. The method for preparing a microphone reinforced flexible circuit board according to claim 3, wherein the difference between the size of each first microphone hole area and the preset microphone hole size is greater than or equal to 0.5 mm; the difference between the size of each second microphone hole area and the preset microphone hole size is greater than or equal to 0.5 mm.
5. The method of claim 2, wherein the forming at least one first conductive via on the metal stiffener and at least one second conductive via on the flexible circuit substrate comprises:
forming at least one first conductive through hole penetrating through the metal reinforcing plate on the area of the metal reinforcing plate except all the first microphone hole areas through laser and copper plating processes;
and forming at least one second conductive through hole penetrating through the flexible circuit substrate on the area of the flexible circuit substrate except all the second microphone hole areas by laser and copper plating processes.
6. The method for preparing a microphone reinforced flexible circuit board according to claim 5, wherein after the forming of the at least one first conductive through hole on the metal reinforcing plate, the method further comprises:
etching the metal reinforcing plate according to a preset etching size;
after the forming of the at least one second conductive via on the flexible circuit substrate, further comprising:
etching the flexible circuit substrate according to the preset etching size;
and the size of each first microphone hole area and the size of each second microphone hole area are both larger than the preset etching size, and the preset etching size is larger than the preset microphone size.
7. The method for manufacturing a microphone reinforcing flexible circuit board according to claim 2, wherein conducting the metal reinforcing plate and the flexible circuit board by using a conductive adhesive according to all the first conductive through holes and all the second conductive through holes to form a conducting circuit board comprises:
attaching the conductive adhesive to the area of the flexible circuit substrate except for the area of all the second microphone holes;
positioning the metal reinforcing plate and the flexible circuit substrate according to all the first microphone hole areas and all the second microphone hole areas;
attaching the metal reinforcing plate to the flexible circuit substrate through the conductive adhesive;
and pressing the attached metal reinforcing plate and the flexible circuit substrate by adopting a rapid pressing method.
8. The method for manufacturing a microphone reinforcing flexible circuit board according to claim 2, wherein the step of punching at least one microphone hole penetrating through the conductive circuit board on a region of the conductive circuit board excluding all of the first conductive through holes and all of the second conductive through holes to form the microphone reinforcing flexible circuit board comprises:
and punching out corresponding microphone holes penetrating through the conducting circuit board on each first microphone hole area or each second microphone hole area of the conducting circuit board according to the position and the size of the preset microphone hole to form the microphone reinforcing flexible circuit board.
9. The method for manufacturing a microphone reinforcement flexible circuit board according to any one of claims 1 to 8, wherein the number of the first conductive through holes is the same as the number of the second conductive through holes, and all the first conductive through holes and all the second conductive through holes are in one-to-one correspondence.
10. A microphone-reinforced flexible circuit board prepared by the preparation method of any one of claims 1 to 9.
CN202210306792.XA 2022-03-25 2022-03-25 Microphone reinforcing flexible circuit board and preparation method thereof Pending CN114793314A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210306792.XA CN114793314A (en) 2022-03-25 2022-03-25 Microphone reinforcing flexible circuit board and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210306792.XA CN114793314A (en) 2022-03-25 2022-03-25 Microphone reinforcing flexible circuit board and preparation method thereof

Publications (1)

Publication Number Publication Date
CN114793314A true CN114793314A (en) 2022-07-26

Family

ID=82461994

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210306792.XA Pending CN114793314A (en) 2022-03-25 2022-03-25 Microphone reinforcing flexible circuit board and preparation method thereof

Country Status (1)

Country Link
CN (1) CN114793314A (en)

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