JP3588243B2 - Plasma display device and method of manufacturing the same - Google Patents

Plasma display device and method of manufacturing the same Download PDF

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Publication number
JP3588243B2
JP3588243B2 JP2007898A JP2007898A JP3588243B2 JP 3588243 B2 JP3588243 B2 JP 3588243B2 JP 2007898 A JP2007898 A JP 2007898A JP 2007898 A JP2007898 A JP 2007898A JP 3588243 B2 JP3588243 B2 JP 3588243B2
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Prior art keywords
hard particles
display device
partition
plasma display
phosphor
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JPH11219658A (en
Inventor
久満 酒井
一雄 和多田
真一 半田
清浩 逆瀬川
雅史 加藤
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Kyocera Corp
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Kyocera Corp
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Description

【0001】
【発明の属する技術分野】
本発明はプラズマ表示装置及びその製造方法に関するものである。
【0002】
【従来の技術】
プラズマ表示装置は、大面積、且つ高画質の画像表示装置であり、軽量で薄型で設置場所等の制約を受けないことから、近年、マルチメディアの浸透に伴う情報のインターフェイスとして、薄型の大画面カラー表示装置等として注目されている。
【0003】
このプラズマ表示装置は、図3に示すように、背面板1上に複数の隔壁2を形成して、各隔壁2間の空間を放電表示セル5とし、その底面にアドレス電極3を形成し、一方、放電電極7を備えた正面板6を隔壁2の上部に接合して、放電表示セル5に希ガス等の放電ガスを封入した構造をしている。そして、アドレス電極3と放電電極7間の放電によりプラズマを発生させ、該プラズマから放出される紫外光により、放電表示セル5内に塗布した蛍光体(不図示)を発光させて画面の発光素子として利用するものである。
【0004】
図4に放電表示セル5の拡大図を示すように、上記放電表示セル5の内面に蛍光体4が塗布されるが、この塗布方法としては、RGB3種の蛍光体パターンそれぞれを、スクリーン印刷法で隔壁2間に塗布する厚膜印刷法を用いた手法がある。この際、パネルの輝度を向上させるために、厚膜印刷法で塗布した蛍光体ペーストの流動性を利用して、蛍光体4を隔壁2の側面まで塗布する手法が用いられている。
【0005】
上記手法によって塗布される蛍光体4は、隔壁2の側面全体に塗布し、その塗布厚みが一様で、かつ隣接する隔壁2間の別の蛍光体4と混色があってはならないものである。
【0006】
【本発明が解決しようとする課題】
しかしながら、上記隔壁2の側面は滑らかであるため、塗布した蛍光体4の付着性が悪いという問題があった。
【0007】
そのため、図2のような状態となるように塗布しても、隔壁2の側面に塗布した蛍光体4が下方へ流動することから、壁面全体に塗布するために多量の蛍光体4を必要とし、しかも隔壁2の側面に塗布する蛍光体4の厚みが薄くなることから、発光輝度を充分に高めることができないという不都合があった。
【0008】
そこで、特開平7−37511号公報に示されるように、隔壁2の表面を凹凸形状とすることが提案されているが、微小な隔壁2の表面を凹凸状に加工することは極めて困難であった。
【0009】
本発明は、上記の問題に鑑みて案出されたものであり、十分な厚みの蛍光体4を塗布することが可能な隔壁2を有するプラズマ表示装置を簡単な製造工程で得ることを目的とする。
【0010】
【課題を解決するための手段】
上記問題点に鑑みて本発明は、一定空間を隔てて対向する背面板と正面板の間に、上記空間を仕切る複数の隔壁を有し、該隔壁の間に構成される放電表示セル内に放電電極とアドレス電極を備えるとともに、上記放電表示セルの内壁面に蛍光体を塗布してなるプラズマ表示装置において、上記隔壁がマトリックス成分と硬質粒子からなり、表面に硬質粒子を露出させて凹凸形状を設け、硬質粒子が隔壁の表面のみに存在し、内部には存在しないことを特徴とする。
さらに上記硬質粒子の平均粒径が0.1〜50μmの範囲内であることを特徴とする。
さらに上記凹凸形状を形成するための上記硬質粒子と、隔壁の補強材として用いる他の硬質粒子の二種類を用いたことを特徴とする。
さらに背面板上に、マトリックス成分を塗布し、この表面に硬質粒子を噴霧し、成形型を押し当てることによって、表面に硬質粒子が露出した隔壁を成形し、焼成した後、この上に蛍光体を塗布し、正面板を接合する工程を含むことを特徴とする。
さらに背面板上に、マトリックス成分からなる隔壁を複数成形し、その表面に硬質粒子を噴霧して焼成した後、この上に蛍光体を塗布し、正面板を接合する工程を含むことを特徴とする。
【0016】
【発明の実施形態】
以下、本発明の参考形態を図によって説明する。
【0017】
図1に放電表示セル5の拡大図を示すように、背面板1上に複数の隔壁2を形成して、各隔壁2間の空間を放電表示セル5とし、その底面にアドレス電極3を形成し、この放電表示セル5内に蛍光体4を塗布してある。そして、図3に示すように、放電電極7を備えた正面板6を隔壁2の上部に接合して、各放電表示セル5に放電ガスを封入すれば、プラズマ表示装置を構成することができる。
【0018】
ここで、本発明のプラズマ表示装置では、隔壁2がガラス等のマトリックス成分2aとこれに含有される硬質粒子2bからなり、この硬質粒子2bが表面に露出して凹凸形状を備えている。そのため、隔壁2の側面に塗布した蛍光体4が、凹凸形状によって流動しにくくなり、付着性を良好にすることができるのである。その結果、少ない塗布量で放電表示セル5内に均一な厚みの蛍光体4を塗布することができる。
【0019】
なお、上記隔壁2のマトリックス成分2aの材質としては、鉛ホウケイ酸ガラス等の低融点ガラスを用い、背面板1の材質としては、ソーダライムガラスや各種セラミックス等を用いる。また、硬質粒子2bとしては、アルミナ、ジルコニア、チタニア等の金属酸化物の微粉末を用いる。この硬質粒子2bを含有させることによって、隔壁2の強度を向上させるとともに、着色させることも可能である。
【0020】
また、上記硬質粒子2bによって形成される凹凸形状の高さは0.1〜50μmの範囲内が好ましい。これは、0.1μm未満では蛍光体4の付着性を向上させる効果に乏しく、一方、50μmを超えると隔壁2の強度低下や、放電空かの減少につながるためである。なお、このような凹凸高さとするためには、硬質粒子2bの平均粒径を0.1〜50μm、好ましくは1〜10μmの範囲内となるようにしておけば良い。
【0021】
さらに、硬質粒子2bは隔壁2全体に対して、0.5〜75体積%の範囲で含有することが好ましい。これは、0.5体積%未満では上記効果に乏しく、75体積%を超えると焼結性が低下するためである。
【0022】
次に、このような凹凸形状を備えた隔壁2の製造方法を説明する。
【0023】
まず、隔壁2を成す材質として、低融点ガラス粉末等のマトリックス成分2aと、セラミックス等の硬質粒子2bの混合粉末をバインダーと共に混合したペーストを用意する。この時、凹凸を形成するための硬質粒子2bと、隔壁2の補強材として用いる硬質粒子の二種類を用いることもでき、この場合は、凹凸を形成するための硬質粒子2bは隔壁2の形成直前に混合する。次に、このペーストを使用して、型を用いた成形等によって背面板1上に隔壁2を形成し、焼成を行う。
【0024】
焼成後、得られた隔壁2の表面にエッチング又はサンドブラストを施すことによって、マトリックス成分2aを除去し、硬質粒子2bを表面に露出させて凹凸形状を形成する。
【0025】
ここで、エッチング手法としては、酸系のエッチング液を用いた化学エッチングを行う。具体的には、フッ酸、硝酸、硫酸、酢酸などの少なくとも1種からなる溶液またはアンモニア等を添加して緩衝機能を持たせて、エッチング速度をコントロールできるようにした溶液を用いる。また、サンドブラストは、研削材としてアルミナ微粉を用い、このときの研削材の粒径、ブラストの噴射圧、ワークに対する角度を変化させることで研削条件を変更できるようにすれば良い。
【0026】
【発明の実施形態】
以下、本発明の実施形態を図によって説明する。
【0027】
図2に示すものは、上記実施形態に比べて、硬質粒子2bが隔壁2の表面のみに存在し、内部には存在しない点で相違しているが、その他は同一である。
【0028】
このような隔壁2を製造する方法は以下の通りである。まず、マトリックス成分2aのみからなるペーストを用意する。次に、これを背面板1の全面に塗布した後、その表面に硬質粒子2bを噴霧し、この上に型部材を押し当てて隔壁2を成形すれば、表面のみに硬質粒子2bが存在した隔壁2が得られ、これを焼成すれば、硬質粒子2bが部分的に隔壁2に埋め込まれて、図2に示す構造とすることができる。
【0029】
あるいは、背面板1上にマトリックス成分2aのみで隔壁2を形成した後、その表面に硬質粒子2bを噴霧して焼成すれば、隔壁2が溶融して表面に硬質粒子2bが埋め込まれ、図2に示す構造とすることができる。
【0030】
なお、上述した本発明のプラズマ表示装置を成す隔壁2は、正面板6側に向けて幅が小さくなるようなテーパ形状としてあり、これによって放電表示セル5の内面に蛍光体4を塗布しやすい形状としてある。
【0031】
【実施例】
参考例1
以下、本発明の参考例と実施例について説明する。
【0032】
隔壁2を成すマトリックス成分2aとして鉛ホウケイ酸ガラスからなる低融点ガラスを用い、硬質粒子2bとしてとアルミナ、ジルコニア、チタニアからなるセラミックスフィラーを用い、両者を混合したペーストを用意した。特にアルミナについては、平均粒径が5μmの粒度のアルミナを全粉体重量に対して5重量%となるよう添加した。
【0033】
背面板1として、400×500×2mmのソーダライムガラス基板を用い、この上に、50μm幅、高さ150μm、220μmピッチで隔壁2を形成し、空気中550〜600℃の温度で隔壁2の焼成を行った。
【0034】
得られた背面板1を30体積%フッ酸に浸漬し、エッチングを行った。エッチング終了後、水で酸を洗い流すと同時に、超音波照射を行い隔壁2間のエッチング屑を取り除いた。
【0035】
得られた背面板1の断面SEM観察を行ったところ、隔壁2の表面に1〜3μm程度の凹凸形状を有することが確認できた。また、この凹凸表面を持った隔壁2に厚膜印刷法により蛍光体4のペーストを塗布したところ、厚みが15μmの蛍光体層を形成することができた。なお、従来の蛍光体層の厚みは5〜10μm程度であったことから、蛍光体4の塗布厚みを充分に厚くできることがわかった。
【0036】
実施例1
参考例1と同様の手法により、背面板1上に隔壁2を形成し、焼成前の段階で、隔壁2の頂部に樹脂層を塗布形成してサンドブラストに対する保護層を形成した。
【0037】
その後、隔壁2の側面を集中的にサンドブラスト処理を行った後、空気中550〜600℃の温度で隔壁2の焼成を行った。焼成終了後、水中での超音波照射を行い隔壁2間のブラスト屑を取り除いた。
【0038】
得られた背面板1の断面SEM観察を行ったところ、1〜3μm程度の凹凸表面を持った隔壁2となっていた。また、この隔壁2に厚膜印刷法により蛍光体4のペーストを塗布したところ、15μmの厚みの蛍光体層が形成でき、上記実施例と同様に塗布厚みを充分に厚くできることがわかった。
【0039】
実施例2
背面板1として400×500×3mmのガラス基板を用い、この上に、隔壁2のマトリックス成分2aのみを数10μm厚みで均一に塗布した。次に、硬質粒子2bとして平均粒径2μmの粒度のアルミナを有機溶媒中に5重量%添加し分散剤により分散させた溶液を準備し、これを上記マトリックス成分2aの塗布膜上に均一に噴霧した。
【0040】
この表面に、成形型を押し当てて加圧成形し、隔壁2を形成した。焼成終了後、背面板1の断面SEM観察を行ったところ、図2に示すような構造となっており、2〜4μm程度の凹凸表面を持った隔壁2が得られた。また、この隔壁2に厚膜印刷法により蛍光体4のペーストを塗布したところ、厚みが18μmの蛍光体層が形成でき、塗布厚みを充分に厚くできることがわかった。
【0041】
実施例3
背面板1として400×500×3mmのガラス基板を用い、この上に、隔壁2のマトリックス成分2aのみを用いて成形型にて加圧成形して隔壁2を形成した。次に、硬質粒子2bとして平均粒径2μmの粒度のアルミナを有機溶媒中に5重量%添加し、分散剤により分散させた溶液を準備し、上記焼成前の隔壁2の表面に均一に噴霧した。
【0042】
その後焼成し、得られた背面板1の断面SEM観察を行ったところ、図2に示すような構造となっており、2〜4μm程度の凹凸表面を持った隔壁2が得られた。また、この隔壁2に厚膜印刷法により蛍光体4のペーストを塗布したところ、18μmの蛍光体層が形成でき、塗布厚みを充分に厚くできることがわかった。
【0043】
【発明の効果】
以上のように本発明によれば、プラズマ表示装置における、隔壁をマトリックス成分と硬質粒子から形成し、その表面に硬質粒子を露出させて凹凸形状を設けたことによって、隔壁間に充填の容易な高い流動性を持つ蛍光体ペーストを用いても、隔壁側部に厚肉の蛍光体を塗布することが可能であり、蛍光体の塗布工程の歩留まりが向上する。また、蛍光体が隔壁側面まで厚肉に塗布できる結果、高輝度で高画質のプラズマ表示装置が製造可能となる。
【0044】
また本発明によれば、マトリックス成分の表面に硬質粒子を埋め込んで隔壁を形成することにより、簡単な工程で、表面に凹凸形状を有する隔壁を製造することができる。
【図面の簡単な説明】
【図1】本発明の参考例のプラズマ表示装置における放電表示セルの拡大断面図である。
【図2】本発明のプラズマ表示装置の実施形態における放電表示セルの拡大断面図である。
【図3】一般的なプラズマ表示装置の構成を示す断面図である。
【図4】従来のプラズマ表示装置における放電表示セルの拡大断面図である。
【符号の説明】
1:背面板
2:隔壁
2a:マトリックス成分
2b:硬質粒子
3:アドレス電極
4:蛍光体
5:放電表示セル
6:正面板
7:放電電極
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a plasma display device and a method for manufacturing the same.
[0002]
[Prior art]
Plasma display devices are large-area, high-quality image display devices that are lightweight, thin, and are not subject to restrictions on installation locations and the like. Attention has been paid to color display devices and the like.
[0003]
In this plasma display device, as shown in FIG. 3, a plurality of partitions 2 are formed on a back plate 1, a space between the partitions 2 is used as a discharge display cell 5, and an address electrode 3 is formed on the bottom surface. On the other hand, a front plate 6 provided with a discharge electrode 7 is joined to the upper part of the partition wall 2 so that the discharge display cell 5 is filled with a discharge gas such as a rare gas. Then, a plasma is generated by a discharge between the address electrode 3 and the discharge electrode 7, and a phosphor (not shown) applied in the discharge display cell 5 emits light by ultraviolet light emitted from the plasma to emit light on the screen. It is used as
[0004]
As shown in an enlarged view of the discharge display cell 5 in FIG. 4, the phosphor 4 is applied to the inner surface of the discharge display cell 5. There is a method using a thick film printing method of applying between the partition walls 2 by using the method. At this time, in order to improve the brightness of the panel, a method of applying the phosphor 4 to the side surface of the partition 2 using the fluidity of the phosphor paste applied by the thick film printing method is used.
[0005]
The phosphor 4 applied by the above-described method is applied to the entire side surface of the partition wall 2 and has a uniform coating thickness and must not be mixed with another phosphor 4 between the adjacent partition walls 2. .
[0006]
[Problems to be solved by the present invention]
However, since the side surface of the partition 2 is smooth, there is a problem that the adhesion of the applied phosphor 4 is poor.
[0007]
For this reason, even if the phosphor 4 is applied so as to have a state as shown in FIG. 2, the phosphor 4 applied to the side surface of the partition wall 2 flows downward, so that a large amount of the phosphor 4 is required to be applied to the entire wall surface. In addition, since the thickness of the phosphor 4 applied to the side surface of the partition wall 2 is reduced, there is a disadvantage that the emission luminance cannot be sufficiently increased.
[0008]
Thus, as disclosed in Japanese Patent Application Laid-Open No. 7-37511, it has been proposed to make the surface of the partition 2 uneven, but it is extremely difficult to process the surface of the minute partition 2 into an uneven shape. Was.
[0009]
The present invention has been devised in view of the above problems, and has as its object to obtain a plasma display device having a partition 2 to which a phosphor 4 having a sufficient thickness can be applied by a simple manufacturing process. I do.
[0010]
[Means for Solving the Problems]
In view of the above problems, the present invention has a plurality of partitions partitioning the space between a back plate and a front plate facing each other with a certain space therebetween, and a discharge electrode is formed in a discharge display cell formed between the partitions. And a plasma display device comprising an address electrode and a phosphor applied to the inner wall surface of the discharge display cell, wherein the partition walls are composed of a matrix component and hard particles, and the hard particles are exposed on the surface to form an uneven shape. , Characterized in that the hard particles are present only on the surface of the partition wall and not inside.
Further, the hard particles have an average particle diameter in a range of 0.1 to 50 μm.
Further, two kinds of the hard particles for forming the irregularities and the other hard particles used as a reinforcing material of the partition wall are used.
Further, on the back plate, a matrix component is applied, hard particles are sprayed on the surface, and a mold is pressed to form a partition having the hard particles exposed on the surface, and after baking, the phosphor is coated thereon. And bonding the front plate.
Further, on the back plate, after forming a plurality of partitions composed of a matrix component, spray hard particles on the surface and sintering, apply a phosphor on this, it is characterized by including a step of joining the front plate I do.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a reference embodiment of the present invention will be described with reference to the drawings.
[0017]
As shown in an enlarged view of the discharge display cell 5 in FIG. 1, a plurality of partitions 2 are formed on a back plate 1, a space between each partition 2 is formed as a discharge display cell 5, and an address electrode 3 is formed on the bottom surface. Then, the phosphor 4 is applied to the inside of the discharge display cell 5. Then, as shown in FIG. 3, a front plate 6 provided with a discharge electrode 7 is joined to the upper part of the partition wall 2 and a discharge gas is sealed in each discharge display cell 5, whereby a plasma display device can be constructed. .
[0018]
Here, in the plasma display device of the present invention, the partition wall 2 is composed of a matrix component 2a such as glass and the hard particles 2b contained therein, and the hard particles 2b are exposed on the surface and have an uneven shape. Therefore, the fluorescent substance 4 applied to the side surface of the partition wall 2 becomes less likely to flow due to the uneven shape, and the adhesion can be improved. As a result, the phosphor 4 having a uniform thickness can be applied in the discharge display cell 5 with a small application amount.
[0019]
The material of the matrix component 2a of the partition wall 2 is a low-melting glass such as lead borosilicate glass, and the material of the back plate 1 is soda lime glass or various ceramics. As the hard particles 2b, fine powder of a metal oxide such as alumina, zirconia, or titania is used. By containing the hard particles 2b, it is possible to improve the strength of the partition walls 2 and to color the partition walls 2 as well.
[0020]
Further, the height of the concavo-convex shape formed by the hard particles 2b is preferably in the range of 0.1 to 50 μm. This is because if the thickness is less than 0.1 μm, the effect of improving the adhesion of the phosphor 4 is poor, while if it exceeds 50 μm, the strength of the partition walls 2 is reduced, and discharge voids are reduced. In addition, in order to obtain such a height of irregularities, the average particle diameter of the hard particles 2b may be set within a range of 0.1 to 50 μm, preferably 1 to 10 μm.
[0021]
Further, the hard particles 2b are preferably contained in the range of 0.5 to 75% by volume based on the entire partition wall 2. This is because if the content is less than 0.5% by volume, the above effect is poor, and if it exceeds 75% by volume, the sinterability is reduced.
[0022]
Next, a method of manufacturing the partition wall 2 having such an uneven shape will be described.
[0023]
First, as a material for forming the partition wall 2, a paste is prepared by mixing a mixed powder of a matrix component 2a such as a low melting glass powder and a hard particle 2b such as a ceramic with a binder. At this time, two types of hard particles 2b for forming the unevenness and hard particles used as a reinforcing material for the partition 2 can be used. In this case, the hard particles 2b for forming the unevenness are formed of the partition 2 Mix immediately before. Next, using this paste, the partition 2 is formed on the back plate 1 by molding using a mold or the like, and firing is performed.
[0024]
After firing, the surface of the obtained partition wall 2 is subjected to etching or sandblasting to remove the matrix component 2a and expose the hard particles 2b to the surface to form an uneven shape.
[0025]
Here, as an etching method, chemical etching using an acid-based etchant is performed. Specifically, a solution composed of at least one of hydrofluoric acid, nitric acid, sulfuric acid, and acetic acid, or a solution in which ammonia or the like is added to have a buffer function so that the etching rate can be controlled is used. In sand blasting, alumina fine powder is used as a grinding material, and the grinding conditions can be changed by changing the particle size of the grinding material, the blast injection pressure, and the angle with respect to the workpiece.
[0026]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0027]
2 is different from the above-described embodiment in that the hard particles 2b are present only on the surface of the partition wall 2 and are not present inside, but are otherwise the same.
[0028]
The method of manufacturing such a partition 2 is as follows. First, a paste consisting only of the matrix component 2a is prepared. Next, after this was applied to the entire surface of the back plate 1, the hard particles 2b were sprayed on the surface thereof, and a mold member was pressed thereon to form the partition walls 2, whereby the hard particles 2b were present only on the surface. When the partition walls 2 are obtained and fired, the hard particles 2b are partially embedded in the partition walls 2 to obtain the structure shown in FIG.
[0029]
Alternatively, after the partition 2 is formed on the back plate 1 using only the matrix component 2a, the hard particles 2b are sprayed on the surface and baked, whereby the partition 2 is melted and the hard particles 2b are embedded in the surface. The structure shown in FIG.
[0030]
Note that the partition wall 2 constituting the above-described plasma display device of the present invention has a tapered shape such that the width decreases toward the front plate 6, thereby facilitating the application of the phosphor 4 to the inner surface of the discharge display cell 5. As a shape.
[0031]
【Example】
Reference Example 1
Hereinafter, reference examples and examples of the present invention will be described.
[0032]
A low-melting-point glass made of lead borosilicate glass was used as the matrix component 2a forming the partition walls 2, a ceramic filler made of alumina, zirconia, and titania was used as the hard particles 2b, and a paste was prepared by mixing the two. Particularly with respect to alumina, alumina having an average particle size of 5 μm was added so as to be 5% by weight based on the total powder weight.
[0033]
A 400 × 500 × 2 mm soda lime glass substrate was used as the back plate 1, and a partition 2 was formed thereon with a width of 50 μm, a height of 150 μm, and a pitch of 220 μm, and the partition 2 was formed in air at a temperature of 550 to 600 ° C. The firing was performed.
[0034]
The obtained back plate 1 was immersed in 30% by volume hydrofluoric acid and etched. After the etching was completed, the acid was washed away with water, and at the same time, ultrasonic irradiation was performed to remove etching dust between the partition walls 2.
[0035]
When a cross-sectional SEM observation of the obtained back plate 1 was performed, it was confirmed that the surface of the partition wall 2 had an uneven shape of about 1 to 3 μm. When the paste of the phosphor 4 was applied to the partition wall 2 having the uneven surface by the thick film printing method, a phosphor layer having a thickness of 15 μm could be formed. In addition, since the thickness of the conventional phosphor layer was about 5 to 10 μm, it was found that the coating thickness of the phosphor 4 could be sufficiently increased.
[0036]
Example 1
In the same manner as in Reference Example 1, the partition 2 was formed on the back plate 1, and before baking, a resin layer was applied on the top of the partition 2 to form a protective layer against sandblasting.
[0037]
Then, after intensively sandblasting the side surfaces of the partition 2, the partition 2 was fired at a temperature of 550 to 600 ° C. in the air. After the firing, ultrasonic irradiation in water was performed to remove blast debris between the partition walls 2.
[0038]
When a cross-sectional SEM observation of the obtained rear plate 1 was performed, it was found that the partition wall 2 had an uneven surface of about 1 to 3 μm. Further, when the paste of the phosphor 4 was applied to the partition walls 2 by a thick film printing method, a phosphor layer having a thickness of 15 μm could be formed, and it was found that the applied thickness could be sufficiently increased similarly to the above-described embodiment.
[0039]
Example 2
A 400 × 500 × 3 mm glass substrate was used as the back plate 1, and only the matrix component 2 a of the partition wall 2 was uniformly coated with a thickness of several tens μm on this. Next, a solution in which 5% by weight of alumina having an average particle size of 2 μm was added to the organic solvent as the hard particles 2b and dispersed with a dispersant was prepared, and this was uniformly sprayed on the coating film of the matrix component 2a. did.
[0040]
A molding die was pressed against this surface to perform pressure molding to form the partition wall 2. After the completion of the firing, a cross-sectional SEM observation of the back plate 1 was performed. As a result, a partition wall 2 having a structure as shown in FIG. 2 and having an uneven surface of about 2 to 4 μm was obtained. Further, when the paste of the phosphor 4 was applied to the partition walls 2 by a thick film printing method, a phosphor layer having a thickness of 18 μm was formed, and it was found that the applied thickness could be sufficiently increased.
[0041]
Example 3
A glass substrate of 400 × 500 × 3 mm was used as the back plate 1, and the partition 2 was formed thereon by pressure molding using only a matrix component 2 a of the partition 2 with a molding die. Next, a solution in which 5% by weight of alumina having an average particle size of 2 μm was added to the organic solvent as the hard particles 2b and dispersed with a dispersant was prepared, and the solution was uniformly sprayed on the surface of the partition wall 2 before firing. .
[0042]
After baking, the obtained back plate 1 was subjected to SEM observation in cross section. As a result, a partition wall 2 having a structure as shown in FIG. 2 and having an uneven surface of about 2 to 4 μm was obtained. Further, when the paste of the phosphor 4 was applied to the partition walls 2 by a thick film printing method, it was found that a phosphor layer of 18 μm could be formed, and the applied thickness could be sufficiently increased.
[0043]
【The invention's effect】
As described above, according to the present invention, in the plasma display device, the partition walls are formed from the matrix component and the hard particles, and the hard particles are exposed on the surface to provide the unevenness, so that the space between the partition walls can be easily filled. Even if a phosphor paste having high fluidity is used, a thick phosphor can be applied to the side wall of the partition wall, and the yield of the phosphor application step is improved. In addition, as a result of the phosphor being applied thickly to the side wall of the partition, a plasma display device with high brightness and high image quality can be manufactured.
[0044]
Further, according to the present invention, by forming the partition walls by embedding the hard particles in the surface of the matrix component, it is possible to manufacture the partition walls having the uneven shape on the surface by a simple process.
[Brief description of the drawings]
FIG. 1 is an enlarged sectional view of a discharge display cell in a plasma display device according to a reference example of the present invention.
FIG. 2 is an enlarged sectional view of a discharge display cell in the embodiment of the plasma display device of the present invention.
FIG. 3 is a cross-sectional view illustrating a configuration of a general plasma display device.
FIG. 4 is an enlarged sectional view of a discharge display cell in a conventional plasma display device.
[Explanation of symbols]
1: Back plate 2: Partition wall 2a: Matrix component 2b: Hard particles 3: Address electrode 4: Phosphor 5: Discharge display cell 6: Front plate 7: Discharge electrode

Claims (5)

一定空間を隔てて対向する背面板と正面板の間に、上記空間を仕切る複数の隔壁を有し、該隔壁の間に構成される放電表示セル内に放電電極とアドレス電極を備えるとともに、上記放電表示セルの内壁面に蛍光体を塗布してなるプラズマ表示装置において、上記隔壁がマトリックス成分と硬質粒子からなり、表面に硬質粒子を露出させて凹凸形状を設け、硬質粒子が隔壁の表面のみに存在し、内部には存在しないことを特徴とするプラズマ表示装置。A plurality of partitions partitioning the space are provided between a rear plate and a front plate facing each other with a certain space therebetween, and a discharge electrode and an address electrode are provided in a discharge display cell formed between the partitions, and the discharge display is provided. In a plasma display device in which a phosphor is applied to the inner wall surface of a cell, the partition walls are composed of a matrix component and hard particles, and the hard particles are exposed on the surface to form irregularities, and the hard particles are present only on the surfaces of the partition walls. And a plasma display device which does not exist inside . 上記硬質粒子の平均粒径が0.1〜50μmの範囲内であることを特徴とする請求項1記載のプラズマ表示装置。2. The plasma display device according to claim 1, wherein said hard particles have an average particle size in a range of 0.1 to 50 [mu] m. 上記凹凸形状を形成するための上記硬質粒子と、隔壁の補強材として用いる他の硬質粒子の二種類を用いたことを特徴とする請求項1記載のプラズマ表示装置。2. The plasma display device according to claim 1, wherein two types of the hard particles for forming the uneven shape and other hard particles used as a reinforcing material of the partition wall are used. 背面板上に、マトリックス成分を塗布し、この表面に硬質粒子を噴霧し、成形型を押し当てることによって、表面に硬質粒子が露出した隔壁を成形し、焼成した後、この上に蛍光体を塗布し、正面板を接合する工程を含むプラズマ表示装置の製造方法。On the back plate, a matrix component is applied, hard particles are sprayed on the surface, and a molding die is pressed to form a partition having the hard particles exposed on the surface, and after baking, the phosphor is coated thereon. A method for manufacturing a plasma display device, comprising a step of applying and joining a front plate. 背面板上に、マトリックス成分からなる隔壁を複数成形し、その表面に硬質粒子を噴霧して焼成した後、この上に蛍光体を塗布し、正面板を接合する工程を含むプラズマ表示装置の製造方法。Production of a plasma display device including a step of forming a plurality of partition walls composed of a matrix component on a back plate, spraying hard particles on the surface and firing the particles, applying a phosphor thereon, and joining the front plate. Method.
JP2007898A 1998-01-30 1998-01-30 Plasma display device and method of manufacturing the same Expired - Fee Related JP3588243B2 (en)

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KR100392952B1 (en) * 2001-01-26 2003-07-28 엘지전자 주식회사 Method of Fabricating Back Plate of Plasma Display Panel
JP2003242881A (en) * 2002-02-19 2003-08-29 Mitsubishi Materials Corp Paste for forming barrier rib
KR100743712B1 (en) * 2005-03-15 2007-07-30 엘지전자 주식회사 The plasma display panel and the manufacturing methode of the same
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