JP2001176394A - Forming method for rear face board of plasma display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a forming method for a rear face board of a plasma display panel having a partition with a uniform height and a dielectric layer with a uniform film thickness. SOLUTION: In the method of forming a partition geometry by reverse duplicating a forming die for a rear face board of a plasma display panel having a stripe channel geometry on a surface as a female die of the partition, the thin film dielectric layer can be obtained after burning, even though the film of the dielectric layer before burning has been thick, by increasing a resin content of an inorganic material paste which forms the partition and the dielectric layer, and by enlarging the shrinking percentage during burning. In this method, it is possible to easily form the dielectric layer with a uniform film thickness. In addition, the same effect is obtained by using a glass frit with a low melting point as an inorganic material for the partition and the dielectric material, or by reducing the aggregate content in the inorganic materials.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the formation of a back plate of a plasma display panel.

[0002]

2. Description of the Related Art A plasma display panel used for a thin large-screen color display device or the like is provided with opposing electrodes in a space surrounded by partition walls called minute display cells, and discharges rare gas or the like into the space. It has a structure in which a possible gas is sealed, generates plasma by discharge between opposing electrodes, and emits a phosphor by the plasma to be used as a light emitting element of a screen.

In a specific structure, a large number of barriers are formed on one surface of a back plate, and a cell is provided between the barriers. A back plate is provided with electrodes on the bottom surface of the cell. A phosphor is applied to the inner wall surface of the cell with respect to the back plate, and a front plate provided with electrodes is joined to a partition of the back plate, and a gas is sealed in the cell to form a plasma display device. I do. Note that the electrodes are arranged so as to be orthogonal.

In general, as a method of manufacturing a barrier on a back plate of a plasma display panel, a paste comprising a composition for forming a barrier is repeatedly printed and dried on a back plate by a screen printing method to a predetermined height, and laminated to a predetermined height. After the barrier shape is formed, a method of baking and solidifying is known.However, this method has a large number of repeated steps, and the barrier bottom is disturbed due to sagging and the mesh of the screen printing plate, and printing is performed. Due to misalignment at the time and deformation due to elongation of the screen printing plate itself, good dimensional accuracy cannot be obtained, and it is difficult to cope with high definition.

As another barrier forming method instead of the screen printing method, a barrier forming material is formed in a required thickness on a back plate, and unnecessary portions are ground and removed by sandblasting using a mask pattern. There is known a method of forming a barrier shape by using such a method. However, this method has a problem in that a barrier material other than a barrier forming portion is deleted, thereby increasing a manufacturing cost, and also in order to cope with higher definition. However, when trying to form a narrow barrier at a fine pitch, the higher the barrier, the more the unnecessary parts are ground by sandblasting, and the side of the barrier is also ground, so the barrier is damaged during processing. Or it may cause barrier breakage during firing, making it difficult to respond to high definition.

Therefore, as disclosed in Japanese Patent Application Laid-Open No. 9-134676, a partition wall forming material comprising a mixture of glass powder, aggregate and binder was filled in a mold having a reverse pattern of partition walls. A method has been proposed in which a partition is formed by joining and integrating a molded body and a back plate.

Further, as shown in Japanese Patent Application Laid-Open No. Hei 10-302614, a partition wall forming material comprising a mixture of glass powder, aggregate and binder is applied to a back plate, and a plurality of grooves are formed on the surface of a roll. Rotate while applying pressure to the application surface,
A method of forming a partition in a circumferential groove of a roll by plastically deforming a partition forming material has also been proposed.

In these methods, it is possible to form a partition having good shape and dimensional accuracy and to reduce the manufacturing cost without wasting the material for forming the partition.

In these systems, when the mold is filled with the partition wall forming material and only the groove of the mold is filled, only the partition wall is formed, but not only the groove but also the surface of the mold. When the partition wall forming material is also left in a film state, the film partition wall forming material becomes a dielectric layer, and the partition walls and the dielectric layer can be formed at once. In addition, the component ratio of the binder of the mixture of the conventional glass powder, the aggregate, and the binder is 10 to 20.
%. Further, in the conventional mixture of glass powder, aggregate and binder, glass powder having a softening point of 500 to 550 ° C. is conventionally used. Further, in the conventional mixture of glass powder, aggregate and binder, the aggregate is conventionally 10 to 20.
%include.

[0010]

In the dielectric layer on the back plate of the plasma display panel, a very high discharge starting voltage is required if the thickness of the dielectric covering the electrode is large. Is about 15 μm, and the thickness of the entire dielectric layer must be uniform between about 5 and 20 μm.

Therefore, when the partition walls and the dielectric are simultaneously formed by the above-mentioned method, the partition wall forming material is filled in the mold by screen printing or embedding by a doctor or a press roll. And a method in which a material for forming a partition is applied in a predetermined thickness on a substrate on which a partition is to be formed, and then a molding die is press-compressed.

However, when the mold is actually filled with the partition-forming material, the method of directly filling the mold with the partition-forming material may be caused by screen mesh marks, unevenness in the pressure of squeegees, doctors, press rolls, and the like. ,Also,
In the method in which the mold is pressed and pressed against the material for forming the partition walls on the substrate, the thickness of the portion corresponding to the dielectric is uniformly formed between 5 and 20 μm due to the undulation of the substrate and the unevenness of the pressure of the mold. It is very difficult to do. This becomes more difficult as the size of the substrate increases.

If the thickness of the dielectric layer is not uniform, a difference in the thickness of the dielectric is caused when the plasma display panel is turned on, which causes a difference in the discharge address time.

In the case where the dielectric is formed into a thin film, a defect that the electrodes are exposed during the formation of the partition and the dielectric is likely to occur due to uneven filling of the material for forming the partition into the mold.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and can provide a partition having good uniformity and a dielectric having a good uniform thickness at a low cost, and have a large screen. It is an object of the present invention to provide a method of manufacturing a rear panel for a plasma display, which can be easily realized.

[0016]

In order to solve the above-mentioned problems, the present invention fills a mold having a stripe or a groove with a predetermined shape with a mixture of glass powder, aggregate and a binder, and mixes the mixture with a ceramic or a binder. In a method in which a partition wall and a dielectric are collectively formed on a substrate made of glass by abutting on the substrate, a binder component ratio of a mixture of glass powder, aggregate, and a binder is set to 40 to 60%. A method for forming a back plate of a plasma display panel is provided.

Further, according to the present invention, the mixture of the glass powder, the aggregate and the binder has a softening point of 400-400.
Provided is a method for forming a back plate of a plasma display panel, wherein a glass powder at 500 ° C. is used.

Further, the present invention provides a mold having a stripe-shaped or predetermined-shaped groove filled with a mixture of glass powder, aggregate, and a binder, and brought into contact with a substrate made of ceramics or glass. In the method of forming the partition wall and the dielectric at one time, after filling the mixture of the glass powder and the binder into the groove of the mold, the surface of the mold is further filled with a glass powder having a binder component ratio of 40 to 60%. A method for forming a back plate of a plasma display panel, comprising applying a mixture of an aggregate and a binder.

Further, the present invention provides a mold having a stripe or a groove having a predetermined shape filled with a mixture of a glass powder, an aggregate and a binder, and brought into contact with a substrate made of ceramics or glass. In the method of forming the partition wall and the dielectric at one time, after filling the mixture of the glass powder and the binder into the groove of the mold, a glass powder having a softening point of 400 to 500 ° C. was further used on the surface of the mold. A method for forming a back plate of a plasma display panel, comprising applying a mixture of glass powder, aggregate, and a binder.

Further, the present invention provides a mold having a groove having a stripe shape or a predetermined shape filled with a mixture of glass powder, an aggregate and a binder, and brought into contact with a substrate made of ceramics or glass. In the method of forming the partition wall and the dielectric at one time, after filling the mixture of the glass powder and the binder into the groove of the mold, the surface of the mold is further mixed with a glass powder containing 0 to 5% of aggregate. A method for forming a back plate of a plasma display panel, comprising applying a mixture of an aggregate and a binder.

Further, the present invention provides a mold having a stripe or a groove having a predetermined shape filled with a mixture of glass powder, aggregate, and a binder, and brought into contact with a substrate made of ceramics or glass. In a method of forming a partition and a dielectric collectively, there is provided a method of forming a back plate of a plasma display panel having at least two of the features of claims 3 to 5.

[0022]

Embodiments of the present invention will be described below.

First, a material for forming a partition wall composed of a mixture of glass powder, aggregate, and a binder in forming the back plate of the plasma display panel of the present invention will be described.

The partition wall forming material used in the present method is preferably in the form of a paste having fluidity because it is necessary to fill the grooves of the mold, and glass which is an inorganic component to be the final structure It is composed of a powder aggregate and a binder which is an organic component having a function of forming a partition wall shape.

The function of the binder is that the binder is in a paste form at the stage of filling the groove of the mold, and is cured at the stage of releasing from the mold, and has a strength to maintain the shape. . As the curing mode, an evaporation curing type, a thermosetting type, a two-part curing type, an ionizing radiation curing type such as ultraviolet rays, electron beams, X-rays, and the like can be selected. Specifically, in the case of the evaporative curing type, a resin solution in which a general-purpose natural resin, semi-synthetic resin, or synthetic resin is dissolved in a solvent is used. In the case of the thermosetting type, the two-part curing type, and the ionizing radiation curing type, a combination of a reactive resin, a reactive monomer and the like and a polymerization initiator is used. Further, two or more of these curing forms may be combined.

Examples of the inorganic component include a lead-based or lead-free low-melting glass powder which is sintered at the intended maximum temperature, an aggregate which retains the shape of the barrier during firing (high-melting glass, alumina, mullite, zirconia, titania, etc.) And a pigment that determines the color of the partition wall after firing.

The substrate having the partition wall shape formed by the above-described partition wall forming material is baked, the binder is eliminated, and the inorganic component mainly composed of the low melting point glass is baked and solidified, whereby the inorganic partition wall can be formed.

At this time, when the component ratio of the binder in the partition wall forming material is increased, the binder component contained in the partition wall forming material is entirely burned out during firing, and only the inorganic component remains. growing. Further, when the low melting point glass powder, which is an inorganic component, has a low softening point, the low melting point glass powder in the partition wall forming material is more densely baked during firing, and the gap between the particles of the fired glass powder is smaller. Therefore, the shrinkage ratio of the partition wall forming material during firing also increases. Further, when the component ratio of the aggregate contained in the inorganic component in the partition wall forming material for holding the shape during firing is reduced, the shape holding force is weak when the low melting point glass in the partition wall forming material is softened during firing. As a result, the low-melting-point glass powder is baked more densely during firing, so that the shrinkage ratio of the partition wall forming material is slightly increased, and the unevenness of the film thickness of the partition wall forming material is evened out. However, if the shrinkage is too large, the partition walls crack during firing, so that the binder component ratio is 4%.
0-60%, the melting point of the low melting glass is 400-500 ° C,
The component ratio of the aggregate is set between 0 and 5%.

In the method of forming a plasma display panel according to the present invention, the above-mentioned material for forming a partition is filled in a mold to form a partition on a substrate. The mold has a groove having a stripe shape or a predetermined shape so as to form a concave shape having a desired partition shape. If necessary, in addition to a uniform width from the head to the bottom of the partition, a tapered shape with a width increasing from the head to the bottom, stepwise from the head to the bottom It is possible to consider a step-like thing whose width increases. Further, as the form of the molding die, a plate-like or block-like shape having the groove portion on a flat surface portion, a roller-like shape having a groove portion on a curved surface portion, or a part of a roller can be considered. As a material of the molding die, there is a resin type other than the metal type.

Next, as a method of filling the mold with the partition wall forming material, a method of directly filling the mold with the partition wall forming material as shown in FIG. 1 to FIG. 2 or FIG. As shown in FIG. 8, there is a method in which a molding die is press-bonded to a partition wall forming material applied on a substrate. In the case of directly filling the mold, the partition wall forming material is embedded in the groove by a method such as screen printing, doctor coating, roll press, roll coater, and flat press. By embedding the material only by cutting into the grooves by scraping with a doctor or polishing after hardening the material, only the partition can be formed. Thereby, the partition and the dielectric can be formed at once. When a molding die is press-bonded to a material applied on a substrate, a press having a groove portion on a flat portion is press-bonded by a flat press, and a molding die having a groove portion on a curved surface portion is pressure-pressed by a roll press. At this time, by giving a uniform gap between the substrate surface and the mold surface,
The partition and the dielectric can be formed at once.

As shown in FIG. 9, as a method of filling the mold with the partition wall forming material, the inside of the groove of the mold is filled with the partition wall forming material having a small shrinkage, and the surface of the mold is filled with the shrinkage. If a two-layer system in which a large partition wall forming material is applied with a uniform film thickness is used, the height of the partition walls is less shrunk during firing and a high aspect ratio is maintained.

In this method, a partition forming material having a small shrinkage is filled in a direct molding die, and a partition forming material having a large shrinkage is applied to the surface thereof. Is applied, and a partition wall forming material having a small shrinkage rate is laminated thereon, and a mold is pressed and pressed, or a partition wall forming material having a small shrinkage rate is coated on a substrate coated with a partition wall forming material having a large shrinkage rate. There is a method in which a directly filled mold is pressure-compressed. At this time, it is ideal that the partition wall forming material having a small shrinkage is filled into the groove of the mold by cutting, but even if the material remains uniformly in the form of a thin film on the surface of the mold, on the contrary, only by the uniform height The partition wall forming material having a large shrinkage rate may enter the inside of the groove.

Next, as shown in FIG. 5, the molding die is released from the partition wall forming material which has been formed into a partition shape by the molding die. When the partition forming material is directly filled on the mold, the cured partition forming material is transferred onto the substrate and released. At this time, an adhesive or a pressure sensitive adhesive may be used between the partition wall forming material and the substrate to facilitate release.

Finally, as shown in FIG. 6, the substrate on which the barrier ribs and the dielectric are formed is baked to eliminate the organic components and to harden the inorganic component mainly composed of the low-melting-point glass. Although the body is formed, the shrinkage of the material for forming the partition walls is set to be large, so that the dielectric is thinned, and the film thickness unevenness also shrinks, thereby reducing the difference in film thickness.
The film thickness becomes uniform.

[0035]

The present invention will be described below with reference to specific examples. Note that the present invention is not limited to the embodiments described below.

<Embodiment 1> One embodiment of a method for forming a back plate of a plasma display panel according to the present invention will be described.

First, the following were kneaded with a roll mill to obtain a paste-like partition wall forming material. PbO-B ₂ O ₃ -SiO ₂ based low-melting glass powder 37.8 parts by weight Al ₂ O ₃ 7.3 parts by mass TiO ₂ 4.9 parts by weight of diethylene glycol dimethacrylate 27.8 parts by weight of 2-hydroxypropyl acrylate 19. 4 parts by mass Benzophenone 2.8 parts by mass

Next, the bottom width is 50 μm, the opening width is 80 μm,
The above-mentioned partition wall forming material was filled in a plate-shaped metal mold having a groove part having a depth of 200 μm in a stripe shape with a pitch of 150 μm by doctor coating. At this time, the material for forming the partition wall was supplied not only to the inside of the groove but also to the surface of the mold at a thickness of about 20 μm.

The material for forming the partition walls filled in the mold was exposed to light of 2000 mj / cm ² by an exposure device using a high-pressure mercury lamp, and was cured.

Next, A was screen-printed on a 23-inch soda-lime glass substrate having a thickness of 2.8 mm.
g was formed over the entire surface at a pitch of 150 μm using an electrode paste containing g as a main component at a pitch of 150 μm, followed by firing to produce a glass substrate with electrodes.

Next, an adhesive is applied on the glass substrate with electrodes to a thickness of about 5 μm by doctor coating, and a mold is pressed thereon by a flat press, and then only the mold is peeled off. Then, a partition wall forming body was formed on the glass substrate.

Next, the glass substrate on which the partition wall-formed body was formed was debindered at a predetermined temperature, and the firing atmosphere was appropriately changed according to the main components of each material, and the glass substrate was fired at a temperature of 550 to 580 ° C. for 10 minutes. 120 μm in width, 50 μm in width,
At the same time as the partition walls having a pitch of 150 μm, a dielectric having a thickness of 12 μm (8 μm above the electrode) and a thickness unevenness of 1 μm or less could be formed.

<Embodiment 2> Another embodiment of the method of forming a plasma display panel back plate according to the present invention will now be described.

First, the following were kneaded in a roll mill to obtain a paste-like partition wall forming material. PbO-B ₂ O ₃ -SiO ₂ based low-melting glass powder 37.8 parts by weight (softening point 400 ℃) Al ₂ O ₃ 7.3 parts by mass TiO ₂ 4.9 parts by weight of diethylene glycol dimethacrylate 27.8 parts by 2 -Hydroxypropyl acrylate 19.4 parts by mass Benzophenone 2.8 parts by mass

When a partition was formed on the electrode substrate under the same conditions as in Example 1 using the above-described partition forming material,
Simultaneously with the partition having a height of 140 μm, a width of 50 μm, and a pitch of 150 μm, the film thickness is 10 μm (5 μm on the electrode), and the film thickness unevenness
It was possible to form a dielectric within μm.

<Embodiment 3> Another embodiment of the method of forming a plasma display panel back plate according to the present invention will now be described.

First, the following were kneaded with a roll mill to obtain a paste-like partition wall forming material. PbO-B ₂ O ₃ -SiO ₂ based low melting point glass frit 72 parts by weight Al ₂ O ₃ 3 parts by weight TiO ₂ 2 parts by weight of diethylene glycol dimethacrylate 13 parts by weight of 2-hydroxypropyl acrylate 9 parts by benzophenone 1 part by weight

When a partition was formed on an electrode substrate using the above-described material for forming a partition under the same conditions as in Example 1, a partition was formed.
At the same time as the partition having a height of 140 μm, a width of 50 μm, and a pitch of 150 μm, a dielectric having a film thickness of 17 μm (12 μm on the electrode) and a film thickness unevenness of 1 μm or less could be formed.

<Embodiment 4> Next, another embodiment of the method for forming the back plate of the plasma display panel according to the present invention will be described.

First, the following were kneaded with a roll mill to obtain a paste-like partition wall forming material A. PbO-B ₂ O ₃ -SiO ₂ based low melting point glass frit 62 parts by weight Al ₂ O ₃ 12 parts by TiO ₂ 8 parts by weight of diethylene glycol dimethacrylate 10 parts by weight of 2-hydroxypropyl acrylate 7 parts Benzophenone 1 part by weight

Next, the following materials were kneaded by a roll mill to obtain a paste-like partition wall forming material B. PbO-B ₂ O ₃ -SiO ₂ based low-melting glass powder 37.8 parts by weight Al ₂ O ₃ 7.3 parts by mass TiO ₂ 4.9 parts by weight of diethylene glycol dimethacrylate 27.8 parts by weight of 2-hydroxypropyl acrylate 19. 4 parts by mass Benzophenone 2.8 parts by mass

Next, the bottom width is 50 μm, the opening width is 80 μm,
The partition wall forming material A was abraded and filled with a doctor coat into a plate-shaped metal mold having a 150 μm-deep groove in a 150 μm pitch stripe shape.

Next, the partition wall forming material B was applied to the surface of the mold by a doctor coat with a film thickness of about 20 μm.

The material for forming the partition walls filled in the mold was exposed to light of 2000 mj / cm ² by an exposure device using a high-pressure mercury lamp, and was cured.

Next, A was screen-printed on a 23-inch soda-lime glass substrate having a thickness of 2.8 mm.
g was formed over the entire surface at a pitch of 150 μm using an electrode paste containing g as a main component at a pitch of 150 μm, followed by firing to produce a glass substrate with electrodes.

Next, an adhesive is applied to the above glass substrate with electrodes by doctor coating to a thickness of about 5 μm, and a mold is pressed thereon by a flat press, and then only the mold is peeled off. Then, a partition wall forming body was formed on the glass substrate.

Next, the glass substrate on which the above-mentioned partition wall forming body is formed is debound from the glass substrate at a predetermined temperature, and the firing atmosphere is appropriately changed according to the main components of each material, and the glass substrate is fired at a temperature of 550 to 580 ° C. for 10 minutes. 120 μm in width, 50 μm in width,
At the same time as the partition walls having a pitch of 150 μm, a dielectric having a thickness of 12 μm (8 μm above the electrode) and a thickness unevenness of 1 μm or less could be formed.

<Embodiment 5> Another embodiment of the method of forming the back plate of the plasma display panel according to the present invention will be described below.

First, the following materials were kneaded by a roll mill to obtain a paste-like partition wall forming material A. PbO-B ₂ O ₃ -SiO ₂ based low melting point glass frit 62 parts by weight Al ₂ O ₃ 12 parts by TiO ₂ 8 parts by weight of diethylene glycol dimethacrylate 10 parts by weight of 2-hydroxypropyl acrylate 7 parts Benzophenone 1 part by weight

Next, the following components were kneaded by a roll mill to obtain a paste-like partition wall forming material B. PbO-B ₂ O ₃ -SiO ₂ based low-melting glass powder 37.8 parts by weight (softening point 400 ℃) Al ₂ O ₃ 7.3 parts by mass TiO ₂ 4.9 parts by weight of diethylene glycol dimethacrylate 27.8 parts by 2 -Hydroxypropyl acrylate 19.4 parts by mass Benzophenone 2.8 parts by mass

A partition was formed on the electrode substrate under the same conditions as in Example 4 using the above-described partition forming material.
Simultaneously with the partition having a height of 140 μm, a width of 50 μm, and a pitch of 150 μm, the film thickness is 10 μm (5 μm on the electrode), and the film thickness unevenness
It was possible to form a dielectric within μm.

<Embodiment 6> Next, another embodiment of the method of forming the back plate of the plasma display panel according to the present invention will be described.

First, the following were kneaded by a roll mill to obtain a paste-form partition wall forming material A. PbO-B ₂ O ₃ -SiO ₂ based low melting point glass frit 62 parts by weight Al ₂ O ₃ 12 parts by TiO ₂ 8 parts by weight of diethylene glycol dimethacrylate 10 parts by weight of 2-hydroxypropyl acrylate 7 parts Benzophenone 1 part by weight

Next, the following were kneaded with a roll mill to obtain a paste-form partition wall forming material B. PbO-B ₂ O ₃ -SiO ₂ based low melting point glass frit 72 parts by weight Al ₂ O ₃ 3 parts by weight TiO ₂ 2 parts by weight of diethylene glycol dimethacrylate 13 parts by weight of 2-hydroxypropyl acrylate 9 parts by benzophenone 1 part by weight

When a partition was formed on an electrode substrate using the above-mentioned material for forming a partition under the same conditions as in Example 1, a partition was formed.
At the same time as the partition having a height of 140 μm, a width of 50 μm, and a pitch of 150 μm, a dielectric having a film thickness of 17 μm (12 μm on the electrode) and a film thickness unevenness of 1 μm or less could be formed.

[0066]

According to the method of forming a plasma display panel of the present invention, as described above, a mixture of a ceramic powder or a glass powder and a binder is formed by utilizing a striped or predetermined groove of a molding die. This is a method of forming a partition wall shape on a substrate, and a method of forming a partition wall and a dielectric all at once. The binder ratio of the mixture of the ceramic powder or the glass powder and the binder is set to 00.
００00%, or the melting point of the glass powder is
By setting the temperature to 0 ° C. and increasing the shrinkage during firing,
It is possible to easily reduce the thickness of the dielectric layer formed after firing without causing any defect.

Further, when filling a mixture of a ceramic powder or a glass powder and a binder into a striped or predetermined groove of a molding die, a portion corresponding to a dielectric layer is thicker than a desired dielectric film thickness. Since it is sufficient to supply, it is easy to set filling conditions, a uniform film thickness can be easily formed, and a large shrinkage rate during firing reduces a slight difference in film thickness caused during filling during firing. Therefore, it is possible to form a dielectric having excellent film thickness uniformity.

[Brief description of the drawings]

FIG. 1 is a schematic view of a step of filling a partition material into a mold according to the present invention.

FIG. 2 is a schematic view of a process of filling a partition material into a mold according to the present invention.

FIG. 3 is a schematic view of a step of filling a partition wall material into a mold according to the present invention.

FIG. 4 is a schematic view of a step of filling a partitioning material into a mold according to the present invention.

FIG. 5 is a schematic view of a mold releasing step of the present invention.

FIG. 6 is a schematic diagram of a firing step in the present invention.

FIG. 7 is a schematic view of a step of filling a partition material into a mold according to the present invention.

FIG. 8 is a schematic view of a step of filling a partition material into a mold according to the present invention.

FIG. 9 is a schematic diagram of filling a partition material into a mold according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Mold 2 ... Partition wall forming material 3 ... Substrate 4 ... Partition forming material A (small shrinkage) 5 ... Partition forming material B (large shrinkage)

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Junichi Arai 1-5-1, Taito, Taito-ku, Tokyo Inside Toppan Printing Co., Ltd. (72) Inventor Eisaburo Watanabe 1-15-1 Taito, Taito-ku, Tokyo Toppan F-term (reference) in Printing Co., Ltd. 5C027 AA05 AA09 5C040 FA01 FA02 GD07 GD09 GF02 GF18 GF19 JA20 MA22 MA23 MA26

Claims (6)

[Claims] 1. A mold having stripes or grooves of a predetermined shape is filled with a mixture of glass powder, aggregate and a binder, and is brought into contact with a substrate made of ceramics or glass to form partitions and dielectrics on the substrate. A method of forming a body at once, wherein a binder component ratio of a mixture of a glass powder, an aggregate, and a binder is set to 40 to 60%. 2. The method according to claim 1, wherein a glass powder having a softening point of 400 to 500 ° C. is used as a mixture of the glass powder, the aggregate and the binder. . 3. A mold having stripes or grooves of a predetermined shape is filled with a mixture of glass powder, aggregate and a binder, and is brought into contact with a substrate made of ceramics or glass. In the method of forming the body in a lump, after filling a mixture of glass powder and a binder into a groove of a molding die, the surface of the molding die is further mixed with a glass powder having a binder component ratio of 40 to 60% and an aggregate. A method for forming a back plate of a plasma display panel, comprising applying a mixture with a binder. 4. A mold having stripes or grooves of a predetermined shape is filled with a mixture of glass powder, aggregate, and a binder, and is brought into contact with a substrate made of ceramics or glass. In the method of forming the body at once, after filling the mixture of the glass powder and the binder into the groove of the mold, the softening point is further increased to 400 to 5 on the surface of the mold.
A method for forming a back plate of a plasma display panel, comprising applying a mixture of glass powder, aggregate, and a binder using glass powder at 00 ° C. 5. A mold having stripes or grooves of predetermined shape is filled with a mixture of glass powder, aggregate and a binder, and is brought into contact with a substrate made of ceramics or glass to form partitions and dielectrics on the substrate. In the method of forming the body in a lump, after filling the mixture of the glass powder and the binder into the groove of the mold, the glass powder and the aggregate further mixed with 0-5% of the aggregate are added to the surface of the mold. A method for forming a back plate of a plasma display panel, comprising applying a mixture with a binder. 6. A mold having stripes or grooves of a predetermined shape is filled with a mixture of glass powder, aggregate and a binder, and is brought into contact with a substrate made of ceramics or glass to form partitions and dielectrics on the substrate. 6. A method of forming a body in a lump, the method comprising forming at least two of the features of claims 3 to 5 together.