JP2000353468A - Forming die for plasma display panel back plate and forming method of back plate - Google Patents
Forming die for plasma display panel back plate and forming method of back plateInfo
- Publication number
- JP2000353468A JP2000353468A JP16373799A JP16373799A JP2000353468A JP 2000353468 A JP2000353468 A JP 2000353468A JP 16373799 A JP16373799 A JP 16373799A JP 16373799 A JP16373799 A JP 16373799A JP 2000353468 A JP2000353468 A JP 2000353468A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- partition
- glass
- back plate
- plasma display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、プラズマディスプ
レイパネルの背面板形成に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the formation of a back plate of a plasma display panel.
【0002】[0002]
【従来の技術】薄型の大画面用カラー表示装置等に用い
られるプラズマディスプレイパネルは、微小な表示セル
と呼ばれる隔壁で囲まれた空間に、対向する電極を設
け、前記空間に希ガス等の放電可能なガスを封入した構
造を成しており、対向する電極間に放電によりプラズマ
を発生させ、該プラズマにより蛍光体を発光させて画面
の発光素子として利用するものである。2. Description of the Related Art A plasma display panel used for a thin large-screen color display device or the like is provided with opposing electrodes in a space surrounded by partition walls called minute display cells, and discharges rare gas or the like into the space. It has a structure in which a possible gas is sealed, generates plasma by discharge between opposing electrodes, and emits a phosphor by the plasma to be used as a light emitting element of a screen.
【0003】具体的な構造は、背面板の一面に多数の障
壁を形成して各障壁間をセルとし、このセルの底面に電
極を備えたものを背面板とする。この背面板に対してセ
ルの内壁面に蛍光体を塗布し、一方、電極を備えた前面
板を背面板の隔壁上に接合して、セルにガスを封入する
ことにより、プラズマ表示装置を構成する。なお、電極
は直行するように配置する。In a specific structure, a large number of barriers are formed on one surface of a back plate, and a cell is provided between the barriers. A back plate is provided with electrodes on the bottom surface of the cell. A phosphor is applied to the inner wall surface of the cell with respect to the back plate, and a front plate provided with electrodes is joined to a partition of the back plate, and a gas is sealed in the cell to form a plasma display device. I do. Note that the electrodes are arranged so as to be orthogonal.
【0004】一般にプラズマディスプレイパネルの背面
板上の障壁の製造方法としては、背面板上に障壁形成用
組成物から成るペーストをスクリーン印刷法により障壁
パターンの印刷・乾燥を繰り返し、所定の高さまで積層
して障壁形状を形成した後、焼成して焼き固める方式が
知られているが、この方式は、繰り返し工程数が多い
上、ダレやスクリーン印刷版のメッシュに起因する障壁
底部の乱れや、印刷時の位置ズレ、スクリーン印刷版自
体の伸びによる変形等のため、良好な寸法精度を得られ
ず、高精細化への対応は難しい。In general, as a method of manufacturing a barrier on a back plate of a plasma display panel, a paste made of a composition for forming a barrier is repeatedly printed and dried on a back plate by a screen printing method to laminate a barrier pattern to a predetermined height. After the barrier shape is formed, a method of baking and solidifying is known.However, this method has a large number of repeated steps, and the barrier bottom is disturbed due to sagging and the mesh of the screen printing plate, and printing is performed. Due to misalignment at the time and deformation due to elongation of the screen printing plate itself, good dimensional accuracy cannot be obtained, and it is difficult to cope with high definition.
【0005】他には、スクリーン印刷法に変わる障壁形
成方法として、背面板上に必要な厚さで障壁形成材料を
層状に形成し、マスクパターンを用いてサンドブラスト
加工で不要な部分を研削削除して障壁形状を形成する方
式が知られているが、この方式は、障壁形成部分以外の
障壁材料が削除されるため製造コストが高くなる問題が
あり、また、更なる高精細化に対応するため、幅が狭い
障壁を細かいピッチで形成しようとした場合には、障壁
が高くなるほどサンドブラスト加工で不要部分を研削削
除するのに伴い障壁部側面も研削されるために、加工中
に障壁が破損したり、焼成時の障壁破損の原因になるこ
とがあり、高精細化への対応は難しい。As another barrier forming method instead of the screen printing method, a barrier forming material is formed in a required thickness on a back plate, and unnecessary portions are ground and removed by sandblasting using a mask pattern. There is known a method of forming a barrier shape by using such a method. However, this method has a problem in that a barrier material other than a barrier forming portion is deleted, thereby increasing a manufacturing cost, and also in order to cope with higher definition. However, when trying to form a narrow barrier at a fine pitch, the higher the barrier, the more the unnecessary part is ground by sandblasting, and the side of the barrier is also ground, so the barrier is damaged during processing. Or it may cause barrier breakage during firing, making it difficult to respond to high definition.
【0006】そこで、特開平9−134676に示され
るように、セラミックス又はガラス粉体とバインダ−と
の混合物からなる隔壁形成材料を、隔壁の反転パターン
をもつ成型型中に充填して得た成型体と背面板を接合一
体化して隔壁を形成する方式が提案されている。Therefore, as shown in Japanese Patent Application Laid-Open No. 9-134676, a molding material obtained by filling a molding material having a mixture of ceramics or glass powder and a binder into a molding die having an inverted pattern of the dividing walls. A method has been proposed in which a partition is formed by joining and integrating a body and a back plate.
【0007】また、特開平10−302614に示され
るように、セラミックス又はガラス粉体とバインダーと
の混合物からなる隔壁形成材料を背面板に塗布し、複数
の溝を刻設したロールの表面で塗布面を加圧しながら回
転させて、隔壁形成材料を塑性変形させてロールの円周
溝に隔壁を形成する方式も提案されている。Further, as disclosed in JP-A-10-302614, a partition wall forming material comprising a mixture of ceramics or glass powder and a binder is applied to a back plate, and is applied on the surface of a roll provided with a plurality of grooves. There has also been proposed a method in which a partition is formed in a circumferential groove of a roll by rotating a surface while applying pressure to plastically deform a partition forming material.
【0008】これらの方式では、形状、寸法精度とも良
好な隔壁の形成が可能であり、また隔壁形成材料の無駄
もなく製造コストも安価に押さえることが可能である。In these methods, it is possible to form a partition having good shape and dimensional accuracy, and it is possible to reduce the production cost without wasting the material for forming the partition.
【0009】[0009]
【発明が解決しようとする課題】これらの方式では、隔
壁形状を反転したストライプ状の溝を有する成形型によ
って隔壁形状が決定されるため、要求される隔壁形状の
幅が細くなり、高さが高くなるに従い、成形型の作製に
おいては幅が細く深い溝をストライプ状に加工しなくて
はいけないが、切削加工にて成形型を作製する場合には
微細な先端形状を持つ工具を使用する必要があり、深い
溝部を切削加工する際に工具の破損が生じやすく、なお
かつ、要求される隔壁の幅、ピッチが変更になった場合
は、使用する工具から作り直さなくてはいけないが、微
細な溝用の工具は作製が困難かつ高価である。In these methods, since the shape of the partition is determined by the mold having the stripe-shaped grooves in which the shape of the partition is inverted, the required width of the partition is reduced and the height is reduced. As the height gets higher, narrow and deep grooves must be machined in stripes when making molds, but when making molds by cutting, it is necessary to use a tool with a fine tip shape When cutting deep grooves, tool breakage is likely to occur, and if the required partition wall width and pitch are changed, it is necessary to re-create from the tool to be used. Tools are difficult and expensive to make.
【0010】また、成形型の形成にドライフィルムなど
の感光性材料を使用する場合も微細かつ高アスペクト比
のパターンは露光不良や現像不良により作製が極めて困
難となるため、更に高精細な隔壁形成には対応出来ない
という欠点があった。Further, when a photosensitive material such as a dry film is used for forming a mold, it is extremely difficult to produce a fine pattern having a high aspect ratio due to poor exposure or poor development. Had the drawback that it could not cope.
【0011】本発明は、上記のような問題を解決すべく
なされたものであり、プラズマディスプレイ用背面板上
に、歪みや変形が無く寸法精度及び高さの均一性の良好
な隔壁を低コストにて得られ、大画面化が容易に実現可
能であり、且つ、表示セルのピッチが0.2mm以下の
高精細化が実現可能なプラズマディスプレイ用背面板の
製造方法を提供することを目的とする。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and a partition wall having no distortion or deformation and having good dimensional accuracy and uniform height is provided on a back plate for plasma display at a low cost. It is an object of the present invention to provide a method of manufacturing a rear panel for a plasma display, which can easily realize a large screen and can realize high definition with a display cell pitch of 0.2 mm or less. I do.
【0012】[0012]
【課題を解決するための手段】本発明は、上記の課題を
解決するため、隔壁と同じ厚みを持つ板Aとセル幅と同
じ厚みを持つ板Bの2種類の板を交互に積層し、且つ、
板Bを板Aよりも隔壁の高さ分だけ均一に突出させるこ
とによって出来るストライプ状の溝部によるプラズマデ
ィスプレイパネル背面板用の成形型を提供する。According to the present invention, two types of plates, a plate A having the same thickness as the partition walls and a plate B having the same thickness as the cell width, are alternately laminated. and,
Provided is a mold for a back plate of a plasma display panel having a stripe-shaped groove formed by projecting a plate B more uniformly than a plate A by a height of a partition wall.
【0013】さらに本発明では、請求項1の成形型にセ
ラミックス粉体又はガラス粉体とバインダーとの混合物
を充填し、セラミックス又はガラスからなる基板上に当
接して、基板上に隔壁を形成することを特徴とするプラ
ズマディスプレイパネルの背面板形成方法を提供する。Further, in the present invention, the mold of claim 1 is filled with a mixture of a ceramic powder or a glass powder and a binder, and is brought into contact with a substrate made of ceramic or glass to form a partition on the substrate. A method for forming a back plate of a plasma display panel is provided.
【0014】さらに本発明では、セラミックス又はガラ
スからなる基板上に塗布したセラミックス粉体又はガラ
ス粉体とバインダーとの混合物に、請求項1の成形型を
加圧させつつ密着させて、基板上に隔壁を形成すること
を特徴とするプラズマディスプレイパネルの背面板形成
方法を提供する。Further, in the present invention, the molding die of claim 1 is brought into close contact with a mixture of a ceramic powder or a glass powder and a binder applied on a substrate made of ceramic or glass while applying pressure to the mixture. A method of forming a back plate of a plasma display panel, comprising forming a partition.
【0015】さらに本発明では、隔壁と同じ厚みを持つ
板Aとセル幅と同じ厚みを持つ板Bの2種類の板を交互
に積層し、且つ、板Aを板Bよりも隔壁の高さ分だけ均
一に突出させることによって出来るストライプ状の溝部
を、電鋳、樹脂、ワックス等によって反転複製して得ら
れるプラズマディスプレイの背面板用の成形型を提供す
る。Further, in the present invention, two types of plates, a plate A having the same thickness as the partition and a plate B having the same thickness as the cell width, are alternately laminated, and the height of the partition is higher than that of the plate B. Provided is a mold for a back plate of a plasma display, which is obtained by inverting and duplicating a stripe-shaped groove portion formed by uniformly projecting the same by electroforming, resin, wax, or the like.
【0016】さらに本発明では、請求項4の成形型にセ
ラミックス粉体又はガラス粉体とバインダーとの混合物
を充填し、セラミックス又はガラスからなる基板上に当
接して、隔壁を形成することを特徴とするプラズマディ
スプレイパネルの背面板形成方法を提供する。Further, the present invention is characterized in that the mold of claim 4 is filled with a mixture of ceramic powder or glass powder and a binder and is brought into contact with a substrate made of ceramic or glass to form partition walls. And a method for forming a back plate of a plasma display panel.
【0017】さらに本発明では、隔壁と同じ厚みを持つ
円板Aとセル幅と同じ厚みを持ち且つ隔壁の高さ分だけ
円板Aよりも半径が短い円板Bの2種類の円板を、円板
A及び円板Bの中心を合わせて交互に積層することによ
って出来る円筒状のストライプ状の溝部をもつプラズマ
ディスプレイパネルの背面板用の成形型を提供する。Further, in the present invention, two kinds of disks, a disk A having the same thickness as the partition wall and a disk B having the same thickness as the cell width and having a shorter radius than the disk A by the height of the partition wall, are used. The present invention provides a mold for a back plate of a plasma display panel having a cylindrical stripe-shaped groove formed by alternately stacking the discs A and B with their centers aligned.
【0018】さらに本発明では、請求項6の成形型にセ
ラミックス粉体又はガラス粉体とバインダーとの混合物
を充填し、セラミックス又はガラスからなる基板上に前
記円筒を当接させ回転させて、基板上に隔壁を形成する
ことを特徴とするプラズマディスプレイパネルの背面板
形成方法を提供する。Further, in the present invention, the molding die according to claim 6 is filled with a mixture of ceramic powder or glass powder and a binder, and the cylinder is brought into contact with a substrate made of ceramic or glass, and is rotated. A method of forming a back plate of a plasma display panel, wherein a partition is formed thereon is provided.
【0019】さらに本発明では、セラミックス又はガラ
スからなる基板上に塗布したセラミックス粉体又はガラ
ス粉体とバインダーとの混合物に、請求項6の成形型を
加圧させつつ回転させて、基板上に隔壁を形成すること
を特徴とするプラズマディスプレイパネルの背面板形成
方法を提供する。Further, in the present invention, the molding die of claim 6 is rotated while pressing the mixture of the ceramic powder or glass powder and the binder applied on the substrate made of ceramic or glass, while pressing the mixture on the substrate. A method of forming a back plate of a plasma display panel, comprising forming a partition.
【0020】さらに本発明では、請求項1、請求項4、
請求項6に於いて、板Bの厚みを少なくとも2種類以上
を使用することを特徴とするプラズマディスプレイパネ
ルの背面板用の成形型を提供する。Further, in the present invention, claim 1, claim 4,
The present invention provides a mold for a back plate of a plasma display panel, wherein at least two kinds of thicknesses of the plate B are used.
【0021】[0021]
【実施例】本発明によるプラズマディスプレイパネル背
面板形成方法の一実施例について説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the method for forming a plasma display panel back plate according to the present invention will be described.
【0022】<実施例1>厚み50μmの金属板Aを3
072枚と厚み100μmの金属板Bを3073枚だけ
用意する。このとき、金属板A、Bそれぞれについて、
少なくとも一辺が長さ400mmの直線状に加工してお
く。Example 1 A metal plate A having a thickness of 50 μm
Only 073 sheets and 3073 metal plates B having a thickness of 100 μm are prepared. At this time, for each of the metal plates A and B,
At least one side is processed into a straight line having a length of 400 mm.
【0023】次いで、上記金属板Aと上記金属板Bを、
直線状に加工した辺a及び辺bを同一方向に向けて、
B,A,B,A,B・・・という順に交互に重ね合わせ
る。Next, the metal plate A and the metal plate B are
The sides a and b processed in a straight line are directed in the same direction,
.. B, A, B, A, B...
【0024】上記金属板Aの直線状に加工した辺aに対
して、上記金属板Bの直線状に加工した辺bが均一に2
00μmだけ突出するようにして、金属板Aの辺aと金
属板Bの辺bを揃え、金属板間に隙間が生じないように
して固定し、ストライプ状成形型とする。このとき積層
した金属板によるストライプ状成形型に電鋳を施して、
各金属板を一体化して強度を上げても良い。With respect to the side a of the metal plate A which has been processed linearly, the side b which has been processed linearly of the metal plate B is uniformly 2.
The side a of the metal plate A and the side b of the metal plate B are aligned so as to protrude by 00 μm, and are fixed so that no gap is formed between the metal plates, thereby forming a striped mold. At this time, electroforming the striped mold with the laminated metal plate,
The strength may be increased by integrating the respective metal plates.
【0025】次に、厚み2.8mmの23インチサイズ
のソーダライムガラス基板上に、スクリーン印刷にてA
gを主成分とする電極ペーストを用いて幅50μmのス
トライプ状に150μmピッチで全面に形成した後、焼
成して電極付ガラス基板を作製した。Next, A was screen-printed on a 23-inch soda-lime glass substrate having a thickness of 2.8 mm.
g was formed over the entire surface at a pitch of 150 μm using an electrode paste containing g as a main component at a pitch of 150 μm, followed by firing to produce a glass substrate with electrodes.
【0026】次に、上記ストライプ状成形型の溝部に低
融点ガラス粉末とブラチール樹脂、溶媒、分散剤から成
るペースト状の隔壁形成材料を充填してから、上記電極
付ガラス基板上に加圧圧着した後、ストライプ状成形型
のみを剥離し、ガラス基板上に隔壁形成体を形成した。
このとき、隔壁形成材料と電極付ガラス基板の間に接着
剤または粘着剤を塗布しても良い。また、このとき、ス
トライプ状成形型を剥離する前に、隔壁形成材料を硬化
させておくと、隔壁形成材料を欠けなく電極付ガラス基
板上に転写することが出来る。隔壁形成材料の硬化方法
は、隔壁形成材料の樹脂成分によって、溶剤の乾燥によ
る硬化、紫外線などによる光硬化、熱硬化などが考えら
れる。Next, after filling the groove of the striped mold with a paste-like partition wall forming material comprising a low melting point glass powder, a bratyl resin, a solvent and a dispersant, pressure bonding is performed on the glass substrate with electrodes. After that, only the striped mold was peeled off to form a partition wall formed body on the glass substrate.
At this time, an adhesive or an adhesive may be applied between the partition wall forming material and the glass substrate with electrodes. At this time, if the partition wall forming material is cured before the striping mold is released, the partition wall forming material can be transferred onto the glass substrate with electrodes without any chipping. As a method of curing the partition wall forming material, curing by drying of a solvent, light curing by ultraviolet rays, heat curing, and the like are considered depending on the resin component of the partition wall forming material.
【0027】次いで、前記隔壁形成体を形成したガラス
基板を所定温度に保持して脱バインダーし、各材料主成
分により焼成雰囲気を適宜変更し、550〜580℃の
温度で10分間焼成し、高さ150μm、幅50μm、
ピッチ150μmの隔壁を形状良く形成することができ
た。Next, the glass substrate on which the partition wall forming body has been formed is debindered while maintaining the glass substrate at a predetermined temperature, and the firing atmosphere is appropriately changed according to the main components of each material. 150 μm in width, 50 μm in width,
The partition walls having a pitch of 150 μm could be formed in a good shape.
【0028】<実施例2>厚み50μmの金属板Aを3
072枚と厚み100μmの金属板Bを3073枚だけ
用意する。このとき、金属板A、Bそれぞれについて、
少なくとも一辺が長さ400mmの直線状に加工してお
く。<Embodiment 2> A metal plate A having a thickness of 50 μm
Only 073 sheets and 3073 metal plates B having a thickness of 100 μm are prepared. At this time, for each of the metal plates A and B,
At least one side is processed into a straight line having a length of 400 mm.
【0029】次に、上記金属板Aと上記金属板Bを、直
線状に加工した辺を同一方向に向けて、B,A,B,
A,B・・・という順に交互に重ね合わせる。Next, the metal plate A and the metal plate B are processed in a straight line so that the sides thereof are oriented in the same direction.
A and B are alternately superposed in this order.
【0030】上記金属板Aの直線状に加工した辺aに対
して、上記金属板Bの直線状に加工した辺bが均一に2
00μmだけ突出するようにして、金属板Aの辺aと金
属板Bの辺bを揃え、金属板間に隙間が生じないように
して固定し、ストライプ状成形型とする。このとき積層
した金属板によるストライプ状成形型に電鋳を施して、
各金属板を一体化して強度を上げても良い。With respect to the side a of the metal plate A which has been processed linearly, the side b which has been processed linearly of the metal plate B is uniformly 2.
The side a of the metal plate A and the side b of the metal plate B are aligned so as to protrude by 00 μm, and are fixed so that no gap is formed between the metal plates, thereby forming a striped mold. At this time, electroforming the striped mold with the laminated metal plate,
The strength may be increased by integrating the respective metal plates.
【0031】次に、実施例1と同様にして電極付ガラス
基板を作製し、電極付ガラス基板上にロールコータに
て、低融点ガラス粉末とブラチール樹脂、溶媒、分散剤
から成るペースト状の隔壁形成材料を膜厚100μmに
て均一に塗布する。Next, a glass substrate with electrodes was prepared in the same manner as in Example 1, and a paste-like partition wall made of low-melting glass powder, a bratyl resin, a solvent, and a dispersant was formed on the glass substrate with electrodes by a roll coater. The forming material is uniformly applied to a thickness of 100 μm.
【0032】上記ガラス基板上に塗布したリブ材料層に
前記ストライプ状成形型を加圧圧着し、隔壁形成材料層
を組成変形させてリブ形状を付与した後、ストライプ状
成形型を剥離し、ガラス基板上に隔壁形成体を形成し
た。また、このとき、ストライプ状成形型を剥離する前
に、隔壁形成材料を硬化させておくと、隔壁形成材料を
欠けなく電極付ガラス基板上に転写することが出来る。
隔壁形成材料の硬化方法は、隔壁形成材料の樹脂成分に
よって、溶剤の乾燥による硬化、紫外線などによる光硬
化、熱硬化などが考えられる。The stripe-shaped mold is press-compressed to the rib material layer applied on the glass substrate, the rib-forming material layer is deformed by composition, and the stripe-shaped mold is peeled off. A partition forming body was formed on the substrate. At this time, if the partition wall forming material is cured before the striping mold is released, the partition wall forming material can be transferred onto the glass substrate with electrodes without any chipping.
Depending on the resin component of the partition wall forming material, a method of curing the partition wall forming material may be, for example, curing by drying a solvent, light curing by ultraviolet rays or the like, thermal curing, or the like.
【0033】次いで、前記隔壁形成体を形成したガラス
基板を所定温度に保持して脱バインダーし、各材料主成
分により焼成雰囲気を適宜変更し、550〜580℃の
温度で10分間焼成し、高さ150μm、幅50μmの
隔壁をピッチ150μmにて形状良く形成することがで
きた。Next, the glass substrate on which the partition wall forming body has been formed is debindered at a predetermined temperature, and the firing atmosphere is appropriately changed according to the main components of each material. A partition having a thickness of 150 μm and a width of 50 μm could be formed with a good pitch at a pitch of 150 μm.
【0034】<実施例3>厚み50μmの金属板Aを3
072枚と厚み100μmの金属板Bを3073枚だけ
用意する。このとき、金属板A、Bそれぞれについて、
少なくとも一辺が長さ400mmの直線状に加工してお
く。<Embodiment 3> A metal plate A having a thickness of 50 μm was
Only 073 sheets and 3073 metal plates B having a thickness of 100 μm are prepared. At this time, for each of the metal plates A and B,
At least one side is processed into a straight line having a length of 400 mm.
【0035】次いで、上記金属板Aと上記金属板Bを、
直線状に加工した辺a及び辺bを同一方向に向けて、
B,A,B,A,B・・・という順に交互に重ね合わせ
る。Next, the metal plate A and the metal plate B are
The sides a and b processed in a straight line are directed in the same direction,
.. B, A, B, A, B...
【0036】上記金属板Bの直線状に加工した辺bに対
して、上記金属板Aの直線状に加工した辺aが均一に2
00μmだけ突出するようにして、金属板Aの辺aと金
属板Bの辺bを揃え、金属板間に隙間が生じないように
して固定した後、ストライプ状の溝部を覆う様にしてシ
リコンゴムを充填して硬化させる。With respect to the side b of the metal plate B which has been processed linearly, the side a which has been processed linearly of the metal plate A is uniformly 2.
The side a of the metal plate A and the side b of the metal plate B are aligned so as to protrude by 00 μm, and fixed so that no gap is formed between the metal plates. Fill and cure.
【0037】上記シリコンゴムを硬化後に金属板の積層
体より剥離し、ストライプ状成形型とする。このときの
型は、シリコンゴムに特定するものでなく、電鋳による
金属型やワックスによる型等でもかまわない。After the silicone rubber has been cured, it is peeled off from the laminate of metal plates to form a striped mold. The mold at this time is not limited to silicon rubber, and may be a metal mold by electroforming, a mold by wax, or the like.
【0038】次に、実施例1と同様にして電極付ガラス
基板を作製し、上記ストライプ状成形型の凹部にに低融
点ガラス粉末とブラチール樹脂、溶媒、分散剤から成る
ペースト状の隔壁形成材料を充填してから電極付ガラス
基板上に加圧圧着した後、ストライプ状成形型のみを剥
離し、ガラス基板上に隔壁形成体を形成した。このと
き、隔壁形成材料と電極付ガラス基板の間に接着剤また
は粘着剤を塗布しても良い。また、このとき、ストライ
プ状成形型を剥離する前に、隔壁形成材料を硬化させて
おくと、隔壁形成材料を欠けなく電極付ガラス基板上に
転写することが出来る。隔壁形成材料の硬化方法は、隔
壁形成材料の樹脂成分によって、溶剤の乾燥による硬
化、紫外線などによる光硬化、熱硬化などが考えられ
る。Next, a glass substrate with electrodes was prepared in the same manner as in Example 1, and a paste-like partition wall forming material comprising a low-melting glass powder, a bratyl resin, a solvent, and a dispersant was placed in the recesses of the striped mold. Was filled and pressed on a glass substrate with electrodes, and then only the striped mold was peeled off to form a partition wall formed body on the glass substrate. At this time, an adhesive or an adhesive may be applied between the partition wall forming material and the glass substrate with electrodes. At this time, if the partition wall forming material is cured before the striping mold is released, the partition wall forming material can be transferred onto the glass substrate with electrodes without any chipping. Depending on the resin component of the partition wall forming material, a method of curing the partition wall forming material may be, for example, curing by drying a solvent, light curing by ultraviolet rays or the like, thermal curing, or the like.
【0039】次いで、前記隔壁形成体を形成したガラス
基板を所定温度に保持して脱バインダーし、各材料主成
分により焼成雰囲気を適宜変更し、550〜580℃の
温度で10分間焼成し、高さ150μm、幅50μmの
隔壁をピッチ150μmにて形状良く形成することがで
きた。Next, the glass substrate on which the partition wall-formed body was formed was debindered while being kept at a predetermined temperature, and the firing atmosphere was appropriately changed according to the main components of each material. A partition having a thickness of 150 μm and a width of 50 μm could be formed with a good pitch at a pitch of 150 μm.
【0040】<実施例4>厚み50μmの金属円板Aを
3072枚と厚み100μmの金属円板Bを3073枚
だけ用意する。このとき、金属円板A、Bそれぞれにつ
いて中心に径の等しい穴をあけておき、且つ、金属円板
Aよりも金属円板Bの方が200μmだけ半径を大きく
しておいた。Embodiment 4 Only 3072 metal disks A having a thickness of 50 μm and 3073 metal disks B having a thickness of 100 μm are prepared. At this time, holes having the same diameter were made in the center of each of the metal disks A and B, and the radius of the metal disk B was larger than that of the metal disk A by 200 μm.
【0041】次に、上記金属板Aと上記金属板Bを、円
板の中心の穴と同じ径の丸棒に通して、B,A,B,
A,B・・・という順に交互に重ね合わせ、金属円板間
に隙間が生じぬよう固定し、ストライプ状の溝部を持つ
ロールとした。このとき積層した金属円板によるロール
に電鋳を施して、各金属板を一体化して強度を上げても
良い。Next, the metal plate A and the metal plate B are passed through a round bar having the same diameter as the hole at the center of the disk, and B, A, B,
A, B... Were alternately superimposed in this order, fixed so that no gap was formed between the metal disks, and formed into a roll having stripe-shaped grooves. At this time, the rolls of the laminated metal disks may be subjected to electroforming to integrate the respective metal plates to increase the strength.
【0042】次に、実施例1と同様にして電極付ガラス
基板を作製し、上記ロールのストライプ状の溝部にに低
融点ガラス粉末とブラチール樹脂、溶媒、分散剤から成
るペースト状の隔壁形成材料を充填してから電極付ガラ
ス基板上に回転させつつ加圧圧着し、隔壁形成材料をガ
ラス基板上に転写して隔壁形成体を形成した。このと
き、隔壁形成材料と電極付ガラス基板の間に接着剤また
は粘着剤を塗布しても良い。また、このとき、電極付ガ
ラス基板上に転写する前に、ロール上にて隔壁形成材料
を硬化させておくと、隔壁形成材料を欠けなく転写する
ことが出来る。隔壁形成材料の硬化方法は、隔壁形成材
料の樹脂成分によって、溶剤の乾燥による硬化、紫外線
などによる光硬化、熱硬化などが考えられる。Next, a glass substrate with electrodes was prepared in the same manner as in Example 1, and a paste-like partition wall forming material comprising a low-melting glass powder, a bratyl resin, a solvent, and a dispersant was formed in the stripe-shaped grooves of the roll. Was filled and pressed under pressure while rotating on a glass substrate with electrodes, and the partition wall forming material was transferred onto the glass substrate to form a partition wall forming body. At this time, an adhesive or an adhesive may be applied between the partition wall forming material and the glass substrate with electrodes. Further, at this time, if the partition wall forming material is cured on a roll before being transferred onto the glass substrate with electrodes, the partition wall forming material can be transferred without any chipping. Depending on the resin component of the partition wall forming material, a method of curing the partition wall forming material may be, for example, curing by drying a solvent, light curing by ultraviolet rays or the like, thermal curing, or the like.
【0043】次いで、前記隔壁形成体を形成したガラス
基板を所定温度に保持して脱バインダーし、各材料主成
分により焼成雰囲気を適宜変更し、550〜580℃の
温度で10分間焼成し、高さ150μm、幅50μmの
隔壁をピッチ150μmにて形状良く形成することがで
きた。Then, the glass substrate on which the above-mentioned partition wall formed body was formed was debindered while being kept at a predetermined temperature, and the firing atmosphere was appropriately changed according to the main components of each material. A partition having a thickness of 150 μm and a width of 50 μm could be formed with a good pitch at a pitch of 150 μm.
【0044】<実施例5>実施例4と同様にしてストラ
イプ状の溝部を持つロールを作製した。Example 5 A roll having stripe-shaped grooves was produced in the same manner as in Example 4.
【0045】次に、実施例1と同様にして電極付ガラス
基板を作製し、その上に低融点ガラス粉末とブラチール
樹脂、溶媒、分散剤から成るペースト状の隔壁形成材料
を膜厚100μmにて均一に塗布した。Next, a glass substrate with electrodes was prepared in the same manner as in Example 1, and a paste-like partition wall forming material comprising a low-melting glass powder, a bratyl resin, a solvent and a dispersant was formed thereon to a thickness of 100 μm. It was applied uniformly.
【0046】上記ガラス基板上に塗布したリブ材料層に
前記ロールのストライプ状の溝部を回転させつつ加圧圧
着し、隔壁形成材料層を組成変形させてリブ形状を付与
し、ガラス基板上に隔壁形成体を形成した。The rib material layer applied on the glass substrate is pressure-pressed while rotating the stripe-shaped groove portion of the roll, and the rib-shaped material is formed by compositionally deforming the partition wall forming material layer. A formed body was formed.
【0047】次いで、前記隔壁形成体を形成したガラス
基板を所定温度に保持して脱バインダーし、各材料主成
分により焼成雰囲気を適宜変更し、550〜580℃の
温度で10分間焼成し、高さ150μm、幅50μmの
隔壁をピッチ150μmにて形状良く形成することがで
きた。Next, the glass substrate on which the partition wall-formed body was formed was debindered at a predetermined temperature, and the firing atmosphere was appropriately changed according to the main components of each material, and fired at a temperature of 550 to 580 ° C. for 10 minutes. A partition having a thickness of 150 μm and a width of 50 μm could be formed with a good pitch at a pitch of 150 μm.
【0048】<実施例6>厚み50μmの金属板Aを3
072枚と、厚み80μmの金属板B1を1024枚、
厚み100μmの金属板B2を1024枚、厚み120
μmの金属板B3を1024枚だけ用意する。このと
き、金属板A、B1、B2、B3それぞれについて、少
なくとも一辺が長さ400mmの直線状に加工してお
く。<Embodiment 6> A metal plate A having a thickness of 50 μm
072 sheets and 1024 metal plates B1 having a thickness of 80 μm,
1024 metal plates B2 having a thickness of 100 μm and a thickness of 120
Only 1024 μm metal plates B3 are prepared. At this time, at least one side of each of the metal plates A, B1, B2, and B3 is processed into a linear shape having a length of 400 mm.
【0049】次いで、上記金属板A、B1、B2、B3
を、直線状に加工した辺a及び辺bを同一方向に向け
て、A,B1,A,B2,A,B3,A,B1,A・・
・という順に交互に重ね合わせる。Next, the metal plates A, B1, B2, B3
A, B1, A, B2, A, B3, A, B1, A,...
・ Lay them alternately in this order.
【0050】上記金属板Aの直線状に加工した辺aに対
して、上記金属板B1、B2、B3それぞれの直線状に
加工した辺bが均一に200μmだけ突出するようにし
て、金属板Aの辺aと金属板Bの辺bを揃え、金属板間
に隙間が生じないようにして固定し、ストライプ状成形
型とする。With respect to the side a of the metal plate A processed linearly, the side b of the metal plate B1, B2, B3 processed linearly projects uniformly by 200 μm. Side a of the metal plate B and the side b of the metal plate B are aligned and fixed so as not to form a gap between the metal plates to obtain a striped mold.
【0051】上記ストライプ状成形型を利用し、実施例
1と同様の手順で電極付ガラス基板上に隔壁を形成した
ところ、高さ150μm、幅50μmの隔壁を、ピッチ
130μm、150μm、170μmのサイクルにて形
状良く形成することができた。Using the above-mentioned stripe-shaped mold, partitions were formed on the glass substrate with electrodes in the same procedure as in Example 1. A partition having a height of 150 μm and a width of 50 μm was formed with a cycle of 130 μm, 150 μm and 170 μm in pitch. It was possible to form with good shape.
【0052】[0052]
【発明の効果】本発明によるプラズマディスプレイパネ
ルの形成方法は、上記のように、セラミックス粉体また
はガラス粉体とバインダーとの混合物を、成形型のスト
ライプ状の溝部を利用して基板上に隔壁形状を成す方式
であるため、隔壁形成材料の無駄が極めて少なく、低コ
ストで簡単な工程にて隔壁を形成することが可能であ
る。According to the method for forming a plasma display panel of the present invention, as described above, a mixture of a ceramic powder or a glass powder and a binder is formed on a substrate by using a striped groove of a molding die. Since the partitioning method is used, the partition wall forming material is extremely wasteless, and the partition walls can be formed by a low cost and simple process.
【0053】さらに本発明によるプラズマディスプレイ
パネルの背面板用の成形型は、均一な膜厚の薄板を積層
して形成するため、より微細で高アスペクト比であり、
かつ形状、精度良く、簡単に作製できる。Further, since the forming die for the back plate of the plasma display panel according to the present invention is formed by laminating thin plates having a uniform thickness, it has a finer and higher aspect ratio,
And it can be easily manufactured with good shape, high accuracy.
【0054】さらに本発明によるプラズマディスプレイ
パネルの背面板用の成形型は、成形型の作製に使用する
薄板の膜厚や積層時の段差を変更することにより、あら
ゆる幅、高さ、ピッチの隔壁の要求に簡単に対応するこ
とが可能である。Further, the mold for the back plate of the plasma display panel according to the present invention can be obtained by changing the film thickness of the thin plate used for manufacturing the mold and the step at the time of lamination so that the partition walls have any width, height and pitch. Can be easily responded to.
【図1】実施例1の概略図(断面図)FIG. 1 is a schematic diagram (cross-sectional view) of a first embodiment.
【図2】実施例1の概略図(断面図)FIG. 2 is a schematic diagram (cross-sectional view) of the first embodiment.
【図3】実施例1の概略図(断面図)FIG. 3 is a schematic diagram (cross-sectional view) of the first embodiment.
【図4】実施例1の概略図(断面図)FIG. 4 is a schematic diagram (cross-sectional view) of the first embodiment.
【図5】実施例2の概略図(断面図)FIG. 5 is a schematic diagram (cross-sectional view) of the second embodiment.
【図6】実施例2の概略図(断面図)FIG. 6 is a schematic diagram (cross-sectional view) of the second embodiment.
【図7】実施例2の概略図(断面図)FIG. 7 is a schematic diagram (cross-sectional view) of the second embodiment.
【図8】実施例2の概略図(断面図)FIG. 8 is a schematic diagram (cross-sectional view) of the second embodiment.
【図9】実施例3の概略図(断面図)FIG. 9 is a schematic diagram (cross-sectional view) of the third embodiment.
【図10】実施例3の概略図(断面図)FIG. 10 is a schematic diagram (cross-sectional view) of Embodiment 3.
【図11】実施例3の概略図(断面図)FIG. 11 is a schematic diagram (cross-sectional view) of a third embodiment.
【図12】実施例3の概略図(断面図)FIG. 12 is a schematic diagram (cross-sectional view) of the third embodiment.
【図13】実施例3の概略図(断面図)FIG. 13 is a schematic diagram (cross-sectional view) of the third embodiment.
【図14】実施例3の概略図(断面図)FIG. 14 is a schematic diagram (cross-sectional view) of the third embodiment.
【図15】実施例4の概略図FIG. 15 is a schematic diagram of Example 4.
【図16】実施例4の概略図FIG. 16 is a schematic diagram of Example 4.
【図17】実施例5の概略図FIG. 17 is a schematic diagram of a fifth embodiment.
【図18】実施例6の概略図FIG. 18 is a schematic diagram of Embodiment 6.
1・・・金属板A 2・・・金属板B 3・・・辺a 4・・・辺b 5・・・隔壁形成材料 6・・・電極 7・・・ガラス基板 8・・・シリコンゴム 9・・・金属円板A 10・・・金属円板B 11・・・円棒 12・・・金属板B1 13・・・金属板B2 14・・・金属板B3 DESCRIPTION OF SYMBOLS 1 ... Metal plate A 2 ... Metal plate B 3 ... Side a4 ... Side b5 ... Partition wall forming material 6 ... Electrode 7 ... Glass substrate 8 ... Silicon rubber 9 ... Metal disk A 10 ... Metal disk B 11 ... Circular bar 12 ... Metal plate B1 13 ... Metal plate B2 14 ... Metal plate B3
Claims (9)
厚みを持つ板Bの2種類の板を交互に積層し、且つ、板
Bを板Aよりも隔壁の高さ分だけ均一に突出させること
によって出来るストライプ状の溝部によるプラズマディ
スプレイパネル背面板用の成形型。1. A plate A having the same thickness as the partition and a plate B having a thickness equal to the cell width are alternately laminated, and the plate B is more uniform than the plate A by the height of the partition. Molding for back panel of plasma display panel by stripe-shaped grooves that can be made to protrude.
ガラス粉体とバインダーとの混合物を充填し、セラミッ
クス又はガラスからなる基板上に当接して、基板上に隔
壁を形成することを特徴とするプラズマディスプレイパ
ネルの背面板形成方法。2. The method according to claim 1, wherein the mold is filled with a mixture of a ceramic powder or a glass powder and a binder, and is brought into contact with a substrate made of ceramic or glass to form a partition on the substrate. A method for forming a back plate of a plasma display panel.
塗布したセラミックス粉体又はガラス粉体とバインダー
との混合物に、請求項1の成形型を加圧させつつ密着さ
せて、基板上に隔壁を形成することを特徴とするプラズ
マディスプレイパネルの背面板形成方法。3. A partition is formed on a substrate made of ceramic or glass by pressing the mold of claim 1 onto a mixture of a ceramic powder or glass powder and a binder applied on a substrate made of ceramic or glass while applying pressure. A method for forming a back plate of a plasma display panel.
厚みを持つ板Bの2種類の板を交互に積層し、且つ、板
Aを板Bよりも隔壁の高さ分だけ均一に突出させること
によって出来るストライプ状の溝部を、電鋳、樹脂、ワ
ックス等によって反転複製して得られるプラズマディス
プレイの背面板用の成形型。4. A plate A having the same thickness as the partition walls and a plate B having the same thickness as the cell width are alternately laminated, and the plate A is more uniform than the plate B by the height of the partition walls. A mold for the back plate of a plasma display, which is obtained by inverting and duplicating a stripe-shaped groove formed by projecting into a groove by electroforming, resin, wax or the like.
ガラス粉体とバインダーとの混合物を充填し、セラミッ
クス又はガラスからなる基板上に当接して、隔壁を形成
することを特徴とするプラズマディスプレイパネルの背
面板形成方法。5. The plasma as claimed in claim 4, wherein said mold is filled with a mixture of ceramic powder or glass powder and a binder, and is brought into contact with a substrate made of ceramic or glass to form partition walls. A method of forming a rear panel of a display panel.
じ厚みを持ち且つ隔壁の高さ分だけ円板Aよりも半径が
短い円板Bの2種類の円板を、円板A及び円板Bの中心
を合わせて交互に積層することによって出来る円筒状の
ストライプ状の溝部をもつプラズマディスプレイパネル
の背面板用の成形型。6. A disk A having the same thickness as the partition wall and a disk B having the same thickness as the cell width and having a radius shorter than the disk A by the height of the partition wall. A mold for a back plate of a plasma display panel having a cylindrical stripe-shaped groove formed by alternately stacking the centers of A and B in alignment.
ガラス粉体とバインダーとの混合物を充填し、セラミッ
クス又はガラスからなる基板上に前記円筒を当接させ回
転させて、基板上に隔壁を形成することを特徴とするプ
ラズマディスプレイパネルの背面板形成方法。7. A molding tool according to claim 6, which is filled with a mixture of ceramic powder or glass powder and a binder, and said cylinder is brought into contact with a substrate made of ceramic or glass and rotated to form a partition on the substrate. Forming a back plate of a plasma display panel.
塗布したセラミックス粉体又はガラス粉体とバインダー
との混合物に、請求項6の成形型を加圧させつつ回転さ
せて、基板上に隔壁を形成することを特徴とするプラズ
マディスプレイパネルの背面板形成方法。8. A partition formed on a substrate made of ceramics or glass by rotating the molding die of claim 6 on a mixture of a ceramic powder or glass powder and a binder applied on a substrate made of ceramics or glass while applying pressure. A method for forming a back plate of a plasma display panel.
板Bの厚みを少なくとも2種類以上を使用することを特
徴とするプラズマディスプレイパネルの背面板用の成形
型。9. The method according to claim 1, 4 or 6,
A mold for a back plate of a plasma display panel, wherein at least two types of the plate B are used.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP16373799A JP2000353468A (en) | 1999-06-10 | 1999-06-10 | Forming die for plasma display panel back plate and forming method of back plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16373799A JP2000353468A (en) | 1999-06-10 | 1999-06-10 | Forming die for plasma display panel back plate and forming method of back plate |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2000353468A true JP2000353468A (en) | 2000-12-19 |
Family
ID=15779726
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16373799A Pending JP2000353468A (en) | 1999-06-10 | 1999-06-10 | Forming die for plasma display panel back plate and forming method of back plate |
Country Status (1)
Country | Link |
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JP (1) | JP2000353468A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030017246A (en) * | 2001-08-24 | 2003-03-03 | 주식회사 유피디 | Fabrication method of soft mold for barrier rib in plasma display panel and method of forming barrier rib using the soft mold |
KR20030017244A (en) * | 2001-08-24 | 2003-03-03 | 주식회사 유피디 | Fabrication method of rolling mold for barrier rib in plasma display panel and method of forming barrier rib using the mold |
WO2023142166A1 (en) * | 2022-01-26 | 2023-08-03 | 武汉华星光电技术有限公司 | Display module and display device |
-
1999
- 1999-06-10 JP JP16373799A patent/JP2000353468A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030017246A (en) * | 2001-08-24 | 2003-03-03 | 주식회사 유피디 | Fabrication method of soft mold for barrier rib in plasma display panel and method of forming barrier rib using the soft mold |
KR20030017244A (en) * | 2001-08-24 | 2003-03-03 | 주식회사 유피디 | Fabrication method of rolling mold for barrier rib in plasma display panel and method of forming barrier rib using the mold |
WO2023142166A1 (en) * | 2022-01-26 | 2023-08-03 | 武汉华星光电技术有限公司 | Display module and display device |
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