JP3577116B2 - Circuit board support structure for electronic equipment - Google Patents

Description

[0001]
[Industrial applications]
The present invention relates to a circuit board support structure of an electronic device, and more particularly, to a circuit board support structure of an electronic device that can efficiently radiate heat generated from a heat-generating component such as a power supply IC.
[0002]
[Prior art]
As shown in FIG. 3, a circuit board 30 usually incorporated in an electronic device is attached to a chassis 31 with screws 33 via a plurality of spacers 32, and is thereby arranged at a predetermined interval from the chassis 31. Often. When a heat-generating component, for example, a power supply IC 34 is mounted on the circuit board 30, the power supply IC 34 is screwed to a heat radiating plate 35, thereby radiating heat generated in the power supply IC 34. .
[0003]
[Problems to be solved by the invention]
The size of the heat radiating plate 35 is selected so as to match the expected heat value of the heat generating component. Therefore, a large heat radiating plate 35 is required for a heat-generating component having a large heat generation. There was a problem that could not be done.
[0004]
Further, in order to dispose the circuit board 30 at a predetermined distance from the chassis 31, a plurality of spacers 32 and screws 33 are required, so that the number of parts is increased and the assembling process is complicated. There was also a problem that the cost was high. The present invention has been made to solve such a conventional problem, and an object of the present invention is to provide a circuit board support structure for an electronic device that can improve the heat radiation efficiency of a heat-generating component and reduce the assembly cost. It is in.
[0005]
[Means for Solving the Problems]
To achieve the above object, the present onset Ming, in the circuit board support structure of an electronic device you support at a predetermined distance from the chassis of an electronic device to a circuit board which heat generating component is mounted in an upright state, the A rising part cut from a part of the chassis at a substantially right angle in a direction supporting the circuit board and having a fitting groove into which one side of the circuit board is fitted, and another side facing the one side of the circuit board A fixing member having thermal conductivity that supports a side of the fixing member at a predetermined interval with respect to the chassis, the fixing member includes a substantially band-shaped fixing portion fixed to the chassis, and both ends in a longitudinal direction of the fixing portion. a pair of left and right receiving portions for supporting at a predetermined distance from the substantially L-shaped bent the circuit the chassis of the substrate from the parts one from the widthwise end portion of the fixed portion of the heat generating component A fin that is raised so as to contact the surface of the fin, and a band-shaped pressing member that has one end locked to the fin and the other end screwed to hold the heating component between the fin and the fin. It is characterized in that it comprises a.
[0006]
In this case, as a structure for inserting and positioning one side of the circuit board in the rising portion, a guide rail having a substantially concave cross section is provided in the rising portion, and one side of the circuit board is inserted into the groove of the guide rail. Or a structure in which one side of a circuit board formed in a convex or key shape into a through hole formed in the surface of the rising portion is inserted. Further, as the material of the fixing member, aluminum or the like can be adopted, and the fixing member may be formed in a desired shape by sheet metal processing or the like.
[0007]
[Action]
According to the present invention , one side of the circuit board is positioned at the rising portion, and the end opposite to the one side is fixed to the fixing member. Therefore, in order to place at predetermined intervals to the circuit board from the chassis, a plurality of spacers, such as in the prior art becomes unnecessary, so that the possible small number of screws.
[0008]
Further, since the heat generation components are sandwiched and the fin and the pressing member, with a surface abutting on the fin can be maintained reliably, heat transfer to the fixing member is performed from a plurality of locations, heat conduction to the fixed member Can be performed efficiently.
[0009]
Further, since the pressing member has one end locked to the fin and the other end screwed, the mounting member can be easily attached to and detached from the fixing member, and a plurality of heat dissipating components can be pressed collectively against the fin. . Therefore, it is possible to further promote the improvement of the heat radiation efficiency and the reduction of the number of parts, and the above-mentioned object is achieved.
[0010]
【Example】
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows an embodiment according to the present invention.
[0011]
The circuit board support structure 10 of the electronic device according to the present embodiment has a circuit board 12 on which two power supply ICs 11 as heat-generating components are mounted at a predetermined distance from a chassis 13 inside an electronic device such as a measuring instrument. It is open and supported. The circuit board 12 has one side 12A positioned on a rising portion 14 formed on the chassis, and an end 12B opposite to the one side 12A supported by a fixing member 15 attached to the chassis.
[0012]
The rising portion 14 has a part of the chassis 13 cut up and raised toward the circuit board 12, that is, upward in the drawing, and a guide rail 16 is attached to the upper portion thereof. The guide rail 16 is formed in a substantially concave cross section having a groove 16A having a width dimension corresponding to the thickness dimension of the circuit board 12. The guide rail 16 is formed of a hard resin or the like, and is fixed to the rising portion 14 by press-fitting a boss 16B.
[0013]
Fixing member 15 includes a substantially band shape of the fixing portion 18 which screws 17 passing through the chassis 1 3 is fixed to the chassis 12 by being screwed into a substantially L-shaped longitudinal ends of the fixed part 18 The circuit board 12 has a pair of bent receiving portions 19 and fins 20 that stand on the side of the circuit board 12 on which the power supply IC 11 is mounted, from the widthwise ends of the fixing portion 18.
[0014]
The receiving portions 19 are provided with press nuts (not shown) on the respective back surfaces (surfaces on the chassis 13 side), and screws 21 that penetrate the circuit board 12 are screwed into these press nuts. Supports the end 12B of the circuit board 12. The fin 20 is bent in a substantially crank shape in cross section, and a band-shaped pressing member 22 for bringing the power supply IC 11 into surface contact with the fin 20 is attached.
[0015]
The pressing member 22 is provided with a locking portion 23 bent at a substantially crank shape at one end 22A, and a contact portion 24 bent at a substantially L shape at the other end 22B. The bent length of the abutting portion 24 is set slightly shorter than the thickness of the power supply IC 11. One end 22A of the pressing member 22 is locked by inserting the locking portion 23 into an insertion hole 25 formed in the fin 20, and the other end 22B is screwed by a screw 26 passing through the fin 20. You. Then, the two power supply ICs 11 are held by the fin 20 and the pressing member 22 described above, so that the two power supply ICs 11 come into contact with the fin 20 at once.
[0016]
At this time, when the screw 26 is excessively tightened, the pressing member 22 maintains the distance between the fin 20 and the fin 20 at a predetermined size by the abutting portion 24 of the other end 22B, thereby crushing the two power supply ICs 11. There is no fear. In such a fixing member 15, a fixing portion 18, a receiving portion 19, and a fin 20 are integrally formed by sheet metal processing of, for example, an aluminum plate having thermal conductivity.
[0017]
According to the present embodiment as described above, since the power supply IC 11, which is a heat-generating component, comes into surface contact with the fin 20, the heat is radiated from the chassis 13 via the fixing member 15. That is, the heat generated in the power supply IC 11 can be efficiently radiated by the sufficient heat radiation surface, and the risk of overheating can be reduced.
[0018]
Further, since the circuit board 12 has one side 12A positioned at the rising portion 14 and the end 12B fixed to the fixing member 15, a plurality of spacers as in the related art are arranged at a predetermined interval from the chassis 13. It is not necessary and the number of screws can be reduced as compared with the conventional case. Therefore, the number of components can be reduced, the assembly process can be simplified, and the cost of assembling the electronic device can be reduced.
[0019]
The fixing member 15 can be easily manufactured because the fixing portion 18, the receiving portion 19, and the fin 20 are integrally formed by sheet metal working, and the cost of parts can be reduced. Further, since the power supply IC 11 is sandwiched between the fins 20 and the pressing members 22, the surface contact with the fins 20 can be reliably maintained, and heat conduction to the fixing member 15 can be performed from a plurality of locations. Therefore, heat generated from the power supply IC 11 can be efficiently conducted to the fixing member 15.
[0020]
Further, the pressing member 22 has one end 22A locked to the fin 20 and the other end 22B screwed, so that the pressing member 22 can be easily attached to and detached from the fixing member 15. The pressing member 22 can simultaneously press the two power supply ICs 11 against the fins 20, so that the number of components for fixing the power supply IC can be reduced as compared with the related art.
[0021]
Since the bending length of the abutting portion 24 of the other end 22B is set slightly shorter than the thickness dimension of the power supply IC 11, the pressing member 22 has the other end 22B when the screw 26 is excessively tightened. The abutment portion 24 maintains the distance between the fin 20 and the fin 20 at a predetermined size, thereby preventing the two power supply ICs 11 from being crushed. Further, since the guide rails 16 are provided on the rising portion 14, the one side 12A of the circuit board 12 can be reliably positioned.
[0022]
It should be noted that the present invention is not limited to the above-described embodiment, and improvements, modifications, and the like within a range in which the present invention can be achieved are included in the present invention. For example, in the above-described embodiment, the guide rail 16 is provided on the rising portion 14, but the guide rail 16 is not essential to the present invention and may be omitted as appropriate. In other words, as a structure for positioning one side 12A of the circuit board 12 on the rising portion 14, as shown in FIG. Alternatively, a structure for inserting the convex portion 12C (see FIG. 2A) or the key portion 12D (see FIG. 2B) may be used.
[0023]
The fins do not need to have the shape illustrated in the above-described embodiment, but may be formed in an appropriate shape corresponding to a mounting form of a heat-generating component such as a power supply IC mounted on a circuit board. Further, in this embodiment, the power supply IC is illustrated as the heat-generating component. However, the present invention can be applied to a case where a heat-generating component other than the power supply IC is mounted on the circuit board. In addition, the shape, size, form, number, location, etc. of the circuit board, the chassis, the rising portion, the fixing member, the fin, the pressing member, etc. shown in the above embodiment are arbitrary as long as the present invention can be achieved. Not limited.
[0024]
【The invention's effect】
According to the onset Ming, heat from the heating part to be released from the chassis via the fixing member, thereby improving the heat radiation efficiency. Also, can a small number of the number of parts than conventional when mounting the circuit board to the chassis, Ru can be reduced assembly cost of the electronic device.
[Brief description of the drawings]
FIG. 1 is an overall perspective view showing one embodiment of the present invention.
FIG. 2 is a perspective view of a main part showing a modification of the present invention.
FIG. 3 is a side view and a front view showing a conventional circuit board support structure.
[Explanation of symbols]
10 Circuit board support structure for electronic equipment 11 Power supply IC as heat-generating component
12 Circuit board 13 Chassis 14 Rise 15 Fixing member 18 Fixing portion 19 Receiving portion 20 Fin 22 Pressing member

Claims (1)

In the heat generating component is a circuit board support structure of an electronic device you support at a predetermined interval a circuit board is mounted in an upright state with respect to the chassis of the electronic device,
A rising portion cut and raised from a portion of the chassis at a substantially right angle in a direction supporting the circuit board and having a fitting groove into which one side of the circuit board is fitted, and another facing the one side of the circuit board. A fixing member having thermal conductivity that supports the sides at a predetermined interval with respect to the chassis,
The fixing member has a substantially band-shaped fixing portion fixed to the chassis, and left and right sides which are bent substantially L-shaped from both ends in the longitudinal direction of the fixing portion to support the circuit board at a predetermined interval with respect to the chassis. A pair of receiving portions, a fin raised from the widthwise end of the fixing portion to abut on one surface of the heat-generating component, one end of the fin is locked to the fin, and the other end is a screw. A circuit-board supporting structure for an electronic device , comprising: a band-shaped pressing member that holds the heating component between the fin and the fin .

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