JP3567644B2 - Coordinate detection order determination device for wire bonder - Google Patents

Coordinate detection order determination device for wire bonder Download PDF

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JP3567644B2
JP3567644B2 JP25306796A JP25306796A JP3567644B2 JP 3567644 B2 JP3567644 B2 JP 3567644B2 JP 25306796 A JP25306796 A JP 25306796A JP 25306796 A JP25306796 A JP 25306796A JP 3567644 B2 JP3567644 B2 JP 3567644B2
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coordinate detection
order
detection
detection order
coordinate
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JPH1098067A (en
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都志也 平井
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Sony Corp
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Sony Corp
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Description

【０００１】
【発明の属する技術分野】
本発明はワイヤボンダーの座標検出順序決定装置に関するものであり、更に詳しくはワイヤボンダーにセットされる半導体チップおよびリード端子の位置を確定させてワイヤボンディングする場合の半導体チップおよびリード端子の座標検出順序を決定する装置に関するものである。
【０００２】
【従来の技術】
半導体素子（以降、半導体チップとリード端子とをワイヤボンディングしたものを称する）の製造工程では、リードフレームに半導体チップをマウントした後、半導体チップ上の電極パッドとリードフレームのインナーリードの端子とが金線やアルミニウム線等のボンディングワイヤで接続される。この配線作業を行なうワイヤボンダー（専用装置のほか他の装置に組み込まれた兼用装置を含む）においては、その作業テーブル上におおまかにセットされるリードフレームのリード端子に設けた検出点と、リードフレーム上の半導体チップに設けた検出点との座標を座標検出用カメラが順に移動して座標検出し、予め設定された検出点の座標値と比較して、半導体チップおよびリード端子の位置、回転状態を認識し、ワイヤボンディングを実施するボンド点の座標値に修正をかけることが行なわれている。
【０００３】
【発明が解決しようとする課題】
座標検出用カメラとワイヤボンディングが行なわれるワイヤ保持部とはワイヤボンダーのボンディングヘッドに取り付けられているが、そのボンディングヘッドの移動距離を短くしワイヤボンディングを効率よく実施するための、上記の座標検出用カメラによるリード端子の単数または複数の検出点、および半導体チップの単数または複数の検出点の検出順序、リード端子またはこれと対になる半導体チップ上の電極パッドの中からボンディングを開始させるべき先頭ボンド点や配線順序は、製造される半導体素子の品種によって異なり、上記の各項目は熟練した作業者によって決定されている。
【０００４】
しかし、ワイヤボンディングの効率を支配する要因は上述のように多く複雑であり人為的ミスを発生しやすいこと、またボンディングヘッドの移動距離の算出においても座標検出用カメラとワイヤ保持部との間隔が考慮されていないことなどのために、ボンディングヘッドの移動距離を不必要に増大させる場合があり、ワイヤボンディング工程のタクトタイムを長時間化し、その生産性を低下させている。
【０００５】
【課題を解決するための手段】
本発明は、座標検出用カメラによるリード端子の検出点および半導体チップの検出点の座標検出順序によるボンディングヘッドの移動および最終の座標検出位置からボンディングを開始する先頭ボンド点までのボンディングヘッドの移動の移動距離を算出する手段と、座標検出順序を組み替える手段と、ボンディングヘッドの移動距離が最も短くなるように座標検出順序を決定する手段とを備えた座標検出順序決定装置によって、ボンディングヘッドの移動距離を最短化させ、ワイヤボンディングの効率を向上させるようにしている。これによって、従来は熟練者の手で決定された座標検出順序により、時として発生することのあったボンディングヘッドの無駄な動きが解消される。
【０００６】
【発明の実施の形態】
本発明の実施の形態によるワイヤボンダーの座標検出順序決定装置について、以下、図面を参照し具体的に説明する。
【０００７】
図１は座標検出対象の一例としての半導体チップおよびリード端子の要部を示す平面図である。図１において、半導体チップ１の四辺の周縁部にはそれぞれ複数の電極パッド４が配列されており、４か所のコーナー部のうちの２か所には画像認識による座標検出用カメラの検出点となるコーナーセル２が設けられている。また、半導体チップ１の四辺の周辺部には電極パッド４に対となる複数のリード端子３が配置されており、その中で半導体チップ１のコーナーセル２に最も近いリード端子３には同じく画像認識による座標検出用カメラの検出点となる突起部６が設けられている。すなわち、リード端子３の検出点として突起部６が２か所、半導体チップ１の検出点としてコーナーセル２が２か所の計４か所に検出点が設けられている。また、半導体チップ１の四辺の周縁部の電極パッド４の列において、各列の両端の電極パッド４、換言すれば、半導体チップ１のコーナー部の近傍に存在する計８個の電極パッド４がワイヤボンディングの開始される先頭ボンド点の候補、すなわち、先頭ボンド点候補５となる。
【０００８】
ワイヤボンダーではワイヤボンディングに先立って、ボンディングヘッドに取り付けられた座標検出用カメラが上記の４か所の検出点を順に移動して、作業テーブル上に置かれたリードフレームのリード端子３とリードフレームにマウントされた半導体チップ１との位置、回転状態を認識し、次いでワイヤ保持部が半導体チップ１上の各電極パッド４と、これに対となる各リード端子３とをワイヤボンディングしていくが、図２はそのボンディングヘッド２０を示し、図２のＡは平面図、図２のＢは側面図である。図２に示すように、座標検出用カメラ２１とワイヤ保持部２２とは間隔Ｄをあけて取り付けられている。そして一般的には、この間隔Ｄは半導体チップ１の一辺の長さｄよりは若干大きく、Ｄ＞ｄのように設定される。また、ボンディングヘッド２０は座標検出時には座標検出用カメラ２１を主体として移動し、ワイヤボンディング時にはワイヤ保持部２２を主体として移動するようになっている。
【０００９】
図３は座標検出用カメラ２１が図１に示すリード端子３の検出点である突起部６、半導体チップ１の検出点であるコーナーセル２の何れかを第１検出点として順に移動してそれらの座標を検出し、最終の検出位置からワイヤ保持部２２が先頭ボンド点候補５の何れかへ至るまでのボンディングヘッド２０の移動距離を最も短くするための座標検出順序決定装置１０の機能構成を示すブロック図である。すなわち、座標検出順序決定装置１０は、既知の情報を入力しておくデバイス情報入力部１１、予め設定される座標検出順序を組み替える検出順序操作部１２、座標検出順序に従ってボンディングヘッド２０が移動する場合の移動距離を算出する移動距離算出部１３、移動距離が最も短くなるように座標検出順序および先頭ボンド点を決定する検出順序決定部１４、ワイヤボンディングの順序すなわち配線の順序を決定する配線順序決定部１５、および先頭ボンド点となるべき候補を抽出し選定する先頭ボンド点候補選定部１６から構成されている。
【００１０】
デバイス情報入力部１１は予め設定する座標検出順序、リード端子１３の検出点である突起部６および半導体チップ１の検出点であるコーナーセル２の座標値、電極パッド４の座標値（例えば中心点の座標値であり、そのほかコーナーの座標値など種々の座標値が採用される）、ボンディングヘッド２０における座標検出用カメラ２１とワイヤ保持部２２との間隔Ｄなどが入力される。これらのデバイス情報は記憶媒体、例えばフロッピーディスク等に格納して提供され、その記憶情報はフロッピーディスクドライブ等で読み取られて入力される。
【００１１】
検出順序操作部１２は検出点である２か所の突起部６、２か所のコーナーセル２をそれぞれ検出の開始点、すなわち第１検出点として座標検出する場合の検出順序を順次設定する。すなわち、４か所の検出点の順列の数（４の階乗の値）に相当する検出順序を順次設定する。
【００１２】
移動距離算出部１３はデバイス情報入力部１１から得られる予め設定された座標検出順序に従ってボンディングヘッド２０が移動する場合の移動距離、および検出順序操作部１２で設定される座標検出順序に従ってボンディングヘッド２０が移動する場合の移動距離を後述するように算出する。この移動距離には座標検出用カメラ２１が最終検出点にある位置からワイヤ保持部２２が先頭ボンド点候補５まで移動する距離も含まれる。移動距離の算出に際しては、デバイス情報入力部１１から得られる各検出点の座標、およびボンディングヘッド２０における座標検出用カメラ２１とワイヤ保持部２２との間隔Ｄが使用される。
【００１３】
検出順序決定部１４はデバイス情報入力部１１から得られる予め設定された座標検出順序に従って検出する場合と、検出順序操作部１２で順次設定される座標検出順序に従って検出する場合とについて、移動距離算出部１３で算出されるボンディングヘッド２０の移動距離が最も短くなるように座標検出順序と先頭ボンド点とを決定する。
【００１４】
配線順序決定部１５は検出順序決定部１４で決定される先頭ボンド点、すなわち、座標検出後に最初にワイヤボンディングされる電極パッド４を起点として、当該電極パッド４が含まれる電極パッド４の列から順に他の電極パッド４の列にワイヤボンディングが行なわれるように配線順序を決定する。
【００１５】
先頭ボンド点候補選定部１６はワイヤボンディングを開始する先頭ボンド点の候補として各電極パッド４の列の両端の計８個の電極パッド４を取り出す。
【００１６】
次ぎに、上記の座標検出順序決定装置１０の作用、すなわち処理手順について、図４のフローチャートを参照し説明する。
【００１７】
（ステップ１）予め設定される座標検出順序、リード端子３の検出点である突起部６の座標値、半導体チップ１の検出点であるコーナーセル２の座標値、電極パッド４の座標値、ボンディングヘッド２０における座標検出用カメラ２１とワイヤ保持部２２との間隔Ｄなどがデバイス情報入力部１１へ入力される。
【００１８】
（ステップ２）先頭ボンド点候補選定部１６において半導体チップ１の周縁部の各電極パッド４の列の両端に位置する計８個の電極パッド４を先頭ボンド点候補５として選び、それらの座標値を取り出す。
【００１９】
（ステップ３）予め設定された座標検出順序に基づいて座標検出用カメラ２１が検出の開始点から全ての検出点を順に移動して最終の検出点にある位置からワイヤ保持部２２が先頭ボンド点候補５まで移動する場合のボンディングヘッド２０の移動距離が移動距離算出部１３において算出される。
【００２０】
この算出について、図５、図６を参照して具体的に説明する。図５に示す半導体チップ１とリード端子３について、座標検出用カメラ２１がリード端子３の検出点Ｐ３、半導体チップ１の検出点Ｐ１およびＰ２、次いでリード端子３の検出点Ｐ４をこの順に検出した後、検出点Ｐ４が属するリード端子３と対をなす電極パッド４を先頭ボンド点Ｐ５としてワイヤボンディングを開始すると仮定した場合の、図２に示したボンディングヘッド２０の移動の軌跡を図６に示す。前述したように、ボンディングヘッド２０は座標検出時には座標検出用カメラ２１を主体として移動し、ワイヤボンディング時にはワイヤ保持部２２を主体として移動する。すなわち、ボンディングヘッド２０は座標検出用カメラ２１が主体となって検出点Ｐ３からＰ１、Ｐ２を経由してＰ４に至ると、その位置からはワイヤ保持部２２が主体となって先頭ボンド点Ｐ５へ移動するようになっている。その時の座標検出用カメラ２１の移動の軌跡を細線で示し、ワイヤ保持部２２の移動の軌跡を破線で示した。なお、従来はボンディングヘッド２０の移動距離を求めるに際して、座標検出用カメラ２１とワイヤ保持部２２との間隔Ｄを考慮せず、ボンディングヘッド２０がＰ３からＰ１、Ｐ２、Ｐ４を経てＰ５へ移動するとしていた。換言すれば、座標検出用カメラ２１がＰ４から、白抜き矢印で示すように、Ｐ５へ移動するような移動距離の算出が行なわれており、実際の移動距離とは異なる値が使用されていたことになる。
【００２１】
本実施の形態の移動距離算出部１３では、同様にボンディングヘッド２０の移動を座標検出用カメラ２１の移動として算出するが、Ｐ５の座標を図５において、Ｙ軸の負方向に距離Ｄだけ移動させた地点Ｐ５’にあるものとして補正しボンディングヘッド２０の移動距離を算出するようにしている。
【００２２】
（ステップ４）予め設定された座標検出順序による場合の（ステップ３）によるボンディングヘッド２０の移動距離を先ず最短移動距離と仮決定し、検出順序操作部１２で順次設定される座標検出順序による場合のボンディングヘッド２０の移動距離との長短を比較判定し、検出順序操作部１２で設定される座標検出順序による移動距離の方が長い場合には（ステップ６）へ進み、短い場合には（ステップ５）へ進む。
【００２３】
（ステップ５）予め設定された座標検出順序よりも検出順序操作部１２で設定された座標検出順序の方がボンディングヘッド２０の移動距離が短いと（ステップ４）において判定された場合、その検出順序による短い移動距離を最短移動距離量として仮決定し、最短移動距離の書き換えを行なう。
【００２４】
（ステップ６）ボンディングヘッド２０の移動距離が最短であると仮決定されている検出順序に対して、可能な検出順序によるボンディングヘッド２０の移動距離の比較が完了するまでは、（ステップ７）へ進むように判断され、すべての検出順序の比較の完了が確認されると（ステップ８）へ進む。
【００２５】
（ステップ７）座標検出は何れの検出点から開始してもよいので検出順序は検出点の数の階乗の値だけ存在し、先頭ボンド点候補も各電極パッド４の列の両端、すなわち計８点存在するが、これらの組み合わせの全てが検出順序操作部１２によって順次設定されて（ステップ３）から（ステップ５）の処理が繰り返され移動距離の算出と長短の比較が行なわれる。
【００２６】
なお、電極パッド４の列の両端の電極パッド４を先頭ボンド点候補とする以外に、全ての電極パッド４を先頭ボンド点候補としてボンディングヘッド２０の移動距離を最短にする検出順序を決定してもよいが、前述したように一般にボンディングヘッド２０における座標検出用カメラ２１とワイヤ保持部２２との間隔Ｄと半導体チップ１の一辺の幅ｄとの間には、Ｄ＞ｄの関係があるので、電極パッド４の列の両端の計８個の電極パッド４を先頭ボンド点候補として算出すれば確実に最短の移動距離を求めることが可能である。また、電極パッド４の列の中ほどからワイヤボンディングを開始すると、一つの電極パッド４の列から次ぎの電極パッド４の列への移動が１回増えるので結果的にボンディングヘッド２０の移動距離の増加を招くことになる。従って、本実施の形態においては、電極パッド４の列の両端の電極パッド４を先頭ボンド点候補としている。
【００２７】
（ステップ８）仮決定されている最短移動距離に対して、他の全ての検出順序の移動距離の比較が完了し、（ステップ６）においてボンディングヘッド２０の移動距離が最も短くなる座標検出順序と先頭ボンド点とが決定されると、その先頭ボンド点を起点とし、その先頭ボンド点が含まれる電極パッド４の列から他の電極パッド４の列へ順にワイヤボンディングが行なわれるように、配線順序決定部１５にて配線順序を決定して一連の処理が終了する。
【００２８】
すなわち、本実施の形態による座標検出決定装置１０は、先頭ボンド点候補選定部１６において全ての先頭ボンド点候補の抽出選定を行ない、検出順序操作部１２において可能なあらゆる座標検出順序を順次設定し、移動距離算出部１３では座標検出用カメラ２１が全ての検出点を移動し、かつ座標検出を完了した位置からワイヤ保持部２２が先頭ボンド点へ移動するボンディングヘッド２０の移動距離を算出し、検出順序決定部１４において当該移動距離が最短となる検出順序と先頭ボンド点を決定し、配線順序決定部１５において電極パッド４とリード端子３との間のワイヤボンディングが先頭ボンド点の含まれる電極パッドの列から順に他の電極パッドの列へ行われるように配線順序を決定するようになっているので、従来のように、熟練した作業者の技量に頼ることなく、ボンディングヘッド２０の移動距離を最短にする座標検出順序、およびそれに続く先頭ボンド点と配線順序を決定することができる。その結果、ボンディングヘッド２０の移動が合理化され移動距離が短くなる分だけワイヤボンディングのタクトタイムが短縮される。
【００２９】
以上、本発明の実施の形態について説明したが、勿論、本発明はこれに限られることなく、本発明の技術的精神に基づいて種々の変形が可能である。
【００３０】
例えば、本実施の形態においては、図１に示したように、半導体チップ１の四辺の周縁部に電極パッド４が各１列に形成されている場合を取り上げたが、集積度が向上した半導体チップであって、電極パッド列が各２列以上で構成されるような場合にも、本発明の座標検出順序決定装置は適用され得る。
【００３１】
また本実施の形態においては、予め座標検出順序を設定し、その場合のボンディングヘッド２０の移動距離を先ず最短移動距離と仮決定する例を説明したが、検出順序操作部１２で順次設定される検出順序のなかには予め設定される検出順序も含まれるので、検出順序を予め設定せず、検出順序操作部１２で最初に設定される検出順序による移動距離を先ず最短移動距離と仮決定するようにしてもよい。
【００３２】
また本実施の形態においては、本発明の座標検出順序決定装置１０内に先頭ボンド点候補選定部１６を一体的に組み込んだが、先頭ボンド点を固定しておき、その条件下にボンディングヘッド２０の移動距離が最短となるような検出順序を決定する座標検出順序決定装置としてもよい。 すなわち、先頭ボンド点候補選定部１６を省略し得る。
【００３３】
また本実施の形態においては、座標検出順序決定装置１０内に配線順序決定部１５を一体的に組み込んだが、電極パッド４とリード端子３との配列は比較的単純であるから、配線順序の決定は人手で行なってデバイス情報入力部１１に入力するようにしてもよい。すなわち、配線順序決定部１５を省略し得る。
【００３４】
また本実施の形態においては、座標検出点をリード端子３に２か所の突起部６と半導体チップ１に２か所のコーナーセル２と、計４か所に設けたが、例えば、リード端子３に２か所と半導体チップ１に１か所のように検出点の数は簡略にしてもよく、また必要に応じ増やしてもよい。
【００３５】
また本実施の形態においては、ボンディングヘッド２０の移動距離の算出に際しては、座標検出用カメラ２１とワイヤ保持部２２との間隔Ｄを考慮した補正を行い座標検出用カメラ２１の移動として求めたが、座標検出用カメラ２１の移動とワイヤ保持部２２の移動とをそれぞれに求めて加算するようにしてもよい。
【００３６】
また本実施の形態においては、先頭ボンド点を電極パッド４の中から決定する例を説明したが、先頭ボンド点をリード端子３の中から求めるようにしてもよい。
【００３７】
【発明の効果】
本発明は以上に説明したような形態で実施され、次ぎに述べるような効果を奏する。
【００３８】
半導体素子の製造のためのワイヤボンディングに際し、ボンディングヘッドの無駄な動きを避けるために、ワイヤボンダーにセットされる半導体チップとリード端子の位置、回転状態を認識するための座標検出順序を従来は熟練した作業者が決定していたが、本発明の座標検出順序決定装置は可能な検出順序を全て比較してボンディングヘッドが最短の移動距離を取るようにしたので、座標検出順序と配線順序が迅速かつ適切に決定され、ワイヤボンディング工程のタクトタイムが削減される。また、このことによって人為的ミスが解消されると共に工数が削減され、ワイヤボンディング工程の生産性を大幅に向上させる。
【図面の簡単な説明】
【図１】座標検出対象の一例としての半導体チップとリード端子との要部を示す平面図である。
【図２】ワイヤボンダーのボンディングヘッドを示し、Ａは平面図、Ｂは側面図である。
【図３】座標検出順序決定装置の機能構成を示すブロック図である。
【図４】座標検出順序決定装置の処理手順を示すフローチャートである。
【図５】座標検出順序の一例における座標の検出点と先頭ボンド点を示す平面図である。
【図６】図５に示す例において、ボンディングヘッドの移動の軌跡を示す平面図である。
【符号の説明】
１……半導体チップ、２……コーナーセル、３……リード端子、４……電極パッド、５……先頭ボンド点候補、６……突起部、１０……座標検出順序決定装置、１１……デバイス情報入力部、１２……検出順序操作部、１３……移動距離算出部、１４……検出順序決定部、１５……配線順序決定部、１６……先頭ボンド点候補選定部、２１……座標検出用カメラ、２２……ワイヤ保持部、Ｐ１、Ｐ２……半導体チップの検出点、Ｐ３、Ｐ４……リード端子の検出点、Ｐ５……先頭ボンド点。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a wire bonder coordinate detection order determination apparatus, and more specifically, a semiconductor chip and lead terminal coordinate detection order when wire bonding is performed by determining the positions of semiconductor chips and lead terminals set on the wire bonder. The present invention relates to an apparatus for determining
[0002]
[Prior art]
In the manufacturing process of a semiconductor element (hereinafter, referred to as a semiconductor chip and lead terminals bonded together), after mounting the semiconductor chip on the lead frame, the electrode pads on the semiconductor chip and the inner lead terminals of the lead frame are connected to each other. They are connected by bonding wires such as gold wires and aluminum wires. In the wire bonder that performs this wiring work (including a dual-purpose device incorporated in another device in addition to the dedicated device), the detection point provided on the lead terminal of the lead frame that is roughly set on the work table, and the lead The coordinate detection camera sequentially moves the coordinates of the detection points provided on the semiconductor chip on the frame to detect the coordinates, and compares the coordinates of the detection points set in advance with the positions and rotations of the semiconductor chip and lead terminals. Recognizing the state and correcting the coordinate value of the bond point where wire bonding is performed is performed.
[0003]
[Problems to be solved by the invention]
The coordinate detection camera and the wire holding portion where wire bonding is performed are attached to the bonding head of the wire bonder. The coordinate detection described above is performed in order to shorten the moving distance of the bonding head and perform wire bonding efficiently. Detecting point or detection points of lead terminal by camera, detection order of detecting point or points of semiconductor chip, lead terminal or head to start bonding from electrode pad on semiconductor chip to pair with it Bond points and wiring order vary depending on the type of semiconductor device to be manufactured, and the above items are determined by skilled workers.
[0004]
However, the factors governing the efficiency of wire bonding are many and complex as described above, and are prone to human error, and the distance between the coordinate detection camera and the wire holding part is also used in calculating the movement distance of the bonding head. In some cases, the moving distance of the bonding head is unnecessarily increased due to the fact that it is not taken into consideration, and the tact time of the wire bonding process is lengthened and the productivity is lowered.
[0005]
[Means for Solving the Problems]
According to the present invention, the movement of the bonding head according to the coordinate detection order of the detection point of the lead terminal and the detection point of the semiconductor chip by the coordinate detection camera and the movement of the bonding head from the final coordinate detection position to the first bond point at which bonding is started. The movement distance of the bonding head by a coordinate detection order determination device comprising means for calculating the movement distance, means for rearranging the coordinate detection order, and means for determining the coordinate detection order so that the movement distance of the bonding head is minimized. To improve the efficiency of wire bonding. This eliminates the unnecessary movement of the bonding head that sometimes occurred due to the coordinate detection order determined by the hands of the skilled worker.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
A wire bonder coordinate detection order determination apparatus according to an embodiment of the present invention will be specifically described below with reference to the drawings.
[0007]
FIG. 1 is a plan view showing a main part of a semiconductor chip and lead terminals as an example of a coordinate detection target. In FIG. 1, a plurality of electrode pads 4 are arranged on each of the four peripheral edges of the semiconductor chip 1, and two of the four corners are detected by a coordinate detection camera by image recognition. A corner cell 2 is provided. In addition, a plurality of lead terminals 3 that are paired with the electrode pads 4 are arranged in the periphery of the four sides of the semiconductor chip 1, and among the lead terminals 3 that are closest to the corner cell 2 of the semiconductor chip 1, the image is the same. Protrusions 6 serving as detection points of the coordinate detection camera by recognition are provided. That is, the detection points are provided at a total of four locations, ie, two protrusions 6 as detection points of the lead terminal 3 and two corner cells 2 as detection points of the semiconductor chip 1. Further, in the row of electrode pads 4 on the four peripheral edges of the semiconductor chip 1, there are electrode pads 4 at both ends of each row, in other words, a total of eight electrode pads 4 existing in the vicinity of the corner portion of the semiconductor chip 1. This is a leading bond point candidate where wire bonding is started, that is, a leading bond point candidate 5.
[0008]
In the wire bonder, prior to wire bonding, the coordinate detection camera attached to the bonding head sequentially moves the above four detection points, and the lead frame 3 and the lead frame of the lead frame placed on the work table. The position and rotation state of the semiconductor chip 1 mounted on the semiconductor chip 1 are recognized, and then the wire holding part wire-bonds each electrode pad 4 on the semiconductor chip 1 and each lead terminal 3 paired therewith. 2 shows the bonding head 20. FIG. 2A is a plan view and FIG. 2B is a side view. As shown in FIG. 2, the coordinate detection camera 21 and the wire holding unit 22 are attached with a gap D therebetween. In general, the distance D is slightly larger than the length d of one side of the semiconductor chip 1 and is set such that D> d. The bonding head 20 moves mainly with the coordinate detection camera 21 at the time of coordinate detection, and moves mainly with the wire holding part 22 at the time of wire bonding.
[0009]
3 shows that the coordinate detection camera 21 sequentially moves one of the protrusion 6 as the detection point of the lead terminal 3 and the corner cell 2 as the detection point of the semiconductor chip 1 shown in FIG. 1 as the first detection point. The coordinate configuration of the coordinate detection order determination device 10 for shortening the movement distance of the bonding head 20 from the final detection position to the wire bonder 22 to any one of the first bond point candidates 5 is detected. FIG. That is, the coordinate detection order determination device 10 includes a device information input unit 11 for inputting known information, a detection order operation unit 12 for rearranging a preset coordinate detection order, and the bonding head 20 moving according to the coordinate detection order. The moving distance calculating unit 13 for calculating the moving distance, the detection order determining unit 14 for determining the coordinate detection order and the first bond point so as to minimize the moving distance, and the wiring order determining for determining the wire bonding order, that is, the wiring order. And a first bond point candidate selection unit 16 that extracts and selects candidates to be the first bond points.
[0010]
The device information input unit 11 has a coordinate detection order set in advance, the coordinate value of the protrusion 6 that is the detection point of the lead terminal 13 and the corner cell 2 that is the detection point of the semiconductor chip 1, the coordinate value of the electrode pad 4 (for example, the center point) In addition, various coordinate values such as corner coordinate values are adopted), and a distance D between the coordinate detection camera 21 and the wire holding unit 22 in the bonding head 20 is input. The device information is provided by being stored in a storage medium such as a floppy disk, and the stored information is read and input by a floppy disk drive or the like.
[0011]
The detection order operation unit 12 sequentially sets the detection order in the case where coordinates are detected as the detection start points, that is, the first detection points, at the two protrusions 6 and the two corner cells 2 which are detection points. That is, the detection order corresponding to the number of permutations of the four detection points (the factorial value of 4) is sequentially set.
[0012]
The movement distance calculation unit 13 is based on the movement distance when the bonding head 20 moves according to a preset coordinate detection order obtained from the device information input unit 11 and the bonding head 20 according to the coordinate detection order set by the detection order operation unit 12. The movement distance when moving is calculated as described later. This moving distance includes the distance by which the wire holding unit 22 moves from the position where the coordinate detection camera 21 is at the final detection point to the first bond point candidate 5. When calculating the movement distance, the coordinates of each detection point obtained from the device information input unit 11 and the interval D between the coordinate detection camera 21 and the wire holding unit 22 in the bonding head 20 are used.
[0013]
The detection order determination unit 14 calculates the movement distance when detecting according to the preset coordinate detection order obtained from the device information input unit 11 and when detecting according to the coordinate detection order sequentially set by the detection order operation unit 12. The coordinate detection order and the first bond point are determined so that the movement distance of the bonding head 20 calculated by the unit 13 is the shortest.
[0014]
The wiring order determination unit 15 starts from the head bond point determined by the detection order determination unit 14, that is, the electrode pad 4 that is first wire-bonded after the coordinate detection, from the column of the electrode pads 4 including the electrode pad 4. The wiring order is determined so that wire bonding is performed on the other electrode pads 4 in order.
[0015]
The leading bond point candidate selection unit 16 takes out a total of eight electrode pads 4 at both ends of each row of electrode pads 4 as candidates for the leading bond point for starting wire bonding.
[0016]
Next, the operation of the coordinate detection order determination apparatus 10, that is, the processing procedure will be described with reference to the flowchart of FIG. 4.
[0017]
(Step 1) Preset coordinate detection order, coordinate value of the protrusion 6 that is the detection point of the lead terminal 3, coordinate value of the corner cell 2 that is the detection point of the semiconductor chip 1, coordinate value of the electrode pad 4, bonding A distance D between the coordinate detection camera 21 and the wire holding unit 22 in the head 20 is input to the device information input unit 11.
[0018]
(Step 2) The leading bond point candidate selection unit 16 selects a total of eight electrode pads 4 positioned at both ends of each electrode pad 4 column at the peripheral edge of the semiconductor chip 1 as the leading bond point candidates 5, and their coordinate values Take out.
[0019]
(Step 3) Based on a preset coordinate detection order, the coordinate detection camera 21 sequentially moves all detection points from the detection start point, and the wire holding unit 22 starts from the position at the final detection point. The movement distance calculation unit 13 calculates the movement distance of the bonding head 20 when moving to the candidate 5.
[0020]
This calculation will be specifically described with reference to FIGS. For the semiconductor chip 1 and the lead terminal 3 shown in FIG. 5, the coordinate detection camera 21 detects the detection point P3 of the lead terminal 3, the detection points P1 and P2 of the semiconductor chip 1, and then the detection point P4 of the lead terminal 3. FIG. 6 shows the movement trajectory of the bonding head 20 shown in FIG. 2 when it is assumed that the wire bonding is started with the electrode pad 4 paired with the lead terminal 3 to which the detection point P4 belongs as the head bond point P5. . As described above, the bonding head 20 moves mainly with the coordinate detection camera 21 at the time of coordinate detection, and moves mainly with the wire holding unit 22 at the time of wire bonding. That is, when the bonding head 20 reaches the P4 from the detection point P3 via P1 and P2 with the coordinate detection camera 21 as the main body, the wire holding portion 22 from that position leads to the first bond point P5. It is supposed to move. The locus of movement of the coordinate detection camera 21 at that time is indicated by a thin line, and the locus of movement of the wire holding unit 22 is indicated by a broken line. Conventionally, when the movement distance of the bonding head 20 is obtained, the bonding head 20 moves from P3 to P5 through P1, P2, and P4 without considering the distance D between the coordinate detection camera 21 and the wire holding unit 22. I was trying. In other words, the movement distance is calculated so that the coordinate detection camera 21 moves from P4 to P5 as indicated by the white arrow, and a value different from the actual movement distance is used. It will be.
[0021]
Similarly, the movement distance calculation unit 13 of the present embodiment calculates the movement of the bonding head 20 as the movement of the coordinate detection camera 21, but the coordinate of P5 is moved by the distance D in the negative direction of the Y axis in FIG. The movement distance of the bonding head 20 is calculated by correcting the position at the point P5 ′.
[0022]
(Step 4) In the case where the movement distance of the bonding head 20 in (Step 3) is determined as the shortest movement distance when the coordinate detection order is set in advance, and the coordinate detection order is sequentially set by the detection order operation unit 12. When the moving distance according to the coordinate detection order set by the detection order operation unit 12 is longer, the process proceeds to (Step 6), and when it is shorter (Step (Step 6)). Go to 5).
[0023]
(Step 5) When it is determined in (Step 4) that the coordinate detection order set by the detection order operation unit 12 is shorter than the preset coordinate detection order, the detection order is the detection order. The short moving distance is temporarily determined as the shortest moving distance amount, and the shortest moving distance is rewritten.
[0024]
(Step 6) Until the comparison of the movement distance of the bonding head 20 by the possible detection order is completed with respect to the detection order temporarily determined that the movement distance of the bonding head 20 is the shortest, go to (Step 7). When it is determined to proceed and it is confirmed that the comparison of all detection orders has been completed, the process proceeds to (Step 8).
[0025]
(Step 7) Since the coordinate detection may be started from any detection point, the detection order exists by the factorial value of the number of detection points, and the leading bond point candidates are also at both ends of each electrode pad 4, that is, the total number of points. Although there are 8 points, all of these combinations are sequentially set by the detection order operation unit 12, and the processing from (Step 3) to (Step 5) is repeated to calculate the moving distance and compare the length.
[0026]
In addition to the electrode pads 4 at both ends of the row of electrode pads 4 being the leading bond point candidates, the detection order for minimizing the movement distance of the bonding head 20 is determined with all the electrode pads 4 being the leading bond point candidates. However, as described above, there is generally a relationship of D> d between the distance D between the coordinate detection camera 21 and the wire holding part 22 in the bonding head 20 and the width d of one side of the semiconductor chip 1. If a total of eight electrode pads 4 at both ends of the row of electrode pads 4 are calculated as leading bond point candidates, it is possible to reliably determine the shortest moving distance. In addition, when wire bonding is started from the middle of the row of electrode pads 4, the movement from one row of electrode pads 4 to the next row of electrode pads 4 is increased by one, resulting in the movement distance of the bonding head 20 as a result. Will lead to an increase. Therefore, in the present embodiment, the electrode pads 4 at both ends of the row of electrode pads 4 are used as leading bond point candidates.
[0027]
(Step 8) The comparison of the movement distances of all other detection orders is completed with respect to the temporarily determined shortest movement distance, and the coordinate detection order in which the movement distance of the bonding head 20 is the shortest in (Step 6) When the head bond point is determined, the wiring sequence is performed so that wire bonding is performed in order from the row of electrode pads 4 including the head bond point to the row of other electrode pads 4 starting from the head bond point. The determination unit 15 determines the wiring order, and the series of processing ends.
[0028]
That is, the coordinate detection determining apparatus 10 according to the present embodiment performs extraction selection of all the leading bond point candidates in the leading bond point candidate selecting unit 16, and sequentially sets all possible coordinate detection orders in the detection order operation unit 12. The movement distance calculation unit 13 calculates the movement distance of the bonding head 20 in which the coordinate detection camera 21 moves all detection points and the wire holding unit 22 moves from the position where the coordinate detection is completed to the first bond point. The detection order determining unit 14 determines the detection order and the leading bond point where the moving distance is the shortest, and the wiring order determining unit 15 includes the electrode including the leading bond point in the wire bonding between the electrode pad 4 and the lead terminal 3. Since the wiring order is determined so as to be performed from the pad row to the other electrode pad row in order, Without relying on the skill of the kneaded the operator, the coordinate detection order that the moving distance of the bonding head 20 in the shortest, and it is possible to determine the top bonding point and the wiring sequence that follows it. As a result, the movement time of the bonding head 20 is rationalized, and the wire bonding tact time is shortened by the amount that the movement distance is shortened.
[0029]
The embodiment of the present invention has been described above. Of course, the present invention is not limited to this, and various modifications can be made based on the technical spirit of the present invention.
[0030]
For example, in the present embodiment, as shown in FIG. 1, the case where the electrode pads 4 are formed in each row on the peripheral edge of the four sides of the semiconductor chip 1 is taken up. The coordinate detection order determining apparatus of the present invention can also be applied to a chip where the electrode pad rows are each composed of two or more rows.
[0031]
In the present embodiment, the coordinate detection order is set in advance, and the movement distance of the bonding head 20 in that case is first temporarily determined as the shortest movement distance. However, the detection order operation unit 12 sequentially sets the coordinate movement order. Since the detection order includes the detection order set in advance, the detection order is not set in advance, and the movement distance based on the detection order initially set by the detection order operation unit 12 is first temporarily determined as the shortest movement distance. May be.
[0032]
In the present embodiment, the leading bond point candidate selecting unit 16 is integrally incorporated in the coordinate detection order determining apparatus 10 of the present invention. However, the leading bond point is fixed and the bonding head 20 is subjected to the conditions. It is good also as a coordinate detection order determination apparatus which determines the detection order that the movement distance becomes the shortest. That is, the first bond point candidate selection unit 16 can be omitted.
[0033]
Further, in the present embodiment, the wiring order determining unit 15 is integrally incorporated in the coordinate detection order determining device 10, but since the arrangement of the electrode pads 4 and the lead terminals 3 is relatively simple, the determination of the wiring order is performed. May be manually input to the device information input unit 11. That is, the wiring order determination unit 15 can be omitted.
[0034]
Further, in this embodiment, the coordinate detection points are provided at four places, two protrusions 6 on the lead terminal 3 and two corner cells 2 on the semiconductor chip 1. The number of detection points may be simplified, such as two in three and one in the semiconductor chip 1, or may be increased as necessary.
[0035]
In the present embodiment, when calculating the movement distance of the bonding head 20, correction is performed in consideration of the distance D between the coordinate detection camera 21 and the wire holding unit 22, and the movement is determined as the movement of the coordinate detection camera 21. The movement of the coordinate detection camera 21 and the movement of the wire holding unit 22 may be obtained and added respectively.
[0036]
In this embodiment, the example in which the head bond point is determined from the electrode pad 4 has been described. However, the head bond point may be determined from the lead terminal 3.
[0037]
【The invention's effect】
The present invention is implemented in the form as described above, and has the following effects.
[0038]
Conventionally skilled in coordinate detection order for recognizing the position and rotation state of semiconductor chip and lead terminal set in wire bonder to avoid useless movement of bonding head during wire bonding for semiconductor element manufacturing However, the coordinate detection order determination device of the present invention compares all possible detection orders so that the bonding head takes the shortest movement distance, so the coordinate detection order and the wiring order are quick. And it is determined appropriately and the tact time of the wire bonding process is reduced. This also eliminates human error and reduces man-hours and greatly improves the productivity of the wire bonding process.
[Brief description of the drawings]
FIG. 1 is a plan view showing main parts of a semiconductor chip and lead terminals as an example of a coordinate detection target;
FIG. 2 shows a bonding head of a wire bonder, where A is a plan view and B is a side view.
FIG. 3 is a block diagram showing a functional configuration of a coordinate detection order determination device.
FIG. 4 is a flowchart showing a processing procedure of the coordinate detection order determination device.
FIG. 5 is a plan view showing coordinate detection points and leading bond points in an example of a coordinate detection order;
6 is a plan view showing a movement path of a bonding head in the example shown in FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Semiconductor chip, 2 ... Corner cell, 3 ... Lead terminal, 4 ... Electrode pad, 5 ... Lead bond point candidate, 6 ... Projection part, 10 ... Coordinate detection order determination apparatus, 11 ... Device information input unit, 12... Detection order operation unit, 13... Movement distance calculation unit, 14... Detection order determination unit, 15 ... Wiring order determination unit, 16 ... Lead bond point candidate selection unit, 21. Coordinate detection camera, 22 ... wire holding part, P1, P2 ... detection point of semiconductor chip, P3, P4 ... detection point of lead terminal, P5 ... first bond point.

Claims (2)

ワイヤボンダーにセットされる半導体チップおよび該半導体チップを外部へ接続するためのリード端子の位置を確定させてワイヤボンディングするに際しての、
ボンディングヘッドにワイヤ保持部と一定の間隔をあけて共に取り付けられる座標検出用カメラが前記半導体チップ上の単数または複数の検出点と前記リード端子上の単数または複数の検出点とを順に移動して座標検出した後、前記半導体チップ上の電極パッドと前記リード端子との間のワイヤボンディングを開始するべく、前記ワイヤ保持部が前記電極パッドまたは前記リード端子から選ばれる先頭ボンド点へ移動するまでの前記ボンディングヘッドの移動距離を最短にするための座標検出順序決定装置であって、
先に設定される座標検出順序（１）とは異なる全ての座標検出順序（２）を順次設定する検出順序操作手段と、
前記先に設定される座標検出順序（１）に従って検出を行なう場合の前記ボンディングヘッドの移動距離（１）と、前記検出順序操作手段で設定される座標検出順序（２）に従って検出を行なう場合の前記ボンディングヘッドの移動距離（２）とを算出する移動距離算出手段と、
該移動距離算出手段によって算出される前記座標検出順序（１）に従う場合の前記移動距離（１）と前記座標検出順序（２）に従う場合の前記移動距離（２）とを比較して、移動距離が最も短くなるように座標検出順序を決定する検出順序決定手段と、
から構成されている
ことを特徴とするワイヤボンダーの座標検出順序決定装置。When determining the position of the semiconductor chip set on the wire bonder and the lead terminal for connecting the semiconductor chip to the outside for wire bonding,
A coordinate detection camera, which is attached to the bonding head together with a wire holding part at a certain interval, sequentially moves the detection point or points on the semiconductor chip and the detection point or points on the lead terminal. After the coordinate detection, in order to start wire bonding between the electrode pad on the semiconductor chip and the lead terminal, the wire holding part moves to the head bond point selected from the electrode pad or the lead terminal. A coordinate detection order determination device for minimizing the moving distance of the bonding head,
A detection order operating means for sequentially setting all coordinate detection orders (2) different from the previously set coordinate detection order (1);
When the detection is performed according to the movement distance (1) of the bonding head when the detection is performed according to the previously set coordinate detection order (1) and according to the coordinate detection order (2) set by the detection order operation means. A moving distance calculating means for calculating a moving distance (2) of the bonding head;
The movement distance (1) in the case of following the coordinate detection order (1) calculated by the movement distance calculation means is compared with the movement distance (2) in the case of following the coordinate detection order (2). Detection order determining means for determining the coordinate detection order so that is the shortest,
A wire bonder coordinate detection order determination device characterized by comprising: 前記先頭ボンド点となるべき単数または複数の先頭ボンド点候補を前記電極パッドまたは前記リード端子のなかから予め設定する先頭ボンド点候補選定手段と、
前記半導体チップ上の周縁部に配列される複数の前記電極パッドの列、または対として該電極パッドの列に対向して配置される複数の前記リード端子のうち、前記先頭ボンド点と同一の列に属する前記電極パッドの列、または前記リード端子の列から順にワイヤボンディングが行われるように配線順序を決定する配線順序決定手段と
のうちの少なくとも何れか一方の手段を具備している
ことを特徴とする請求項１に記載のワイヤボンダーの座標検出順序決定装置。A first bond point candidate selecting means for presetting one or a plurality of first bond point candidates to be the first bond point from the electrode pad or the lead terminal;
Of the plurality of the lead pads arranged opposite to the row of the electrode pads as a pair, the row of the electrode pads arranged at the peripheral edge on the semiconductor chip, the same row as the head bond point And a wiring order determining means for determining a wiring order so that wire bonding is performed in order from the row of electrode pads or the row of lead terminals. The wire bonder coordinate detection order determination device according to claim 1.
JP25306796A 1996-09-25 1996-09-25 Coordinate detection order determination device for wire bonder Expired - Fee Related JP3567644B2 (en)

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