WO2011163441A2 - Methods of operating of a wire bonding machine - Google Patents

Methods of operating of a wire bonding machine Download PDF

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Publication number
WO2011163441A2
WO2011163441A2 PCT/US2011/041571 US2011041571W WO2011163441A2 WO 2011163441 A2 WO2011163441 A2 WO 2011163441A2 US 2011041571 W US2011041571 W US 2011041571W WO 2011163441 A2 WO2011163441 A2 WO 2011163441A2
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WO
WIPO (PCT)
Prior art keywords
wire bonding
wire
data
bonding machine
bonded
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Application number
PCT/US2011/041571
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French (fr)
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WO2011163441A3 (en
Inventor
Ivy Wei Qin
Matthew P. Meyer
Original Assignee
Kulicke And Soffa Industries, Inc.
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Publication of WO2011163441A2 publication Critical patent/WO2011163441A2/en
Publication of WO2011163441A3 publication Critical patent/WO2011163441A3/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/788—Means for moving parts
    • H01L2224/78801—Lower part of the bonding apparatus, e.g. XY table
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H—ELECTRICITY
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
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    • H01L2924/01005—Boron [B]
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    • H01L2924/01006—Carbon [C]
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    • H01L2924/01028—Nickel [Ni]
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    • H01L2924/01033—Arsenic [As]
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    • H01L2924/01082—Lead [Pb]

Definitions

  • the present invention relates to wire bonding machines, and specifically to methods of operating wire bonding machines to improve accuracy in wire bonding processes.
  • wire bonding continues to be the primary method of providing electrical interconnection between two locations within a package (e.g ., between a die pad of a semiconductor die and a lead of a leadframe) . More specifically, using a wi re bonder (also known as a wire bondi ng machine) wire loops are formed between respective locations to be electrically interconnected .
  • a typical automatic wire bonder includes an XY table that carries a bond head assembly above a bondable area of the wire bonding machine. The bond head assembly typically includes a link portion and a transducer portion, where a bonding tool is held by the transducer. An optics assembly is also typically carried by the XY table.
  • the temperature of a wire bonding machine tends to vary from one XY position of the bondable area to another XY position of the bonda ble area .
  • a heat block is often used to support and heat a substrate carryi ng semiconductor dice.
  • the heat provided by the heat block tends to cause expansion and/or contraction of certain elements of the wi re bonding machine i ncluding, for example, the bond head assembly and the optics assembly.
  • This expansion and contraction can vary from one XY position of the bondable area to another XY position of the bondable area .
  • This variation i n the expansion/contraction introduces undesirable variations and errors during wire bonding .
  • a method of determini ng a sequence of wire bonding devices on a substrate includes the steps of: (a) providing an algorithm for determining a sequence of wire bondi ng a plurality of devices on a substrate; (b) providing data to be used by the algorithm for determining the sequence of wire bonding the plurality of devices; and (c) determining the sequence of wire bonding the plurality of devices using the provided data in connection with the algorithm .
  • a method of determining a park position for a bond head of a wire bonding machine includes the steps of: (a) providing an algorithm for determining a park position of a bond head of a wire bonding machi ne; (b) providing data to be used by the algorithm for determining the park position of the bond head ; and (c) determining the park position of the bond head using the provided data in connection with the algorithm .
  • a method of determining a sequence of wire bonding wire loops on a device includes the steps of: (a) providing an algorithm for determining a sequence of wire bonding the wire loops on the device; (b) providing data to be used by the algorithm for determining the sequence of wire bonding the wire loops; (c) determining the sequence of wire bonding the wire loops using the provided data in connection with the algorithm.
  • FIG. 1 is a block diagram plan view of various elements of a wire bonding machine useful for illustrating various exemplary em bodiments of the present invention ;
  • FIGS . 2A-2C are block diagram plan views of portions of FIG. 1 with further elements of the wire bonding machine;
  • FIG. 2D is a block diagram plan view of a bonding section of a leadframe illustrating an exemplary wire bonding sequence
  • FIGS . 3, 4A, 5A and 6A are a series of flow diagrams i ll ustrating methods of determining at least one of (1 ) a sequence of wire bonding devices on a substrate, and (2) park positions for a bond head of a wire bonding machi ne, in accordance with various exemplary em bodiments of the present invention ; and
  • FIGS. 4B, 5B and 6B-6C are block diagram plan views of a portion of a leadframe useful for illustrating the methods of FIGS. 4A, 5A, and 6A, respectively.
  • an algorithm is intended to broadly refer to any type of calculation or method used to determine the desired result (e.g ., a park position, a wire bonding sequence, etc.) .
  • An algorithm may (or may not) include computer program instructions for determining the desired result, and may utilize formulas determined to be useful in the determination of the desired result.
  • Such an algorithm may (or may not) be automated (and/or closed loop) using such computer program instructions.
  • such an algorithm may be manually derived by a user who manually uses data (without such computer program instructions) to determine the desi red result (e.g ., a park position, a wi re bonding sequence, etc.) .
  • an algorithm within the scope of the present invention may include multiple algorithms working in conjunction with one another.
  • FIG. 1 i llustrates substrate 100 (e.g ., leadframe 100, also known as leadframe strip 100) that moves along rails 102, 104 between input magazi ne 106 (holding leadframes to be wire bonded) and output magazine 108 (receivi ng leadframes that have been wire bonded) .
  • leadframe 100 may be considered divided into bonding sections 100a, 100b, 100c, a nd lOOd, where a given bonding section is the area defined by the aperture of window clamp 112 during a given index.
  • Each bonding section incl udes a respective pl urality of devices 101a, 101 b, 101c, lOld (e.g . , semiconductor dice) to be wire bonded .
  • bond head assembly 114 is positioned proximate leadframe section lOOd in what may be considered park position 124A (i .e., a temporary, stationary position of bond head assembly 114 and optics assembly 120 when the wire bonder is idle).
  • Window clamp 112 has been lowered over leadframe section lOOd to hold and stabilize section lOOd during wire bonding by bond head assembly 114.
  • Bond head assem bly 114 includes transducer portion 116 (e.g ., an ultrasonic transducer) that holds bonding tool 118 at its distal end, and link portion 122 (e.g ., that separates transducer portion 116 from the XY table of the wire bonding machine, where the XY table is not shown) .
  • Optics assembly 120 is positioned proximate bonding tool 118 so as to be able to image portions of semiconductor dice and substrates during wire bonding (e.g ., wire bondi ng of wire loops between die pads of respective dice lOld and leads of leadframe section lOOd) . More specifically, a ball bond may be bonded on a die pad of die lOld, and then a continuous length of wire may be extended from the ball bond to a lead on leadframe lOOd .
  • FIGS . 2A-2C are illustrations of portions FIG. 1 (and also showing further elements) in the processing of bonding sections 100a, 100b, lOOc, lOOd .
  • FIG. 2A illustrates heat block 130 (which is configured to heat/support bonding sections 100a, 100b, 100c, lOOd of leadframe 100, in turn, as indexed during wire bonding) .
  • Window clamp 112 e.g ., see FIG. 1
  • leadframe section lOOd shown in FIG.
  • Heat block 130 is supported by heat block 130 during wire bonding of respective dice lOld withi n section lOOd .
  • Heat block 130 defines sides 130a, 130b, 130c, 130d which will be discussed in greater detail below.
  • heat generated by heat block 130 causes expansion of elements carried by the XY table (e.g., elements of the bond head assembly 114 and/or optics assembly 120) ; however, such expansion (and associated contraction) of the elements tends to vary depending upon the position of the elements across the bondable area, thereby causi ng i nconsistent placement of bal l bonds (and other bonded portions of wire) .
  • diffuser 142 provides a ir flow 144 for assisting the imaging operation of optics assembly 120 by reduci ng radiant heat waves from heat block 130.
  • diffuser 142 is placed to the left of heat block 130, and as such, air flow 144 from diffuser 142 causes the area a bove side 130a of heat block 130 to have a lower temperature than the area above opposite side 130b and adjacent sides 130c, 130d . As such, this creates a first cooler zone 162 as seen by bond head assembly 114 and/or optics assem bly 120.
  • Another reason for the position dependent temperature variation is that the portion of the bond head assembly 114 and optics assembly 120 above heat block 130 varies depending upon the portion of leadframe section l OOd being bonded . That is, when bond head assembly 114 is in park position 124A shown in FIG. 2A (where none of bond head assembly 114 and optics assembly 120 is above heat block 130), the temperature seen by bond head assembly 114 and optics assembly 120 is relatively low as they are not above heat block 130. In contrast, when bond head assembly 114 is in the position shown in FIG.
  • bond head assembly 114 and/or optics assembly 120 varies depending upon the position of the XY table (which carries bond head assembly 114 and optics assembly 120), and in the configuration shown in FIG. 2A, a generally second cooler zone 160 is provided .
  • FIG. 2A illustrates first cooler zone 162 and second cooler zone 160; however, the temperature variation seen by bond head assembly 114 (and/or optics assembly 120) actually varies across the XY bondable area of the wire bonding machine.
  • FIG. 2A incl uding first cooler zone 162 and second cooler zone 160
  • the temperature profile/gradient as seen by bond head assembly 114 and/or optics assembly 120
  • FIG. 2D illustrates an exemplary conventional sequence of wi re bonding of bonding section 100a as shown by arrow 150 from letter A through H for simplicity.
  • bonding section 100a has a plurality of devices 101a (e.g ., semiconductor dice lOla l, 101a2, 101a3, 101a4, 101a5, 101a6, 101a7, 101a8) .
  • This sequence is frequently done column by col umn (or row by row as i llustrated) i n a serpentine fashion .
  • the bond head and optics assembly follow wire bonding sequence 150 across the bondable area, the temperature values of the bond head and/or the optics assembly at each device lOla l - 101a8 varies, as well as at each point of the bondable area, as exemplified by the temperature profile/gradient (e.g ., see arrow 164 in FIG. 2A) .
  • the thermal expansion (and associated contraction) of the bond head assembly and/or the optics assembly may vary greatly during wire bonding which affects bonding accuracy of the ball bonds and/or the wire loops formed .
  • the bonding sequence follows a conventional sequence such as sequence 150 shown in FIG. 2D, the temperature variation (and associated expansion/contraction) may be made worse as the sequence is not selected to minimize such temperature variation during the bonding of bonding section 100a .
  • Various examples of the present invention attempt to reduce temperature variations seen by the bond head assembly and/or the optics assembly that may be caused by, for example, a heat block, a diffuser, a park position of the bond head assembly/optics assembly, a sequence of bonding various devices on a substrate, etc.
  • FIGS. 3, 4A, 5A, and 6A are flow diagrams in accordance with certain exemplary embodiments of the present invention . As is understood by those skilled in the art certain steps included in the flow diagrams may be omitted, certain additional steps may be added, and the order of the steps may be altered from the order illustrated .
  • FIG. 3 is a flow diagram illustrating a method of determining at least one of: (1) a park position for a bond head of a wire bonding machi ne; and (2) a sequence of wire bonding devices on a substrate, in order to reduce the temperature variation seen by the bond head assem bly and/or optics assembly of the wire bondi ng machine. That is, the method may be used to determine a park position for the bond head assembly (e.g .
  • an algorithm is provided for determining at least one of the sequence of wire bonding devices on the substrate and the park position of the bond head assembly.
  • data is provided to be used by the algorithm for determining at least one of the sequence of wire bonding devices on the substrate and the park position of the bond head .
  • the data may be provided from computer memory of the wire bondi ng machine, from remote computer memory, by measuring certain information on the wire bonding machine, by measuring certain data offline, amongst others.
  • data may include temperature data measured with respect to a portion of the wi re bonding machine (e.g .
  • the bond head assembly the optics assembly, etc.
  • temperature data of one or more fixed positions of the wire bonding machine (e.g ., the heat block, etc.), position data of a plural ity of devices on a substrate, placement data of a plurality of bonded portions of wire (e.g ., ball bonds), amongst others.
  • at least one of the sequence of wire bonding devices on the substrate and the park position of the bond head assembly is determined using the provided data in connection with the algorithm .
  • steps 302 and 304 it may be desirable to repeat steps 302 and 304 for a plurality of iterations (e.g ., in a closed loop manner) to determine an improved park position and/or sequence of wire bonding devices.
  • a determination is made as to whether the wire bonding sequence and/or the park position is acceptable based on selected criteria .
  • Such criteria may be any desired criterias such as, for example : a desired number of iterations; a desirably low level of temperature variation ; and a desirably low level of placement variation of bonded wire portions (e.g . , ball bonds), amongst others.
  • step 308 the process is complete at step 308 (except for embodiments utilizing continuous monitoring, described below) . If the the wire bonding sequence and/or the park position is not acceptable based on the selected criteria, then the process repeats step 302 and 304 until the wire bonding sequence and/or the park position is acceptable based on the selected criteria at step 306 (then the process is complete at step 308) .
  • FIGS. 4A, 5A, and 6A are specific exemplary embodiments of the method of FIG. 3 illustrating methods of determining at least one of: ( 1) a park position for a bond head of a wire bonding machine; and (2) a sequence of wire bonding devices on a substrate, in order to reduce the temperature variation seen by the bond head assembly and/or optics assembly of the wire bonding machine.
  • an algorithm is provided for determining at least one of the sequence of wire bonding devices on the substrate and the park position of the bond head assembly.
  • a temperature value of a portion of the wire bonding machine is measured (e.g ., using one or more thermal sensors such as thermocouples) at a plurality of positions of the portion of the wire bonding machine.
  • the portion of the wire bonding machine may include a portion of the bond head assembly (e.g ., the linkage, the transducer, the wire clamp, etc.) and/or the optics assembly.
  • the bond head assembly and the optics assembly are typically carried by the XY table of a wire bonding machine.
  • a tem perature of the portion (or portions) of the wi re bonding machine is measured at a plurality of positions, and saved into computer memory of the wire bonding machine.
  • the positions may correspond to XY positions of a plurality of devices to be wire bonded .
  • other positions are contemplated .
  • the temperature measurements may be taken with respect to a single portion of the wire bondi ng machine or with respect to multiple portions of the wire bonding machine. If multiple portions are used, the temperatures of each portion at a given position may be averaged, used
  • step 408 the process is complete at step 408 (except for embodiments utilizing continuous monitoring, described below) . If the wire bonding sequence and/or the park position is not acceptable based on the selected criteria, then the process repeats step 402 and 404 until the wire bonding sequence and/or the park position is acceptable based on the selected criteria at step 406.
  • FIG. 4B illustrates bonding section 100a of the leadframe of FIG. 1 which will also be used to illustrate the method of FIG. 4A.
  • bonding section 100a is one of a pl ural ity of portions of a leadframe - that is, bonding section 100a represents a portion of the leadframe that is accessible through the window of window clamp 112 during a single index.
  • Bonding section 100a includes semiconductor dice lOla l, 101a2, 101a3, 101a4, 101a5, 101a6, 101a7, 101a8.
  • an algorithm is provided for determining at least one of the park position of the bond head assembly and the sequence of wire bonding devices on the substrate.
  • a temperature value of a portion of the wire bonding machine is measured at a plurality of positions of the portion of the wire bonding machine. Let us assume that the temperature is measured at a single portion of the wi re bonding machine (i .e., at the linkage of the bond head assembly) at the plurality of positions.
  • the positions correspond to each of semiconductor dice lOla l, 101a2, 101a3, 101a4, 101a5, 101a6, 101a7, 101a8. That is, a
  • temperature measurement is taken (in this example, of a portion of the linkage of the bond head assembly) with the bonding tool of the bond head assembly positioned above a portion of each of semiconductor dice lOla l , 101a2, 101a3, 101a4, 101a5, 101a6, 101a7, 101a8.
  • the temperature at the position corresponding to semiconductor die lOla l is 36°C
  • the temperature at the position corresponding to semiconductor die 101a2 is 37°C, etc.
  • the temperature values corresponding to the eight positions are provided to the algorithm (e.g ., from computer memory of the wire bonding machine), and at step 404 both the park position of the bond head assembly and the sequence of wire bonding devices on the substrate is determined using the measured temperature values in connection with the algorithm .
  • the park position is designated by an "X”.
  • the determined wi re bonding sequence is i ndicated by letters A-H, that is, die lO la l is marked with an "A" a nd is to be wire bonded first, die 101a8 is marked with a "B" and is to be wire bonded second, etc.
  • the algorithm was set up to provide a wi re bonding sequence where the wire bonding sequence proceeds from a cooler area, then to a warmer area, then to another cooler area, and so on, in order to avoid excessive tem perature variations as seen by the bond head assembly and/or optics assembly.
  • an algorithm for determining at least one of the sequence of wire bonding devices on the substrate and the park position of the bond head assembly.
  • position data of a plurality of devices on a substrate to be wire bonded are measured .
  • the substrate may be a leadframe strip
  • the plurality of devices may be a plural ity of
  • FIG. 5B illustrates bonding section 100a of the leadframe of FIG. 1 which shall be used to illustrate the method of FIG. 5A.
  • an algorithm is provided for determining at least one of the sequence of wire bonding devices on the substrate and the park position of the bond head assembly.
  • position data of a plurality of devices on a substrate to be wire bonded are measured .
  • position data may be XY position data for each of the semiconductor dice lOla l , 101a2, 101a3, 101a4, 101a5, 101a6, 101a7, 101a8 in bonding section 100a .
  • Such position data may be provided from computer memory of the wire bondi ng machine (e.g ., origi nally provided via CAD data or the l ike), may be provided by measuri ng the position of each die using a vision system of the wire bonding machine, amongst other techniques.
  • At step 504 at least one of the sequence of wire bonding devices on the substrate and the park position of the bond head assembly are determined using the measured position data of step 502 i n connection with the algorithm of step 500.
  • the park position is designated as element 550.
  • the determined wire bonding sequence is indicated by letters A-H, that is, die lOla l is marked with an "A” and is to be wire bonded first, die 101a8 is marked with a "B" and is to be wire bonded second, etc.
  • the algorithm was set up to provide a wire bonding sequence where the wire bonding sequence proceeds from one extreme position in bonding section 100a (die lOla l) to an opposite extreme position in bonding section 100a (die 101a8), and so on, in order to avoid excessive
  • an algorithm for determining at least one of the sequence of wire bonding devices on the substrate and the park position of the bond head assembly.
  • a plurality of bonding positions of bonded portions of a plurality of wires bonded to a plurality of bonding locations on a plurality of wire bonded devices are measured .
  • the bonded portions of a plurality of wi res may be ball bonds (e.g ., ball bonds of a wire loop) that are bonded to respective die pads (bonding locations) on a plurality of wire bonded devices.
  • the bondi ng positions of such ball bonds may refer to the placement accuracy of ball bonds bonded on die pads.
  • At step 604 at least one of the sequence of wire bonding devices on the substrate and the park position of the bond head assem bly is determined using the measured bonding positions of the bonded portions in connection with the algorithm . It may be desirable to repeat steps 602 and 604 for a plurality of iterations (e.g ., i n a closed loop manner) to determine an i mproved park position and/or sequence of wire bonding devices. For example, at optional step 606 a determination is made as to whether at least one of the wire bonding sequence and the park position is acceptable based on selected criteria .
  • step 608 the process proceeds and is complete at step 608 (except for embodiments util izing conti nuous monitoring, described below) .
  • the process repeats step 602 and 604 until the wire bonding sequence and/or the park position is acceptable based on the selected criteria at step 606.
  • FIGS. 6B-6C illustrate bonding section 100a of the leadframe of FIG . 1 which sha ll be used to ill ustrate the method of FIG. 6A (with FIG. 6C being an enlargement of circled section "6C" in FIG. 6B) .
  • an algorithm is provided for determining at least one of the park position of the bond head assem bly and the sequence of wire bonding devices on the substrate.
  • a plurality of bonding positions of bonded portions of a plurality of wires bonded to a plurality of bonding locations on a plurality of wire bonded devices are measured . For example, as shown in FIG .
  • exemplary bonded portions of the pl urality of wi res are ball bonds 622 bonded to die pads 621 of a semiconductor die (of course, other portions of wi res bonded to bonding locations are contemplated such as stitch bonds bonded to leads of a leadframe) .
  • the measured bondi ng positions of the ball bonds 622 refers to relative location of ball bond 622 to its respective die pad 621 , and may be termed the "placement accuracy" of the ball bond 622.
  • FIG. 6C a detailed view of semiconductor die 101a2 is provided, including ba ll bonds 622 (e.g ., ball bonds of wire loops, not shown) that have been bonded to die pads 621. As is clear i n FIG.
  • ball bonds 622 may not be placed exactly as desi red with respect to corresponding die pads 621 (e.g ., may not be consistently centered with respect to the die pad, etc.) .
  • ball bonds 622 may not be placed exactly as desi red with respect to corresponding die pads 621 (e.g ., may not be consistently centered with respect to the die pad, etc.) .
  • the placement accuracy will also tend to vary.
  • the placement accuracy e.g ., bonding position of the bonded portion
  • the algorithm to generate the bonding sequence (and/or park position) based on the placement accuracy.
  • the park position is designated by an "Y”.
  • the determi ned wi re bonding sequence is indicated by letters A-H, that is, die lOla l is marked with an "A” and is to be wire bonded fi rst, die 101a8 is marked with a "B" and is to be wire bonded second, etc.
  • the present invention has been described primarily in connection with a one time determination of a park position and/or a wire bonding sequence (or in con nection with closed loop techniques of determi ni ng the park position and/or wire bonding sequence), the present invention is not limited thereto.
  • the tecniques disclosed herein may be performed as desired, for example : at every index; at a predetermined interval (e.g ., every 30 minutes) ; as desired by an operator; based on feedback from monitoring at least one characteristic (e.g ., placement accuracy); etc.
  • the present invention has been described largely in connection with determining a sequence for wire bonding a plurality of devices/dice on a substrate (e.g ., which die to be wire bonded first, which die to be wire bonded second, etc), it is not limited thereto. That is, the techniques disclosed herein may also be used to determi ne the wire bonding sequence for individual wire loops on a given device (i .e., which wire loop to form in what order) .
  • data e.g ., temperature data, position data, etc. such as the data disclosed herein in connection with determining the sequence for wire bonding a pl urality of devices/dice on a substrate
  • algorithm i n order may be provided to determine such a wire looping sequence.

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Abstract

A method of determining at least one of: (1) a park position of a bond head of a wire bonding machine; and (2) a sequence of wire bonding devices on a substrate, is provided. The method comprises the steps of: (a) providing an algorithm for determining at least one of the park position of the bond head and the sequence of wire bonding devices on the substrate; (b) providi ng data to be used by the algorithm for determining at least one of the park position of the bond head and the sequence of wire bonding devices on the substrate; and (c) determining at least one of the park position of the bond head and the sequence of wire bonding devices on the substrate using the provided data in connection with the algorithm.

Description

M ETHODS OF OPERATING OF A WIRE BONDING MACHINE
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the benefit of U .S . Provisional Application No. 61/358, 104, filed June 24, 2010, the contents of which are incorporated herein by reference.
FIELD OF TH E INVENTION
[0002] The present invention relates to wire bonding machines, and specifically to methods of operating wire bonding machines to improve accuracy in wire bonding processes.
BACKGROUN D OF THE INVENTION
[0003] In the processi ng and packaging of semiconductor devices, wire bonding continues to be the primary method of providing electrical interconnection between two locations within a package (e.g ., between a die pad of a semiconductor die and a lead of a leadframe) . More specifically, using a wi re bonder (also known as a wire bondi ng machine) wire loops are formed between respective locations to be electrically interconnected . A typical automatic wire bonder includes an XY table that carries a bond head assembly above a bondable area of the wire bonding machine. The bond head assembly typically includes a link portion and a transducer portion, where a bonding tool is held by the transducer. An optics assembly is also typically carried by the XY table.
[0004] The temperature of a wire bonding machine (e.g ., as seen by the bond head assembly and/or optics assembly) tends to vary from one XY position of the bondable area to another XY position of the bonda ble area . For example, a heat block is often used to support and heat a substrate carryi ng semiconductor dice. The heat provided by the heat block tends to cause expansion and/or contraction of certain elements of the wi re bonding machine i ncluding, for example, the bond head assembly and the optics assembly. This expansion and contraction can vary from one XY position of the bondable area to another XY position of the bondable area . This variation i n the expansion/contraction introduces undesirable variations and errors during wire bonding . [0005] Thus, it would be desirable to improve methods of operating a wire bonding machine.
SU M MARY OF TH E INVENTION
[0006] According to an exemplary embodiment of the present invention, a method of determini ng a sequence of wire bonding devices on a substrate is provided . The method includes the steps of: (a) providing an algorithm for determining a sequence of wire bondi ng a plurality of devices on a substrate; (b) providing data to be used by the algorithm for determining the sequence of wire bonding the plurality of devices; and (c) determining the sequence of wire bonding the plurality of devices using the provided data in connection with the algorithm .
[0007] According to another exemplary embodiment of the present invention, a method of determining a park position for a bond head of a wire bonding machine is provided . The method includes the steps of: (a) providing an algorithm for determining a park position of a bond head of a wire bonding machi ne; (b) providing data to be used by the algorithm for determining the park position of the bond head ; and (c) determining the park position of the bond head using the provided data in connection with the algorithm .
[0008] According to yet another exem plary embodiment of the present invention, a method of determining a sequence of wire bonding wire loops on a device is provided . The method includes the steps of: (a) providing an algorithm for determining a sequence of wire bonding the wire loops on the device; (b) providing data to be used by the algorithm for determining the sequence of wire bonding the wire loops; (c) determining the sequence of wire bonding the wire loops using the provided data in connection with the algorithm.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] The i nvention is best understood from the following detailed description when read in connection with the accompanyi ng drawi ngs. It is emphasized that, according to common practice, the va rious features of the drawings are not to scale. On the contrary, the dimensions of the various features are arbitrarily expanded or reduced for clarity. Included i n the drawing are the following figures : FIG. 1 is a block diagram plan view of various elements of a wire bonding machine useful for illustrating various exemplary em bodiments of the present invention ;
FIGS . 2A-2C are block diagram plan views of portions of FIG. 1 with further elements of the wire bonding machine;
FIG. 2D is a block diagram plan view of a bonding section of a leadframe illustrating an exemplary wire bonding sequence;
FIGS . 3, 4A, 5A and 6A are a series of flow diagrams i ll ustrating methods of determining at least one of (1 ) a sequence of wire bonding devices on a substrate, and (2) park positions for a bond head of a wire bonding machi ne, in accordance with various exemplary em bodiments of the present invention ; and
FIGS. 4B, 5B and 6B-6C are block diagram plan views of a portion of a leadframe useful for illustrating the methods of FIGS. 4A, 5A, and 6A, respectively.
DETAILED DESCRIPTION OF TH E INVENTION
[0010] As used herein, the term "algorithm" is intended to broadly refer to any type of calculation or method used to determine the desired result (e.g ., a park position, a wire bonding sequence, etc.) . An algorithm may (or may not) include computer program instructions for determining the desired result, and may utilize formulas determined to be useful in the determination of the desired result. Such an algorithm may (or may not) be automated (and/or closed loop) using such computer program instructions. Conversely, such an algorithm may be manually derived by a user who manually uses data (without such computer program instructions) to determine the desi red result (e.g ., a park position, a wi re bonding sequence, etc.) . Of course, an algorithm within the scope of the present invention may include multiple algorithms working in conjunction with one another.
[0011] FIG. 1 i llustrates substrate 100 (e.g ., leadframe 100, also known as leadframe strip 100) that moves along rails 102, 104 between input magazi ne 106 (holding leadframes to be wire bonded) and output magazine 108 (receivi ng leadframes that have been wire bonded) . As illustrated by the dashed lines i n FIG. 1 , leadframe 100 may be considered divided into bonding sections 100a, 100b, 100c, a nd lOOd, where a given bonding section is the area defined by the aperture of window clamp 112 during a given index. Each bonding section incl udes a respective pl urality of devices 101a, 101 b, 101c, lOld (e.g . , semiconductor dice) to be wire bonded . [0012] As illustrated in FIG. 1, bond head assembly 114 is positioned proximate leadframe section lOOd in what may be considered park position 124A (i .e., a temporary, stationary position of bond head assembly 114 and optics assembly 120 when the wire bonder is idle). Window clamp 112 has been lowered over leadframe section lOOd to hold and stabilize section lOOd during wire bonding by bond head assembly 114. Bond head assem bly 114 includes transducer portion 116 (e.g ., an ultrasonic transducer) that holds bonding tool 118 at its distal end, and link portion 122 (e.g ., that separates transducer portion 116 from the XY table of the wire bonding machine, where the XY table is not shown) . Optics assembly 120 is positioned proximate bonding tool 118 so as to be able to image portions of semiconductor dice and substrates during wire bonding (e.g ., wire bondi ng of wire loops between die pads of respective dice lOld and leads of leadframe section lOOd) . More specifically, a ball bond may be bonded on a die pad of die lOld, and then a continuous length of wire may be extended from the ball bond to a lead on leadframe lOOd .
[0013] FIGS . 2A-2C are illustrations of portions FIG. 1 (and also showing further elements) in the processing of bonding sections 100a, 100b, lOOc, lOOd . FIG. 2A illustrates heat block 130 (which is configured to heat/support bonding sections 100a, 100b, 100c, lOOd of leadframe 100, in turn, as indexed during wire bonding) . Window clamp 112 (e.g ., see FIG. 1) is lowered over one of sections 100a, 100b, 100c, lOOd during such wire bonding to secure the respective section against heat block 130. For example, leadframe section lOOd (shown in FIG. 1) is supported by heat block 130 during wire bonding of respective dice lOld withi n section lOOd . Heat block 130 defines sides 130a, 130b, 130c, 130d which will be discussed in greater detail below. During bonding, heat generated by heat block 130 causes expansion of elements carried by the XY table (e.g., elements of the bond head assembly 114 and/or optics assembly 120) ; however, such expansion (and associated contraction) of the elements tends to vary depending upon the position of the elements across the bondable area, thereby causi ng i nconsistent placement of bal l bonds (and other bonded portions of wire) .
[0014] One reason for the position dependent tem perature variation is due to diffuser 142 of the wi re bonding machine. As understood by those skilled in the art, diffuser 142 provides a ir flow 144 for assisting the imaging operation of optics assembly 120 by reduci ng radiant heat waves from heat block 130. In the exam ple configuration i llustrated i n FIG.2A, diffuser 142 is placed to the left of heat block 130, and as such, air flow 144 from diffuser 142 causes the area a bove side 130a of heat block 130 to have a lower temperature than the area above opposite side 130b and adjacent sides 130c, 130d . As such, this creates a first cooler zone 162 as seen by bond head assembly 114 and/or optics assem bly 120.
[0015] Another reason for the position dependent temperature variation is that the portion of the bond head assembly 114 and optics assembly 120 above heat block 130 varies depending upon the portion of leadframe section l OOd being bonded . That is, when bond head assembly 114 is in park position 124A shown in FIG. 2A (where none of bond head assembly 114 and optics assembly 120 is above heat block 130), the temperature seen by bond head assembly 114 and optics assembly 120 is relatively low as they are not above heat block 130. In contrast, when bond head assembly 114 is in the position shown in FIG. 2B (where portions of bond head assembly 114 and optics assembly 120 are partially above heat block 130) then the temperature as seen by at least a portion of the bond head assembly 114 and/or optics assembly 120 is somewhat higher than the temperature at the position shown in FIG. 2A. Further, when bond head assembly 114 is in the position shown in FIG. 2C (where bond head assembly 114 and optics assembly 120 are fully above heat block 130) then the temperature as seen by at least a portion of the bond head assembly 114 and/or optics assembly 120 is even higher than the temperature at the position shown in FIG. 2B. Thus, it is clear that the temperature as seen by bond head assembly 114 and/or optics assembly 120 varies depending upon the position of the XY table (which carries bond head assembly 114 and optics assembly 120), and in the configuration shown in FIG. 2A, a generally second cooler zone 160 is provided .
[0016] Of course, the actual tem perature variation seen by bond head assembly 114 (and/or optics assembly 120) is more complex than that shown in the simplified example view in FIG. 2A. That is, FIG. 2A illustrates first cooler zone 162 and second cooler zone 160; however, the temperature variation seen by bond head assembly 114 (and/or optics assembly 120) actually varies across the XY bondable area of the wire bonding machine. In a configuration such as in FIG. 2A (incl uding first cooler zone 162 and second cooler zone 160), one can generally assume that the temperature profile/gradient (as seen by bond head assembly 114 and/or optics assembly 120) follows arrow 164 shown in FIG . 2A; that is, the lowest temperature va lues may be measured (by bond head assembly 114 and/or optics assembly 120) when bondi ng a device positioned on the upper left-hand corner of heat block 130 (at the tail of arrow 164) . The highest temperature values may be measured (using bond head assembly 114 and/or optics assembly 120) when bonding a device positioned on the lower right- hand corner of heat block 130 (at the tip of arrow 164) . Of course, the temperature values tend to increase between the tail end of arrow 164 and the tip of arrow 164. [0017] FIG. 2D illustrates an exemplary conventional sequence of wi re bonding of bonding section 100a as shown by arrow 150 from letter A through H for simplicity. That is, bonding section 100a has a plurality of devices 101a (e.g ., semiconductor dice lOla l, 101a2, 101a3, 101a4, 101a5, 101a6, 101a7, 101a8) . This sequence is frequently done column by col umn (or row by row as i llustrated) i n a serpentine fashion . As the bond head and optics assembly (not shown) follow wire bonding sequence 150 across the bondable area, the temperature values of the bond head and/or the optics assembly at each device lOla l - 101a8 varies, as well as at each point of the bondable area, as exemplified by the temperature profile/gradient (e.g ., see arrow 164 in FIG. 2A) . The thermal expansion (and associated contraction) of the bond head assembly and/or the optics assembly may vary greatly during wire bonding which affects bonding accuracy of the ball bonds and/or the wire loops formed . When the bonding sequence follows a conventional sequence such as sequence 150 shown in FIG. 2D, the temperature variation (and associated expansion/contraction) may be made worse as the sequence is not selected to minimize such temperature variation during the bonding of bonding section 100a .
[0018] Various examples of the present invention attempt to reduce temperature variations seen by the bond head assembly and/or the optics assembly that may be caused by, for example, a heat block, a diffuser, a park position of the bond head assembly/optics assembly, a sequence of bonding various devices on a substrate, etc.
[0019] FIGS. 3, 4A, 5A, and 6A are flow diagrams in accordance with certain exemplary embodiments of the present invention . As is understood by those skilled in the art certain steps included in the flow diagrams may be omitted, certain additional steps may be added, and the order of the steps may be altered from the order illustrated .
[0020] FIG. 3 is a flow diagram illustrating a method of determining at least one of: (1) a park position for a bond head of a wire bonding machi ne; and (2) a sequence of wire bonding devices on a substrate, in order to reduce the temperature variation seen by the bond head assem bly and/or optics assembly of the wire bondi ng machine. That is, the method may be used to determine a park position for the bond head assembly (e.g . , a position for the bond head assembly during idl ing, during operator assist i n the event of a problem, during substrate indexing/transfering, or for purpose of temperature stabi lization before wire bond, etc.), a bonding sequence for bondi ng devices on a substrate (e.g ., semiconductor dice on a portion of a leadframe to be bonded duri ng a given index of the leadfra me), or both the park position and the bonding sequence. At step 300, an algorithm is provided for determining at least one of the sequence of wire bonding devices on the substrate and the park position of the bond head assembly. At step 302, data is provided to be used by the algorithm for determining at least one of the sequence of wire bonding devices on the substrate and the park position of the bond head . For example, the data may be provided from computer memory of the wire bondi ng machine, from remote computer memory, by measuring certain information on the wire bonding machine, by measuring certain data offline, amongst others. Such data may include temperature data measured with respect to a portion of the wi re bonding machine (e.g . , the bond head assembly, the optics assembly, etc.), temperature data of one or more fixed positions of the wire bonding machine (e.g ., the heat block, etc.), position data of a plural ity of devices on a substrate, placement data of a plurality of bonded portions of wire (e.g ., ball bonds), amongst others. At step 304, at least one of the sequence of wire bonding devices on the substrate and the park position of the bond head assembly is determined using the provided data in connection with the algorithm .
[0021] As will be appreciated by those skilled in the art, it may be desirable to repeat steps 302 and 304 for a plurality of iterations (e.g ., in a closed loop manner) to determine an improved park position and/or sequence of wire bonding devices. For example, at optional step 306 a determination is made as to whether the wire bonding sequence and/or the park position is acceptable based on selected criteria . Such criteria may be any desired criterias such as, for example : a desired number of iterations; a desirably low level of temperature variation ; and a desirably low level of placement variation of bonded wire portions (e.g . , ball bonds), amongst others. If the the wire bonding sequence and/or the park position is acceptable based on the selected criteria, then the process is complete at step 308 (except for embodiments utilizing continuous monitoring, described below) . If the the wire bonding sequence and/or the park position is not acceptable based on the selected criteria, then the process repeats step 302 and 304 until the wire bonding sequence and/or the park position is acceptable based on the selected criteria at step 306 (then the process is complete at step 308) .
[0022] Of course, the method illustrated in FIG. 3 may cover any of a number of exemplary embodi ments. FIGS. 4A, 5A, and 6A are specific exemplary embodiments of the method of FIG. 3 illustrating methods of determining at least one of: ( 1) a park position for a bond head of a wire bonding machine; and (2) a sequence of wire bonding devices on a substrate, in order to reduce the temperature variation seen by the bond head assembly and/or optics assembly of the wire bonding machine. [0023] Referri ng specifically to FIG. 4A, at step 400, an algorithm is provided for determining at least one of the sequence of wire bonding devices on the substrate and the park position of the bond head assembly. At step 402, a temperature value of a portion of the wire bonding machine is measured (e.g ., using one or more thermal sensors such as thermocouples) at a plurality of positions of the portion of the wire bonding machine. For example, the portion of the wire bonding machine may include a portion of the bond head assembly (e.g ., the linkage, the transducer, the wire clamp, etc.) and/or the optics assembly. As provided above, the bond head assembly and the optics assembly are typically carried by the XY table of a wire bonding machine. Thus, as the XY table moves across the bondable area a tem perature of the portion (or portions) of the wi re bonding machine is measured at a plurality of positions, and saved into computer memory of the wire bonding machine. For example, the positions may correspond to XY positions of a plurality of devices to be wire bonded . Of course, other positions are contemplated . It will be appreciated that the temperature measurements may be taken with respect to a single portion of the wire bondi ng machine or with respect to multiple portions of the wire bonding machine. If multiple portions are used, the temperatures of each portion at a given position may be averaged, used
independently, scaled based on the criticality of the given portion, etc. At step 404, at least one of the sequence of wire bonding devices on the substrate and the park position of the bond head assembly is determined using the measured temperature values in connection with the algorithm . It may be desi rable to repeat steps 402 and 404 for a plurality of iterations (e.g ., in a closed loop manner) to determine an improved park position and/or sequence of wire bonding devices. For example, at optional step 406 a determi nation is made as to whether the wire bonding sequence and/or the park position is acceptable based on selected criteria . If the the wire bonding sequence and/or the park position is acceptable based on the selected criteria, then the process is complete at step 408 (except for embodiments utilizing continuous monitoring, described below) . If the wire bonding sequence and/or the park position is not acceptable based on the selected criteria, then the process repeats step 402 and 404 until the wire bonding sequence and/or the park position is acceptable based on the selected criteria at step 406.
[0024] FIG. 4B illustrates bonding section 100a of the leadframe of FIG. 1 which will also be used to illustrate the method of FIG. 4A. As will be appreciated by those skilled in the art, bonding section 100a is one of a pl ural ity of portions of a leadframe - that is, bonding section 100a represents a portion of the leadframe that is accessible through the window of window clamp 112 during a single index. Bonding section 100a includes semiconductor dice lOla l, 101a2, 101a3, 101a4, 101a5, 101a6, 101a7, 101a8. Referri ng again to step 400, an algorithm is provided for determining at least one of the park position of the bond head assembly and the sequence of wire bonding devices on the substrate. At step 402, a temperature value of a portion of the wire bonding machine is measured at a plurality of positions of the portion of the wire bonding machine. Let us assume that the temperature is measured at a single portion of the wi re bonding machine (i .e., at the linkage of the bond head assembly) at the plurality of positions. In FIG. 4B, the positions correspond to each of semiconductor dice lOla l, 101a2, 101a3, 101a4, 101a5, 101a6, 101a7, 101a8. That is, a
temperature measurement is taken (in this example, of a portion of the linkage of the bond head assembly) with the bonding tool of the bond head assembly positioned above a portion of each of semiconductor dice lOla l , 101a2, 101a3, 101a4, 101a5, 101a6, 101a7, 101a8. As indicated in FIG. 4B, the temperature at the position corresponding to semiconductor die lOla l is 36°C, the temperature at the position corresponding to semiconductor die 101a2 is 37°C, etc. The temperature values corresponding to the eight positions are provided to the algorithm (e.g ., from computer memory of the wire bonding machine), and at step 404 both the park position of the bond head assembly and the sequence of wire bonding devices on the substrate is determined using the measured temperature values in connection with the algorithm . As indicated i n FIG. 4B, the park position is designated by an "X". Further, the determined wi re bonding sequence is i ndicated by letters A-H, that is, die lO la l is marked with an "A" a nd is to be wire bonded first, die 101a8 is marked with a "B" and is to be wire bonded second, etc. As will be appreciated by one skilled in the art, in the example shown in FIG. 4B the algorithm was set up to provide a wi re bonding sequence where the wire bonding sequence proceeds from a cooler area, then to a warmer area, then to another cooler area, and so on, in order to avoid excessive tem perature variations as seen by the bond head assembly and/or optics assembly.
[0025] Referring specifically to FIG. 5A, at step 500, an algorithm is provided for determining at least one of the sequence of wire bonding devices on the substrate and the park position of the bond head assembly. At step 502, position data of a plurality of devices on a substrate to be wire bonded are measured . For example, the substrate may be a leadframe strip, and the plurality of devices may be a plural ity of
semiconductor dice/devices on the leadframe strip in a given i ndex of the leadframe stri p. The position data may be X and Y position data of each of the pl urality of semiconductor dice on the leadframe strip. At step 504, at least one of the sequence of wire bonding devices on the substrate and the park position of the bond head assembly is determined using the measured position data in connection with the algorithm . At step 506, the operation is complete. [0026] FIG. 5B illustrates bonding section 100a of the leadframe of FIG. 1 which shall be used to illustrate the method of FIG. 5A. Referring again to step 500, an algorithm is provided for determining at least one of the sequence of wire bonding devices on the substrate and the park position of the bond head assembly. At step 502, position data of a plurality of devices on a substrate to be wire bonded are measured . For example, such position data may be XY position data for each of the semiconductor dice lOla l , 101a2, 101a3, 101a4, 101a5, 101a6, 101a7, 101a8 in bonding section 100a . Such position data may be provided from computer memory of the wire bondi ng machine (e.g ., origi nally provided via CAD data or the l ike), may be provided by measuri ng the position of each die using a vision system of the wire bonding machine, amongst other techniques. At step 504 at least one of the sequence of wire bonding devices on the substrate and the park position of the bond head assembly are determined using the measured position data of step 502 i n connection with the algorithm of step 500. As indicated in FIG. 5B, the park position is designated as element 550. Further, the determined wire bonding sequence is indicated by letters A-H, that is, die lOla l is marked with an "A" and is to be wire bonded first, die 101a8 is marked with a "B" and is to be wire bonded second, etc. As will be appreciated by one skilled in the art, in the example shown in FIG. 5B, the algorithm was set up to provide a wire bonding sequence where the wire bonding sequence proceeds from one extreme position in bonding section 100a (die lOla l) to an opposite extreme position in bonding section 100a (die 101a8), and so on, in order to avoid excessive
temperature variations as seen by the bond head assembly and/or optics assembly.
[0027] Referring specifically to FIG. 6A, at step 600, an algorithm is provided for determining at least one of the sequence of wire bonding devices on the substrate and the park position of the bond head assembly. At step 602, a plurality of bonding positions of bonded portions of a plurality of wires bonded to a plurality of bonding locations on a plurality of wire bonded devices are measured . For example, the bonded portions of a plurality of wi res may be ball bonds (e.g ., ball bonds of a wire loop) that are bonded to respective die pads (bonding locations) on a plurality of wire bonded devices. The bondi ng positions of such ball bonds may refer to the placement accuracy of ball bonds bonded on die pads. At step 604, at least one of the sequence of wire bonding devices on the substrate and the park position of the bond head assem bly is determined using the measured bonding positions of the bonded portions in connection with the algorithm . It may be desirable to repeat steps 602 and 604 for a plurality of iterations (e.g ., i n a closed loop manner) to determine an i mproved park position and/or sequence of wire bonding devices. For example, at optional step 606 a determination is made as to whether at least one of the wire bonding sequence and the park position is acceptable based on selected criteria . If the the wi re bonding sequence and/or the park position is acceptable based on the selected criteria, then the process proceeds and is complete at step 608 (except for embodiments util izing conti nuous monitoring, described below) . On the other hand, if the the wire bonding sequence and/or the park position is not acceptable based on the selected criteria, then the process repeats step 602 and 604 until the wire bonding sequence and/or the park position is acceptable based on the selected criteria at step 606.
[0028] FIGS. 6B-6C illustrate bonding section 100a of the leadframe of FIG . 1 which sha ll be used to ill ustrate the method of FIG. 6A (with FIG. 6C being an enlargement of circled section "6C" in FIG. 6B) . Referring again to step 600 of FIG. 6A, an algorithm is provided for determining at least one of the park position of the bond head assem bly and the sequence of wire bonding devices on the substrate. At step 602, a plurality of bonding positions of bonded portions of a plurality of wires bonded to a plurality of bonding locations on a plurality of wire bonded devices are measured . For example, as shown in FIG . 6C, exemplary bonded portions of the pl urality of wi res are ball bonds 622 bonded to die pads 621 of a semiconductor die (of course, other portions of wi res bonded to bonding locations are contemplated such as stitch bonds bonded to leads of a leadframe) . The measured bondi ng positions of the ball bonds 622 refers to relative location of ball bond 622 to its respective die pad 621 , and may be termed the "placement accuracy" of the ball bond 622. Referring to FIG. 6C, a detailed view of semiconductor die 101a2 is provided, including ba ll bonds 622 (e.g ., ball bonds of wire loops, not shown) that have been bonded to die pads 621. As is clear i n FIG. 6C, ball bonds 622 may not be placed exactly as desi red with respect to corresponding die pads 621 (e.g ., may not be consistently centered with respect to the die pad, etc.) . As will be appreciated by one skilled in the art, based on the
temperature variation across bonding section 100a, the placement accuracy will also tend to vary. Thus, by measuring the placement accuracy (e.g ., bonding position of the bonded portion) one can learn about the temperature variation, and configure the algorithm to generate the bonding sequence (and/or park position) based on the placement accuracy. As indicated in FIG. 6B, the park position is designated by an "Y". Further, the determi ned wi re bonding sequence is indicated by letters A-H, that is, die lOla l is marked with an "A" and is to be wire bonded fi rst, die 101a8 is marked with a "B" and is to be wire bonded second, etc.
[0029] Although the present invention has been described primarily in connection with a one time determination of a park position and/or a wire bonding sequence (or in con nection with closed loop techniques of determi ni ng the park position and/or wire bonding sequence), the present invention is not limited thereto. The tecniques disclosed herein may be performed as desired, for example : at every index; at a predetermined interval (e.g ., every 30 minutes) ; as desired by an operator; based on feedback from monitoring at least one characteristic (e.g ., placement accuracy); etc.
[0030] Although the present invention has been described largely in connection with determining a sequence for wire bonding a plurality of devices/dice on a substrate (e.g ., which die to be wire bonded first, which die to be wire bonded second, etc), it is not limited thereto. That is, the techniques disclosed herein may also be used to determi ne the wire bonding sequence for individual wire loops on a given device (i .e., which wire loop to form in what order) . Thus, data (e.g ., temperature data, position data, etc. such as the data disclosed herein in connection with determining the sequence for wire bonding a pl urality of devices/dice on a substrate) may be provided to an algorithm i n order to determine such a wire looping sequence.
[0031] Although the invention is illustrated and described herein with reference to specific embodiments, the invention is not intended to be limited to the details shown . Rather, various modifications may be made in the detai ls within the scope and range of equivalents of the claims and without departing from the invention .

Claims

What is Claimed :
1. A method of determining a sequence of wi re bonding devices on a substrate, the method comprising the steps of:
(a) providing an algorithm for determining a sequence of wire bonding a plurality of devices on a substrate;
(b) providing data to be used by the algorithm for determi ning the sequence of wire bonding the plurality of devices; and
(c) determining the sequence of wire bonding the plurality of devices using the provided data in connection with the algorithm .
2. The method of claim 1 wherei n the data provided in step (b) includes at least one of: ( 1) position data of the plurality of devices on the substrate to be wire bonded ; (2) data related to bonding positions of bonded portions of a plurality of wires bonded to a plurality of bonding locations on a plurality of wi re bonded devices; and (3) temperature data of a portion of a wire bonding machine at a plurality of positions of the wire bondi ng machine.
3. The method of claim 2 wherein the data provided in step (b) includes at least two of the data types recited in ( 1), (2) and (3) .
4. The method of claim 1 wherein the data provided in step (b) is temperature data of a portion of a wire bonding machine at a plurality of positions of the portion of the wi re bonding machine.
5. The method of claim 1 wherein step (b) includes measuring a temperature value of a portion of a wire bonding machine at a plurality of positions of the portion of the wire bondi ng machine.
6. The method of claim 1 wherein the data provided in step (b) is temperature data of at least one of an optics assembly of a wire bondi ng machine, and a bond head assembly of the wire bondi ng machine, the temperature data being provided relative to a plurality of positions of the wire bonding machine.
7. The method of claim 1 wherein step (b) includes measuring a temperature value at a portion of a wire bonding machine at a plurality of positions of the portion of the wire bonding machine, the portion of the wire bonding machi ne including at least one of an optics assembly of the wire bondi ng machine and a bond head assembly of the wire bonding machine.
8. The method of claim 1 wherein the data provided in step (b) is temperature data of at least one of an optics assembly of a wire bonding machine, a link portion of a bond head assembly of the wire bonding machine, a wire clamp of the bond head assembly of the wire bonding machine, and a transducer portion of the bond head assembly of the wire bonding machine, the temperature data being provided relative to a plurality of positions of the wire bondi ng machine.
9. The method of claim 1 wherein step (b) includes measuring a temperature value of a portion of a wire bonding machine at a plurality of positions of the portion of the wire bondi ng machine, the portion of the wire bonding machine including at least one of an optics assembly of the wire bonding machine, a link portion of a bond head assembly of the wire bonding machine, a wire clam p of the bond head assembly of the wire bonding machine, and a transducer portion of the bond head assembly of the wire bonding machine.
10. The method of claim 1 wherein the data provided in step (b) is temperature data of one or more fixed positions of the wire bonding machine.
11. The method of claim 1 wherein the data provided in step (b) is position data of the plural ity of devices on the substrate to be wi re bonded .
12. The method of claim 1 wherein step (b) includes collecting position data of a pl urality of devices on a substrate to be wire bonded .
13. The method of claim 1 wherein the data provided in step (b) is X and Y position data of a plurality of semiconductor die on a leadframe stri p.
14. The method of claim 1 wherei n step (b) includes collecting X and Y position data of a plurality of semiconductor die on a leadframe strip.
15. The method of claim 1 wherein the data provided in step (b) is data related to bonding positions of bonded portions of a pl urality of wi res bonded to a plurality of bonding locations on a plurality of wire bonded devices.
16. The method of claim 1 wherein step (b) includes measuring a plurality of bonding positions of bonded portions of a plural ity of wires bonded to a plurality of bonding locations on a plural ity of wire bonded devices.
17. The method of claim 1 wherein the data provided in step (b) includes placement accuracy data of ball bonds bonded on die pads of respective devices.
18. The method of claim 1 wherein step (b) includes at least one of ( 1) measuri ng placement accuracy of ball bonds bonded on die pads of respective devices, and (2) measuring accuracy of stitch bonds on leads of respective devices.
19. The method of claim 1 wherein step (c) incl udes determining the sequence of wire bonding the plurality of devices using the provided data in connection with the algorithm to reduce temperature variations of a bond head assembly of a wi re bonding machine during a wire bonding process.
20. The method of claim 1 wherein step (c) includes determining the sequence of wi re bonding the pl urality of devices using the provided data in connection with the algorithm to reduce position variations among wires bonded on a plurality of devices formed during a wire bonding process.
21. The method of claim 1 further including the step of (d) repeating steps (b) and (c) for a plurality of iterations to determine an improved sequence of wire bonding the plurality of devices.
22. The method of claim 1 further including the step of (d) repeating steps (b) and (c) for a plurality of iterations until a predetermined level of tem perature variation of a portion of a wire bonding machi ne at a plurality of positions of the portion of the wire bonding machine is reached .
23. The method of claim 1 further incl uding the step of (d) repeating steps (b) and (c) for a plurality of iterations until a temperature variation of a portion of a wire bonding machine at a plurality of positions of the portion of the wi re bonding machine remains substantially the same.
24. The method of claim 1 further including the step of (d) repeating steps (b) and (c) for a plurality of iterations unti l a predetermined level of placement accuracy of ball bonds bonded on die pads of respective devices is reached .
25. The method of claim 1 further including the step of (d) repeating steps (b) and (c) for a plurality of iterations until a placement accuracy of ba ll bonds bonded on die pads of respective devices remains substantial ly the same.
26. The method of claim 1 wherein step (a) includes providing the algorithm for determining the sequence of wire bonding and for determining a park position of a bond head of a wire bonding machine, and step (c) includes determining the sequence of wire bonding and the park position of the bond head using the provided data in connection with the algorithm .
27. The method of claim 1 wherein steps (b) and (c) are repeated at a predetermined interval .
28. The method of claim 1 wherein steps (b) and (c) are repeated at each index of a wire bonding process of a wire bonding machine.
29. A method of determining a sequence of wire bonding wire loops on a device, the method comprising the steps of:
(a) providing an algorithm for determ ining a sequence of wire bonding the wi re loops on the device;
(b) providing data to be used by the algorithm for determi ning the sequence of wire bonding the wire loops; and
(c) determining the sequence of wire bonding the wire loops using the provided data in connection with the algorithm .
30. A method of determining a park position of a bond head of a wire bonding machi ne, the method comprising the steps of:
(a) providing an algorithm for determining a park position of a bond head of a wire bonding machine;
(b) providing data to be used by the algorithm for determi ning the park position of the bond head ; and
(c) determining the park position of the bond head usi ng the provided data in connection with the algorithm .
31. The method of claim 30 wherein the data provided in step (b) includes at least one of: ( 1 ) position data of a plurality of devices on a substrate to be wire bonded ; (2) data related to bonding positions of bonded portions of a pl ural ity of wires bonded to a plurality of bondi ng locations on a plurality of wire bonded devices; and (3) temperature data of a portion of the wire bonding machine at a plurality of positions of the wire bonding machine.
32. The method of claim 31 wherein the data provided in step (b) includes at least two of the data types recited in ( 1), (2) and (3) .
33. The method of clai m 30 wherein the data provided in step (b) is temperature data of a portion of the wire bonding machine at a plurality of positions of the portion of the wire bonding machine.
34. The method of claim 30 wherein step (b) includes measuring a temperature val ue of a portion of the wire bonding machine at a plural ity of positions of the portion of the wire bonding machine.
35. The method of claim 30 wherein the data provided in step (b) is temperature data of at least one of an optics assembly of the wi re bonding machine and a bond head assem bly of the wire bonding machine, the temperature data being provided relative to a plurality of positions of the wire bonding machine.
36. The method of claim 30 wherein step (b) includes measuring a temperature value of a portion of the wire bondi ng machine at a plurality of positions of the portion of the wire bondi ng machine, the portion of the wire bonding machine including at least one of an optics assembly of the wire bonding machine and a bond head assembly of the wire bonding machine.
37. The method of claim 30 wherein the data provided in step (b) is temperature data of at least one of an optics assembly of the wire bonding machine, a link portion of a bond head assembly of the wire bonding machi ne, a wire clamp of the bond head assembly of the wire bonding machine, and a transducer portion of the bond head assembly of the wire bonding machine, the temperature data being provided relative to a plurality of positions of the wire bonding machine.
38. The method of claim 30 wherein step (b) i ncludes measuring a temperature val ue of a portion of the wire bonding machine at a plural ity of positions of the portion of the wi re bonding machine, the portion of the wire bonding machine including at least one of an optics assembly of the wire bondi ng machine, a link portion of a bond head assembly of the wire bonding machine, a wire clam p of the bond head assembly of the wire bonding machine, and a transducer portion of the bond head assembly of the wire bonding machine.
39. The method of claim 30 wherein the data provided in step (b) includes position data of a plurality of devices on a substrate to be wire bonded .
40. The method of claim 30 wherein step (b) includes collecting position data of a pl urality of devices on a substrate to be wire bonded .
41. The method of claim 30 wherein the data provided in step (b) includes X and Y position data of a plurality of semiconductor dice on a leadfra me strip.
42. The method of claim 30 wherein step (b) includes collecting X and Y position data of a plurality of semiconductor dice on a leadframe stri p.
43. The method of clai m 30 wherein the data provided in step (b) includes data related to bonding positions of bonded portions of a plural ity of wires bonded to a plurality of bonding locations on a plurality of wire bonded devices.
44. The method of claim 30 wherein step (b) incl udes measuring a plurality of bonding positions of bonded portions of a plural ity of wires bonded to a plurality of bonding locations on a plurality of wire bonded devices.
45. The method of claim 30 wherein the data provided in step (b) includes placement accuracy data of ball bonds bonded on die pads of respective devices.
46. The method of claim 30 wherein step (b) i ncl udes measuring placement accuracy of bal l bonds bonded on die pads of respective devices.
47. The method of claim 30 wherein step (c) incl udes determining the park position of the bond head using the provided data in connection with the algorithm to reduce tem perature variations of a bond head assem bly of the wi re bonding machine during a wire bonding process.
48. The method of claim 30 wherein step (c) i ncludes determining the park position of the bond head using the provided data in connection with the algorithm to reduce position va riations among wires bonded on a plurality of devices formed during a wire bonding process.
49. The method of claim 30 further incl uding the step of (d) repeating steps (b) and (c) for a plurality of iterations to determine an improved park position .
50. The method of claim 30 further incl uding the step of (d) repeating steps (b) and (c) for a plural ity of iterations until a predetermined level of temperature variation of a portion of the wire bonding machine at a plurality of positions of the portion of the wire bonding machine is reached .
51. The method of claim 30 further incl uding the step of (d) repeating steps (b) and (c) for a plurality of iterations until a temperature variation of a portion of the wire bonding machine at a plurality of positions of the portion of the wire bonding machine remains substantially the same.
52. The method of claim 30 further including the step of (d) repeating steps (b) and (c) for a plurality of iterations until a predetermined level of placement accuracy of ball bonds bonded on die pads of respective devices is reached .
53. The method of claim 30 further including the step of (d) repeating steps (b) and (c) for a plurality of iterations until a placement accuracy of ball bonds bonded on die pads of respective devices remains substantial ly the same.
54. The method of claim 30 wherein step (a) includes providing the algorithm for determining the park position of the bond head and for determining a sequence of wire bondi ng a plurality of devices on a substrate, and step (c) includes determining the sequence using the provided data in connection with the algorithm .
55. The method of claim 30 wherein steps (b) and (c) are repeated at a predetermined interval .
56. The method of claim 30 wherein steps (b) and (c) are repeated at each index of a wi re bonding process of the wire bonding machine.
PCT/US2011/041571 2010-06-24 2011-06-23 Methods of operating of a wire bonding machine WO2011163441A2 (en)

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