JP3522132B2 - Optical semiconductor element storage package - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor device and an optical semiconductor device housing package for housing a driving device for driving the optical semiconductor device. 2. Description of the Related Art Conventionally, an optical semiconductor device housing package for housing an optical semiconductor device is generally made of an aluminum oxide sintered body, and the optical semiconductor device and the optical semiconductor device are driven at the center of the upper surface. A base having an optical semiconductor element mounting area and a driving element mounting area on which a driving element to be mounted is mounted,
A frame made of an aluminum oxide sintered body having a through-hole on a side and attached to a base so as to surround the optical semiconductor element mounting area and the driving element mounting area; A cylindrical fixing member attached to a frame around the through hole or the through hole and having a space through which an optical signal is transmitted, made of a metal material such as an iron-nickel-cobalt alloy; and the cylindrical fixing member. A light-transmissive member made of amorphous glass or the like that seals the inside of the fixed member attached via a low-melting brazing material such as a gold-tin alloy having a melting point of 200 to 400 ° C., and a frame inside the base body And a plurality of wiring conductor layers made of tungsten, molybdenum, manganese, etc., which are attached and derived from the outside to the outside, and the electrodes of the optical semiconductor element and the electrodes of the drive element are connected via electrical connection means such as bonding wires. ,
A lid member attached to the upper surface of the frame body to hermetically seal the optical semiconductor element and the driving element, and the optical semiconductor element is mounted on the optical semiconductor element mounting area of the base; Each drive element is placed and fixed in the mounting area, and each electrode of the optical semiconductor element and the drive element is electrically connected to a predetermined wiring conductor layer via an electrical connection means such as a bonding wire, and then, A lid member is joined to the upper surface of the frame body, the optical semiconductor element and the driving element are hermetically accommodated inside a container including the base, the frame body, and the lid member, and the optical fiber member is attached and connected to the cylindrical fixing member. Thus, an optical semiconductor device as a product is obtained. Such an optical semiconductor device causes a drive element to perform a predetermined drive based on a drive signal supplied from an external electric circuit, and causes the optical semiconductor element to cause a predetermined optical excitation in accordance with the drive of the drive element. The excited light is transmitted to and received from an optical fiber member via a light-transmitting member, and is transmitted through the optical fiber of the optical fiber member, thereby being used for high-speed communication and the like. [0004] However, in this conventional package for housing an optical semiconductor element, the base is formed of an aluminum oxide sintered body, and the aluminum oxide sintered body is made of a heat conductive material. Rate is about 15W / m · K
Therefore, when a drive signal is supplied to the drive element from an external electric circuit to cause a predetermined drive, and a predetermined light excitation is caused to the optical semiconductor element in accordance with the drive of the drive element, the drive element operates. Sometimes, a large amount of heat is generated, and a part of the heat acts on the optical semiconductor element via the base, causing a high temperature of the optical semiconductor element to cause the optical semiconductor element to malfunction. SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned drawbacks, and has as its object to effectively prevent heat generated during operation of a driving element from acting on an optical semiconductor element, and to keep an optical semiconductor element always at an appropriate temperature. An object of the present invention is to provide an optical semiconductor device housing package that can operate a device normally and stably for a long period of time. SUMMARY OF THE INVENTION The present invention has an optical semiconductor element mounting area on which an optical semiconductor element, a driving element for driving the optical semiconductor element, and a driving element mounting area are mounted. A base, a frame mounted on the base so as to surround the optical semiconductor element mounting area and the driving element mounting area, and having a through hole on a side portion; and a frame around the through hole or the through hole. For mounting an optical semiconductor element, comprising: a cylindrical fixing member attached to the optical fiber member; and a lid member attached to the upper surface of the frame body to hermetically seal the optical semiconductor element and the driving element. A package in which a notch is formed in the base to separate an optical semiconductor element mounting area and a driving element mounting area, and carbon fibers arranged in the thickness direction in the notch are bonded by carbon. Made of conductive composite material and exposed A heat shielding member whose outer surface is covered with a coating layer. According to the package for housing an optical semiconductor element of the present invention, an optical semiconductor element mounting area, a driving element mounting area, and a substrate on which an optical semiconductor element and a driving element for driving the optical semiconductor element are mounted. A notch is provided so as to divide the heat treatment, and the heat treatment is made of a unidirectional composite material in which carbon fibers arranged in the thickness direction in the notch are bonded with carbon, and the exposed outer surface is covered with a coating layer. Since the blocking member is provided, when a predetermined drive is caused by supplying a drive signal from an external electric circuit to the drive element and a predetermined light excitation is caused in the optical semiconductor element with the drive of the drive element, When the drive element emits a large amount of heat during operation, even if a part of the heat tries to act on the optical semiconductor element via the base, the transfer of heat is cut off by the heat shutoff member and does not act on the optical semiconductor element, as a result The optical semiconductor element is always suitable temperature, normally an optical semiconductor device for a long period, and it is possible to stably operate. Next, the present invention will be described in detail with reference to the accompanying drawings. 1 and 2 show an embodiment of the package for housing an optical semiconductor element according to the present invention, wherein 1 is a base, 2 is a frame, and 3 is a lid member. The base 1, frame 2, and cover 3
A container for accommodating the optical semiconductor element 4 and the driving element 5 for driving the optical semiconductor element 4 is formed therein. The base 1 functions as a support member for supporting the optical semiconductor element 4 and the driving element 5, and has an optical semiconductor element mounting area 1a on which the optical semiconductor element 4 is mounted.
And a driving element mounting area 1b on which the driving element 5 is mounted. The optical semiconductor element 4 is provided in the optical semiconductor element mounting area 1a.
For example, the silicon substrate is interposed therebetween, and is bonded and fixed via a brazing material made of gold-germanium, and the driving element 5 is mounted and fixed in the driving element mounting area 1b. The base 1 is made of, for example, an electrically insulating material such as an aluminum oxide sintered body, and is mixed with a raw material powder such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide by adding an appropriate organic solvent and a solvent. A ceramic green sheet (ceramic green sheet) is obtained by employing a conventionally known doctor blade method, calender roll method, or the like, and then the ceramic green sheet is appropriately punched. And the like, and a plurality of sheets are stacked one above the other, and then fired at a high temperature (about 1600 ° C.). The base 1 is provided with an optical semiconductor element mounting area 1.
a and a driving element mounting area 1b, a notch hole 1c is formed, the optical semiconductor element mounting area 1a and the driving element mounting area 1b are divided by the notch hole 1c, and the notch hole 1c is formed. A heat blocking member 6 made of a unidirectional composite material in which carbon fibers arranged in the thickness direction are bonded by carbon and having an exposed outer surface covered with a coating layer is provided. The notch hole 1c functions as an arrangement hole for disposing the heat insulating member 6, and when a plurality of ceramic green sheets are stacked and fired to obtain the base 1, the ceramic green sheet serving as the base 1 is obtained. Is formed by punching a hole at a predetermined position in advance by a punching method. The heat blocking member 6 provided in the cutout hole 1c has a function of effectively preventing the heat generated when the driving element 5 operates from acting on the optical semiconductor element 4 via the base 1. None, when a drive signal is supplied from an external electric circuit to the drive element 5 to cause a predetermined drive, and when the drive of the drive element 5 causes the optical semiconductor element 4 to perform a predetermined optical excitation, the drive element 5 During operation, a large amount of heat is generated, and even if a part of the heat tries to act on the optical semiconductor element 4 via the base 1, the transfer of heat is interrupted by the heat shutoff member 6 and does not act on the optical semiconductor element 4. As a result, the optical semiconductor element 4
Is always at an appropriate temperature, and the optical semiconductor element 4 can be operated normally and stably for a long period of time. The heat blocking member 6 is made of a unidirectional composite material in which carbon fibers arranged in the thickness direction are bonded with carbon.
The exposed outer surface is covered with a coating layer 6a. The one-way composite material forming the heat insulating member 6 has a heat conductivity of 300 W / m · K or more in the carbon fiber brain direction, that is, the direction from the upper surface to the lower surface of the heat insulating member 6. On the other hand, the thermal conductivity in the direction orthogonal to 30 W /
m · K or less, and heat is selectively and efficiently transmitted in one direction from the upper surface side to the lower surface side of the base 1. Therefore, when the heat blocking member 6 made of the one-way composite material is disposed in the cutout hole 1c provided in the base 1, the heat generated when the driving element 5 operates spreads the base 1 and the optical semiconductor element 4 is mounted. Even if an attempt is made to transmit the optical semiconductor element to the optical semiconductor element mounting area 1a, heat is
Is hardly transmitted to the optical semiconductor element mounting area 1a, and as a result, the optical semiconductor element 4 does not become hot due to the heat generated by the driving element 5, and the optical semiconductor element 4 is always At an appropriate temperature, the optical semiconductor element 4 can operate normally and stably for a long period of time. The heat blocking member 6 made of the one-way composite material is formed by, for example, forming a bundle of carbon fibers arranged in one direction into a solid pitch or a phenol resin or the like in which fine powder such as coke is dispersed. Impregnated in a solution of a curable resin, and then dried to form a plurality of sheets in which carbon fibers are arranged in one direction and to make each sheet have the same direction of carbon fibers. A plurality of sheets are laminated, and then a predetermined pressure is applied to the plurality of laminated sheets and heated to cure the thermosetting resin portion,
Finally, this is fired at a high temperature in an inert atmosphere to carbonize the phenolic resin and the fine powder of pitch or coke (form carbon) and bond each carbon fiber with the carbon. The heat blocking member 6 made of the one-way composite material has a coating layer 6a applied to the exposed outer surface, and the one-way composite material forming the heat blocking member 6 by the coating layer 6a. Has a large number of pores inside and on the surface, and even if porous, the pores are completely closed by the coating layer 6a, and the reliability of hermetic sealing of the container is extremely high. At the same time, since the pores of the heat blocking member 6 are completely closed by the coating layer 6a, the optical semiconductor element 4 and the driving element 5 are accommodated in the container, and the optical semiconductor device is formed.
In the case of inspecting the hermetic sealing of the optical semiconductor device using helium, a part of helium is not trapped in the pores of the heat insulating member 6, and the inspection of hermetic sealing of the optical semiconductor device is extremely accurate. Can be done. The coating layer 6a is made of metal, lead boric acid or borosilicate glass, epoxy resin, silicone resin, urethane resin or the like. When the coating layer 6a is formed of a metal, a thin metal member having a thickness of 50 μm or less, such as iron, nickel, chromium, titanium, molybdenum, tantalum, or tungsten, is disposed on the lower surface of the heat insulating member 6. This is performed by applying a temperature of 1200 ° C. for 1 hour while applying a pressure of 5 MPa by a vacuum hot press, diffusing a part of the sheet metal member into the heat insulating member 6 and performing diffusion bonding. The heat insulating member 6 made of the one-way composite material has an elastic modulus of 30 GPa or less and is soft, so that the heat insulating member 6 and the base 1 on which the heat insulating member 6 is disposed are formed. Even if some thermal stress occurs due to the difference in the coefficient of thermal expansion between them, the thermal stress will
Is absorbed by deforming it moderately,
The heat blocking member 6 and the base 1 are bonded very firmly, and the optical semiconductor element 4 and the driving element 5 housed therein are operated normally and stably for a long period of time with high reliability of hermetic sealing of the container. It becomes possible. Further, the base 1 on which the heat blocking member 6 is provided.
A frame 2 is mounted on the upper surface so as to surround the optical semiconductor element mounting area 1a and the driving element mounting area 1b, and the optical semiconductor element 4 and the driving element are mounted inside the frame 2. A space for accommodating 5 is formed. The frame 2 is made of an electrical material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, a silicon carbide sintered body, or a glass ceramic sintered body. When made of an insulating material, for example, when it is made of an aluminum oxide sintered body, an appropriate organic binder, a solvent, etc. are added to and mixed with raw material powders of aluminum oxide, silicon oxide, magnesium oxide, calcium oxide, etc. At the same time, the slurry is formed into a ceramic green sheet (ceramic green sheet) by employing a doctor blade method or a calender roll method. Thereafter, the ceramic green sheet is appropriately punched, and a plurality of the green sheets are laminated. It is manufactured by firing at a temperature of about 1600 ° C. A plurality of metallized wiring layers 7 are formed on the surface of the substrate 1 located inside the frame 2 from the surface of the substrate 1 located inside the frame 2 to the lower surface of the substrate 1. The electrodes of the optical semiconductor element 4 and the driving element 5 are electrically connected to the formed metallized wiring layer 7 via electrical connection means such as bonding wires. The wiring conductor of the external electric circuit board is connected via solder or the like. The metallized wiring layer 7 comprises an optical semiconductor element 4
And the electrodes of the driving element 5 are connected to an external electric circuit, or act as conductive paths when the optical semiconductor element 4 and the driving element 5 are electrically connected, and tungsten, molybdenum,
It is formed of a high melting point metal powder such as manganese. The metallized wiring layer 7 is made of tungsten,
A metal paste obtained by adding and mixing an appropriate organic binder, a solvent, and the like to a high melting point metal powder such as molybdenum, manganese, or the like is applied to a ceramic green sheet serving as the base 1 in a predetermined pattern by a known screen printing method in advance. As a result, the substrate 1 is adhered and formed from the surface of the substrate 1 located inside the frame 2 to the lower surface of the substrate 1. On the exposed surface of the metallized wiring layer 7, a metal such as nickel and gold having excellent corrosion resistance and excellent wettability with a brazing material is applied to a thickness of 1 to 20 μm by plating. In addition, oxidation corrosion of the metallized wiring layer 7 can be effectively prevented, and the connection between the metallized wiring layer 7 and the wiring conductors of the optical semiconductor element 4, the driving element 5, and the external electric circuit board can be made strong.
Therefore, it is preferable that the metallized wiring layer 7 has a metal having excellent corrosion resistance such as nickel and gold and excellent wettability with a brazing material having a thickness of 1 μm to 20 μm on the exposed surface. Further, the frame 2 is provided with a through hole 2a on a side portion thereof, and a cylindrical fixing member 8 is attached to the inner wall surface of the through hole 2a. A light transmitting member 9 is attached to one end of the light emitting element. The through hole 2a formed on the side of the frame 2 acts as a mounting hole for mounting the fixing member 8 to the frame 2, and for example, the through hole 2a is conventionally known in the side of the frame 2. Is formed into a predetermined shape by performing a drilling process. The fixing member 8 attached to the through hole 2a of the frame 2 functions as a base fixing member for fixing the optical fiber member 10 to the frame 2, and also transmits the light excited by the optical semiconductor element 4 to the optical fiber. A function of transmitting the light to the member 10 is provided.
And an optical fiber member 10 at the outer end.
Are attached and connected. The cylindrical fixing member 8 is made of, for example, a metal material such as an iron-nickel-cobalt alloy or an iron-nickel alloy, and is formed by pressing an iron-nickel alloy ingot into a cylindrical shape. Is done. The fixing member 8 has one end on its inner side.
For example, a light-transmitting member 9 is attached, the light-transmitting member 9 closes the internal space of the fixing member 8, and maintains the hermetic sealing of the container including the base 1, the frame 2, and the lid 3. At the same time, the light excited by the optical semiconductor element 4 that transmits the internal space of the fixing member 8 is transmitted as it is to the optical fiber member 10 attached to and connected to the fixing member 8. The translucent member 9 is made of, for example, a lead-based amorphous glass mainly containing silicon oxide and lead oxide and a borosilicate-based amorphous glass mainly containing boric acid and silica sand. Since the amorphous glass does not have a crystal axis, the light excited by the optical semiconductor element 4 is transmitted and received by the optical fiber member 10 through the light transmitting member 9. The birefringence does not occur in the member 9 and is transmitted and received to the optical fiber member 10 as it is. As a result, the transmission and reception of the light excited by the optical semiconductor element 4 to the optical fiber member 10 becomes highly efficient, and the transmission efficiency of the optical signal is increased. Can be made higher. The attachment of the translucent member 9 to the fixing member 8 is performed, for example, as shown in FIG. This is performed by brazing the layer 11 and the fixing member 8 via a brazing material such as a gold-tin alloy. In this case, the attachment of the translucent member 9 to the fixing member 8 is performed by brazing with a gold-tin alloy or the like, so that the attachment is highly reliable. 9, the container housing the optical semiconductor element 4 and the driving element 5 at the portion where the optical semiconductor element 4 and the driving element 5 are housed is completely hermetically sealed, and the optical semiconductor element 4 and the driving element 5 housed inside the container operate normally and stably for a long time Can be done. The metallized layer 11 previously coated on the outer periphery of the light transmitting member 9 has a low melting point of about 700 ° C. of the amorphous glass constituting the light transmitting member 9, and the conventionally known Mo is used. As shown in FIG. 2, since at least one of titanium, titanium-tungsten, and tantalum nitride, which are active with respect to amorphous glass and can be strongly bonded, cannot be formed by employing the Mn method. And a third layer 11c, which will be described later, generated by heat generated when the first layer 11a brazes the translucent member 9 to the fixing member 8.
And platinum, nickel, which effectively prevent the metallized layer 11 from being reduced in bonding strength to the translucent member 9.
Second layer 11 of at least one of nickel-chromium
b, at least one of gold, platinum and copper, which improves the wettability of the brazing material with respect to the metallized layer 11 and firmly joins the brazing material to the metallized layer 11 to firmly attach the translucent member 9 to the fixing member 8. The metallized layer 11 is formed by sequentially laminating one kind of third layer 11c. In particular, the metallized layer 11 formed by sequentially laminating titanium-platinum-gold has a strong bonding strength with the translucent member 9, and It is very suitable as the metallized layer 11 because the wettability with the brazing material is good and the translucent member 9 can be brazed to the fixing member 8. The above titanium, titanium-tungsten,
First layer 11a made of at least one kind of tantalum nitride
And at least one of platinum, nickel and nickel-chromium
The metallized layer 11 having a three-layer structure of a second layer 11b made of a seed and a third layer 11c made of at least one of gold, platinum, and copper is made of a metal material and a nitride of the light-transmitting member 9. It is formed by sequentially applying a predetermined thickness to the outer peripheral portion by a sputtering method, a vapor deposition method, an ion plating method, a plating method, or the like. Further, the metallized layer 11 is made of titanium,
A first layer 11a made of at least one of titanium-tungsten and tantalum nitride, a second layer 11b made of at least one of platinum, nickel, and nickel-chromium;
In the case where the third layer 11c made of at least one of platinum and copper is used, if the thickness of the first layer 11a is less than 500 angstroms, the bonding strength of the metallized layer 11 to the translucent member 9 tends to be weak. If the thickness exceeds 2,000 angstroms, a large stress is generated in the first layer 11a when the first layer 11a is applied to the light transmitting member 9, and the first layer 11a is formed by the internal stress. It is preferable that the thickness of the first layer 11a be in the range of 500 Å to 2000 Å because the film tends to be more easily peeled off, and the light transmitting member 9 is fixed when the thickness of the second layer 11b is less than 500 Å. The first layer 1 is heated by heat when brazing to the member 8.
1a cannot be effectively prevented from diffusing into the third layer 11c, and there is a risk that the bonding strength of the metallized layer 11 to the translucent member 9 may be reduced.
When the thickness exceeds Å, the second layer 1 is formed on the first layer 11a.
When the first layer 1b is deposited, a large stress is generated inside the second layer 11b, and the second layer 11b is caused by the intrinsic stress.
1a, the second layer 11
The thickness of b is preferably in the range of 500 Å to 10000 Å, and if the thickness of the third layer 11 c is less than 0.5 μm, the metallized layer 1
1, the wettability of the brazing material is not greatly improved, and it tends to be difficult to firmly braze and attach the translucent member 9 to the fixing member 8, and if it exceeds 5 μm, the second layer 11b
When the third layer 11c is deposited thereon, a large stress is generated inside the third layer 11c, and the third layer 11c is generated by the intrinsic stress.
The thickness of the third layer 11c is preferably set in the range of 0.5 μm to 5 μm because c tends to be more easily peeled off than the second layer 11b. Further, a lid member 3 made of a metal material such as, for example, an iron-nickel-cobalt alloy or an iron-nickel alloy is joined to the upper surface of the frame 2 to thereby form the base 1.
The optical semiconductor element 4 and the driving element 5 are hermetically sealed inside a container including the frame 2 and the lid member 3. The lid member 3 is joined to the upper surface of the frame 2 by, for example, welding such as a seam welding method. Thus, according to the package for housing an optical semiconductor element of the present invention, the optical semiconductor element 4 is mounted on the optical semiconductor element mounting area 1a of the base 1, and the driving element 5 is mounted on the driving element mounting area 1b.
And the optical semiconductor element 4 and the driving element 5
Are electrically connected to the metallized wiring layer 7 via electrical connection means such as a bonding wire.
The lid member 3 is joined to the upper surface of the optical semiconductor element 4 and the driving element 5 inside the container including the base 1, the frame 2, and the lid member 3.
And a cylindrical fixing member 8 finally attached to the frame 2.
By attaching and connecting the optical fiber member 10 to the optical semiconductor device, an optical semiconductor device as a final product is obtained. Such an optical semiconductor device causes the drive element 5 to perform a predetermined drive based on a drive signal supplied from an external electric circuit, and causes a predetermined optical excitation of the optical semiconductor element 4 with the drive of the drive element 5. Then, the excited light is transmitted / received to / from the optical fiber member 10 through the translucent member 9 and transmitted through the optical fiber of the optical fiber member 10 to be used for high-speed communication or the like. It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention.
The case where the optical semiconductor element 4 excites light by driving the driving element 5 has been described.
The present invention is also applicable to a case where the optical semiconductor element 4 converts light transmitted through the optical element 0 into an electric signal, and the driving element 5 amplifies the converted electric signal. According to the package for housing an optical semiconductor element of the present invention, the optical semiconductor element mounting area and the driving area are provided on the base on which the optical semiconductor element and the driving element for driving the optical semiconductor element are mounted. Notch holes are provided so as to divide the element mounting region, and a unidirectional composite material in which carbon fibers arranged in the thickness direction in the notch holes are bonded by carbon, and the exposed outer surface is a coating layer. Since the covered heat shielding member is provided, a drive signal is supplied to the drive element from an external electric circuit to cause a predetermined drive, and a predetermined optical excitation is applied to the optical semiconductor element with the drive of the drive element. When awakened,
The drive element emits a large amount of heat during operation, and even if a part of the heat tries to act on the optical semiconductor element via the base, the transfer of heat is cut off by the heat shutoff member and does not act on the optical semiconductor element, As a result, the optical semiconductor element is always at the appropriate temperature,
It becomes possible to operate the optical semiconductor element normally and stably for a long period of time.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing one embodiment of an optical semiconductor element housing package of the present invention. FIG. 2 is a partially enlarged cross-sectional view illustrating a light-transmitting member of the package for housing an optical semiconductor element shown in FIG. [Description of Signs] 1.... Base 1a... Optical semiconductor element mounting area 1b... Driving element mounting area 1c. Notch hole 2 Frame 2a Through hole 3 Cover member 4 Optical semiconductor element 5 ... Driving element 7 Metallized wiring layer 8 Fixing member 9 Transparent member 10 ..Optical fiber members

Claims (1)

(57) Claims: 1. An optical semiconductor element mounting area on which an optical semiconductor element and a driving element for driving the optical semiconductor element are mounted on the upper surface, and a base having the driving element mounting area. A frame having a through hole on the side and a frame around the through hole or a frame around the through hole, the frame being attached to the substrate so as to surround the optical semiconductor element mounting area and the driving element mounting area. An optical semiconductor element housing package comprising: a cylindrical fixing member attached to the optical fiber member; and a lid member attached to the upper surface of the frame body and hermetically sealing the optical semiconductor element and the driving element. A one-way composite in which a notch is formed in the base to separate an optical semiconductor element mounting area and a driving element mounting area and carbon fibers arranged in the thickness direction in the notch are bonded with carbon; Made of material and exposed outer surface is coated In an optical semiconductor device package for housing, characterized in that the heat block member being coated is disposed.