JP3514180B2 - Method for producing rolled copper foil - Google Patents
Method for producing rolled copper foilInfo
- Publication number
- JP3514180B2 JP3514180B2 JP23719799A JP23719799A JP3514180B2 JP 3514180 B2 JP3514180 B2 JP 3514180B2 JP 23719799 A JP23719799 A JP 23719799A JP 23719799 A JP23719799 A JP 23719799A JP 3514180 B2 JP3514180 B2 JP 3514180B2
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- Prior art keywords
- copper foil
- rolled copper
- annealing
- temperature
- rolled
- Prior art date
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Description
【０００１】[0001]
【発明の属する技術分野】本発明は、圧延銅箔の製造方
法に関し、特に、常温において軟化しにくく、従って、
強度の低下しにくい圧延銅箔の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a rolled copper foil, and in particular, it is difficult to soften at room temperature and therefore,
The present invention relates to a method for manufacturing a rolled copper foil that is less likely to have a decrease in strength.
【０００２】[0002]
【従来の技術】厚さが１５μｍクラスの極薄の銅箔がプ
リント基板の配線板、電池の集電体、コンデンサの電
極、電磁波シールド材、リードフレーム等に使用されて
いる。通常、この種の銅箔は、銅の素材に焼鈍と冷間圧
延を繰り返し施すことによって、たとえば、２００μｍ
厚さの生地材を製造し、最終の圧延加工において、この
生地材を、たとえば、１５μｍに減厚して製造される。2. Description of the Related Art Ultra-thin copper foil with a thickness of 15 μm is used for printed wiring boards, current collectors for batteries, electrodes for capacitors, electromagnetic wave shields, lead frames and the like. Usually, this type of copper foil has a thickness of, for example, 200 μm obtained by repeatedly performing annealing and cold rolling on a copper material.
A fabric material having a thickness is manufactured, and in the final rolling process, this fabric material is manufactured by reducing the thickness to, for example, 15 μm.
【０００３】このようにして製造される銅箔は、最終圧
延が９０％を超える高い冷間加工度のため、内部に高エ
ネルギーを蓄積した状態となり、このため、時間が経過
するのに伴って再結晶が進行し、常温下において軟化す
る性質を有している。軟化した銅箔は、強度と伸びが低
下して破断あるいはシワが入りやすくなり、取扱いの難
しい銅箔となる。The copper foil produced in this manner has a high cold workability of more than 90% in the final rolling, so that high energy is accumulated inside the copper foil. Therefore, with the passage of time, It has the property of recrystallizing and softening at room temperature. The softened copper foil has a reduced strength and elongation, is prone to breakage or wrinkles, and is difficult to handle.
【０００４】従来、この問題への対処策としては、最終
圧延前の生地材の厚さを薄くすることが行われている
（特開平１０−２３０３０３号等）。生地材の厚さを薄
くすることで冷間圧延の加工度を下げ、これによって銅
箔内への蓄積エネルギーを少なくし、再結晶の進行を抑
制しようとするもので、強度低下を防ぐうえでの効果は
確かに大きい。Conventionally, as a measure against this problem, the thickness of the dough material before the final rolling has been reduced (Japanese Patent Laid-Open No. 10-230303, etc.). By reducing the thickness of the dough material, the workability of cold rolling is reduced, thereby reducing the energy stored in the copper foil and suppressing the progress of recrystallization. The effect of is certainly great.
【０００５】[0005]
【発明が解決しようとする課題】しかし、この方法に基
づく圧延銅箔の製造方法によると、たとえば、１５μｍ
の銅箔を得ようとするとき、最終圧延前の生地材の厚さ
を従来の半分の１００μｍに設定したとすると、焼鈍時
間が生地材の厚さに反比例して長くなるため、重量当た
りの焼鈍効率の低下が著しく、コスト上の負担が大きく
なる。However, according to the method for producing a rolled copper foil based on this method, for example, 15 μm is obtained.
When the thickness of the base material before the final rolling is set to 100 μm, which is half that of the conventional one, when the copper foil of is to be obtained, the annealing time becomes long in inverse proportion to the thickness of the base material. The annealing efficiency is remarkably lowered, and the cost burden is increased.
【０００６】また、この方法によると、焼鈍を圧延ライ
ンの中で連続して行うとき、材料が破断しやすい問題を
有しており、一方、これを避けるためにコイル巻き材料
を炉内で焼鈍するときには、巻き層間において材料が粘
着するなど、製造上の問題も有している。Further, according to this method, when annealing is continuously performed in the rolling line, there is a problem that the material is easily broken, and in order to avoid this, the coil winding material is annealed in the furnace. When doing so, there is also a manufacturing problem such as the material sticking between the winding layers.
【０００７】このように最終圧延前の生地材の厚さを薄
くする方法は、銅箔の強度低下を防ぐうえにおいては有
効であるけれども、製造コストおよび製造技術上の観点
からすると不利であり、現実には、採用の難しい方法で
あると言わざるを得ない。The method of reducing the thickness of the dough material before final rolling is effective in preventing the strength of the copper foil from decreasing, but is disadvantageous from the viewpoint of manufacturing cost and manufacturing technology. In reality, I have to say that this is a difficult method to employ.
【０００８】従って、本発明の目的は、最終圧延前の生
地材の薄肉化に依存することなく、常温下での軟化とそ
れによる強度低下を効果的に抑制することのできる圧延
銅箔の製造方法を提供することにある。Therefore, the object of the present invention is to produce a rolled copper foil capable of effectively suppressing the softening at room temperature and the resulting strength reduction without depending on the thinning of the material before the final rolling. To provide a method.
【０００９】[0009]
【課題を解決するための手段】本発明は、上記の目的を
達成するため、焼鈍と圧延を繰り返すことによって銅の
素材から所定の厚さの銅箔を製造する圧延銅箔の製造方
法において、焼鈍される生地材の温度が５５０〜７５０
℃になるようにして最終圧延前の焼鈍を行うことを特徴
とする圧延銅箔の製造方法を提供するものである。Means for Solving the Problems In order to achieve the above object, the present invention provides a rolled copper foil manufacturing method for manufacturing a copper foil having a predetermined thickness from a copper material by repeating annealing and rolling, The temperature of the material to be annealed is 550 to 750
The present invention provides a method for producing a rolled copper foil, which comprises performing annealing before final rolling at a temperature of ℃.
【００１０】本発明における最終圧延前の焼鈍温度５５
０〜７５０℃は、圧延銅箔の焼鈍において一般に採用さ
れている２００〜５００℃に比較すると格段に高い温度
である。最終圧延前の焼鈍をこのように高い温度に設定
して行う理由は、生地材中に析出している不純物元素を
銅の母相中に固溶させ、生地材そのものの耐軟化性を向
上させるためである。Annealing temperature 55 before final rolling in the present invention
0 to 750 ° C. is a much higher temperature than 200 to 500 ° C. which is generally adopted in annealing rolled copper foil. The reason why the annealing before the final rolling is performed at such a high temperature is that the impurity elements precipitated in the base material are dissolved in the matrix phase of copper to improve the softening resistance of the base material itself. This is because.
【００１１】通常、銅に含まれる不純物元素は、銅の母
相中に原子レベルで固溶して存在する場合と、不純物原
子だけの相、あるいは酸化物のような化合物相の形で析
出する場合があり、Ｓなどの不純物においては、銅の母
相中に固溶状態で存在するときに軟化現象を抑制する性
質を有する一方、析出した状態では、抑制効果を有しな
い特質を備えている。また、高温になるほど母相中に固
溶できる不純物の量は増え、従って、生地材を高温に加
熱した後、析出が進行しない速度で冷却すれば、通常よ
り多くの不純物が固溶した材料を得ることができる。Usually, the impurity element contained in copper is precipitated in the form of a solid solution at the atomic level in the mother phase of copper, in the form of impurity atoms only, or in the form of a compound phase such as oxide. In some cases, impurities such as S have the property of suppressing the softening phenomenon when they exist in a solid solution state in the mother phase of copper, while they have the characteristic that they do not have a suppressing effect in the precipitated state. . In addition, the higher the temperature, the greater the amount of impurities that can be solid-dissolved in the matrix phase. Therefore, if the dough material is heated to a high temperature and then cooled at a rate at which precipitation does not proceed, a material in which more impurities are dissolved than usual will be obtained. Obtainable.
【００１２】発明者らは、以上の観点から圧延銅箔の焼
鈍条件と圧延後の軟化特性の関係を究明し、薄い圧延銅
箔において問題となる常温下での軟化現象を解決したも
ので、生地材の温度を５５０〜７５０℃に設定して最終
圧延前の焼鈍を行うことが、常温での軟化現象と強度低
下を抑制するための条件となることを見いだしたもので
ある。From the above viewpoints, the inventors have investigated the relationship between the annealing conditions of rolled copper foil and the softening characteristics after rolling, and have solved the softening phenomenon at room temperature, which is a problem for thin rolled copper foil. It was found that setting the temperature of the dough material to 550 to 750 ° C. and performing annealing before the final rolling is a condition for suppressing the softening phenomenon and the strength reduction at room temperature.
【００１３】生地材の温度が５５０℃を下廻ると、母相
中への不純物の固溶が進行せずに析出が進行するように
なるため、常温での軟化現象が生ずるようになり、一
方、７５０℃を超過すると、焼鈍後の結晶組織が粗大化
して機械的特性の低下を招くようになる。When the temperature of the dough material falls below 550 ° C., the solid solution of impurities in the matrix phase does not proceed but the precipitation proceeds, so that the softening phenomenon occurs at room temperature. If the temperature exceeds 750 ° C., the crystal structure after annealing becomes coarse and the mechanical properties are deteriorated.
【００１４】生地材を５５０〜７５０℃に保持する時間
は、短く設定することが好ましい。高温での保持時間が
長くなると、結晶の粗大化が起こるようになる。この現
象を避ける意味から、上記温度での保持時間は最長で２
０分とすべきである。It is preferable to set the time for holding the dough material at 550 to 750 ° C. short. When the holding time at high temperature becomes long, the crystal becomes coarse. In order to avoid this phenomenon, the maximum holding time at the above temperature is 2
Should be 0 minutes.
【００１５】５５０〜７５０℃に加熱された後の生地材
は、急速に冷却することが望ましく、３００℃までの降
温を５０℃／分以上の速度で冷却すべきである。冷却速
度が５０℃／分よりも遅くなると、３００〜５００℃の
温度領域において不純物元素の析出が生ずるようにな
り、高温での焼鈍によって与えられた耐軟化性が消失す
るようになる。It is desirable that the dough material after being heated to 550 to 750 ° C. is cooled rapidly, and the temperature reduction to 300 ° C. should be cooled at a rate of 50 ° C./minute or more. If the cooling rate is slower than 50 ° C./min, precipitation of impurity elements will occur in the temperature range of 300 to 500 ° C., and the softening resistance given by annealing at high temperature will disappear.
【００１６】本発明による軟化防止効果は、銅の素材と
して微量の酸素を含有するタフピッチ銅を使用するとき
に大きく現れる。タフピッチ銅を構成材とした圧延銅箔
は、無酸素銅などを構成材とした圧延銅箔に比べて常温
での軟化現象が特に大きく、従って、本発明がタフピッ
チ銅の圧延銅箔の製造に適用されるとき、その効果は顕
著なものとなる。The effect of preventing softening according to the present invention is greatly exhibited when tough pitch copper containing a trace amount of oxygen is used as a copper material. Rolled copper foil with tough pitch copper as a constituent material has a particularly large softening phenomenon at room temperature as compared with rolled copper foil with oxygen-free copper as a constituent material, and thus the present invention is applicable to the production of rolled copper foil of tough pitch copper. When applied, the effect becomes noticeable.
【００１７】本発明により製造される圧延銅箔は、強度
低下が起こりにくいために多くの用途に使用可能であ
る。たとえば、絶縁板と積層されるプリント基板の配線
層、絶縁フィルムと接着させられるフレキシブルプリン
ト基板の配線層、コンデンサの電極、電磁波のシールド
材、表面に活性物質をコーティングされる電池の集電
材、あるいは半導体チップを搭載するためのリードフレ
ーム材など、その硬質性を利用した多くの用途が考えら
れる。The rolled copper foil produced according to the present invention can be used for many purposes because it is unlikely that the strength will decrease. For example, a wiring layer of a printed circuit board laminated with an insulating plate, a wiring layer of a flexible printed circuit board adhered to an insulating film, an electrode of a capacitor, an electromagnetic wave shielding material, a current collecting material of a battery whose surface is coated with an active substance, or There are many possible applications that utilize its hardness, such as lead frame materials for mounting semiconductor chips.
【００１８】[0018]
【発明の実施の形態】次に、本発明による圧延銅箔の製
造方法の実施の形態を説明する。BEST MODE FOR CARRYING OUT THE INVENTION Next, an embodiment of a method for producing a rolled copper foil according to the present invention will be described.
【実施例１】酸素を約３００ｐｐｍ含有し、銅が９９．
９重量％以上を占めるタフピッチ銅の鋳塊を熱間圧延加
工することによって厚さ１２ｍｍの銅の素材を製造し、
次いで、焼鈍と冷間圧延を繰り返すことによって厚さ２
００μｍの最終圧延前の生地材を製造した。Example 1 About 300 ppm oxygen and 99.
A tough pitch copper ingot occupying 9% by weight or more is hot-rolled to produce a 12 mm-thick copper material,
Then, annealing and cold rolling are repeated to obtain a thickness of 2
A final material of 00 μm before final rolling was manufactured.
【００１９】次に、これに、生地材が６００℃に加熱さ
れ、かつその温度に１０分間保持される焼鈍処理を施し
た後、３００℃まで５０℃／分以上の速度で冷却し、そ
の後、これを１５μｍの厚さに冷間圧延加工することに
よって所定の圧延銅箔を製造した。Next, this is subjected to an annealing treatment in which the dough material is heated to 600 ° C. and kept at that temperature for 10 minutes, then cooled to 300 ° C. at a rate of 50 ° C./min or more, and thereafter, A predetermined rolled copper foil was manufactured by cold rolling this to a thickness of 15 μm.
【００２０】[0020]
【実施例２】焼鈍時の生地材の温度を６５０℃に設定し
た以外、他を実施例１と同一条件に設定することによっ
て所定の圧延銅箔を製造した。Example 2 A predetermined rolled copper foil was manufactured by setting the same conditions as in Example 1 except that the temperature of the dough material during annealing was set to 650 ° C.
【００２１】[0021]
【従来例１】実施例１において、焼鈍時の生地材の温度
を４００℃に設定し、他を同一条件とすることによって
所定の圧延銅箔を製造した。PRIOR ART EXAMPLE 1 In Example 1, a predetermined rolled copper foil was manufactured by setting the temperature of the dough material during annealing to 400 ° C. and making the other conditions the same.
【００２２】[0022]
【従来例２】実施例１において、焼鈍時の生地材の温度
を５００℃に設定し、他を同一条件とすることによって
所定の圧延銅箔を製造した。PRIOR ART EXAMPLE 2 In Example 1, a predetermined rolled copper foil was manufactured by setting the temperature of the dough material during annealing to 500 ° C. and making the other conditions the same.
【００２３】[0023]
【従来例３】実施例１において、焼鈍時の生地材の温度
を５００℃に設定するとともに、焼鈍後の冷却速度を１
０℃／分に設定し、他を同一条件とすることによって所
定の圧延銅箔を製造した。Conventional Example 3 In Example 1, the temperature of the dough material during annealing was set to 500 ° C., and the cooling rate after annealing was set to 1
A predetermined rolled copper foil was manufactured by setting the temperature to 0 ° C./min and making the other conditions the same.
【００２４】[0024]
【比較例】実施例１において、焼鈍時の生地材の温度を
８００℃に設定し、他を同一条件とすることによって所
定の圧延銅箔を製造した。[Comparative Example] In Example 1, a predetermined rolled copper foil was manufactured by setting the temperature of the dough material during annealing to 800 ° C and making the other conditions the same.
【００２５】表１に、以上の各例により得られた圧延銅
箔の特性試験結果を示す。各サンプルを常温下に放置し
たときの引張強さの経時変化を示したもので、圧延直
後、３カ月後、６ケ月後、および１２ケ月後の引張強さ
を示したものである。また、表２に、実施例１、２およ
び比較例を対象とした焼鈍後の結晶粒径の測定結果を示
す。Table 1 shows the characteristic test results of the rolled copper foil obtained in each of the above examples. It shows the change with time of the tensile strength when each sample was left at room temperature, and shows the tensile strength immediately after rolling, after 3 months, after 6 months, and after 12 months. Further, Table 2 shows the measurement results of the crystal grain size after annealing for Examples 1 and 2 and Comparative Example.
【００２６】[0026]
【表１】 [Table 1]
【００２７】[0027]
【表２】 [Table 2]
【００２８】表１によれば、実施例１および２における
引張強さの経時変化は緩やかであり、１２ケ月後の引張
強さの残率がそれぞれ８５％および９５％と高いレベル
を維持しているのに比べ、従来例１〜３の１２ケ月後の
引張強度残率は、５１〜６０％と格段に低く、両者の間
には顕著な差が認められる。According to Table 1, the changes in tensile strength with time in Examples 1 and 2 are gradual, and the residual values of the tensile strength after 12 months maintain high levels of 85% and 95%, respectively. In contrast, the tensile strength residual ratio after 12 months of Conventional Examples 1 to 3 is significantly low at 51 to 60%, and a remarkable difference is recognized between the two.
【００２９】また、表２によれば、本発明の数値から外
れる比較例の場合が、焼鈍後において結晶粒径を著しく
粗大化させているのに比べ、実施例の場合には、いずれ
も適度な粒径を有することが示されている。表１と表２
には、軟化現象とそれによる強度低下を防止し、良質の
結晶組織を有した圧延銅箔を得るうえにおいて、最終圧
延前の焼鈍における生地材の温度を５５０〜７５０℃に
設定することの重要性が示されており、本発明による効
果が明確に現れている。Further, according to Table 2, in the case of the comparative example deviating from the numerical value of the present invention, the crystal grain size is remarkably coarsened after annealing, whereas in the case of the example, all are moderate. It has been shown to have various particle sizes. Table 1 and Table 2
In order to prevent the softening phenomenon and the strength reduction due to it, and to obtain a rolled copper foil having a good crystal structure, it is important to set the temperature of the base material in the annealing before final rolling to 550 to 750 ° C. The effect of the present invention is clearly shown.
【００３０】[0030]
【発明の効果】以上説明したように、本発明による圧延
銅箔の製造方法によれば、最終圧延前の生地材を５５０
〜７５０℃の温度で焼鈍した後、３００℃に到達するま
での降温を５０℃／分以上の速度で冷却するため、得ら
れる銅箔は、常温下において軟化しにくい性質を有する
ようになり、従って、強度低下の少ない圧延銅箔を提供
することができる。As described above, according to the method for producing a rolled copper foil according to the present invention, the dough material before the final rolling is 550
After annealing at a temperature of ~ 750 ° C, reach 300 ° C.
Since the temperature is lowered at 50 ° C./min or more , the obtained copper foil has a property of being less likely to be softened at room temperature, and thus a rolled copper foil with less strength reduction can be provided. .
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ Ｃ２２Ｆ 1/00 ６９２ Ｃ２２Ｆ 1/00 ６９２Ａ ６９２Ｂ (72)発明者 嶋田 健 茨城県土浦市木田余町3550番地 日立電 線株式会社 システムマテリアル研究所 内 (56)参考文献 特開 平２−170951（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) B21B 1/00 - 11/00 C22F 1/00 - 1/08 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 7 identification code FI C22F 1/00 692 C22F 1/00 692A 692B (72) Inventor Ken Shimada 3550 Kidayo-cho, Tsuchiura-shi, Ibaraki Hitachi Electric Wire Co., Ltd. System Materials Research Laboratories (56) Reference JP-A-2-170951 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) B21B 1/00-11/00 C22F 1/00- 1/08
Claims (2)
材から所定の厚さの銅箔を製造する圧延銅箔の製造方法
において、最終圧延前の生地材を５５０〜７５０℃の温
度で焼鈍した後、３００℃に到達するまでの降温を５０
℃／分以上の速度で冷却することを特徴とする圧延銅箔
の製造方法。1. A method for producing a rolled copper foil, which produces a copper foil having a predetermined thickness from a copper material by repeating annealing and rolling, wherein a dough material before final rolling is heated at a temperature of 550 to 750 ° C.
After annealing in degrees, and then it decreased to reach the 300 ° C. 50
A method for producing a rolled copper foil, which comprises cooling at a rate of not less than ° C / minute .
間圧延した所定の厚さの板材であることを特徴とする請
求項１記載の圧延銅箔の製造方法。2. The copper material is produced by heating a tough pitch copper ingot.
Method for producing a rolled copper foil of claim 1 Symbol mounting, characterized in that between a rolled predetermined thickness sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23719799A JP3514180B2 (en) | 1999-08-24 | 1999-08-24 | Method for producing rolled copper foil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23719799A JP3514180B2 (en) | 1999-08-24 | 1999-08-24 | Method for producing rolled copper foil |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001062504A JP2001062504A (en) | 2001-03-13 |
| JP3514180B2 true JP3514180B2 (en) | 2004-03-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23719799A Expired - Lifetime JP3514180B2 (en) | 1999-08-24 | 1999-08-24 | Method for producing rolled copper foil |
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Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5320638B2 (en) * | 2008-01-08 | 2013-10-23 | 株式会社Ｓｈカッパープロダクツ | Rolled copper foil and method for producing the same |
| JP2010121154A (en) * | 2008-11-18 | 2010-06-03 | Hitachi Cable Ltd | Method for producing rolled copper foil and rolled copper foil |
| JP5390852B2 (en) * | 2008-12-24 | 2014-01-15 | 株式会社Ｓｈカッパープロダクツ | Rolled copper foil |
| JP2010150597A (en) * | 2008-12-25 | 2010-07-08 | Hitachi Cable Ltd | Rolled copper foil |
| JP2010280191A (en) * | 2009-06-08 | 2010-12-16 | Hitachi Cable Ltd | Copper foil for heat treatment, manufacturing method thereof and flexible printed wiring board |
| JP5342712B1 (en) * | 2011-11-11 | 2013-11-13 | 古河電気工業株式会社 | Rolled copper foil |
| JP5705107B2 (en) * | 2011-12-28 | 2015-04-22 | Jx日鉱日石金属株式会社 | Rolled copper foil for superconducting film formation |
| JP5126434B1 (en) * | 2012-02-17 | 2013-01-23 | 日立電線株式会社 | Rolled copper foil |
| CN103071678A (en) * | 2012-11-20 | 2013-05-01 | 无锡常安通用金属制品有限公司 | Calendaring method of copper foil |
| CN115805436B (en) * | 2022-11-24 | 2023-09-05 | 安徽鑫科铜业有限公司 | Production method of brass strip for LED with uniform surface texture |
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1999
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|---|---|
| JP2001062504A (en) | 2001-03-13 |
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