JP3480828B2 - Solder plating method for printed wiring boards - Google Patents
Solder plating method for printed wiring boardsInfo
- Publication number
- JP3480828B2 JP3480828B2 JP2000091066A JP2000091066A JP3480828B2 JP 3480828 B2 JP3480828 B2 JP 3480828B2 JP 2000091066 A JP2000091066 A JP 2000091066A JP 2000091066 A JP2000091066 A JP 2000091066A JP 3480828 B2 JP3480828 B2 JP 3480828B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- solder plating
- printed wiring
- plating
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半田実装接続端子部と
接点接続端子部が混在するプリント配線板において、接
続信頼性及び生産性に優れた半田メッキ処理方法に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder plating method which is excellent in connection reliability and productivity in a printed wiring board in which a solder mounting connection terminal portion and a contact connection terminal portion are mixed.
【０００２】[0002]
【従来の技術】一般に、エポキシ樹脂プリント配線板、
フレキシブルプリント配線板等の硬質、又は軟質のプリ
ント配線板には、複数の電子部品を電気的に接続するた
め、接続端子部が設けられており、その接続方法や接続
用途が異なるものが混在することが多い。これらの接続
端子部は、接続の目的、用途に応じて表面処理が施され
るが、通常半田実装接続端子部には、スズ：鉛の含有量
が６：４の共晶半田メッキが、接点接続端子部には、光
沢ニッケルー硬質金メッキが最適であるとされている。
ところが、接続方法に合わせて表面処理を複数にする
と、メッキレジスト等の工程が増え、生産性の低下によ
るコスト増加となる。このためプリント配線板は、組立
て段階のみに使用されるような比較的抜き差しの少ない
接点接続端子部であれば、半田実装接続端子部の表面処
理を優先し、スズ：鉛の含有量が６：４の共晶半田メッ
キを用いることが多い。近年、半田実装技術の目覚しい
発達により、半田ペーストを印刷して電子部品を搭載
し、半田リフロー処理をする方法が一般的となってきて
いるが、このような半田実装方法で前記のプリント配線
板を処理すると以下のような問題点があった。即ち、半
田溶融温度以上で半田リフロー処理（通常、リフローピ
ーク温度２００〜２４０℃で、１〜４秒処理）をするた
めに、接点接続端子部の共晶半田メッキも溶融し、接点
接続に要求される平滑性を阻害する場合があった。この
ため、このようなプリント配線板の半田実装には、接点
接続端子部に熱遮蔽板を設置し、半田メッキの溶融を防
いでいたが、生産性が低下し、半田リフロー条件の管理
も困難であった。2. Description of the Related Art Generally, an epoxy resin printed wiring board,
A hard or soft printed wiring board such as a flexible printed wiring board is provided with a connection terminal portion for electrically connecting a plurality of electronic components, and the connection method and connection application are different. Often. These connection terminals are subjected to a surface treatment according to the purpose and purpose of the connection, but usually the solder-mounted connection terminals are contacted with eutectic solder plating with a tin: lead content of 6: 4. It is said that the bright nickel-hard gold plating is most suitable for the connection terminals.
However, if a plurality of surface treatments are used in accordance with the connection method, the number of steps for plating resist and the like increases, resulting in a decrease in productivity and an increase in cost. Therefore, if the printed wiring board is a contact connection terminal portion that is used only at the assembly stage and has a relatively small number of insertion / removal, the surface treatment of the solder mounting connection terminal portion is prioritized, and the tin: lead content is 6: Eutectic solder plating of 4 is often used. In recent years, due to the remarkable development of solder mounting technology, a method of printing a solder paste, mounting an electronic component, and performing a solder reflow treatment has become common. However, there are the following problems. That is, in order to perform a solder reflow process (usually a reflow peak temperature of 200 to 240 ° C. and a process of 1 to 4 seconds) at a solder melting temperature or higher, the eutectic solder plating of the contact connection terminal portion is also melted and required for contact connection. There is a case where the smoothness is impaired. For this reason, when soldering such a printed wiring board, a heat shield was installed at the contact connection terminal part to prevent melting of the solder plating, but this reduced productivity and made it difficult to control solder reflow conditions. Met.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、半田実装接
続端子部と接点接続端子部の２種類の接続用途を有する
プリント配線板において、半田実装のリフロー処理工程
で接点接続端子部上に遮蔽板を必要せず、半田リフロー
後も平滑な表面状態を維持できるプリント配線板の半田
メッキ処理方法を提供ものである。SUMMARY OF THE INVENTION The present invention provides a printed wiring board having two types of connection applications, that is, a solder mounting connection terminal portion and a contact connection terminal portion, and is shielded on the contact connection terminal portion during a solder mounting reflow process. It is an object of the present invention to provide a solder plating method for a printed wiring board, which does not require a plate and can maintain a smooth surface state even after solder reflow.
【０００４】[0004]
【課題を解決するための手段】本発明は、はんだ実装接
続端子部と、接点接続端子部とを有するプリント配線板
にあって、前記端子部の半田メッキの工程において、ス
ズ金属イオン濃度が１０〜１００ｇ／Ｌ、鉛金属イオン
濃度が５〜５０ｇ／Ｌ、及び有機酸濃度１００〜２００
ｇ／Ｌからなる半田メッキ液を用いて、電流密度がスズ
金属イオン濃度値の１／１０〜０．１（Ａ／ｄｍ２）で
メッキ処理し、半田メッキ膜を形成することを特徴とす
るプリント配線板の半田メッキ処理方法で、前記端子部
の半田メッキ膜さは厚さ１〜４μｍである。SUMMARY OF THE INVENTION The present invention is a solder mounting contact.
Printed wiring board having connection terminal portion and contact connection terminal portion
In the step of solder plating the terminal portion, the tin metal ion concentration is 10 to 100 g / L, the lead metal ion concentration is 5 to 50 g / L, and the organic acid concentration is 100 to 200.
It is characterized in that a solder plating film is formed by performing a plating treatment with a current density of 1/10 to 0.1 (A / dm 2 ) of a tin metal ion concentration value using a solder plating solution composed of g / L. in the solder plating method of the printed wiring board, the terminal portions
The thickness of the solder plating film is 1 to 4 μm.
【０００５】[0005]
【発明の実施の形態】以下に、本発明について説明す
る。本発明に用いるスズ金属イオン濃度が１０〜１００
ｇ／Ｌ、鉛金属イオン濃度が５〜５０ｇ／Ｌ、有機酸１
００〜２００ｇ／Ｌを必須成分とする半田メッキ液に
は、必要によりその他の成分として、添加剤、光沢剤等
を含んでもよい。スズ金属イオン濃度としては、１０〜
１００ｇ／Ｌが好ましく、この範囲を外れると析出皮膜
の光沢、物性、メッキ液の寿命が著しく低下するため好
ましくない。プリント配線板のようなパネルにメッキ処
理をする場合には、メッキ浴槽の外へのメッキ液の持ち
出しによるランニングコスト、電流分布によるメッキ膜
の厚さのバラツキを考慮すると、スズ金属イオン濃度
は、好ましくは１５〜６０ｇ／Ｌが望ましい。これに対
し、鉛金属イオン濃度は、より好ましくは７〜３０ｇ／
Ｌが望ましく、この範囲を外れると共晶半田の析出比率
を著しく外れるため好ましくない。BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below. The tin metal ion concentration used in the present invention is 10 to 100.
g / L, lead metal ion concentration 5 to 50 g / L, organic acid 1
The solder plating solution containing 100 to 200 g / L as an essential component may optionally contain additives, brighteners, and the like as other components. The tin metal ion concentration is 10-
100 g / L is preferable, and if it deviates from this range, the gloss of the deposited film, the physical properties, and the life of the plating solution remarkably decrease, which is not preferable. When plating a panel such as a printed wiring board, considering the running cost of bringing the plating solution out of the plating bath and the variation in the thickness of the plating film due to the current distribution, the tin metal ion concentration is It is preferably 15 to 60 g / L. On the other hand, the lead metal ion concentration is more preferably 7 to 30 g /
L is desirable, and if it is out of this range, the precipitation ratio of the eutectic solder is significantly deviated, which is not preferable.
【０００６】有機酸は、アルカノールスルホン酸等の有
機酸であり、有機酸濃度は１００〜２００ｇ／Ｌが好ま
しい。この範囲を外れると上記スズ金属イオン濃度、鉛
金属イオン濃度が不安定になり好ましくない。添加剤、
光沢剤としては、一般にノニオン系界面活性剤、有機ア
ミン、アルデヒド、ケトン、アルコール類等があるが、
一般にスズ：鉛の含有量が６：４の共晶半田メッキ液用
に市販されているものであれば、特に限定されない。前
記半田メッキ液を用いて半田メッキ処理する場合の電流
密度としては、スズ金属イオン濃度値の１／１０〜０．
１（Ａ／ｄｍ2）が好ましい。この範囲を外れると、リ
フロー後のメッキ表面に凹凸を生じ、又は十分な光沢が
得られないいため好ましくない。光沢剤を含む半田メッ
キ液の場合、各光沢剤の光沢範囲により、最適の電流密
度を設定すればよい。本発明でのスズ金属イオン濃度値
とは、使用時のメッキ液中のスズ金属イオン濃度の値を
指す。本発明に用いるメッキ液を用いて、前記電流密度
でメッキ処理することにより、得られる半田メッキの析
出粒子は、メッキ液中の水の電気分解が発生しにくいた
めに、水素原子のメッキ皮膜中の共析がなく、スズと鉛
粒子からなる安定した結晶が得られる。得られるメッキ
膜の厚さは、半田リフローの処理条件であるピーク温度
２００〜２４０℃で１〜４秒間の処理において、熱によ
る半田溶融時の表面張力の流動性を考慮し、１〜４μｍ
に設定することが望ましい。これにより半田リフロー後
も平滑な表面状態のメッキ膜を得ることができる。１〜
４μｍのメッキ膜の厚さは、２〜６ｍ／分の揺動又は噴
流攪拌を行いながら、上記メッキ液中で、上記処理電流
で０．２〜８０分処理を行うことにより得ることができ
る。The organic acid is an organic acid such as alkanol sulfonic acid, and the organic acid concentration is preferably 100 to 200 g / L. Outside of this range, the tin metal ion concentration and the lead metal ion concentration become unstable, which is not preferable. Additive,
Generally, brighteners include nonionic surfactants, organic amines, aldehydes, ketones, alcohols, etc.
There is no particular limitation as long as it is commercially available for a eutectic solder plating solution having a tin: lead content of 6: 4. The current density when performing the solder plating treatment using the solder plating solution is 1/10 to 0.
1 (A / dm 2 ) is preferable. Outside of this range, it is not preferable because unevenness is generated on the plating surface after reflow or sufficient gloss cannot be obtained. In the case of a solder plating solution containing a brightener, the optimum current density may be set according to the gloss range of each brightener. The tin metal ion concentration value in the present invention refers to the tin metal ion concentration value in the plating solution during use. Precipitated particles of solder plating obtained by plating with the current density using the plating solution used in the present invention are less likely to cause electrolysis of water in the plating solution. A stable crystal composed of tin and lead particles can be obtained without any eutectoid. The thickness of the obtained plating film is 1 to 4 μm in consideration of the fluidity of the surface tension when the solder is melted by heat in the processing for 1 to 4 seconds at the peak temperature of 200 to 240 ° C. which is the processing condition of the solder reflow.
It is desirable to set to. This makes it possible to obtain a plated film having a smooth surface state even after solder reflow. 1 to
The thickness of the plating film of 4 μm can be obtained by performing the treatment at the treatment current for 0.2 to 80 minutes in the plating solution while performing the rocking or the jet agitation for 2 to 6 m / min.
【０００７】本発明を、以下実施例で具体的に説明す
る。表１に示す薬液濃度の半田メッキ液を用いて、表１
の電流密度条件でフレキシブルプリント配線板を処理
し、３〜４μｍの半田メッキ膜を形成し、ピーク温度２
４０℃で、４秒間の半田リフロー後の半田メッキ表面の
外観の観察をした。なお、用いた有機酸は、アルカノー
ルスルホン酸である。
・半田リフロー後、
半田メッキの表面に凹凸の発生のないもの：○
半田メッキの表面の一部に凹凸の発生が認められるも
の：△
半田メッキの全面に凹凸が認められるもの：× で表し
た。
この結果から、スズ金属イオン濃度値の１／１０の電流
密度（Ａ／ｄｍ2）で処理された半田メッキ膜は、半田
リフロー後のメッキ膜表面の凹凸の発生がないことが分
かる。The present invention will be specifically described with reference to the following examples. Using the solder plating liquid having the chemical concentration shown in Table 1,
The flexible printed wiring board is processed under the current density condition of 3 to form a solder plating film of 3 to 4 μm, and the peak temperature is 2
The appearance of the solder plating surface after solder reflow for 4 seconds at 40 ° C. was observed. The organic acid used was alkanol sulfonic acid.・ After solder reflow, no unevenness was found on the surface of solder plating: ○ Some unevenness was found on the surface of solder plating: △ Some unevenness was found on the entire surface of solder plating: × . From this result, it can be seen that the solder plating film treated with the current density (A / dm 2 ) which is 1/10 of the tin metal ion concentration value does not have unevenness on the surface of the plating film after solder reflow.
【表１】 [Table 1]
【０００８】[0008]
【発明の効果】本発明は、半田実装接続端子部と接点接
続端子部の接続用途を有するプリント配線板において、
半田実装の半田リフロー処理工程で接点接続端子部上に
半田メッキの溶融を遮蔽する遮蔽板を用いなくとも、半
田リフロー後も平滑な表面状態のメッキ膜を有するプリ
ント配線板の半田メッキ処理方法であり、接続信頼性、
生産性に優れている。Industrial Applicability The present invention provides a printed wiring board having a connection application of a solder mounting connection terminal portion and a contact connection terminal portion,
Even if you do not use a shield plate that shields melting of solder plating on the contact connection terminal part in the solder reflow processing step of solder mounting, you can use the solder plating method for the printed wiring board that has a plated film with a smooth surface state even after solder reflow. Yes, connection reliability,
It has excellent productivity.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭61−48589（ＪＰ，Ａ) 特開 昭59−182986（ＪＰ，Ａ) 特開 平10−25595（ＪＰ，Ａ) 特開 平９−20732（ＪＰ，Ａ) 特開 平８−325783（ＪＰ，Ａ) 特開 平７−300696（ＪＰ，Ａ) 特開 平５−171489（ＪＰ，Ａ) 特開 平４−28893（ＪＰ，Ａ) 特開 平２−85395（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) C25D 3/00 - 7/12 H05K 3/24 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP 61-48589 (JP, A) JP 59-182986 (JP, A) JP 10-25595 (JP, A) JP 9- 20732 (JP, A) JP 8-325783 (JP, A) JP 7-300696 (JP, A) JP 5-171489 (JP, A) JP 4-28893 (JP, A) JP-A-2-85395 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) C25D 3/00-7/12 H05K 3/24
Claims (2)
部とを有するプリント配線板にあって、前記端子部の半
田メッキの工程において、スズ金属イオン濃度が１０〜
１００ｇ／Ｌ、鉛金属イオン濃度が５〜５０ｇ／Ｌ、及
び有機酸濃度１００〜２００ｇ／Ｌからなる半田メッキ
液を用いて、電流密度がスズ金属イオン濃度値の１／１
０〜０．１（Ａ／ｄｍ２）でメッキ処理し、半田メッキ
膜を形成することを特徴とするプリント配線板の半田メ
ッキ処理方法。1. A solder mounting connection terminal portion and a contact connection terminal.
A printed wiring board having a
In the plating process, the tin metal ion concentration is 10-
Using a solder plating solution of 100 g / L, a lead metal ion concentration of 5 to 50 g / L, and an organic acid concentration of 100 to 200 g / L, the current density is 1/1 of the tin metal ion concentration value.
A solder plating method for a printed wiring board, characterized by forming a solder plating film by plating with 0 to 0.1 (A / dm 2 ).
μｍである請求項１記載のプリント配線板の半田メッキ
処理方法。2. The solder plating film of the terminal portion has a thickness of 1 to 4
The solder plating method for a printed wiring board according to claim 1, wherein the solder plating treatment method is μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000091066A JP3480828B2 (en) | 2000-03-29 | 2000-03-29 | Solder plating method for printed wiring boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000091066A JP3480828B2 (en) | 2000-03-29 | 2000-03-29 | Solder plating method for printed wiring boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001279485A JP2001279485A (en) | 2001-10-10 |
| JP3480828B2 true JP3480828B2 (en) | 2003-12-22 |
Family
ID=18606578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000091066A Expired - Fee Related JP3480828B2 (en) | 2000-03-29 | 2000-03-29 | Solder plating method for printed wiring boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3480828B2 (en) |
-
2000
- 2000-03-29 JP JP2000091066A patent/JP3480828B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001279485A (en) | 2001-10-10 |
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