JP3436242B2 - Electrode, method of manufacturing electrode, plasma display device, and method of manufacturing plasma display device - Google Patents
Electrode, method of manufacturing electrode, plasma display device, and method of manufacturing plasma display deviceInfo
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- JP3436242B2 JP3436242B2 JP2000258686A JP2000258686A JP3436242B2 JP 3436242 B2 JP3436242 B2 JP 3436242B2 JP 2000258686 A JP2000258686 A JP 2000258686A JP 2000258686 A JP2000258686 A JP 2000258686A JP 3436242 B2 JP3436242 B2 JP 3436242B2
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- electrode
- metal film
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- exposed
- film
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Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電極及び電極の製
造方法及びプラズマディスプレイ表示装置及びプラズマ
ディスプレイ表示装置の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrode, a method for manufacturing the electrode, a plasma display device, and a method for manufacturing the plasma display device.
【０００２】[0002]
【従来の技術】従来、薄型に適したディスプレイ装置と
して注目されているプラズマディスプレイパネルは、例
えば図６に示す構造を有する。2. Description of the Related Art Conventionally, a plasma display panel, which has attracted attention as a display device suitable for a thin type, has a structure shown in FIG. 6, for example.
【０００３】このプラズマディスプレイパネルは、互い
に対向して配置された前面基板３００と背面基板３０１
とを備えている。前面基板３００上には表示電極３０２
および３０３、誘電体層３０４、およびＭｇＯ誘電体保
護膜３０５が形成されている。また、背面基板３０１の
上には、アドレス電極３０６および誘電体層３０７が形
成されており、その上にはさらに隔壁３０８が形成され
ている。そして、隔壁３０８の側面および誘電体層３０
７上には蛍光体層３０９が塗布されている。This plasma display panel has a front substrate 300 and a rear substrate 301 which are arranged to face each other.
It has and. A display electrode 302 is provided on the front substrate 300.
And 303, the dielectric layer 304, and the MgO dielectric protective film 305 are formed. An address electrode 306 and a dielectric layer 307 are formed on the back substrate 301, and a partition wall 308 is further formed on the address electrode 306. Then, the side surface of the partition wall 308 and the dielectric layer 30.
7 is coated with a phosphor layer 309.
【０００４】前面基板３００と背面基板３０１との間に
は、放電ガス３１０（例えばＮｅ−Ｘｅの混合ガス）
が、６６５００Ｐａ〜８００００Ｐａの圧力で封入され
ている。この放電ガス３１０を表示電極３０２および３
０３の間で放電させて紫外線を発生させ、その紫外線を
蛍光体層３０９に照射することによって、カラー表示を
含む画像表示が可能となる。A discharge gas 310 (for example, a mixed gas of Ne--Xe) is provided between the front substrate 300 and the rear substrate 301.
Is sealed at a pressure of 66,500 Pa to 80,000 Pa. The discharge gas 310 is supplied to the display electrodes 302 and 3
It is possible to display an image including a color display by discharging the light during the period 03 to generate ultraviolet rays and irradiating the fluorescent layers 309 with the ultraviolet rays.
【０００５】なお、通常、表示電極３０２および３０３
とアドレス電極３０６が直角となるように、前面基板３
００と背面基板３０１が配されるが、図６では、説明の
都合上、９０度前面板を回転させて表示している。Incidentally, the display electrodes 302 and 303 are usually used.
So that the address electrode 306 and the address electrode 306 form a right angle.
00 and the rear substrate 301 are arranged, but in FIG. 6, the front plate is rotated by 90 degrees for convenience of explanation.
【０００６】従来の積層金属膜から構成される電極の製
造方法の一例を図４に示す。最初にガラス基板２０２
に、感光性ペーストを印刷等で塗膜し感光性金属電極膜
Ａ２０１を形成する（図４（ａ））。次に、感光性金属
電極膜Ａ２０１を乾燥する（図４（ｂ））。次に、紫外
線２０４を露光マスクＡ２０５を通して照射すると、感
光性金属電極膜Ａ２０３に露光部２０７と未露光部２０
６が形成される（図４（ｃ））。次に、現像を行なうと
露光部２０７のみが基板上に残る（図４（ｄ））。次
に、焼成を行なうと基板上に残った感光性金属電極膜Ａ
が焼き縮む（図４（ｅ））。以上の工程を繰り返したの
が図中の（ｆ）から（ｊ）であり、この方法で感光性金
属膜を積層していく。なお、図中２０８は現像後の感光
性金属電極膜Ａを、２０９は焼成後感光性金属電極膜Ａ
を、２１０は印刷後の感光性金属電極膜Ｂを、２１１は
乾燥後の感光性金属電極膜Ｂを、２１２は紫外線を、２
１３は露光マスクＢを、２１４は感光性金属電極膜Ｂの
未露光部を、２１５は感光性金属電極膜Ｂの露光部を、
２１６は現像後の感光性金属電極膜Ｂを、２１７は焼成
後の感光性金属電極膜Ｂをそれぞれ示す。FIG. 4 shows an example of a conventional method for manufacturing an electrode composed of a laminated metal film. First glass substrate 202
Then, a photosensitive paste is applied by printing or the like to form a photosensitive metal electrode film A201 (FIG. 4A). Next, the photosensitive metal electrode film A201 is dried (FIG. 4B). Next, when ultraviolet rays 204 are irradiated through the exposure mask A205, the exposed portion 207 and the unexposed portion 20 are formed on the photosensitive metal electrode film A203.
6 is formed (FIG. 4 (c)). Next, when development is performed, only the exposed portion 207 remains on the substrate (FIG. 4D). Next, when the baking is performed, the photosensitive metal electrode film A remaining on the substrate
Shrinks (Fig. 4 (e)). The above steps are repeated from (f) to (j) in the figure, and the photosensitive metal film is laminated by this method. In the figure, 208 is the photosensitive metal electrode film A after development, and 209 is the photosensitive metal electrode film A after firing.
210 is the photosensitive metal electrode film B after printing, 211 is the photosensitive metal electrode film B after drying, and 212 is the ultraviolet light.
13 is an exposure mask B, 214 is an unexposed portion of the photosensitive metal electrode film B, and 215 is an exposed portion of the photosensitive metal electrode film B.
Reference numeral 216 shows the photosensitive metal electrode film B after development, and 217 shows the photosensitive metal electrode film B after baking.
【０００７】[0007]
【発明が解決しようとする課題】（第一の課題）感光性
ペーストを用いた金属膜から構成される電極において
は、従来電極膜の異物、ピンホール等による電極の断線
等を防ぎ、電極の信頼性を向上させるため積層構成にて
電極を作成していた。前記積層構成の電極を製造する場
合、従来図４に示すようにガラス等の基板上に感光性ペ
ーストを用いた金属膜Ａをスクリーン印刷等で形成し、
その後、所望の電極パターンに従って紫外線等の光を露
光し、アルカリ等を含む現像液により現像することで前
記電極パターンのみの金属膜Ａを前記基板上に残し、そ
の後、パターニングした金属膜Ａを焼成する事によりペ
ースト中の有機成分等を気化させ、Ａｇ粒子の結合を促
し、導電性の優れた金属電極を形成する。さらに、金属
膜Ｂを金属膜Ａを形成した感光性ペーストを用い、前記
印刷、前記露光、前記現像、前記焼成を再度行う事で、
信頼性のある積層構造の電極を形成する。しかし、これ
らの製造工程は前記現像工程、前記焼成工程を複数回含
むため、製造タクトも長く、製造コストも高くなるとい
う欠点があった。さらに、形成された電極の抵抗値もよ
り低いことが望まれていた。(First Problem) In an electrode composed of a metal film using a photosensitive paste, it is possible to prevent disconnection of the electrode due to foreign matter of the conventional electrode film, pinholes, etc. In order to improve the reliability, the electrodes are formed in a laminated structure. When manufacturing an electrode having the above-mentioned laminated structure, a metal film A using a photosensitive paste is conventionally formed on a substrate such as glass by screen printing as shown in FIG.
Then, according to a desired electrode pattern, light such as ultraviolet rays is exposed and developed with a developing solution containing alkali or the like to leave the metal film A having only the electrode pattern on the substrate, and then the patterned metal film A is baked. By doing so, the organic components and the like in the paste are vaporized, the bonding of Ag particles is promoted, and a metal electrode having excellent conductivity is formed. Further, the printing, the exposure, the development, and the baking are performed again using the photosensitive paste in which the metal film B is formed on the metal film A,
An electrode having a reliable laminated structure is formed. However, since these manufacturing processes include the developing process and the baking process a plurality of times, there are drawbacks that the manufacturing tact is long and the manufacturing cost is high. Furthermore, it has been desired that the resistance value of the formed electrode be lower.
【０００８】本発明は、これらの不都合に鑑みて創案さ
れたものであり、信頼性を保ちつつ製造工程を短縮で
き、かつ抵抗値の低い電極とその製造方法を提供するこ
とを目的としている。The present invention was devised in view of these inconveniences, and it is an object of the present invention to provide an electrode which can shorten the manufacturing process while maintaining reliability and has a low resistance value, and a manufacturing method thereof.
【０００９】（第二の課題）また、前記積層構成の電極
を製造する場合、金属膜Ａの露光部分上に形成した金属
膜Ｂが極端に膜厚が厚くなり、結果、図５に示すような
形状となる。その結果焼成時に焼き縮みや膜が反った
り、最悪の場合は剥離を起こすという欠点があった。本
発明は、これらの不都合に鑑みて創案されたものであ
り、積層電極膜を一括形成する際に所望の膜厚に制御が
可能で、製造工程を短縮でき、焼き縮みや剥離のない信
頼性を有する電極とその製造方法を提供することを目的
としている。(Second Problem) Further, when the electrode having the above-mentioned laminated structure is manufactured, the metal film B formed on the exposed portion of the metal film A becomes extremely thick, and as a result, as shown in FIG. It becomes a shape. As a result, there are drawbacks such as shrinkage and warpage of the film during firing, and peeling in the worst case. The present invention was devised in view of these inconveniences, it is possible to control the desired film thickness when collectively forming a laminated electrode film, can shorten the manufacturing process, reliability without shrinkage and peeling. It is an object of the present invention to provide an electrode having the above and a manufacturing method thereof.
【００１０】本発明は、積層電極膜を一括形成する際に
所望の膜厚に制御が可能で、製造工程を短縮でき、焼き
縮みや剥離のない信頼性を有する電極とその製造方法を
提供することを目的としている。The present invention provides an electrode which can be controlled to a desired film thickness when a laminated electrode film is collectively formed, can shorten the manufacturing process, and is reliable without shrinkage or peeling, and a manufacturing method thereof. Is intended.
【００１１】[0011]
【課題を解決するための手段】本発明に係る電極は、感
光性ペースト材料を用いて、印刷、乾燥、露光を複数回
繰り返した後、一括して現像することを特徴とする。An electrode according to the present invention is characterized in that a photosensitive paste material is used, printing, drying and exposure are repeated a plurality of times and then collectively developed.
【００１２】また、感光性ペースト中に、Ａｇ、Ｃｕ、
Ａｌのうち少なくとも一つを含んでいる事を特徴とす
る。Further, Ag, Cu,
It is characterized by containing at least one of Al.
【００１３】また、線幅が、積層膜数が多くなるほど減
少することを特徴とする。Further, the line width is reduced as the number of laminated films increases.
【００１４】また、パターン形成した感光性ペーストを
一括で焼成することを特徴とする。Further, it is characterized in that the patterned photosensitive paste is fired at once.
【００１５】また、プラズマディスプレイパネル用の電
極であることを特徴とする。Further, it is characterized in that it is an electrode for a plasma display panel.
【００１６】本発明に係る電極の製造方法は、感光性ペ
ースト材料を用いて、印刷、乾燥、露光を複数回繰り返
した後、一括して現像することを特徴とする。The method of manufacturing an electrode according to the present invention is characterized in that a photosensitive paste material is used, printing, drying and exposure are repeated a plurality of times, and then development is performed collectively.
【００１７】また、乾燥温度プロファイルが、矩形状で
あることを特徴とする。Further, the drying temperature profile has a rectangular shape.
【００１８】また、露光用マスクの線幅が、積層膜数が
多くなるほど減少することを特徴とする。Further, the line width of the exposure mask decreases as the number of laminated films increases.
【００１９】また、現像液が、アルカリ溶液を含んでい
ることを特徴とする。Further, the developing solution is characterized by containing an alkaline solution.
【００２０】また、パターン形成した感光性ペーストを
一括で焼成することを特徴とする。Further, the invention is characterized in that the patterned photosensitive paste is fired at once.
【００２１】また、プラズマディスプレイパネル用の電
極であることを特徴とする。Further, it is characterized in that it is an electrode for a plasma display panel.
【００２２】本発明に係る電極およびその製造方法は、
金属膜から構成される電極で、前記金属電極が感光性ペ
ーストを用いて、異なる露光量からなる電極膜が積層形
成されていることを特徴とする。The electrode and the manufacturing method thereof according to the present invention are
An electrode formed of a metal film, wherein the metal electrode is formed of a photosensitive paste, and electrode films having different exposure amounts are laminated.
【００２３】また、積層形成される電極膜のうち、最表
面の電極膜露光量が直下の電極膜露光量膜よりも低いこ
とを特徴とする。Further, among the laminated electrode films, the exposure amount of the electrode film on the outermost surface is lower than that of the electrode film immediately below.
【００２４】また、異なる露光量にて露光した後、一括
して現像することを特徴とする。Further, it is characterized in that after the exposure is performed with different exposure amounts, the development is carried out collectively.
【００２５】また、積層形成される電極膜のうち、最表
面の電極膜線幅が直下の電極膜線幅より小さいことを特
徴とする。Further, the electrode film line width of the outermost surface of the laminated electrode films is smaller than the electrode film line width immediately below.
【００２６】また、積層形成される電極膜のうち、最下
の電極膜が感光性を有していない電極膜であることを特
徴とする。Further, the lowermost electrode film among the laminated electrode films is a non-photosensitive electrode film.
【００２７】また、積層形成される電極膜のうち、最下
の電極膜が、最上の電極膜より可視光透過率が低いこと
を特徴とする。Further, the lowermost electrode film of the laminated electrode films has a lower visible light transmittance than the uppermost electrode film.
【００２８】また、積層形成される電極膜に黒色顔料が
含有されていることを特徴とする。Further, the laminated electrode film is characterized by containing a black pigment.
【００２９】また、積層形成される電極膜が、それぞれ
異なる成分で形成されることを特徴とする。Further, it is characterized in that the laminated electrode films are formed of different components.
【００３０】また、感光性電極ペーストをスクリーン印
刷にて形成することを特徴とする。Further, it is characterized in that the photosensitive electrode paste is formed by screen printing.
【００３１】また、電極膜が形成されている基板が、ガ
ラス基板もしくは、シリコン酸化物、もしくはシリコン
窒化物からなることを特徴とする。Further, the substrate on which the electrode film is formed is made of a glass substrate, silicon oxide, or silicon nitride.
【００３２】また、プラズマディスプレイパネル用の電
極であることを特徴とする。It is also characterized in that it is an electrode for a plasma display panel.
【００３３】本発明の電極およびその製造方法により、
製造工程を短縮し、抵抗値が低く、信頼性の高い電極が
得られ、本発明を採用した際には、信頼性の高い高品質
な電極を用いた表示デバイス等が安定して得られるとい
う利点がある。According to the electrode of the present invention and the method for producing the same,
It is said that the manufacturing process is shortened, a low resistance value and a highly reliable electrode can be obtained, and when the present invention is adopted, a display device etc. using a highly reliable and high quality electrode can be stably obtained. There are advantages.
【００３４】上記の手段により、製造工程が短縮できる
理由と、抵抗値が低くなる理由について下記に述べる。The reason why the manufacturing process can be shortened and the resistance value is lowered by the above means will be described below.
【００３５】まず、製造工程が短縮できる理由について
述べる。積層構造の電極を形成する場合、一度の露光に
よりパターンを形成すると露光マスクに付着するダスト
により断線を起こしやすくなる。しかし露光を複数回に
増すと、一度目の露光マスクと同じ箇所にダストが付着
する可能性は極めて少なく、断線等の無い信頼性の高い
電極を形成する事が可能となる。また、金属膜を積層す
るにあたり、現像、焼成工程を一括して行うため、製造
工程を短縮する事が可能となる。特に、タクトが長く、
消費電力も高い焼成工程を一括で行う事により製造コス
トも安価とする事が可能となる。First, the reason why the manufacturing process can be shortened will be described. When forming an electrode having a laminated structure, if a pattern is formed by a single exposure, the dust attached to the exposure mask is likely to cause disconnection. However, if the exposure is increased to a plurality of times, it is extremely unlikely that dust will be attached to the same location as the exposure mask for the first time, and it is possible to form a highly reliable electrode without disconnection. In addition, since the development and firing steps are collectively performed when stacking the metal films, the manufacturing steps can be shortened. Especially, the tact is long,
It is possible to reduce the manufacturing cost by performing the firing process with high power consumption all at once.
【００３６】次に抵抗値を低くできる理由について述べ
る。感光性ペーストを露光するとペースト中の感光性成
分が光照射により架橋反応し重合、高分子化する。架橋
により重合した部分は未露光部よりも密度が疎に変化す
る。その結果露光部は未露光部と比較すると溶剤の吸収
性が高まる。前記のような露光部と未露光部が同時に存
在する膜状にさらに感光性ペーストを形成すると、前記
露光部と未露光部の溶剤吸収性の差により、積層したペ
ーストが乾燥時に露光部に移動集中する。この時の乾燥
プロファイルが矩形状の温度勾配が激しい場合、前記露
光部上のペーストと未露光部上のペーストの膜厚減少率
は、差が大きく異なる。その結果露光部上の膜が極端に
厚くなるため、焼成後の膜厚も厚くなり、従来の複数回
現像、焼成を行う製造工程で形成した電極より断面積が
大きくなる。したがって、抵抗値は断面積と反比例の関
係にあるため、形成した電極の抵抗値を低くする事が可
能となる。Next, the reason why the resistance value can be lowered will be described. When the photosensitive paste is exposed to light, the photosensitive component in the paste undergoes a cross-linking reaction by light irradiation to polymerize and become a polymer. The density of the part polymerized by the cross-linking changes to that of the unexposed part. As a result, the solvent absorbability of the exposed area is higher than that of the unexposed area. When a photosensitive paste is further formed in the form of a film in which the exposed part and the unexposed part are present at the same time, the laminated paste moves to the exposed part during drying due to the difference in solvent absorption between the exposed part and the unexposed part. concentrate. When the drying profile at this time has a rectangular rectangular temperature gradient, the difference in the film thickness reduction rate between the paste on the exposed portion and the paste on the unexposed portion is significantly different. As a result, the film on the exposed portion becomes extremely thick, and the film thickness after baking also becomes large, and the cross-sectional area becomes larger than the electrode formed in the conventional manufacturing process in which development and baking are performed a plurality of times. Therefore, since the resistance value is in inverse proportion to the cross-sectional area, the resistance value of the formed electrode can be lowered.
【００３７】以上の結果より、積層電極膜を一括形成す
る際に所望の膜厚に制御が可能で、製造工程を短縮で
き、焼き縮みや剥離のない信頼性を有する電極とその製
造方法を提供できる。From the above results, it is possible to control the film thickness to a desired value when collectively forming laminated electrode films, shorten the manufacturing process, and provide a reliable electrode without shrinkage or peeling and a manufacturing method thereof. it can.
【００３８】本発明の電極およびその製造方法により、
製造工程を短縮し、焼き縮みや剥離を生じない信頼性の
高い電極が得られ、本発明を採用した際には、信頼性の
高い高品質な電極を用いた表示デバイス等が安定して得
られるという利点がある。By the electrode of the present invention and the method for producing the same,
A highly reliable electrode that does not cause shrinkage or peeling can be obtained by shortening the manufacturing process, and when the present invention is adopted, a display device or the like using a highly reliable and high quality electrode can be stably obtained. The advantage is that
【００３９】上記の手段により、露光量が異なる感光性
ペーストを積層した金属電極膜が膜厚が制御可能である
理由について下記に述べる。The reason why the film thickness of the metal electrode film formed by laminating the photosensitive pastes having different exposure amounts can be controlled by the above means will be described below.
【００４０】感光性ペーストを露光するとペースト中の
感光性成分が光照射により架橋反応し重合、高分子化す
る。架橋により重合した部分は未露光部よりも密度が疎
に変化する。その結果露光部は未露光部と比較すると溶
剤の吸収性が高まる。前記のような露光部と未露光部が
同時に存在する膜状にさらに感光性ペーストを形成する
と、前記露光部と未露光部の溶剤の吸収性の差により積
層したペーストが露光部に移動集中する。When the photosensitive paste is exposed to light, the photosensitive component in the paste undergoes a crosslinking reaction by light irradiation to polymerize and become a polymer. The density of the part polymerized by the cross-linking changes to that of the unexposed part. As a result, the solvent absorbability of the exposed area is higher than that of the unexposed area. When a photosensitive paste is further formed in a film shape in which the exposed portion and the unexposed portion are present at the same time, the laminated paste moves and concentrates on the exposed portion due to the difference in solvent absorption between the exposed portion and the unexposed portion. .
【００４１】その結果露光部上の膜が極端に厚くなる。
膜厚が厚くなれば焼成時の焼き縮みが大きくなり、剥離
する欠陥となる。As a result, the film on the exposed portion becomes extremely thick.
The thicker the film, the greater the shrinkage during baking, resulting in a peeling defect.
【００４２】また、光照射されない未露光部分は現像液
に可溶性である。露光されても架橋の状態は照射される
光の露光量によって変化し、高露光量であるほど架橋は
進行する。従って、高露光量であると溶解しにくく、低
露光量であると容易に現像液に溶解する。The unexposed portion which is not irradiated with light is soluble in the developing solution. Even when exposed to light, the state of crosslinking changes depending on the exposure amount of the irradiation light, and the higher the exposure amount, the more the crosslinking proceeds. Therefore, when the exposure amount is high, it hardly dissolves, and when the exposure amount is low, it easily dissolves in the developing solution.
【００４３】図３に、本発明において使用している感光
性金属ペーストの露光部分の現像液溶解性を示す。露光
量の増加により溶解速度は低下し、不溶化が進行するこ
とがわかる。図中、３００ｍＪ／ｃｍ2以上ではほぼ一
定の溶解速度である。よって、積層する各電極膜の露光
量を溶解速度の異なる２点以上の露光量に設定すること
により、１回の現像工程で各層異なる膜厚に仕上げるこ
とが可能である。FIG. 3 shows the solubility of the photosensitive metal paste used in the present invention in the developing solution in the exposed portion. It can be seen that the dissolution rate decreases and the insolubilization progresses as the exposure amount increases. In the figure, at 300 mJ / cm 2 or more, the dissolution rate is almost constant. Therefore, by setting the exposure dose of each electrode film to be laminated to two or more exposure doses having different dissolution rates, it is possible to finish the film thickness of each layer in a single development step.
【００４４】以上の結果より、積層電極膜を一括形成す
る際に所望の膜厚に制御が可能で、製造工程を短縮で
き、焼き縮みや剥離のない信頼性を有する電極とその製
造方法を提供できる。From the above results, it is possible to control the film thickness to a desired value when a laminated electrode film is collectively formed, shorten the manufacturing process, and provide a reliable electrode without shrinkage or peeling and a manufacturing method thereof. it can.
【００４５】[0045]
【発明の実施の形態】（実施の形態１）図１は本実施の
形態に係る電極の要部構成とその製造工程を示す概略図
である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (Embodiment 1) FIG. 1 is a schematic view showing the structure of an essential part of an electrode according to the present embodiment and its manufacturing process.
【００４６】最初にガラス基板１０２上に、Ａｇ粒子を
含むネガ型感光性金属ペーストをスクリーン印刷を用い
感光性金属電極膜Ａ１０１を形成する（図１（ａ））。
次に、感光性金属電極膜Ａ１０１を温度が室温から１０
５℃まで直線的に上昇する温度プロファイルが矩形状の
ＩＲ炉により乾燥すると、乾燥後の感光性金属電極膜Ａ
１０３は印刷後の感光性金属電極膜Ａ１０１より膜厚が
低下する（図１（ｂ））。次に、紫外線１０４を線幅１
１５μｍの露光マスクＡ１０５を通して露光すると感光
性金属電極膜Ａ１０３に露光部１０７と未露光部１０６
が形成される（図１（ｃ））。次に、露光済みの感光性
金属電極膜Ａ上に感光性金属電極膜Ａと同一の感光性ペ
ーストをスクリーン印刷を用い感光性金属電極膜Ｂ１０
８を形成すると、感光性金属電極膜Ａの露光部１０７上
の感光性金属電極膜Ｂの膜厚、感光性金属電極膜Ａの未
露光部１０６上の感光性金属電極膜Ｂの膜厚より薄くな
る（図１（ｄ））。次に、温度プロファイルが矩形状の
ＩＲ炉により乾燥すると、感光性金属電極膜Ａの露光部
１０７上の膜厚が、感光性金属電極膜Ａの未露光部１０
６上の膜厚より厚い感光性金属電極膜Ｂ１０９が形成さ
れる（図１（ｅ））。次に、紫外線１１０を、線幅８５
μｍの露光マスクＢ１１１を通して露光すると、感光性
金属電極膜Ａ１０９に露光部１１３と未露光部１１２が
形成される（図１（ｆ））。次に、炭酸ナトリウムを
０．４ｗｔ％含む現像液にて現像すると図１（ｃ）およ
び図１（ｆ）において未露光の部分が除去され、露光さ
れた部分である感光性金属電極膜Ａ１１５と感光性金属
電極膜Ｂ１１４のみが残る（図１（ｇ））。次に、焼成
を行なうと、現像で残った感光性金属電極膜Ａ１１５と
感光性金属電極膜Ｂ１１４が焼き縮み、導電性の良い感
光性金属電極膜Ａ１１７と感光性金属電極膜Ｂ１１６が
形成される（図１（ｈ））。この製造工程で電極を製造
すると、図４に示される従来の電極の製造方法よりも、
短縮された製造工程を提供することができる。First, a photosensitive metal electrode film A101 is formed on a glass substrate 102 by screen printing a negative photosensitive metal paste containing Ag particles (FIG. 1A).
Next, the temperature of the photosensitive metal electrode film A101 is changed from room temperature to 10
When dried in an IR furnace having a rectangular temperature profile that linearly rises to 5 ° C., the photosensitive metal electrode film A after drying is dried.
The film thickness of 103 is smaller than that of the photosensitive metal electrode film A101 after printing (FIG. 1B). Next, a line width of 1
When exposed through a 15 μm exposure mask A105, an exposed portion 107 and an unexposed portion 106 are formed on the photosensitive metal electrode film A103.
Are formed (FIG. 1C). Next, the same photosensitive paste as the photosensitive metal electrode film A is screen-printed on the exposed photosensitive metal electrode film A to form a photosensitive metal electrode film B10.
8 is formed, the thickness of the photosensitive metal electrode film B on the exposed portion 107 of the photosensitive metal electrode film A and the thickness of the photosensitive metal electrode film B on the unexposed portion 106 of the photosensitive metal electrode film A It becomes thinner (Fig. 1 (d)). Next, when the film is dried in an IR oven having a rectangular temperature profile, the film thickness on the exposed portion 107 of the photosensitive metal electrode film A becomes unexposed portion 10 of the photosensitive metal electrode film A.
A photosensitive metal electrode film B109 thicker than the film thickness above 6 is formed (FIG. 1E). Next, ultraviolet rays 110 are applied to a line width of 85
When exposed through a μm exposure mask B111, an exposed portion 113 and an unexposed portion 112 are formed on the photosensitive metal electrode film A109 (FIG. 1 (f)). Next, by developing with a developing solution containing 0.4 wt% of sodium carbonate, the unexposed portion in FIGS. 1C and 1F is removed, and the exposed portion is the photosensitive metal electrode film A115. Only the photosensitive metal electrode film B114 remains (FIG. 1 (g)). Next, when baking is performed, the photosensitive metal electrode film A115 and the photosensitive metal electrode film B114 remaining after development are shrunk, and the photosensitive metal electrode film A117 and the photosensitive metal electrode film B116 having good conductivity are formed. (FIG. 1 (h)). When an electrode is manufactured by this manufacturing process, the electrode is
It is possible to provide a shortened manufacturing process.
【００４７】また、本実施の形態により形成された電極
の膜厚及び抵抗値と、従来の電極の製造方法により形成
された電極の膜厚及び抵抗値の一例を（表１）に示す。Further, Table 1 shows an example of the film thickness and resistance value of the electrode formed by this embodiment and the film thickness and resistance value of the electrode formed by the conventional electrode manufacturing method.
【００４８】[0048]
【表１】 [Table 1]
【００４９】（表１）の抵抗値は、長さ９６０ｍｍ、幅
１００μｍの電極の抵抗値の一例である。本実施の形態
により形成された電極は、従来の電極の製造方法により
形成された電極より膜厚が厚いため、抵抗値が小さくな
っている。The resistance value shown in Table 1 is an example of the resistance value of an electrode having a length of 960 mm and a width of 100 μm. The electrode formed according to the present embodiment has a larger film thickness than the electrode formed by the conventional electrode manufacturing method, and thus has a smaller resistance value.
【００５０】本実施の形態において、感光性ペーストは
ネガ型でなくてもよく本実施の形態に限定されるもので
はない。また、感光性ペーストはＡｇを含んでなくても
よく本実施の形態に限定されるものではない。また、感
光性ペーストは金属電極膜Ａと金属電極膜Ｂとは同一で
なくてもよく本実施の形態に限定されるものではない。
また、積層される層数は２層でなくてもよく本実施の形
態に限定されるものではない。また、感光性ペーストは
スクリーン印刷で形成されなくてもよく本実施の形態に
限定されるものではない。また、印刷後の乾燥はＩＲ炉
においてなされなくてもよく本実施の形態に限定される
ものではない。また、乾燥温度は１０５℃でなくてもよ
く本実施の形態に限定されるものではない。また、露光
マスクの線幅は１１５μｍ、８５μｍでなくてもよく本
実施の形態に限定されるものではない。また、各層にお
ける露光マスクの線幅は、上層になるほど小さくならな
くてもよく本実施の形態に限定されるものではない。ま
た、現像液は炭酸ナトリウムを０．４ｗｔ％含まなくて
もよく本実施の形態に限定されるものではない。また、
電極膜が形成される基板はガラス基板でなくてもよく本
実施の形態に限定されるものではない。またガラス等の
基板上に透明電極等があらかじめ形成されていてもよ
い。また、（表１）の値は単なる一例に過ぎず、比較例
と実施例の膜厚と抵抗値の大小関係を満たしていれば、
その絶対値は表１の値に限定されるものではない。In this embodiment, the photosensitive paste does not have to be a negative paste and is not limited to this embodiment. The photosensitive paste need not contain Ag and is not limited to this embodiment. Further, the photosensitive electrode does not have to be the same as the metal electrode film A and the metal electrode film B, and is not limited to this embodiment.
Further, the number of layers to be laminated is not limited to two and is not limited to this embodiment. Further, the photosensitive paste need not be formed by screen printing and is not limited to this embodiment. Further, the drying after printing may not be performed in the IR furnace and is not limited to this embodiment. Further, the drying temperature does not have to be 105 ° C. and is not limited to this embodiment. The line width of the exposure mask is not limited to 115 μm and 85 μm, and is not limited to this embodiment. In addition, the line width of the exposure mask in each layer does not have to be smaller in the upper layer, and is not limited to this embodiment. Further, the developing solution need not contain 0.4 wt% of sodium carbonate and is not limited to this embodiment. Also,
The substrate on which the electrode film is formed does not have to be a glass substrate and is not limited to this embodiment. Further, a transparent electrode or the like may be previously formed on a substrate such as glass. Further, the values in (Table 1) are merely examples, and if the magnitude relation between the film thickness and the resistance value of the comparative example and the example is satisfied,
The absolute value is not limited to the value in Table 1.
【００５１】（実施の形態２）図２は本実施の形態に係
る電極の要部構成とその製造工程を示す概略図であり、
従来例と同様であり、図２について詳細に説明する。(Embodiment 2) FIG. 2 is a schematic view showing the structure of an essential part of an electrode according to the present embodiment and its manufacturing process.
This is similar to the conventional example, and FIG. 2 will be described in detail.
【００５２】最初にガラス基板上に、感光性金属ペース
トをスクリーン印刷を用い感光性金属電極膜１を形成す
る（図２（ａ））。First, a photosensitive metal electrode film 1 is formed on a glass substrate by screen printing a photosensitive metal paste (FIG. 2A).
【００５３】次に、該感光性金属電極膜１を所望のパタ
ーンおよび露光量１で露光する（図２（ｂ））。Next, the photosensitive metal electrode film 1 is exposed with a desired pattern and an exposure amount of 1 (FIG. 2 (b)).
【００５４】次に露光済みの感光性金属電極膜１上に感
光性金属電極膜１と同一の感光性ペーストをスクリーン
印刷を用い感光性金属電極膜２を形成する（図２
（ｃ））。Next, a photosensitive metal electrode film 2 is formed on the exposed photosensitive metal electrode film 1 by screen printing the same photosensitive paste as the photosensitive metal electrode film 1 (FIG. 2).
(C)).
【００５５】露光された感光性金属電極膜１上の感光性
金属電極膜２は膜厚が未露光部より厚くなる（図２
（ｃ））。The photosensitive metal electrode film 2 on the exposed photosensitive metal electrode film 1 is thicker than the unexposed portion (FIG. 2).
(C)).
【００５６】次に該感光性金属電極膜２を所望のパター
ンおよび露光量２で露光する。Next, the photosensitive metal electrode film 2 is exposed with a desired pattern and an exposure amount of 2.
【００５７】ここで露光量１と２は露光量１＞露光量２
の関係を有する（図２（ｄ））。Here, exposure amounts 1 and 2 are exposure amount 1> exposure amount 2
(FIG. 2 (d)).
【００５８】次に感光性金属電極膜１および２が積層さ
れた電極膜を現像液で現像しパターン化する（図２
（ｅ））。Next, the electrode film in which the photosensitive metal electrode films 1 and 2 are laminated is developed with a developing solution and patterned (FIG. 2).
(E)).
【００５９】露光量１と２は露光量１＞露光量２の関係
であるから金属電極膜２の溶解性が高く膜厚は金属電極
膜１と同程度もしくは薄くなる。これにより、金属電極
膜２の膜厚を厚くすることなく積層された金属膜を形成
することができる。Since the exposure doses 1 and 2 have a relation of exposure dose 1> exposure dose 2, the solubility of the metal electrode film 2 is high and the film thickness thereof is the same as or thinner than that of the metal electrode film 1. As a result, a stacked metal film can be formed without increasing the thickness of the metal electrode film 2.
【００６０】なお、このとき、露光量に応じて電極膜線
幅は変化し、露光量が高くすれば、線幅は太くなる。こ
のため、本実施の形態では表面の電極膜線幅が直下の電
極膜線幅より小さくなる。At this time, the line width of the electrode film changes according to the exposure amount, and the line width becomes thicker as the exposure amount is increased. Therefore, in the present embodiment, the electrode film line width on the surface is smaller than the electrode film line width immediately below.
【００６１】（表２）に露光量１と露光量２を様々に変
化させた場合の金属電極膜１および金属電極膜２の膜厚
を示す。Table 2 shows the film thicknesses of the metal electrode film 1 and the metal electrode film 2 when the exposure amount 1 and the exposure amount 2 are variously changed.
【００６２】[0062]
【表２】 [Table 2]
【００６３】（表２）より異なる露光量で露光すること
により良好な膜厚を得ることができることがわかる。ま
た、比較例として同表１中に露光量１と露光量２が同一
の場合の膜厚を示した。It can be seen from Table 2 that a good film thickness can be obtained by exposing with different exposure doses. As a comparative example, Table 1 shows the film thickness when the exposure amount 1 and the exposure amount 2 are the same.
【００６４】なお、感光性ペーストは、金属電極膜１と
金属電極膜２とは同一でなくてもよく本実施の形態に限
定されるものではない。また、積層される層数は２層で
なくてもよく本実施の形態に限定されるものではない。
また、感光性ペーストはスクリーン印刷で形成されなく
てもよく本実施の形態に限定されるものではない。ま
た、電極膜が形成される基板はガラス基板でなくてもよ
く本実施の形態に限定されるものではない。またガラス
等の基板上に透明電極等があらかじめ形成されていても
よい。The photosensitive paste does not have to be the same as the metal electrode film 1 and the metal electrode film 2 and is not limited to this embodiment. Further, the number of layers to be laminated is not limited to two and is not limited to this embodiment.
Further, the photosensitive paste need not be formed by screen printing and is not limited to this embodiment. The substrate on which the electrode film is formed does not have to be a glass substrate and is not limited to this embodiment. Further, a transparent electrode or the like may be previously formed on a substrate such as glass.
【００６５】[0065]
【発明の効果】以上説明したように、本発明に係る電極
およびその製造方法によれば、低抵抗の積層金属電極膜
を短い製造工程で形成する事が出来る。As described above, according to the electrode and the method of manufacturing the same of the present invention, it is possible to form a laminated metal electrode film having a low resistance in a short manufacturing process.
【００６６】また、本発明に係る電極およびその製造方
法によれば、積層金属電極膜を各層所望の膜厚に制御で
き、短い製造工程で焼き縮みや剥離のない良好な電極を
形成する事が出来る。Further, according to the electrode and the method of manufacturing the same of the present invention, the laminated metal electrode film can be controlled to have a desired film thickness for each layer, and a good electrode without shrinkage or peeling can be formed in a short manufacturing process. I can.
【図１】本発明の実施の形態に係る電極の要部構成とそ
の製造工程を示す概略図FIG. 1 is a schematic diagram showing a configuration of essential parts of an electrode according to an embodiment of the present invention and a manufacturing process thereof.
【図２】本発明の実施の形態に係る電極の要部構成とそ
の製造工程を示す概略図FIG. 2 is a schematic diagram showing a configuration of essential parts of an electrode according to an embodiment of the present invention and a manufacturing process thereof.
【図３】本発明の実施の形態に係る感光性ペーストの露
光部の現像液溶解性を示す概略図FIG. 3 is a schematic diagram showing the solubility of a developing solution in an exposed portion of a photosensitive paste according to an embodiment of the present invention.
【図４】従来の電極の要部構成とその製造工程を示す概
略図FIG. 4 is a schematic diagram showing a configuration of a main part of a conventional electrode and a manufacturing process thereof.
【図５】従来の電極の要部構成を示す概略図FIG. 5 is a schematic diagram showing a configuration of a main part of a conventional electrode.
【図６】従来のプラズマディスプレイパネルの構造図FIG. 6 is a structural diagram of a conventional plasma display panel.
１０１ 印刷後の感光性金属電極膜Ａ １０２ ガラス基板 １０３ 乾燥後の感光性金属電極膜Ａ １０４ 紫外線 １０５ 露光マスクＡ １０６ 感光性金属電極膜Ａの未露光部分 １０７ 感光性金属電極膜Ａの露光部分 １０８ 印刷後の感光性金属電極膜Ｂ １０９ 印刷後の感光性金属電極膜Ｂ １１０ 紫外線 １１１ 露光マスクＢ １１２ 感光性金属電極膜Ｂの未露光部分 １１３ 感光性金属電極膜Ｂの露光部分 １１４ 現像後の感光性金属電極膜Ｂ １１５ 現像後の感光性金属電極膜Ａ １１６ 焼成後の感光性金属電極膜Ｂ １１７ 焼成後の感光性金属電極膜Ａ ２０１ 印刷後の感光性金属電極Ａ ２０２ ガラス基板 ２０３ 乾燥後の感光性金属電極Ａ ２０４ 紫外線 ２０５ 露光マスクＡ ２０６ 感光性金属電極膜Ａの未露光部 ２０７ 感光性金属電極膜Ａの露光部 ２０８ 現像後の感光性金属電極膜Ａ ２０９ 焼成後の感光性金属電極膜Ａ ２１０ 印刷後の感光性金属電極膜Ｂ ２１１ 乾燥後の感光性金属電極膜Ｂ ２１２ 紫外線 ２１３ 露光マスクＢ ２１４ 感光性金属電極膜Ｂの未露光部 ２１５ 感光性金属電極膜Ｂの露光部 ２１６ 現像後の感光性金属電極膜Ｂ ２１７ 焼成後の感光性金属電極膜Ｂ 101 Photosensitive metal electrode film A after printing 102 glass substrate 103 Photosensitive metal electrode film A after drying 104 UV 105 exposure mask A 106 Unexposed part of photosensitive metal electrode film A 107 Exposed part of photosensitive metal electrode film A 108 Photosensitive metal electrode film B after printing 109 Photosensitive metal electrode film B after printing 110 UV 111 exposure mask B 112 Unexposed Part of Photosensitive Metal Electrode Film B 113 Exposed part of photosensitive metal electrode film B 114 Photosensitive metal electrode film B after development 115 Photosensitive metal electrode film A after development 116 Photosensitive metal electrode film B after firing 117 Photosensitive metal electrode film A after baking 201 Photosensitive metal electrode A after printing 202 glass substrate 203 Photosensitive metal electrode A after drying 204 UV 205 exposure mask A 206 Unexposed Area of Photosensitive Metal Electrode Film A 207 Exposed part of photosensitive metal electrode film A 208 Photosensitive metal electrode film A after development 209 Photosensitive metal electrode film A after firing 210 Photosensitive metal electrode film B after printing 211 Photosensitive metal electrode film B after drying 212 UV 213 exposure mask B 214 Unexposed part of photosensitive metal electrode film B 215 Exposed part of photosensitive metal electrode film B 216 Photosensitive metal electrode film B after development 217 Photosensitive metal electrode film B after baking
───────────────────────────────────────────────────── フロントページの続き (72)発明者 仲川 整 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (72)発明者 住田 圭介 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (72)発明者 安井 秀明 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (72)発明者 杉本 和彦 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (72)発明者 田中 博由 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 平10−40821（ＪＰ，Ａ) 特開 昭60−221926（ＪＰ，Ａ) 特開2001−110322（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01J 9/02 H01J 11/02 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Sei Nakagawa 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Keisuke Sumita 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. (72) Inventor Hideaki Yasui 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor, Kazuhiko Sugimoto 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. (72) Inventor Hiroyuki Tanaka 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) Reference JP 10-40821 (JP, A) JP 60-221926 (JP, A) JP 2001-110322 (JP, A) (58) Fields surveyed (Int.Cl. 7 , DB name) H01J 9/02 H01J 11/02
Claims (15)
１）を基板に形成し、 前記金属膜Ａを露光マスク（Ａ１０５）を通して露光
し、 前記露光された金属膜Ａ上に、感光性ペーストを用いて
金属膜Ｂ（Ｂ１０８）を形成して矩形状の温度プロファ
イルで乾燥し、 前記金属膜Ｂを露光マスク（Ｂ１１１）を通して露光
し、 前記露光された金属膜Ａおよび前記露光された金属膜Ｂ
を一括して現像し、 前記現像された金属膜Ａおよび前記金属膜Ｂを焼成させ
て積層構造の電極を形成する電極の形成方法。1. A metal film A (A10) using a photosensitive paste.
1) is formed on a substrate, the metal film A is exposed through an exposure mask (A105), and a metal film B (B108) is formed on the exposed metal film A using a photosensitive paste to form a rectangular shape. Temperature profile
And the metal film B is exposed through an exposure mask (B111), and the exposed metal film A and the exposed metal film B are exposed.
Are collectively developed, and the developed metal film A and the developed metal film B are baked to form an electrode having a laminated structure.
ことによって、前記金属膜Ｂの膜厚を、中央部においてAs a result, the thickness of the metal film B is
端部近傍よりも大きくすることを特徴とする請求項１にIt is made larger than the vicinity of the end portion.
記載の電極の形成方法。A method for forming the described electrode.
とを特徴とする請求項２記載の電極の形成方法。 3. The method for forming an electrode according to claim 2, wherein the metal film A is dried before being exposed.
ロファイルで前記金属膜Ａを乾燥させることを特徴とす
る請求項３記載の電極の形成方法。 4. A forming method according to claim 3, wherein the electrode, characterized in that drying the metal film A at a temperature profile which rises linearly rectangular room temperature.
なるほど小さくなることを特徴とする請求項４記載の電
極の形成方法。 5. The method of forming an electrode according to claim 4, wherein the line width of the exposure mask in each layer becomes smaller toward the upper layer.
光量が異なることを特徴とする請求項５記載の電極の形
成方法。 6. The forming method according to claim 5, wherein the electrode exposure amount of the exposure amount and the metal film B of the metal film A are different from each other.
を現像液の溶解速度の異なる２点以上の露光量に設定す
ることを特徴とする請求項６記載の電極の形成方法。 Wherein said metal film A, forming method of claim 6, wherein the electrodes and setting the respective exposure metal film B to the exposure amount of more than two different points of the dissolution rate of the developing solution.
光量よりも小さいことを特徴とする請求項７記載の電極
の形成方法。 8. A forming method according to claim 7, wherein the electrode exposure of the metal film B is equal to or smaller than the exposure amount of the metal film A.
上に形成することを特徴とする請求項１から８いずれか
に記載の電極の形成方法。 9. The method for forming an electrode according to claim 1, wherein the metal film A is formed on a transparent electrode formed on a substrate.
に第２層が積層された構造を含む感光性金属膜の積層構A laminated structure of a photosensitive metal film including a structure in which a second layer is laminated on
造の電極であって、断面において、第２層の膜厚が中央Structure electrode, the thickness of the second layer is the center in the cross section
部において端部近傍より大きい形状を有する電極。An electrode having a shape larger than that in the vicinity of the end portion.
になるほど小さくなることを特徴とする請求項１０記載
の電極。 11. The electrode according to claim 10, wherein the line width of each layer of the electrode becomes smaller toward the upper layer.
に形成されていることを特徴とする請求項１１記載の電
極。12. The electrode according to claim 11, wherein the electrode is formed on a transparent electrode formed on a substrate.
置用の電極であることを特徴とする請求項１２に記載の
電極。 13. The electrode according to claim 12, wherein the electrode is an electrode for a plasma display device.
属膜が最上の金属膜より可視光透過率が低いことを特徴
とする請求項１３に記載の電極。 14. The electrode according to claim 13 , wherein the lowermost metal film of the laminated metal films has a lower visible light transmittance than the uppermost metal film.
されていることを特徴とする請求項１４に記載の電極。 15. The electrode according to claim 14 , wherein the metal film having the laminated structure contains a black pigment.
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| JP2004265634A (en) | 2003-02-21 | 2004-09-24 | Matsushita Electric Ind Co Ltd | Manufacturing method of plasma display panel |
| JP4539112B2 (en) * | 2003-02-28 | 2010-09-08 | パナソニック株式会社 | Method for manufacturing plasma display panel |
| JP4540968B2 (en) * | 2003-11-13 | 2010-09-08 | パナソニック株式会社 | Plasma display panel manufacturing method and plasma display |
| JP2005250465A (en) * | 2004-02-04 | 2005-09-15 | Toray Ind Inc | Method for manufacturing display member, and display member |
| JP2006049079A (en) * | 2004-08-04 | 2006-02-16 | Matsushita Electric Ind Co Ltd | Plasma display device |
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