JP3384391B2 - Electrode and method of manufacturing electrode - Google Patents
Electrode and method of manufacturing electrodeInfo
- Publication number
- JP3384391B2 JP3384391B2 JP2000281566A JP2000281566A JP3384391B2 JP 3384391 B2 JP3384391 B2 JP 3384391B2 JP 2000281566 A JP2000281566 A JP 2000281566A JP 2000281566 A JP2000281566 A JP 2000281566A JP 3384391 B2 JP3384391 B2 JP 3384391B2
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- coating
- electrode
- lower layer
- upper layer
- film thickness
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- Gas-Filled Discharge Tubes (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、主としてプラズマ
ディスプレイ表示装置に用いられる電極及び電極の製造
方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrode mainly used in a plasma display device and a method for manufacturing the electrode.
【０００２】[0002]
【従来の技術】従来から、液晶ディスプレイ、プラズマ
ディスプレイ等の表示装置に使用されている電極の中
で、積層金属膜から構成される電極が多く用いられてい
る。これは、金属膜を積層することで、異なった複数の
機能を電極に付与することが可能になるからである。2. Description of the Related Art Conventionally, among electrodes used in display devices such as liquid crystal displays and plasma displays, electrodes composed of laminated metal films are often used. This is because by stacking metal films, a plurality of different functions can be given to the electrodes.
【０００３】従来の積層金属膜から構成される電極の製
造方法の一例を図１に示す。An example of a conventional method of manufacturing an electrode composed of a laminated metal film is shown in FIG.
【０００４】最初にガラス基板１０２に、例えば酸化ル
テニウム、樹脂等を含む感光性材料を印刷法等で塗工
し、金属電極膜Ａ１０１を形成する（図１（ａ））。次
に、前記金属電極膜Ａ１０１の上に、例えばＡｇ、樹
脂、低軟化点ガラス等を含む感光性材料を印刷法等で塗
工し金属電極膜Ｂ１０３を形成する（図１（ｂ））。次
に、紫外線１０４を露光マスク１０５を介して照射する
と、感光性材料中の感光性成分が光照射により硬化し、
前記金属電極膜Ａ１０１および前記金属電極膜Ｂ１０３
に露光部１０７と非露光部１０６が形成される（図１
（ｃ））。次に、アルカリ等を含む現像液で現像を行な
うと硬化していない非露光部１０６が現像液中に溶出
し、露光部１０７のみが基板上に残り、現像後の金属電
極膜１０８が形成される（図１（ｄ））。次に、焼成を
行なうと材料中の樹脂等がバーンアウトし、低軟化点ガ
ラスが溶融してＡｇ等が結合し基板上に密着すると同時
に、体積収縮し焼成後の金属電極膜１０９が形成される
（図１（ｅ））。First, a glass substrate 102 is coated with a photosensitive material containing, for example, ruthenium oxide or resin by a printing method or the like to form a metal electrode film A101 (FIG. 1A). Then, a photosensitive material containing, for example, Ag, resin, low softening point glass or the like is applied on the metal electrode film A101 by a printing method or the like to form a metal electrode film B103 (FIG. 1B). Next, when the ultraviolet ray 104 is irradiated through the exposure mask 105, the photosensitive component in the photosensitive material is cured by light irradiation,
The metal electrode film A101 and the metal electrode film B103
An exposed portion 107 and a non-exposed portion 106 are formed on the surface (FIG.
(C)). Next, when development is performed with a developing solution containing an alkali or the like, the non-exposed portion 106 that has not cured is eluted into the developing solution, and only the exposed portion 107 remains on the substrate, and the metal electrode film 108 after development is formed. (FIG. 1 (d)). Next, when baking is performed, the resin or the like in the material is burned out, the low softening point glass is melted, Ag or the like is bonded and adheres to the substrate, and at the same time the volume is contracted to form the metal electrode film 109 after baking. (FIG. 1 (e)).
【０００５】このようにして形成された電極は、酸化ル
テニウムを主成分とする金属電極膜Ａ１０１が黒色を呈
することで、ガラス裏面側から見た場合の外光の反射を
防止する役割を果たし、また、高い導電性を有する銀を
主成分とする金属電極膜Ｂ１０３により、全体の抵抗値
を下げる役割をする。The electrode thus formed plays a role of preventing reflection of external light when viewed from the back surface side of the glass, because the metal electrode film A101 containing ruthenium oxide as a main component exhibits a black color. Further, the metal electrode film B103 containing silver having high conductivity as a main component plays a role of reducing the overall resistance value.
【０００６】また、例えば、単層での抵抗値を補う目的
で、金属電極膜Ａ１０１を露光した後、金属電極膜Ｂ１
０３として、同じ材料を塗工、露光、現像して、低抵抗
電極を製造することも知られている。Further, for example, for the purpose of supplementing the resistance value of a single layer, after exposing the metal electrode film A101, the metal electrode film B1 is exposed.
As 03, it is also known to coat, expose and develop the same material to manufacture a low resistance electrode.
【０００７】[0007]
【発明が解決しようとする課題】しかし、樹脂や低軟化
点ガラスを含む材料を用いた積層金属膜から構成される
電極においては、焼成工程において下層における樹脂や
ガラスに吸着した水酸基等がバーンアウトする時、上層
が既に固化を開始していると上層を通過して大気中に放
出される樹脂や水分からなる気体が上層を通過できなく
なり、前記気体が電極内部に内包され、形成した電極に
前記気体からなる気泡による膨れ（以下、ブリスターと
称す）が生じる。However, in an electrode composed of a laminated metal film using a resin or a material containing a low softening point glass, hydroxyl groups adsorbed on the resin or glass in the lower layer in the firing step are burned out. At that time, if the upper layer has already started to solidify, the gas consisting of resin or moisture that passes through the upper layer and is released into the atmosphere cannot pass through the upper layer, and the gas is encapsulated inside the electrode to form the formed electrode. Swelling (hereinafter referred to as a blister) occurs due to the bubbles made of the gas.
【０００８】焼成時にブリスターが生じると、電極形成
面との接着面積が縮小されるため電極が剥離しやすくな
る、電極の断面積が変化するため抵抗が高くなる、もし
くは断線する等の欠陥を生じる可能性が高くなる。When blisters occur during firing, the adhesion area with the electrode forming surface is reduced, so that the electrodes are easily peeled off, and the cross-sectional area of the electrodes changes, which increases the resistance or causes defects such as disconnection. More likely.
【０００９】本発明は、これらの不都合に鑑みて創案さ
れたものであり、内包気泡による欠陥の少ない金属積層
膜から構成される電極とその製造方法を提供することを
目的としている。The present invention was devised in view of these disadvantages, and it is an object of the present invention to provide an electrode composed of a metal laminated film having few defects due to inclusion bubbles, and a manufacturing method thereof.
【００１０】[0010]
【課題を解決するための手段】本発明に係る電極は、少
なくとも樹脂を含有する材料を塗工して下層を形成する
第一工程、少なくとも金属を含有する材料を用いて前記
下層を被覆して上層を塗工する第二工程、前記上層及び
下層を同時に焼成する第三工程から製造され、下層の塗
工後膜厚が上層の塗工後膜厚より薄いことを特徴とす
る。In the electrode according to the present invention, a first step of coating a material containing at least a resin to form a lower layer, and coating the lower layer with a material containing at least a metal. It is manufactured from the second step of applying the upper layer and the third step of simultaneously firing the upper layer and the lower layer, and the thickness of the lower layer after coating is smaller than the thickness of the upper layer after coating.
【００１１】また、少なくとも樹脂を含有する材料を塗
工して下層を形成する第一工程、少なくとも低軟化点ガ
ラスもしくは樹脂及び金属を含有する材料を用いて前記
下層を被覆する上層を塗工する第二工程、前記上層及び
下層を同時に焼成する第三工程から製造され、下層の塗
工後膜厚が上層の塗工後膜厚より薄いことを特徴とす
る。A first step of applying a material containing at least a resin to form a lower layer, and applying an upper layer covering the lower layer with at least a low softening point glass or a material containing a resin and a metal. It is manufactured from the second step and the third step of simultaneously firing the upper layer and the lower layer, and the film thickness of the lower layer after coating is smaller than the film thickness of the upper layer after coating.
【００１２】また、少なくとも感光性樹脂を含有する材
料を塗工して下層を形成する第一工程、少なくとも感光
性樹脂及び金属を含有する材料を用いて前記下層を被覆
する上層を塗工する第二工程、前記上層及び下層を同時
に焼成する第三工程から製造され、下層の塗工後膜厚が
上層の塗工後膜厚より薄いことを特徴とする。A first step of applying a material containing at least a photosensitive resin to form a lower layer, and a step of applying an upper layer covering the lower layer with a material containing at least a photosensitive resin and a metal. It is manufactured from two steps, that is, a third step in which the upper layer and the lower layer are simultaneously fired, and the thickness of the lower layer after coating is smaller than the thickness of the upper layer after coating.
【００１３】また、下層の塗工後膜厚が５μｍ以下、上
層の塗工後膜厚が５μｍ以上であることを特徴とする。Further, it is characterized in that the lower layer has a thickness of 5 μm or less after coating, and the upper layer has a thickness of 5 μm or more after coating.
【００１４】また、塗工方法が印刷法であって、下層と
上層の印刷スクリーンが異なり、下層の印刷スクリーン
のメッシュ数が上層より大きい、もしくは下層の印刷ス
クリーンがカレンダースクリーンであることを特徴とす
る。Further, the coating method is a printing method, the lower and upper printing screens are different, the number of meshes of the lower printing screen is larger than the upper layer, or the lower printing screen is a calendar screen. To do.
【００１５】また、塗工方法がラミネート法であって、
下層の電極材料フィルムの膜厚が上層の電極材料フィル
ムの膜厚より薄いことを特徴とする。The coating method is a laminating method,
The film thickness of the lower electrode material film is smaller than the film thickness of the upper electrode material film.
【００１６】また、上層の材料中にＡｇ、Ｃｕ、Ａｌの
うち少なくとも一種を含み、下層の材料中にＡｇ、Ｃ
ｕ、Ａｌ、酸化ルテニウム、黒色顔料のうち少なくとも
一種を含み、灰色ないし黒色を呈することを特徴とす
る。The material of the upper layer contains at least one of Ag, Cu and Al, and the material of the lower layer contains Ag and C.
It is characterized by containing at least one of u, Al, ruthenium oxide, and a black pigment and exhibiting gray or black.
【００１７】また、以上の製造方法で作成した電極、あ
るいはプラズマディスプレイ表示装置用の電極および電
極の製造方法であることを特徴とする。Further, the invention is characterized in that the electrode is manufactured by the above manufacturing method, or an electrode for a plasma display display device and a manufacturing method of the electrode.
【００１８】本発明の電極およびその製造方法により、
ブリスターによる欠陥のない電極が得られ、本発明を採
用した際には、信頼性の高い高品質な電極を用いた表示
デバイス等が安定して得られるという利点がある。According to the electrode of the present invention and the method for producing the same,
An electrode without defects due to blister can be obtained, and when the present invention is adopted, there is an advantage that a display device or the like using a highly reliable and high quality electrode can be stably obtained.
【００１９】[0019]
【発明の実施の形態】図２は本実施の形態に係る電極の
要部構成とその製造工程を示す概略図である。FIG. 2 is a schematic view showing the structure of a main part of an electrode according to this embodiment and the manufacturing process thereof.
【００２０】最初に、酸化ルテニウム粒子、ＰＭＭＡ、
ポリアクリル酸等の樹脂成分、低軟化点ガラス等を含む
黒色のネガ型感光性ペーストＡを、ガラス基板２０２上
に４２０メッシュのポリエステルスクリーン版もしくは
３３０メッシュのカレンダー処理を施したポリエステル
スクリーン版のいずれかを用いて印刷し、室温から９０
℃まで直線的に上昇した後９０℃で一定時間保持する温
度プロファイルのＩＲ炉により乾燥し、前記黒色感光性
ペーストから溶剤等が減少した感光性金属電極膜Ａ２０
１を形成する（図２（ａ））。このときの感光性金属電
極膜Ａ２０１の膜厚は、４μｍである。First, ruthenium oxide particles, PMMA,
Either a 420-mesh polyester screen plate or a 330-mesh calendered polyester screen plate is coated with a black negative photosensitive paste A containing a resin component such as polyacrylic acid and low softening point glass on a glass substrate 202. Print from room temperature to 90
Photosensitive metal electrode film A20 in which solvent, etc. is reduced from the black photosensitive paste by being dried in an IR oven having a temperature profile of rising linearly to 90 ° C. and holding at 90 ° C. for a certain time
1 is formed (FIG. 2A). The film thickness of the photosensitive metal electrode film A201 at this time is 4 μm.
【００２１】次に、感光性金属電極膜Ａ２０１上にＡｇ
粒子、ＰＭＭＡ、ポリアクリル酸等の樹脂成分、低軟化
点ガラス等を含むネガ型感光性ペーストＢを３８０メッ
シュのポリエステルスクリーン版を用いて印刷し、前記
プロファイルのＩＲ炉により乾燥し、前記感光性ペース
トＢから溶剤等が減少した感光性金属電極膜Ｂ２０３を
形成する（図２（ｂ））。このときの感光性金属電極膜
Ｂ２０３の膜厚は、６μｍである。Next, Ag is formed on the photosensitive metal electrode film A201.
A negative photosensitive paste B containing particles, a resin component such as PMMA, polyacrylic acid, etc., a low softening point glass, etc. is printed using a 380 mesh polyester screen plate, dried in an IR oven of the above profile, A photosensitive metal electrode film B203 in which the solvent and the like are reduced is formed from the paste B (FIG. 2B). The film thickness of the photosensitive metal electrode film B203 at this time is 6 μm.
【００２２】次に、紫外線２０４を、線幅４０μｍの露
光マスク２０５を通して照度１０ｍＷ／ｃｍ2、積算光
量３００ｍＪ／ｃｍ2、露光マスクと基板間の距離１０
０μｍの露光条件にて露光すると、感光性金属電極膜Ｂ
２０３の膜表面から架橋反応が進み重合、高分子化し、
露光部２０７と非露光部２０６が形成される（図２
（ｃ））。Next, the ultraviolet rays 204 are passed through the exposure mask 205 having a line width of 40 μm, the illuminance is 10 mW / cm 2 , the integrated light amount is 300 mJ / cm 2 , and the distance between the exposure mask and the substrate is 10 mW / cm 2 .
When exposed under an exposure condition of 0 μm, the photosensitive metal electrode film B is exposed.
A cross-linking reaction progresses from the film surface of 203, polymerization and polymerization,
An exposed portion 207 and a non-exposed portion 206 are formed (see FIG. 2).
(C)).
【００２３】次に、炭酸ナトリウムを０．４ｗｔ％含む
現像液にて現像すると図２（ｃ）における重合、高分子
化していない非露光部２０６が現像液中に溶出して除去
され、パターニングされた感光性金属電極膜２０８が残
る（図２（ｄ））。Next, by developing with a developing solution containing 0.4 wt% of sodium carbonate, the non-exposed portions 206 not polymerized and polymerized in FIG. 2C are eluted and removed in the developing solution and patterned. The photosensitive metal electrode film 208 remains (FIG. 2D).
【００２４】次に、ピーク温度５４０℃のベルト式連続
焼成炉により焼成を行なうと、現像で残った感光性金属
電極膜２０８中の樹脂成分等が気化し低軟化点ガラスが
溶融して線幅、膜厚が減少し、金属電極２０９が形成さ
れる（図２（ｅ））。このとき感光性金属電極膜Ａ２０
１の膜厚が感光性金属電極膜Ｂ２０３の膜厚より薄いた
め、感光性金属電極膜Ｂ２０３中の樹脂成分等が感光性
金属電極膜Ａ２０１中の低軟化点ガラスが固化する前に
樹脂成分等が気化し、ブリスターの発生は抑制される。Next, when baking is carried out in a belt type continuous baking furnace having a peak temperature of 540 ° C., the resin component and the like in the photosensitive metal electrode film 208 remaining after the development is vaporized and the low softening point glass is melted to form a line width. The film thickness is reduced, and the metal electrode 209 is formed (FIG. 2E). At this time, the photosensitive metal electrode film A20
Since the film thickness of 1 is thinner than the film thickness of the photosensitive metal electrode film B203, the resin component or the like in the photosensitive metal electrode film B203 does not become solid before the low softening point glass in the photosensitive metal electrode film A201 solidifies. Is vaporized and the occurrence of blisters is suppressed.
【００２５】ここで、感光性金属電極膜Ａ２０１および
Ｂ２０３の膜厚が４μｍおよび６μｍの場合の現像後膜
厚差によるブリスター発生状態を（表１）に示す。な
お、（表１）におけるブリスター発生状態の「○」はブ
リスターが発生していない状態、「△」はわずかにブリ
スターが発生した状態、「×」はブリスターが発生した
状態をそれぞれ示す。Here, the blister generation state due to the difference in film thickness after development when the film thickness of the photosensitive metal electrode films A201 and B203 is 4 μm and 6 μm is shown in (Table 1). In Table 1, the blister generation state “◯” indicates that no blisters have occurred, “Δ” indicates that blisters have occurred slightly, and “x” indicates that blisters have occurred.
【００２６】[0026]
【表１】 [Table 1]
【００２７】電極膜Ａの膜厚が電極膜Ｂの膜厚より大き
い場合は、電極膜Ｂの材料中の低軟化点ガラス等の容積
が少ないため熱容量が小さくなり、電極膜Ａの材料中の
樹脂成分等が完全に気化する前に低軟化点ガラス等が軟
化し、気化成分を電極膜ＡとＢの界面に封じてしまうた
めブリスターを発生する。また、電極膜ＡおよびＢの膜
厚が同一の場合も、樹脂等の気化成分が大気中に完全に
放出されると同時に低軟化点ガラス等が軟化するため、
ブリスターが発生すると考えられる。しかし電極膜Ａの
膜厚が電極膜Ｂの膜厚より小さい場合は、樹脂等の気化
成分が十分に大気中に放出された後、低軟化点ガラス等
が軟化するため、ブリスターは発生しない。また、電極
膜Ａの膜厚が電極膜Ｂの膜厚より小さい場合でも電極膜
Ａの膜厚が５μｍ以上となるとブリスターの発生源であ
る樹脂等が多く含まれるためわずかにブリスターを発生
する。また、電極膜Ｂの膜厚が５μｍ以下となると低軟
化点ガラス等の軟化が早くなりわずかにブリスターを発
生する。したがって、電極膜Ａの膜厚が電極膜Ｂの膜厚
より小さく、電極膜Ａの膜厚が５μｍ以下、電極膜Ｂの
膜厚が５μｍ以上でブリスターの発生を抑制でき、最も
望ましい。When the film thickness of the electrode film A is larger than the film thickness of the electrode film B, the heat capacity becomes small because the volume of the low softening point glass or the like in the material of the electrode film B is small and the material of the electrode film A is small. Before the resin component or the like is completely vaporized, the low softening point glass or the like is softened, and the vaporized component is sealed at the interface between the electrode films A and B, so that a blister is generated. Even when the electrode films A and B have the same film thickness, the vaporized components such as the resin are completely released into the atmosphere, and at the same time, the low softening point glass and the like are softened.
Blistering is thought to occur. However, when the film thickness of the electrode film A is smaller than the film thickness of the electrode film B, the low softening point glass or the like is softened after the vaporized components such as the resin are sufficiently released into the atmosphere, so that the blister does not occur. Even when the film thickness of the electrode film A is smaller than the film thickness of the electrode film B, when the film thickness of the electrode film A is 5 μm or more, a large amount of resin or the like, which is a source of blister generation, is included, so that blisters are slightly generated. Further, when the film thickness of the electrode film B is 5 μm or less, softening of the low softening point glass or the like is accelerated and slight blistering occurs. Therefore, when the film thickness of the electrode film A is smaller than that of the electrode film B, the film thickness of the electrode film A is 5 μm or less, and the film thickness of the electrode film B is 5 μm or more, the occurrence of blisters can be suppressed, which is the most desirable.
【００２８】また、電極膜Ｂの印刷スクリーン版がポリ
エステル製３８０メッシュである場合、電極膜Ａの印刷
スクリーン版のメッシュ数が同一もしくは小さいと、印
刷後の電極膜Ａの膜厚が電極膜Ｂの膜厚と同等もしくは
厚くなるため、ブリスターを発生する。しかし、電極膜
Ａの印刷スクリーン版のメッシュ数が大きい場合、印刷
後の電極膜Ａの膜厚が電極膜Ｂの膜厚より薄くなるた
め、ブリスターを発生しない。また、電極膜Ａの印刷ス
クリーン版のメッシュ数が同一もしくは小さい場合でも
カレンダー処理を行っている印刷スクリーン版である
と、版の紗厚が薄いため印刷後の電極膜Ａの膜厚が電極
膜Ｂの膜厚より薄くなり、ブリスターを発生しない。When the printing screen plate of the electrode film B is a polyester 380 mesh and the number of meshes of the printing screen plate of the electrode film A is the same or small, the film thickness of the electrode film A after printing is the electrode film B. Blister is generated because it is equal to or thicker than the film thickness of. However, when the number of meshes of the printing screen plate of the electrode film A is large, the film thickness of the electrode film A after printing becomes smaller than the film thickness of the electrode film B, so that blisters do not occur. Further, when the printing screen plate of the electrode film A is calendered even if the number of meshes of the printing screen plate is the same or small, the thickness of the electrode film A after printing is small because the plate thickness of the printing screen plate is thin. It is thinner than the film thickness of B, and blisters do not occur.
【００２９】なお、本実施の形態において、感光性ペー
ストＡおよびＢは、酸化ルテニウムおよびＡｇを含んで
なくてもよく本発明の形態に限定されるものではない。
また、感光性ペーストＡおよびＢ中の樹脂成分は、ＰＭ
ＭＡおよびポリアクリル酸を含有して無くてもよく、本
発明の実施の形態に限定されるものではない。また、感
光性ペーストＡおよびＢは、低軟化点ガラスを含有して
無くてもよく、本発明の実施の形態に限定されるもので
はない。また、感光性ペーストＡおよびＢは、ネガ型で
無くてもよく、本発明の実施の形態に限定されるもので
はない。また、電極膜が形成される基板はガラス基板で
なくてもよく本発明の形態に限定されるものではない。
またガラス等の基板上に透明電極等があらかじめ形成さ
れていてもよい。また、感光性ペーストの塗布方法はス
クリーン印刷法でなくてもよく本発明の形態に限定され
るものではない。また、印刷スクリーンは、４２０メッ
シュのポリエステルスクリーン版もしくは３３０メッシ
ュのカレンダー処理を施したポリエステルスクリーン版
もしくは３８０メッシュのポリエステルスクリーン版で
なくてもよく本発明の形態に限定されるものではない。
また、積層される層数は２層でなくてもよく本発明の形
態に限定されるものではない。また、印刷後の乾燥は、
室温から９０℃まで直線的に上昇した後９０℃で一定時
間保持する温度プロファイル、およびＩＲ炉においてな
されなくてもよく本発明の形態に限定されるものではな
い。また、感光性金属電極膜ＡおよびＢの膜厚は、Ａ＜
ＢもしくはＡ＜５μｍ、Ｂ＞５μｍを満たしていれば、
それぞれ４μｍ、６μｍでなくてもよく本発明の形態に
限定されるものではない。また、露光条件は、照度１０
ｍＷ／ｃｍ2、積算光量３００ｍＪ／ｃｍ2、露光マスク
と基板間の距離１００μｍでなくてもよく本発明の形態
に限定されるものではない。また、現像液は炭酸ナトリ
ウムを０．４ｗｔ％含まなくてもよく本発明の形態に限
定されるものではない。また、現像後の焼成は、ピーク
温度５４０℃、およびベルト式連続焼成炉においてなさ
れなくてもよく本実施の形態に限定されるものではな
い。また、（表１）の膜厚の値は４μｍ、４．８μｍ
５．２μｍおよび６μｍでなくてもよく本実施の形態に
限定されるものではない。In the present embodiment, photosensitive pastes A and B need not contain ruthenium oxide and Ag, and are not limited to the form of the present invention.
Further, the resin component in the photosensitive pastes A and B is PM
It does not need to contain MA and polyacrylic acid, and is not limited to the embodiment of the present invention. Further, the photosensitive pastes A and B may not contain the low softening point glass and are not limited to the embodiments of the present invention. Further, the photosensitive pastes A and B do not have to be the negative type and are not limited to the embodiments of the present invention. The substrate on which the electrode film is formed does not have to be a glass substrate and is not limited to the form of the present invention.
Further, a transparent electrode or the like may be previously formed on a substrate such as glass. The method of applying the photosensitive paste does not have to be the screen printing method and is not limited to the form of the present invention. Further, the printing screen may not be a 420-mesh polyester screen plate, a 330-mesh calendered polyester screen plate, or a 380-mesh polyester screen plate, and is not limited to the form of the present invention.
Further, the number of layers to be laminated need not be two, and is not limited to the form of the present invention. Also, drying after printing is
A temperature profile in which the temperature is linearly increased from room temperature to 90 ° C. and then held at 90 ° C. for a certain time, and may not be performed in an IR furnace and is not limited to the embodiment of the present invention. The film thickness of the photosensitive metal electrode films A and B is A <
If B or A <5 μm and B> 5 μm are satisfied,
The thickness is not limited to 4 μm and 6 μm, respectively, and is not limited to the form of the present invention. The exposure condition is an illuminance of 10
The present invention is not limited to the form of the present invention, in which the mW / cm 2 , the integrated light quantity of 300 mJ / cm 2 , and the distance between the exposure mask and the substrate may not be 100 μm. Further, the developing solution need not contain 0.4 wt% of sodium carbonate and is not limited to the form of the present invention. Further, the baking after the development may be performed at a peak temperature of 540 ° C. and in a belt type continuous baking furnace, and is not limited to the present embodiment. In addition, the film thickness values in (Table 1) are 4 μm and 4.8 μm.
It does not need to be 5.2 μm and 6 μm, and is not limited to this embodiment.
【００３０】また、本実施の形態において電極膜Ａおよ
びＢの成分は、アルミ、銀、銅で特に効果を発揮した
が、他の金属でも同様の膜厚関係を満たしていれば同様
の効果が得られた。また、塗工方法は、印刷法だけでな
く、フィルムのラミネート法においても同様の膜厚関係
を満たしていれば同様の効果が得られた。また、本実施
の形態では、感光性ペーストを用いた例を示したが、本
発明には必ずしも感光性ペーストを用いることは必須で
はなく、例えば、感光性を示さない２種類の材料につい
て本発明の工法を適用することにより、同様にブリスタ
ーのない良好な積層電極を得ることができた。Further, in the present embodiment, the components of the electrode films A and B are particularly effective with aluminum, silver and copper, but other metals can also have similar effects as long as the same film thickness relationship is satisfied. Was obtained. Further, not only the printing method but also the film laminating method, the same effect was obtained as long as the film thickness relationship was satisfied. In addition, although an example of using a photosensitive paste is shown in the present embodiment, it is not always necessary to use a photosensitive paste in the present invention. For example, the present invention is applied to two types of materials that do not show photosensitivity. By applying the method of (3), it was possible to obtain a good laminated electrode without blisters.
【００３１】[0031]
【発明の効果】以上説明したように、本発明に係る電極
およびその製造方法によれば、内包気泡による欠陥の少
ない金属積層膜から構成され断線等の少ない高品質の電
極を形成する事ができる。As described above, according to the electrode and the method for manufacturing the same of the present invention, it is possible to form a high quality electrode which is composed of a metal laminated film having few defects due to the inclusion bubbles and has few disconnections. .
【図１】従来の電極の要部構成とその製造工程を示す概
略図FIG. 1 is a schematic view showing a configuration of essential parts of a conventional electrode and a manufacturing process thereof.
【図２】本発明の実施の形態に係る電極の要部構成とそ
の製造工程を示す概略図FIG. 2 is a schematic diagram showing a configuration of essential parts of an electrode according to an embodiment of the present invention and a manufacturing process thereof.
１０１ 塗工後の金属電極膜Ａ １０２ ガラス基板 １０３ 塗工後の金属電極膜Ｂ １０４ 紫外線 １０５ 露光マスク １０６ 感光性金属電極膜の非露光部 １０７ 感光性金属電極膜の露光部 １０８ 現像後の感光性金属電極膜 １０９ 焼成後の感光性金属電極膜 ２０１ 塗工後の感光性金属電極膜Ａ ２０２ ガラス基板 ２０３ 塗工後の感光性金属電極膜Ｂ ２０４ 紫外線 ２０５ 露光マスク ２０６ 感光性金属電極膜の非露光部 ２０７ 感光性金属電極膜の露光部 ２０８ 現像後の感光性金属電極膜 ２０９ 焼成後の感光性金属電極膜 101 Metal electrode film A after coating 102 glass substrate 103 Metal electrode film B after coating 104 UV 105 exposure mask 106 Unexposed Area of Photosensitive Metal Electrode Film 107 Exposed part of photosensitive metal electrode film 108 Photosensitive metal electrode film after development 109 Photosensitive metal electrode film after baking 201 Photosensitive metal electrode film A after coating 202 glass substrate 203 Photosensitive metal electrode film B after coating 204 UV 205 exposure mask 206 Non-exposed part of photosensitive metal electrode film 207 Exposed part of photosensitive metal electrode film 208 Photosensitive metal electrode film after development 209 Photosensitive metal electrode film after baking
───────────────────────────────────────────────────── フロントページの続き (72)発明者 大谷 光弘 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (72)発明者 藤原 伸也 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (72)発明者 丸中 英喜 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (72)発明者 仲川 整 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 平10−40821（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01J 9/02 ─────────────────────────────────────────────────── --- Continuation of the front page (72) Inventor Mitsuhiro Otani 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Shinya Fujiwara 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. (72) Inventor Hideki Marunaka 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Instructor, Nakagawa Sei, 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. (56) Reference Document JP-A-10-40821 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) H01J 9/02
Claims (10)
有する材料を塗工して下層を形成する第一工程、少なく
とも金属を含有する材料を用いて前記下層を被覆して上
層を塗工する第二工程、前記上層及び下層を同時に焼成
する第三工程を含む表示装置の電極の製造方法であつ
て、下層の塗工後膜厚が５μｍ以下であり，且つ上層の
塗工後膜厚が５μｍ以上であり，下層の塗工後膜厚が上
層の塗工後膜厚より薄いことを特徴とする表示装置の電
極の製造方法。1. A first step of applying a material containing at least a resin and ruthenium oxide to form a lower layer, and a second step of coating the lower layer with a material containing at least a metal to apply an upper layer. , shall apply in the manufacturing method of the electrodes of a display device including a third step of firing the upper and lower layers at the same time, the film thickness after the underlying coating is at 5μm or less, and the upper layer of
A method for manufacturing an electrode of a display device, wherein the film thickness after coating is 5 μm or more, and the film thickness after coating of the lower layer is smaller than the film thickness after coating of the upper layer.
有する材料を塗工して下層を形成する第一工程、少なく
とも低軟化点ガラス及び金属を含有する材料を用いて前
記下層を被覆する上層を塗工する第二工程、前記上層及
び下層を同時に焼成する第三工程を含む表示装置の電極
の製造方法であつて、下層の塗工後膜厚が５μｍ以下で
あり，且つ上層の塗工後膜厚が５μｍ以上であり，下層
の塗工後膜厚が上層の塗工後膜厚より薄いことを特徴と
する表示装置の電極の製造方法。2. A first step of applying a material containing at least a resin and ruthenium oxide to form a lower layer, and applying an upper layer covering the lower layer with a material containing at least a low softening point glass and a metal. second step of the shall apply the upper layer and a manufacturing method of electrodes of a display device including a third step of firing the lower layer at the same time, the following underlying film thickness after coating is 5μm
A method for manufacturing an electrode of a display device, wherein the upper layer has a coated film thickness of 5 μm or more, and the lower layer has a coated film thickness smaller than that of the upper layer.
有する材料を塗工して下層を形成する第一工程、少なく
とも樹脂及び金属を含有する材料を用いて前記下層を被
覆する上層を塗工する第二工程、前記上層及び下層を同
時に焼成する第三工程を含む表示装置の電極の製造方法
であつて、下層の塗工後膜厚が５μｍ以下であり，且つ
上層の塗工後膜厚が５μｍ以上であり，下層の塗工後膜
厚が上層の塗工後膜厚より薄いことを特徴とする表示装
置の電極の製造方法。3. A first step of applying a material containing at least a resin and ruthenium oxide to form a lower layer, and a second step of applying an upper layer covering the lower layer with a material containing at least a resin and a metal. step, the shall apply the upper layer and a manufacturing method of electrodes of a display device including a third step of firing the lower layer at the same time, the film thickness after the underlying coating is at 5μm or less, and
A display device characterized in that the thickness of the upper layer after coating is 5 μm or more, and the thickness of the lower layer after coating is thinner than the thickness of the upper layer after coating.
Method for manufacturing a stationary electrode.
ムを含有する材料を塗工して下層を形成する第一工程、
少なくとも感光性樹脂及び金属を含有する材料を用いて
前記下層を被覆する上層を塗工する第二工程、前記上層
及び下層を同時に焼成する第三工程を含む表示装置の電
極の製造方法であつて、下層の塗工後膜厚が５μｍ以下
であり，且つ上層の塗工後膜厚が５μｍ以上であり，下
層の塗工後膜厚が上層の塗工後膜厚より薄いことを特徴
とする表示装置の電極の製造方法。4. At least a photosensitive resin and ruthenium oxide.
The first step of forming a lower layer by applying a material containing arm,
An electrode of a display device , comprising: a second step of applying an upper layer that covers the lower layer using a material containing at least a photosensitive resin and a metal; and a third step of simultaneously firing the upper layer and the lower layer. Manufacturing method, the film thickness after coating of the lower layer is 5 μm or less
A method for manufacturing an electrode of a display device, wherein the upper layer has a film thickness after coating of 5 μm or more, and the lower layer has a film thickness after coating smaller than the film thickness after coating of the upper layer.
上層の印刷スクリ−ンが異なることを特徴とする請求項
１〜４のいずれかに記載の表示装置の電極の製造方法。Shall apply in claim 5, wherein the coating method is a printing method, a lower layer and an upper print subscription - method of manufacturing an electrode of a display device according to any one of claims 1 to 4, down are different from each other.
印刷スクリ−ンのメツシユ数が上層より大きいことを特
徴とする請求項５記載の表示装置の電極の製造方法。And wherein said coating method filed a printing method, the underlying print subscription - method of manufacturing an electrode according to claim 5 display device according to mesh screen number of emissions being greater than the upper layer.
印刷スクリ−ンがカレンダ−スクリ−ンであることを特
徴とする請求項５のいずれかに記載の表示装置の電極の
製造方法。 7. The method for producing an electrode of a display device according to claim 5 , wherein the coating method is a printing method, and the printing screen of the lower layer is a calendar screen. Method.
下層の電極材料フイルムの膜厚が上層の電極材料フイル
ムの膜厚より薄いことを特徴とする請求項１〜４のいず
れかに記載の表示装置の電極の製造方法。 Wherein said coating method lamination - shall apply in method, a
Method of manufacturing an electrode of a display device according to any one of claims 1 to 4, the film thickness of the lower layer of the electrode material film is equal to or thinner than the thickness of the upper layer of the electrode material film.
少なくとも一種を含むことを特徴とする請求項１〜８の
いずれかに記載の表示装置の電極の製造方法。 9. Ag in the upper layer of the material, Cu, method of manufacturing an electrode of a display device according to any one of claims 1-8, characterized in that it comprises at least one of Al.
装置の電極の製造方法を用いて形成した電極を有するプ
ラズマデイスプレイ表示装置。 10. The display according to any one of claims 1 to 9.
A plasma display device having an electrode formed by using the method for manufacturing an electrode of the device.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000281566A JP3384391B2 (en) | 2000-09-18 | 2000-09-18 | Electrode and method of manufacturing electrode |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000281566A JP3384391B2 (en) | 2000-09-18 | 2000-09-18 | Electrode and method of manufacturing electrode |
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|---|---|---|---|
| JP2002310772A Division JP2003197093A (en) | 2002-10-25 | 2002-10-25 | Electrode and method of manufacturing electrode |
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| US20140084778A1 (en) * | 2011-12-01 | 2014-03-27 | Panasonic Corporation | Plasma display panel and method for producing the same |
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