JP3398876B2 - IC carrier and its automatic adjustment mechanism - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC carrier for use in an IC testing device and an automatic adjusting mechanism for the IC carrier, which can automatically position various ICs having different lengths and widths.

[0002]

2. Description of the Related Art As the degree of integration is improved, the number of pins (terminals) led out from the package of the IC is increased, and the pin lead-out structure is changed from DIP (Dual In-line Package) to QFP.
(Quad Flat Package), SOP (Small Outline Pack)
age), SOJ (Small Outline J-lead), PLCC (P
Lastic Leaded Chip Carrier). In addition, there are many types with different sizes in each derived structure. In order to test the ICs of these various pin lead-out structures, an IC testing device employing a horizontal transfer system equipped with a vacuum suction means has been put into practical use.

9 and 10 are shown in Japanese Patent Laid-Open No. 05-6765.
As an example of the IC carrier introduced in No. 8, the internal structure of the IC carrier for DIP type IC is shown. In the figure, 21 indicates a frame. The O-ring 22 is embedded in the annular groove on the lower surface inside the frame 21, and the spiral disk 23 is mounted on the upper surface side of the O-ring 22. Spiral disc 2
3 is a disk 23A as shown in FIG. 10, and this disk 23A
And a concave and convex engaging surface 23B formed in a spiral shape on the upper surface of the. In this example, a case where the spiral concave-convex engagement surface 23B is formed so as to protrude from the protrusion is shown.

An IC support member 24 is mounted on the upper surface of the spiral disk 23. The peripheral edge of the IC support member 24 is held by the cover 26 and is supported in the frame body 21. I
In this example, the C support member 24 is a support base that supports the DIP type IC. That is, the IC support member 24 is divided into two in this example, and the projection 24A is engaged with and guided by the elongated hole 25A formed in the guide plate 25, and is supported so as to be movable in two directions.

When the teeth formed on the projection 24A are engaged with the concave-convex engagement surface 23B of the spiral disk 23 and the spiral disk 23 is rotated, the projections 24B, 24C and 24D formed on the IC support member 24 are interleaved with each other. Has a structure capable of supporting DIP type ICs having different numbers of mills. That is, the storage size of the IC is changed.

In the state shown in FIG. 9, if the spacing is set so that the IC of 300 mil standard can be mounted on the protrusion 24B, the IC of 600 mil standard can be supported on the protrusion 24C. At this time, the protrusion 24D has an I of 900 mil standard.
C can be supported. In addition to the 300 mil, 600 mil and 900 mil standards, the DIP type IC standards include 400 mil and 750 mil standards. Therefore, in order to support the ICs of 400 mils and 750 mils, the distance between the IC support members 24 may be expanded from the state shown in FIG. In other words, by moving the IC support member 24 outward by 50 mils, the protrusion 24B can support an IC of 400 mil standard, and by moving the IC support member 24 outward by 75 mils, the protrusion 24C can be formed. Is capable of supporting 750 mil standard ICs. The spiral disk 23 may be rotated to move the support table outward by 50 mils and 75 mils.

The O-ring 22 is provided to prevent the spiral disk 23 from rotating due to vibration or the like. Two small holes 23C are formed in the spiral disk 23, and a pin 28B attached to a drive shaft 28A shown in FIG. 9 is engaged with the two small holes 23C, and the drive shaft 28A is rotationally driven by, for example, a stepping motor. By doing so, the desired interval can be set.

In order to automate the standard changing operation of the IC carriers 20, the interval data currently set in each IC carrier 20 is required. For this purpose, for example, the rotation angle position of the spiral disk 23 is displayed by a black and white stripe or the like attached to the back surface side, and this can be optically read through a hole formed in the lower surface plate of the frame body 21. As another method, an identification number can be attached to each IC carrier by, for example, a bar code, and the setting value previously set for each identification number can be stored in a memory and managed.

11 to 13 show Japanese Patent Laid-Open No. 05-6765.
An example of an IC test apparatus using the IC carrier introduced in No. 8 is shown. Reference numeral 10 in the drawing denotes an annular conveying rail. The annular carrier rail 10 is formed horizontally, and guides the rectangular IC carrier 20 by the guide rails 11 provided on both sides. That is, in this example, the case where the annular transport rail 10 is formed in a quadrangle is shown. At each corner of the annular carrier rail 10, a drive device 12 formed of, for example, an air cylinder
A, 12B, 12C and 12D are provided.

The driving devices 12A, 12B and 12D move the IC carrier 20 by one stroke, and the driving device 12C moves the IC carrier 20 by two strokes. As an example of the driving method, in this example, two empty spaces are provided in the annular transport rail 10, and the driving device 12
When C operates, two empty spaces are formed on this side. When the driving devices 12B, 12A, and 12D are operated in this state in this order, the IC carrier 20 in the annular carrier rail 10 moves in the clockwise direction by one pitch. Here, when the drive device 12C is again operated with a stroke of two, it returns to a state in which two empty spaces (state of FIG. 11) are formed in a portion facing the drive device 12C.

In this way, the IC carrier 20 is moved along the ring-shaped carrier rail 10 and, at the same time, the protruding position of the extrusion drive device 12E described later is maintained in an empty space. A loader unit 30 and an unloader unit 40 are provided along one side of the rectangular annular transport rail 10. The loader section 30 is provided with a loading suction conveyance means 31, and the unloader section 40 is provided with a sorting suction conveyance means 41. In the suction conveyance means, the suction head is made of a suction cup-shaped rubber, and has a suction hole inside the suction cup-shaped rubber. Air is sucked through this suction hole and the suction force of the air causes I to move.
A structure that adsorbs and conveys C.

The loading suction transfer means 31 is supported by a rail 32 so as to be able to reciprocate between the loader section 30 and the annular transfer rail 10. Carry out loading operation. When one IC is loaded on the IC carrier 20, the driving device 12D is driven to move the IC carrier 20 by one. By this movement, the loading suction transport means 31
Before, the empty IC carrier 20 is supplied. This empty I
The adsorption carrier means 31 for loading on the C carrier 20 is the loader section 3
Load one IC from 0. In this way, the IC to be tested is mounted on the IC carrier 20 that has passed the position of the loading suction transport means 31.

The IC carrier 20 on which the IC is mounted is turned by the drive of the drive unit 12A and further turned by the drive unit 12B to be carried to the position of the first suction transfer means 50. In this example, two first suction conveyance means 50 are provided at intervals of the arrangement pitch of the IC carriers 20. The two first suction transfer means 50 are supported by the ends of transfer stands 51 and 52 that can operate separately.
The transfer frames 51 and 52 are movably supported by rails 53, and the second suction transfer means 60 is attached to the other end. When the first suction / transport means 50 is located above the annular transport rail 10, the second suction / transport means 60 is located above the test section 70.

Therefore, when the first sucking and conveying means 50 sucks the IC from the IC carrier 20, the second sucking and conveying means 60.
Adsorbs the tested IC from the test unit 70. The first suction transfer means 50 sucks the IC from the IC carrier 20,
The second suction conveyance means 60 has been tested by the test unit 70.
When C is adsorbed, the transportation platforms 51 and 52 move along the rail 53, the first adsorption transportation means 50 reaches the upper part of the test section 70, and the second adsorption transportation means 60 is prepared at the end of the rail 53. Reach the relay stand 71.

Adsorption transport means 4 provided in the unloader section 40
1 moves by a rail 43 that is provided between the relay stand 71 and the unloader section 40, and carries the tested IC from the relay stand 71 to the unloader section 40. Unloader section 40
The ICs that have been tested and are transported to are sorted according to the test results and stored in a magazine or the like. First suction conveyance means 5
The IC carrier 20 that has passed the position 0 is empty. In the test mode, the IC carrier 20 that has become empty is changed in direction by the drive devices 12C and 12D and is conveyed again to the front of the loader unit 30 to start the next circulation operation.

On the other hand, the IC carrier 20 is driven by the drive unit 12B.
The IC carrier storage unit 80 is provided on an extension of the side on which is driven. The IC carrier storage unit 80 has a U-shaped transfer passage 81, and drive devices 82 and 83 are provided at two corners of the transfer passage 81. The transfer passage 81 is equivalent to one set of the IC carriers 20 circulating on the annular transfer rail 10 (for example, 5 sets).
The length is set to store 0 to 100 pieces), and as shown in FIG. 13, the U-shaped transfer passages 81 for storing each IC carrier 20 are arranged in multiple layers. The plurality of transfer paths 81 thus moved move up and down, and the type of the IC carrier 20 is selected.

In other words, in order to change the type of the IC carrier 20, in the IC carrier storage section 80, the layer in which the type of the IC carrier 20 to be called on the annular carrier rail 10 is placed in the same plane as the annular carrier rail 10. To move. In this state, the operation of the drive device 12C is stopped.
At the same time, the set cylinder 84 projects the rod 85 from the outside of the annular transport rail 10, and the push-out driving device 12E provided at the tip of the rod 85 is arranged on the annular transport rail 10 (see FIG. 12).

When the operation of the driving device 12C is stopped, the IC carrier 20 circulating on the annular carrier rail 10 is I
One by one is pushed into the U-shaped transfer passage 81 provided in the C carrier storage portion 80. That is, when one IC carrier 20 is pushed in from the annular carrier rail 10, the driving device 82
And 83 are driven, and one new IC carrier 20 is ejected from the IC carrier storage unit 80 to the annular carrier rail 10.

When a new IC carrier 20 is ejected from the IC carrier storage unit 80, the pushing drive unit 12E pushes the ejected IC carrier 20 along the annular carrier rail 10. After that, the drive devices 83, 82, 12B,
12A, 12D, extrusion drive device 12E, drive device 83,
The IC carriers 20 on the annular carrier rail 10 are stored in the IC carrier storage unit 80 by repeating this operation, and the IC carriers 20 stored in the IC carrier storage unit 80 are discharged to the annular carrier rail 10. ,
The IC carriers on the annular carrier rail 10 are exchanged.

The annular carrier rail 10 is provided with means for changing the IC storage size of the IC storage portion of the IC carrier 20.
That is, for example, the drive shaft 28A shown in FIG. 9 is provided at the position 10A (see FIG. 11) of the annular transport rail 10. If the spiral disk 23 of the IC carrier 20 is rotated at this position 10A, it is possible to automatically respond to the standard change.

[0021]

In the above-described conventional IC testing apparatus which adopts the horizontal transfer method, the IC is sucked by the IC suction means, transferred, and mounted on the test section, so that the IC is sucked. The position of the IC must be accurately specified. For this reason, the IC must be positioned with high precision in the IC carrier portion. For this reason, a means for changing the storage size of each IC is provided. However, in the conventional method, in the case of the IC carrier for the DIP type IC, only the means for changing the storage dimension of the IC in the width direction is provided, and the means for changing the storage dimension of the IC in the length direction is not provided. I
In the portion of the C carrier, the IC must be positioned with high accuracy not only in the width direction of the IC but also in the length direction of the IC. Further, in the conventional method, the complete automation is insufficient because the method of changing the dimension standard of the IC carrier is not clearly defined. INDUSTRIAL APPLICABILITY The present invention can be commonly used for IC packages having a structure in which pins are led out on both sides in the width direction and pins are not led out on both sides in the length direction, such as DIP type IC, SOP type IC, and SOJ type IC. It is an object of the present invention to provide a structure of an IC carrier having means for changing an IC storage size in the vertical direction and an automatic adjusting mechanism thereof.

[0022]

In order to achieve the above object, in the IC carrier of the present invention, a circular groove is provided on the bottom surface of a frame having a quadrangular planar shape, and a spiral disk is mounted in the groove. The spiral disc is rotatable and has a spiral concave-convex engagement surface on the upper surface side. On the upper portion of the spiral disc, a projection is formed on the lower surface that engages with the concave and convex engaging surface formed on the spiral disc, and an IC mounting surface for mounting an IC is formed on the upper surface to rotate the spiral disc. As a result, the two ICs whose IC storage width on the IC mounting surface is changed
A C support member is provided. An arm gear, which is rotatably housed on the upper surface of the spiral disk and has a gear groove on the side surface of the disk, is provided. A gear groove that engages with a gear groove formed on the arm gear is formed on a side surface, an arm extending upward is formed at one end, and the IC storage length dimension is changed by rotating the arm gear. Provide the center arm of. A cover is provided to prevent the above members from coming off from the frame, and ICs having different widths and lengths are conveyed I
Realize a C carrier.

In the IC carrier automatic adjusting mechanism of the present invention, a carrier guide for guiding the conveyance of the IC carrier and a carrier aligner for fixing and positioning the IC carrier are attached to the base fixed to the main body of the IC carrier conveying device. A transfer base that moves up and down by a plurality of cylinders is provided on the base, and the following members are attached to the transfer base. The transfer head is a member for rotationally driving an arm gear or a spiral disk built in the IC carrier.
The pulse motor is a member that is connected to the transfer head with a pulley and a timing belt to rotate the transfer head. The position sensor is a member that detects a sensor hole that is provided on a position plate that rotates together with the transfer head and that indicates the origin of rotation. The set sensor is a member that detects that the guide pin of the transfer head has entered the guide hole of the arm gear of the IC carrier or the guide hole of the spiral disk. The above-mentioned members realize a mechanism capable of automatically adjusting the width dimension and the length dimension of the IC carrier.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a DIP type IC and SOP according to the present invention.
-Type IC and SOJ-type IC that can be shared with IC packages having a structure in which pins are led out on both sides in the width direction, and IC that has means for changing the IC storage dimensions in the width direction and the length direction
The internal structure of a carrier is shown. In the figure, 121 indicates a frame.
A circular groove is formed on the lower surface inside the frame 121, and the spiral disk 123 is mounted in the groove. As shown in FIG. 1, the spiral disk 123 has a groove formed in a spiral shape on the upper surface of the disk.

An IC supporting member 124 is mounted on the upper surface of the spiral disk 123 via a guide plate 125. I
The peripheral edge of the C support member 124 is held by the cover 126 and is supported in the frame 121. The IC support member 124 is divided into two, and the long hole 12 formed in the guide plate 125 is formed.
The projection 124A passes through the 5A and the spiral disk 12
3 is engaged with the groove of the IC support member 124, and the projection 12 formed on the guide plate 125 is inserted into the long hole 124E formed on the IC support member 124.
5B is engaged and guided, and is supported so as to be movable in two directions.

Protrusions 124 formed on the IC support member 124
When A engages with the groove of the spiral disc 123 and the spiral disc 123 is rotated, the IC support member 124
The intervals between the protrusions 124B, 124C, and 124D formed in the above are changed, so that ICs having different widths and lengths of mils can be supported. That is, the storage size of the IC in the width direction is changed.

Two guide holes 123A and 123B are formed in the spiral disk 123, and guide pins 104A and 104B attached to the transfer head 104 shown in FIG. 5 are engaged with the two guide holes 123A and 123B, respectively. By rotating the pulley 104I, I
It is possible to set a desired interval in the width direction of C.

On the other hand, the arm gear 1 which can be rotationally driven from below through a circular hole formed in the center of the spiral disk 123 in order to change the lengthwise storage size of the IC.
16 is mounted on the upper surface side of the spiral disc 123. The rotation of the arm gear 116 changes the storage size in both directions of the length of the IC with the rotation axis at the center, so two center arms 117 that operate in opposite directions are provided. The center arm 117 is provided with a gear groove on its side surface,
The two center arms 11 are guided by the guide plate 125.
The storage dimension of the IC in the length direction can be changed by the arm 117A provided at one end of each IC.

The arm gear 116 has two guide holes 11
6A and 116B are formed, and these two guide holes 116 are formed.
The transfer head 104 shown in FIGS.
Engage the guide pins 104A and 104B attached to
By rotating the pulley 104I, it is possible to set a desired interval in the longitudinal direction of the IC. Here, since the distances from the axes of the two guide holes 116A and 116B of the arm gear 116 are smaller than the distances from the axes of the two guide holes 123A and 123B of the spiral disk 123, the guides attached to the transfer head 104 are shown. Pin 1
The distances of 04A and 104B from the rotation axis are shorter in the case of the arm gear 116 than in the case of the spiral disk 123. That is, the transfer head 104 that rotationally drives the arm gear 116 and the transfer head 104 that rotationally drives the spiral disk 123 are prepared as separate automatic adjustment mechanisms. Therefore, after that, the arm gear 116 for changing the storage dimension in the length direction,
The center arm 117 and its automatic adjustment mechanism will be described.

FIG. 2 shows the basic structure of the arm gear 116 and the center arm 117 provided in the IC carrier for changing the storage size of the IC in the longitudinal direction. Figure 2 (a)
The arm gear 116 shown in FIG. 5 is provided with guide holes 116A and 116B in the same size relationship as the guide pins 104A and 104B of the transfer head 104 shown in FIG. The distances of the guide holes 116A and 116B from the rotation axis are different from each other, and the position matching the guide pins 104A and 104B of the transfer head 104 is one position per one rotation. A gear is cut on the side surface of the arm gear 116.

The center arm 117 shown in FIG.
It has an L-shaped structure, and a gear groove is provided on the side surface of the lower arm in the longitudinal direction.
7A serves as a stopper in the length direction of the IC. The arm gear 116 and the center arm 117 are used for the IC carrier 11
5 and the arm gear 1 is assembled as shown in FIG. 2 (c).
The rotation of 16 makes the dimension L between the arms 117A of the pair of facing center arms 117 variable. The allowable rotation angle of the arm gear 116 is within one rotation, for example, 2
It is limited to 70 degrees, and the distance between the two arms 117A can be obtained by knowing the rotation angle of the arm gear 116.

FIG. 3 shows a cross section of the IC carrier 115 and its automatic adjusting mechanism, and FIG. 4 shows a schematic top view thereof. In the figure, 101 is a base which is fixed to the main body of the IC carrier carrier, and to which a carrier aligner 102 and a carrier guide 103 are attached. The carrier guide 103 is I
Part of the C carrier transport rail, IC carrier 1
This is a block which guides the IC carrier 115 when 15 is conveyed. The carrier aligner 102 receives the I
This is a cylinder for fixing and positioning the C carrier 115.

In the figure, 105 is a transfer base,
A plurality of cylinders 106 mounted between the base 101 and the transfer base 105 to move the transfer base 105 up and down, a transfer head 104 via a pulley shaft 104L, a pulse motor 114 via a motor holder 113, a position sensor 110, a sensor holder. Set sensor 107 and reflector 1 via 108
09 is attached.

The transfer head 104 is a rotary unit that rotationally drives an arm gear 116 that adjusts the lengthwise dimension of the center arm 117 built in the IC carrier 115. The pulse motor 114 is a motor that rotates the transfer head 104 by connecting the pulleys 112 and 104I attached to the rotation shafts of the pulse motor 114 and the transfer head 104 with the timing belt 111. The position sensor 110 is a sensor hole 1 that is provided on a position plate 104F that rotates together with the transfer head 104 and that indicates the origin of rotation.
This is a sensor for detecting 04M. Set sensor 1
07 is the guide pin 104 of the transfer head 104
A and 104B are arm gears 1 on the IC carrier 115 side.
It is a reflection type sensor that detects whether or not 16 guide holes 116A and 116B have been entered.

The sensor holder 108 includes a set sensor 1
The reflector 109 is fixed so as to face 07. The transfer head 104 is at a position where the arm gear 116 of the IC carrier 115 can be rotationally driven.
When 04 is in the upper position, the shielding plate 104G is also in the upper position, and the light from the set sensor 107 is reflected by the reflecting plate 109 and sensed by the set sensor 107. When the guide pins 104A and 104B of the transfer head 104 do not enter the guide holes 116A and 116B of the arm gear 116 of the IC carrier 115, the transfer head 10
4 is at the lower position and the shield plate 104G is also at the lower position, the light of the set sensor 107 is blocked by the shield plate 104G and is not sensed by the set sensor 107.

FIG. 5 shows a detailed view of the transfer head 104. The transfer head 104 is a disk-shaped guide pin base 10 that rotates a pulley 104I portion that transmits a motor drive and an arm gear 116 of the IC carrier 115.
The 4C portion, a detection mechanism that recognizes whether or not the arm gear 116 of the IC carrier 115 and the guide pin base 104C are correctly joined, and a detection mechanism that recognizes the origin of rotation of the transfer head 104.

The pulley 104I is the pulley shaft 104.
It rotates about L as an axis through a bearing 104K, and is linked with a pulley 112 attached to a pulse motor 114 by a timing belt 111.

The disc-shaped guide pin base 104C includes:
Guide pins 104A and 104B provided in the same dimension relationship as the guide holes 116A and 116B of the arm gear 116 built in the IC carrier 115 are attached. The guide pin base 104C has a pulley 10
The connecting shaft 104E for positioning with 4I is press-fitted. The positions of the guide pins 104A and 104B are shown in FIG.
As described above, the transfer head 104 is eccentrically provided with respect to the rotation axis thereof. Therefore, the guide pin base 10
4C and the arm gear 116 are designed so that the guide pins enter the guide holes at only one location on the concentric shaft.

Whether the arm pin 116 and the guide pin base 104C are correctly joined by the guide pin entering the guide hole is determined by setting the vertical movement of the shield plate 104G.
07 and the reflection plate 109 detect and determine. The guide pin base 104C has a structure in which the connecting shaft 104E is guided by the bearing 104J of the pulley 104I, and the vertical movement is movable with respect to the pulley 104I, but there is no rattling in the rotational direction. Between the guide pin base 104C of the connecting shaft 104E and the pulley 104I, there is a spring 104D, which is normally the guide pin base 104C.
Is pushed up. A shield plate 104G is fixed to the tip of the connecting shaft 104E, and normally,
It is pushed up together with the guide pin base 104C.

In order to drive the arm gear 116 to rotate, when the transfer base 105 is pulled up by the cylinder 106, the tip of the guide pin contacts the arm gear 116, and the guide pin base 104C and the connecting shaft 10 are connected.
The shield plate 104G fixed by 4E is pushed down. At this time, the shield plate 104G is inserted between the set sensor 107 and the reflection plate 109 to turn off the set sensor 107. In this state, when the guide pin base 104C is rotated by the pulley 104I and the guide pin enters the guide hole, the guide pin base 104C and the shield plate 104G
Is pushed upward, and the set sensor 107 is turned on. As a result, it can be determined that the guide pin has entered the guide hole and can be driven to rotate.

The origin of rotation of the transfer head 104 is recognized by detecting the sensor hole 104M provided in the position plate 104F. The position plate 104F is fixed to the pulley 104I and has a fan shape so that the optical axis of the position sensor 110 can be blocked or transmitted by the rotation of the transfer head 104. There is one sensor hole 10 in the fan-shaped part that blocks the optical axis.
4M is provided, and the optical axis is transmitted through the sensor hole 104M so that the origin of rotation of the transfer head 104 can be recognized.

Next, a method of recognizing the distance between the arms 117A will be described. First, the transfer head 104 is moved to the origin position where the position sensor 110 detects the sensor hole 104M. In that state, the IC carrier 11
5 moves onto the base 101 guided by the carrier guide 103 above the transfer head 104. Then, the carrier aligner 102 fixes the IC carrier 115 from both side surfaces. Next, the transfer base 105 moves upward by turning on the cylinder 106. At this time, if the guide pins 104A and 104B are not aligned with the guide holes 116A and 116B of the arm gear 116,
The tips of the guide pins 104A and 104B are arm gears 1
Upon hitting 16, the guide pin base 104C is pushed down.

When the guide pin base 104C is pushed down, the shield plate 104G connected thereto is also lowered at the same time, and the optical axis of the set sensor 107 is shut off. From this state, the guide pins 104A and 104B are connected to the arm gear 1
After entering the 16 guide holes 116A and 116B, the shield plate 104G goes up together with the guide pin base 104C,
The pulse motor 114 is driven one pulse at a time until the optical axis of the set sensor 107 is transmitted, reflected by the reflection plate 109, and input to the set sensor 107.

The rotation distance of the arm gear 116 from the origin is calculated from the number of pulses of the pulse motor 114 from the position of the origin to the time when the optical axis of the set sensor 107 is transmitted,
The distance between the arms 117A of the IC carrier 115 can be recognized. However, the distance between the arms at the origin is designed to be a constant value.

The arm distance L ₀ when the transfer head 104 is in the origin set to be 7mm in FIG 6, Amugiya by driving the pulse motor 114 116
The resolution of one rotation of the arm gear 116 is 1000 divisions.
A schematic diagram for obtaining the arm-to-arm distance L ₁₀₀ when the driving pulse is 100 pulses when the pitch circle diameter is 15 mm is shown. The arm-to-arm distance ΔL per pulse of the pulse motor 114 in this case is ΔL = 2 × (15 × π) /1000=0.0942 mm, and when the number of pulses from the origin is P, the arm-to-arm distance L is calculated. The formula is L = ΔL × P + L ₀ , and the arm-to-arm distance L ₁₀₀ when the driving pulse from the origin is 100 pulses is L ₁₀₀ = 0.0942 × 100 + 7 = 16.42 mm.

FIG. 7 shows a flowchart for setting the arm-to-arm distance to an arbitrary value. Transfer head origin search The transfer head 104 is rotated about a pulley shaft 104L fixed to the transfer base 105 by a pulse motor 114, pulleys 112 and 104I, and a timing belt 111. At this time, pulley 1
Position plate 104 mounted under 04I
F also rotates, and the sensor hole 104M causes the position sensor 11 to move.
The position detected by 0 is the origin.

The carrier aligner CLOSE IC carrier 115 is moved along the carrier guide 103 to the upper part of the transfer head 104, and the ICs 115 on both sides are moved.
The two carrier aligners 102 sandwich and fix them.

Transfer Base UP The transfer base 105 is lifted by the cylinder 106. At this time, the tip ends of the guide pins 104A and 104B are pressed by the arm gear 116, the shield plate 104G connected to the guide pin base 104C is lowered between the set sensor 107 and the reflection plate 109, and the set sensor 107 is at a low level. .

Motor driving 1 pulse, set sensor check pulse The motor 114 is driven by 1 pulse to drive the set sensor 1
Check the output level of 07. Set sensor 107
Is at the Low level, the pulse motor 114 is driven by one pulse. When the guide pins 104A and 104B of the transfer head 104 enter the guide holes 116A and 116B of the arm gear 116 of the IC carrier 115, the shield plate 1 connected to the guide pin base 104C.
04G is pushed up by the spring 104D, the light from the light source of the set sensor 107 is reflected by the reflection plate 109, and the set sensor 107 becomes high level. The distance between the arms of the IC carrier 115 is recognized based on the number of motor drive pulses generated from the origin until the set sensor 107 reaches the high level.

Corrected pulse number motor drive If the pulse number from the origin corresponding to the distance between the arms to be set is P _S, and the pulse number to the current position of the IC carrier 115 obtained in P is set, The motor drive correction pulse number P _C for moving the arm 117A to the desired position is obtained by P _C = P _S −P. When P _C is positive, it is positive rotation, and when P _C is negative, The motor is driven in reverse rotation, and the arm is moved to the distance between the arms to be set.

Transfer base DOWN By pushing down the transfer base 105 with the cylinder 106, the guide pin is separated from the guide hole, and the IC carrier 115 and the transfer head 104 are separated from each other. Carrier Aligner OPEN IC Carrier Aligner 1 fixing carrier 115
02 is moved in both directions so that the IC carrier can move along the carrier guide 103. The transfer head 104 is moved to the origin position in the same manner as the transfer head origin search.

FIG. 8 shows a method of driving a motor when setting the arm-to-arm distance. The transfer base 105 is raised at the first origin, and the set sensor 107 is set for each step while the motor is stepwise fed.
Is checked whether the output is High level or Low level. When the guide pin reaches the position before the adjustment, the output of the set sensor 107 becomes High level, and the step feed is stopped. The number of pulses from the origin to the set value is P
_{Let S} be the number of pulses from the origin to the position before the adjustment, and P be the number of moving pulses P _C to the set value in order to adjust the arm-to-arm distance from the position before the adjustment to the set position. P _C is obtained by P _S -P, and when it is positive, it is rotated forward, and when it is negative, it is rotated backward to position it at the set value. When the setting is completed, lower the transfer base 105, return to the origin,
Send the next IC carrier.

From the second time onward, it is highly likely that the position of the arm of the IC carrier 115 before adjustment is the same as that at the first time. Therefore, with the transfer base 105 lowered, the number of pulses P pulses to the position before adjustment is P pulses. High-speed block feed. When reaching the position before adjustment, raise the transfer base 105,
The output of the set sensor 107 is checked. When the output of the set sensor 107 is at the high level, the transfer base 10 is positioned at the set value in the same manner as.
Lower 5 to return to the origin and send the next IC carrier 115.

As in the case of the n-th time, the transfer base 105 is lowered and the high-speed block feed of the pulse number P pulse to the position before the adjustment is performed. When the position before adjustment is reached, the transfer base 105 is raised and the output of the set sensor 107 is checked. Here, when the output of the set sensor 107 is at the low level, the transfer base 105
Lower to return to the origin. Then, since it may have already been adjusted to the set value, the high-speed block feed of the pulse number P _S pulses from the origin to the set value is performed. Here, the transfer base 105 is raised and the output of the set sensor 107 is checked. The output of the set sensor 107 is High
In the case of h level, it has already been adjusted to the set value,
Lower the transfer base 105, return to the origin, and proceed to the next I
Send C carrier 115. When the output of the set sensor 107 is at the low level, the transfer base 105 is lowered and the process returns to the origin. Then, the transfer base 105 is raised, and the set sensor 107 is checked while performing step feed. When the current position before the adjustment is reached, the output of the set sensor 107 becomes High level. In the same manner as above, the number of movement pulses up to the set value is obtained, and the arm-to-arm distance is moved to the set value. When the setting is completed, lower the transfer base 105, return to the origin, and next IC carrier 1
Send 15

Here, the setting of the inter-arm distance by the arm gear 116 has been described, but the setting of the distance between the IC supporting members 124 by the spiral disk 123 can be performed by the same method.

[0056]

As described above, according to the present invention, I
With the C carrier, the storage dimensions of the IC storage portion in the width direction and the length direction can be changed, so that ICs of different sizes can be transported by the same IC carrier. Also, I
By the automatic adjustment mechanism of the C carrier, the storage dimensions of the IC storage portion in the width direction and the length direction can be automatically set, and a fully automated IC test device can be configured. Therefore, the effect is practical and very useful.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing an internal structure of an IC carrier according to the present invention.

FIG. 2 is an explanatory view showing the basic structure for changing the storage dimension of the IC carrier in the length direction according to the present invention.

FIG. 3 is a cross-sectional view showing an IC carrier and an automatic adjustment mechanism thereof according to the present invention.

FIG. 4 is a schematic top view showing an IC carrier and an automatic adjustment mechanism thereof according to the present invention.

FIG. 5 is a detailed view of a transfer head of the automatic adjustment mechanism according to the present invention.

FIG. 6 is a schematic diagram for obtaining an inter-arm distance according to the present invention.

FIG. 7 is a flow chart for setting an inter-arm distance according to the present invention to an arbitrary value.

FIG. 8 is an explanatory diagram showing a method of driving a motor when setting an arm-to-arm distance according to the present invention.

FIG. 9 is a cross-sectional view showing a conventional IC carrier.

FIG. 10 is an exploded perspective view for explaining the structure of a conventional IC carrier.

FIG. 11 is a plan layout view for explaining an example of an IC test apparatus that uses an IC carrier.

FIG. 12 is a plan layout view for explaining an operating state of an IC test apparatus that uses an IC carrier.

FIG. 13 is an IC of an IC test apparatus that uses an IC carrier.
It is a side view for explaining a storage part.

[Explanation of symbols]

10 Annular Conveying Rail 10A Position 11 Guide Rail 12A, 12B, 12C, 12D, 82, 83 Driving Device 12E Extrusion Driving Device 20 IC Carrier 21 Frame 22 O-ring 23 Spiral Disc 23A Disc 23B Concavo-convex Engaging Surface 23C Small Hole 24 IC Support member 24A, 24B, 24C, 24D Protrusion 25 Guide plate 25A Long hole 26 Cover 28A Drive shaft 28B Pin 30 Loader section 31, 41 Adsorption transfer means 40 Unloader section 32, 43, 53 Rail 50 First adsorption transfer means 51, 52 Transport platform 60 Second suction transport means 70 Test section 71 Relay platform 80 IC carrier storage section 81 Transport path 84 Set cylinder 85 Rod 90 Temperature control means 101 Base 102 Carrier aligner 103 Carrier guide 104 Transfer head 104A, 1 04B Guide pin 104C Guide pin base 104D Spring 104E Connecting shaft 104F Position plate 104G Shielding plate 104H Fixing nuts 104I, 112 Pulley 104J Bearing 104K Bearing 104L Pulley shaft 104M Sensor hole 105 Transfer base 106 Cylinder 107 Set sensor 108 Sensor holder 109 Reflecting plate 110 Position sensor 111 Timing belt 113 Motor holder 114 Pulse motor 115 IC carrier 116 Arm gears 116A, 116B, 123A, 123B Guide hole 117 Center arm 117A Arm 121 Frame 123 Spiral disk 124 IC support member 124A, 124B, 124C, 124D, 125B
Protrusions 124E, 125A Long holes 125 Guide plate 126 Cover

─────────────────────────────────────────────────── ─── Continuation of the front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) G01R 31/26 G01R 31/28-31/3193 H01L 21/66

Claims (2)

(57) [Claims] 1. A spiral disk (123) having a quadrangular frame (121) in plan view and a rotatably housed in the bottom surface of the frame (121) and having a spiral concave-convex engagement surface on the upper surface side. ), And a protrusion (124A) that engages with the concave-convex engagement surface formed on the spiral disk (123) is formed on the bottom surface, and an IC mounting surface for mounting an IC is formed on the upper surface, and the spiral disk (123) The two IC support members (124) whose IC storage width dimension of the IC mounting surface is changed by rotating the same and the spiral disk (123) are rotatably housed on the upper surface and the side surface of the disc. Arm gear with a gear groove (1
16) and a gear groove that engages with a gear groove formed in the arm gear (116) on the side surface, and an arm (117A) extending upward is formed at one end, and the arm gear (116)
An IC composed of two center arms (117) whose IC storage length is changed by rotating the IC, and a cover (126) for preventing each member from coming off from the frame body (121). Career. 2. A carrier guide (103) and an IC carrier (115) fixed to a base (101) fixed to a main body of an IC carrier (115) carrier device for guiding the carrier of the IC carrier (115). A carrier aligner (102) for positioning, a transfer base (105) that moves up and down with respect to the base (101) by a plurality of cylinders (106), and an IC carrier (115) attached to the transfer base (105). A pulse motor (114) that rotates the transfer head (104) by connecting it to a transfer head (104) that rotationally drives the built-in arm gear (116) or spiral disk (123) with a timing belt (111).
And a position sensor (1) that detects a sensor hole (104M) provided on a position plate (104F) that rotates together with the transfer head (104) and indicating the origin of rotation.
10) and the guide pin (104A) of the transfer head (104)
And 104B) are the guide holes (116A and 116B) of the arm gear (116) of the IC carrier (115) or the guide hole (123A of the spiral disk (123).
And 123B), an IC carrier automatic adjusting mechanism configured by a set sensor (107) for detecting that it has entered.