JP3366482B2 - Flip-chip type liquid crystal display element and liquid crystal display module - Google Patents

Description

Detailed Description of the Invention

[0001]

The present invention relates to a superimposed liquid crystal display device及beauty liquid crystal display module of the flip chip method equipped with a driving IC on one substrate of the two transparent insulating substrate were.

[0002]

2. Description of the Related Art For example, in order to mount a driving IC on one transparent insulating substrate of a liquid crystal display element (liquid crystal display panel), outer leads of a tape carrier package (TCP) mounted with the driving IC and a liquid crystal display panel. The upper wiring pattern is electrically connected using an anisotropic conductive film. This anisotropic conductive film is a film-shaped thermosetting adhesive in which fine conductive particles are evenly dispersed, and when heated and pressed, the outer leads and the wiring pattern facing each other are connected to each other to form a TCP component. It can be fixed to the transparent insulating substrate.

However, in recent years, due to the demand for higher density liquid crystal display elements and the desire to reduce the module outer shape as much as possible, TCP components are not used, and bump electrodes of the driving IC and one of the liquid crystal display elements are not used. A method of directly connecting with a wiring pattern on a transparent insulating substrate has been considered. Such a mounting method may be a flip chip method or a driving I
Since C is mounted on the transparent insulating substrate, chip-on
It is called a glass (COG) mounting method.

This flip-chip connection method is shown in FIG.
This will be described with reference to FIG. As shown in FIG. 11A, bumps BUMP (projection electrodes) are formed on the driving IC, and the bumps BUMP (projection electrodes) are held on the pressing surface of the bonding head HEAD by vacuum suction or the like. On the transparent insulating substrate SUB1, a wiring pattern DTM to be joined with the bump BUMP.
(GTM) is formed. Further, the anisotropic conductive film AC is previously formed on the wiring pattern DTM (GTM).
F is attached.

The bump BUMP and the wiring pattern DTM
(GTM) is an imaging camera CAM arranged below the transparent insulating substrate SUB1 with the imaging surface FACE facing upward.
The transparent insulating substrate SUB1 based on the signal from ERA
Are driven in the XY directions to align the bump BUMP with the wiring pattern DTM (GTM).

Then, as shown in FIG. 11 (b), the bonding head HEAD is driven downward to bring the bump BUMP into contact with the upper surface of the anisotropic conductive film ACF, temporarily attach it, and then securely again. It is confirmed by the imaging camera CAMERA whether or not it is positioned, and if it is good, it is heated and pressure-bonded by the bonding head HEAD.

In this way, the conductive particles in the anisotropic conductive film ACF are crushed between the bump BUMP and the wiring pattern DTM, and electrical connection is possible.

Although not shown in FIG. 11, a flexible substrate (FPC) electrically connected to an input wiring pattern to the driving IC is also subjected to a similar bonding method by a wiring pattern on the flexible substrate. (Normally, the copper pattern is plated with gold.) And the wiring pattern (Td) on the transparent insulating substrate SUB1 can be electrically connected by the anisotropic conductive film ACF.

[0009]

In the conventional flip-chip type liquid crystal display element and its manufacturing method, the anisotropic conductive film ACF attached on the wiring patterns DTM (GTM) and Td on the transparent insulating substrate SUB1 is used. Since it contains conductive particles, it is semi-transparent. Therefore, the visibility is lowered, and the bump BUMP and the position of the wiring pattern on the flexible substrate may be erroneously recognized, which causes a problem that accurate mounting cannot be performed. .

A first object of the present invention is to reduce the outer shape of the module as much as possible even if the bump BUMP of the driving IC or the pitch of the wiring pattern on the flexible substrate FPC is reduced due to the high density of the liquid crystal display element. And a liquid crystal display device of a flip chip system capable of electrically connecting the driving IC and the flexible substrate FPC to the wiring patterns DTM (GTM) and Td on the transparent insulating substrate SUB1 with high positional accuracy. It is to provide a manufacturing method.

A second object of the present invention is to reduce the outer shape of the module as much as possible even if the bump BUMP of the driving IC or the pitch of the wiring pattern on the flexible substrate FPC is reduced due to the high density of the liquid crystal display element. Of the wiring pattern DT on the transparent insulating substrate SUB1 with good workability while ensuring the bonding position accuracy.
An anisotropic conductive film ACF is arranged on M (GTM) and Td.

[0012]

[Means for Solving the Problems ]
Therefore, in the present invention, as described in the claims,
Take a different configuration. That is, the flip chip according to claim 1.
The liquid crystal display device of the type is a driving IC on a transparent insulating substrate.
On the transparent insulating substrate
Connect a sible board and connect the input to the driving IC to the transparent board.
The wiring pattern formed on the bright insulating substrate
In a liquid crystal display device made from a flexible substrate,
The transparent substrate in the area where the flexible substrate overlaps the transparent insulating substrate is
On the light insulating board, align the flexible board with the flexible board.
The alignment mark is a transparent pixel electrode in the wiring material.
The material is coated. Also bill
The flip-chip type liquid crystal display device according to item 2,
In the flip-chip type liquid crystal display device according to item 1.
The flexible substrate formed on the transparent insulating substrate.
Alignment mark with the plate is formed on the flexible board
Than the second mark that is paired with the above alignment mark
Small, wiring material is covered with transparent pixel electrode material
The transparent insulating substrate and the flexible substrate.
When the sibble substrates are attached, the above flexible substrate
The second mark formed on the transparent insulating substrate
It has a shape that surrounds the alignment mark formed on
To collect. In addition, the flip-chip method according to claim 3
The liquid crystal display device is of the flip-chip type according to claim 1.
In the liquid crystal display element, the anisotropic conductive films are arranged in a line.
Elongated shape common to multiple driving ICs
And the input wiring pattern to the plurality of driving ICs
Attaching the elongated shape common to the parts separately
Characterized by The flip according to claim 4
The flip chip liquid crystal display device according to claim 2.
In the chip-type liquid crystal display element, the second adjustment
The mark is pattern-connected to the wiring on the flexible board
It is characterized by being provided. In addition, claim 5
The flip-chip type liquid crystal display element described in claim 1.
5. A flip-chip type liquid crystal table according to any one of
In示素Ko, wood charge is aluminum of the wiring
It is characterized by Further, the flip chip according to claim 6
A liquid crystal display device of the type is a liquid crystal display device according to any one of claims 1 to 4.
In the flip-chip type liquid crystal display element described above,
The wiring is a gate wiring. Also, the contract
The flip-chip type liquid crystal display element according to claim 7 is a contract
The flip chip method according to any one of claims 1 to 4
In the liquid crystal display element, the material of the transparent pixel electrode is IT
It is O. The liquid crystal according to claim 8.
The display module according to any one of claims 1 to 7.
A liquid crystal display element is used.

[0013]

[0014]

[0015]

[Action] In the liquid crystal display device及beauty liquid crystal display module of a flip chip method, which is constituted by the above means, the mark alignment mark ALC is combined flexible substrate FPC AL
Combined with M, it has the effect of performing accurate alignment during temporary attachment.

Further, since the anisotropic conductive film ACF is first commonly attached only to a plurality of driving IC portions arranged in a line, the alignment mark ALC is transparent to the transparent insulating substrate SUB1 with good visibility by the image pickup camera CAMERA. The position can be detected through, and there is an effect of performing accurate position alignment when the drive IC is temporarily attached. Further, the connection state of the driving IC can be inspected by using the inspection pad before attaching the flexible substrate FPC.

[0017]

EXAMPLES The present invention will be specifically described below with reference to examples.

FIG. 1 shows a transparent insulating substrate S according to the present invention.
FIG. 3 is a plan view showing a state in which a driving IC is mounted on UB1. Further, a cross-sectional view taken along the line AA is shown in FIG.
A sectional view taken along the line B is shown in FIG. The one transparent insulating substrate SUB2 is shown by a one-dot chain line.
Located above B1, seal pattern SL (see FIG. 5)
Thus, the liquid crystal LC is enclosed in the effective screen area AR. The electrode COM on the transparent insulating substrate SUB1 is connected to the transparent insulating substrate SUB2 via conductive beads or silver paste.
The wiring is electrically connected to the common electrode pattern on the side. The wiring DTM supplies an output signal from the driving IC to the wiring in the effective screen area AR. Wiring Td
Is for supplying an input signal to the driving IC. The anisotropic conductive film ACF has an elongated shape common to a plurality of driving IC portions arranged in a line ACF2 and an elongated shape common to the input wiring pattern portions to the plurality of driving ICs. ACF1 is attached separately.
As shown in FIG. 5, the passivation film PSV1 covers the wiring portion as much as possible and the exposed portion is covered with the anisotropic conductive film ACF1 in order to prevent electrolytic corrosion. The alignment mark ALC is provided on both sides outside the input wiring pattern to the driving IC and the common electrode wiring in this example.

FIG. 2 is a perspective view of the assembled liquid crystal display module MDL as seen from the front side of the liquid crystal display element.

The module MDL is a shield case SH.
It has two types of storage / holding members, D and a lower case.

The HLDs are four mounting holes provided for mounting the module MDL as a display unit on an information processing device such as a personal computer and a word processor. Mounting holes SH1 to SH4 of the shield case SHD are formed at positions corresponding to the mounting holes of the lower case MCA, and the both mounting holes are fixed and mounted on the information processing device with screws or the like. The module MDL is provided with a brightness adjusting volume VR, a backlight inverter is arranged in the MI portion, and power is supplied to the backlight via the connector LCT and the lamp cable LPC. Signals from the main computer (host) and necessary power supply are sent via the interface connector CT located on the back of the module.
The liquid crystal display module MDL is supplied to the controller unit and the power supply unit.

FIG. 3 shows a TFT which is the embodiment shown in FIG.
FIG. 3 is a block diagram showing a TFT liquid crystal display element of a liquid crystal display module and a circuit arranged on an outer peripheral portion thereof. In the present invention, the drain drivers IC _{1 to} IC _M and the gate drivers IC _{1 to} IC _N are, as shown in FIG. 5, drain side lead lines DTM and gates formed on one transparent insulating substrate SUB1 of the liquid crystal display element. Chip-on-glass mounting (COG mounting) is performed using the side lead-out line GTM and an anisotropic conductive film or an ultraviolet curable resin. In this example, it is applied to a liquid crystal display device having effective dots of 1024 × 3 × 768 which are XGA specifications. Therefore, on the transparent insulating substrate of the liquid crystal display element, the drain driver I of 192 outputs is provided.
Eight Cs on each of the opposing long sides (M = 16) and 1
Eight output gate driver ICs on the short side (N = 8)
And COG are implemented. The drain driver section 103 is arranged on the upper and lower sides of the liquid crystal display element, the gate driver section 104 is provided on the side surface section, and the other side section is provided.
A controller unit 101 and a power supply unit 102 are arranged. The controller unit 101, the power supply unit 102, the drain driver unit 103, and the gate driver unit 104 are mutually connected by electrical connecting means JN1 to JN4.

FIG. 4 shows the multilayer flexible boards FPC1 to FPC1 to 3 and the multilayer printed board P on the outer periphery of the display panel PNL.
It is a bottom view which shows the state which mounted CB. In this example, the multilayer flexible boards FPC1 to FPC3 are bent downward in the subsequent steps.

The upper eight in FIG. 4 are drive IC chips on the side of the vertical scanning circuit, and the left and right eight are drive IC chips on the side of the video signal drive circuit. Anisotropic conductive films and ultraviolet curing agents are used. And chip-on-glass (COG) on transparent insulating substrate
It is implemented. In the conventional method, a tape carrier package (TCP) in which a driving IC chip is mounted by a tape automated bonding (TAB) method is connected to a display panel PNL using an anisotropic conductive film.
In COG mounting, since the direct drive IC is used, the above-mentioned TAB step is not required, so that the steps are shortened and the tape carrier is not required, so that there is an effect of cost reduction. Further, the COG mounting is suitable as a mounting technology for the high-definition / high-density display panel PNL. That is, in this example, XG
As the A panel, a TFT liquid crystal display module of 1024 × 3 × 768 dots and a 10-inch screen size was designed.
Therefore, the size of each dot of red (R), green (G), and blue (B) is 207 μm (gate line pitch) × 69 μm
(Drain line pitch), and one pixel is a combination of 3 dots of red (R), green (G), and blue (B)
It is 07 μm square. Therefore, if the drain line lead-out DTM is 1024 × 3 on one side, the lead-out line pitch will be 69 μm or less, which is less than the connection pitch limit of the currently available TCP mounting. In COG mounting, depending on the material such as the anisotropic conductive film used, the pitch of the bump BUMP of the driving IC chip is about 70 μm and the crossing area with the underlying wiring is about 50 μm square. It can be called a value. Therefore, in this example, the drain driver I is provided on the two long sides facing each other of the liquid crystal panel.
Cs are arranged in a line, the drain lines are alternately drawn out to the two long sides, and the pitch of the drain line drawing DTM is 69 ×.
2 μm. Therefore, the bump BUMP (see FIG. 5) of the driving IC chip can be designed to have a pitch of about 100 μm and an intersecting area with the underlying wiring of about 70 μm square, and it is possible to connect the underlying wiring with higher reliability. Since the gate line pitch is 207 μm, which is sufficiently large, the gate line lead-out GTM is led out on the short side on one side. It is also possible to draw the line GTM alternately.

In the method of alternately drawing out the drain lines or the gate lines, as described above, the connection between the lead-out line DTM or GTM and the output side BUMP of the driving IC becomes easy, but the peripheral circuit board is opposed to the liquid crystal panel PNL. Therefore, there is a problem in that it is necessary to dispose them on the outer peripheral portion of the two long sides, and therefore the outer dimension becomes larger than in the case of one-sided drawing. In particular, as the number of display colors increases, the number of data lines of display data also increases, and the outermost shape of the information processing device becomes large. Therefore, in this example, the conventional problem is solved by using the multilayer flexible substrate. When the screen size of the XGA panel is 14 inches or more, the pitch of the drain line lead-out DTM is as large as about 100 μm or more, and the drain driver IC can be arranged on one long side by COG mounting on one side. Also in this case, the multilayer flexible substrate of this example can be used.

The multilayer flexible substrate used in this example is
The number of data lines can be increased by providing three or more conductor layers, for example, four portions FML of the conductor layers L1 to 4 in parallel with the sides of the liquid crystal panel PNL and mounting peripheral circuit wiring and electronic parts in this portion. Can be dealt with by increasing the number of layers while maintaining the outer shape of the substrate. The connections between the conductor layers are electrically connected through the through holes. The conductor layers L1 to L4 are copper CU
Although it is formed of wiring, only the conductor layer L3 is formed by plating the copper CU with gold AU. Therefore, the output terminal TM
And the connection resistance between the input terminal wiring Td to the drive IC (see FIG. 5) can be reduced. An intermediate layer made of a polyimide film BFI material is interposed as an insulating layer between the conductor layers, and the conductor layers are fixed by an adhesive BIN. The conductor layer is covered with an insulating layer except for the output terminal TM, but the multilayer wiring portion F
In ML, solder resist SRS was applied to the uppermost and lowermost layers to ensure insulation.

The advantage of the multilayer flexible substrate is that the conductor layer L3 including the connection terminal portion TM required for COG mounting is used.
Can be configured integrally with other conductor layers, and the number of parts can be reduced.

Further, by forming the portion FML of the conductor layer of three or more layers, it becomes a hard portion with little deformation, so that the positioning hole FHL (FIG. 7) can be arranged in this portion. Further, even when the multilayer flexible substrate is bent, the bending can be performed with high reliability and accuracy without causing deformation in this portion. Furthermore, a solid or mesh-shaped conductor pattern can be arranged on the surface conductor layer L1, and the remaining two or more conductor layers can be used for wiring the component mounting and peripheral wiring conductor patterns.

In this way, the protruding portion FSL (FIG. 6) is divided into two.
By configuring the conductor layers to be less than or equal to the layers, the heat conduction is good and the pressure can be uniformly applied during the thermocompression bonding with the heat tool, and the electrical reliability of the connection terminal portion TM and the terminal wiring Td can be improved. Further, even when the multilayer flexible substrate is bent, accurate bending can be performed without applying bending stress to the connection terminal portion TM. Also, the protruding portion FSL
Since the portion is semi-transparent, the pattern of the conductor layer can be observed from the upper surface side of the multilayer flexible substrate, so that there is also an advantage that the pattern inspection of the connection state and the like can be performed from the upper surface side.

The alignment mark on the flexible substrate will be described below.

In the flexible boards FPC1 to FPC3,
The length of the connection terminal portion TM is usually designed to be about 2 mm in order to secure connection reliability. However, flexible substrate F
Since the long sides of the PCs 1 to 3 are as long as 170 to 240 mm, the input terminal wiring Td and the connection terminal portion TM may be misaligned due to misalignment including a slight rotation in the long axis direction, which may result in poor connection. is there. The liquid crystal panel PNL and the flexible substrates FPC1 to FPC1 to 3 are aligned by inserting the opening holes FHL formed at both ends of each substrate into the fixing pins and then aligning the input terminal wiring Td and the connecting terminal portion TM at several places. You can However, in this example, in order to further improve the alignment accuracy, the alignment marks ALMG, AL
An MD (Fig. 7) was provided.

As an input of the gate driver driving IC,
There are 20 in total, number 2 of the connection terminal portion TM shown in FIG.
21 are electrically connected to each other. The pitch PG of the terminals TM is about 600 μm. The alignment mark ALMG is
It is positioned near each of the 20 terminals TM to each drive IC, and the alignment accuracy with the input terminal wiring Td pattern is improved and the inspection after connection is performed. In this example, in order to improve connection reliability, dummy lines NC (terminal numbers 1 and 22) are provided adjacent to the 20 input terminals TM, and further,
The square-shaped alignment mark ALMG is formed by pattern-connecting to the dummy line NC, and is opposed to the transparent substrate S.
Align the square filled pattern ALC (see FIG. 6) on UB1 just within the square shape. Furthermore, in this example, since the joint patterns JN3 and JN4 for connecting to the drain driver substrates FPC2 and FPC3 are provided on both end sides of the FPC1, the alignment mark ALMG is the outermost wiring pattern JN4.
The pattern is connected to the number 1 in the above or the number 1 in the pattern JN3.

There are a total of 47 inputs to the drain driver drive IC, which are electrically connected to the connection terminal portion TM. The pitch of the terminals TM is about 370 μm. In this example, the alignment mark ALMD has dummy lines (terminal numbers 2 and 50) for improving the connection reliability arranged adjacent to the 47 input terminals TM. Further, on the outer side of the transparent insulating substrate SUB2 is a counter electrode for the liquid crystal capacitor.
Terminals (Nos. 1 and 51) for supplying a voltage to the common transparent pixel electrode COM (see FIG. 1) inside are disposed. Thus, the common voltage is supplied to the common transparent pixel electrode COM on the transparent insulating substrate SUB2 side through the wiring Td pattern on the transparent insulating substrate SUB1 and via the conductive beads or paste.

The alignment mark ALMD is provided by pattern-connecting to terminals (numbers 1 and 51) electrically connected to this electrode COM, and is aligned with a square filled pattern ALC (see FIG. 6) on the transparent substrate SUB1.

Next, the shape of the conductor layer portion FSL of two layers or less will be described.

In this example, the protruding length of the portion FSL formed of a single-layer or two-layer conductor wiring is a bent portion (see FIG. 6).
Is set to about 4.5 mm. However, in the structure without bending, the portion FSL can be further shortened.

The projecting shape of the portion FSL is a convex shape separated for each drive IC. Therefore, it is possible to prevent a phenomenon in which the flexible substrate thermally expands in the major axis direction during thermocompression bonding with a heat tool, the pitches PG and PD of the terminals TM change, and peeling or connection failure from the connection terminals Td occurs.
That is, by forming a convex shape that is separated for each drive IC, the pitch PG and PD shifts of the terminals TM can be set to the amount of thermal expansion corresponding to the cycle length of each drive IC at the maximum. In this example, the flexible substrate FPC has a convex shape divided into eight divisions in the major axis direction, and this thermal expansion amount can be reduced to about 1/8, and the terminal T
It also contributes to the stress relaxation to M, and the reliability of the liquid crystal module MDL against heat can be improved.

As described above, the flexible substrate FPC
In addition, by providing alignment marks ALMG and ALMD and forming the protruding shape of the partial FSL into a convex shape separated for each drive IC, even if the number of connection wirings or the number of display data data increases, the connection accuracy is high and the connection reliability is high. It is possible to reduce the size of the peripheral drive circuit while ensuring the above.

FIG. 7 is a perspective view showing a method of bending and mounting a multilayer flexible substrate. Drain driver substrate F
For connection between the PC2 and FPC3 and the gate driver board FPC1, it is possible to use a flexible board as a joiner and, if necessary, fold and mount at this portion. However, in this example, in order to reduce the number of parts and to perform bending mounting easily, the transparent insulating substrate S
An electrical connection pattern between the substrates is formed on the UB1.

First, as a rough alignment between the flexible substrates FPC1 to FPC3 and the liquid crystal panel PNL, the liquid crystal panel PNL is fixed to a jig at a predetermined position, and the fixing pin of the jig has a hole F.
HL is inserted to temporarily fix the boards FPC1 to 3. Anisotropic conductive film ACF 1 is attached on the liquid crystal panel PNL, and while performing more accurate alignment with the alignment mark described above, temporary thermocompression bonding is performed with a heat tool to confirm that there is no misalignment again. After that, main thermocompression bonding is performed, and the flexible substrate F
The PCs 1 to 3 are fixed on the liquid crystal panel PNL.

Next, the conductor layer portion FM of the flexible substrate
A double-sided tape is attached to the surface of L which is not mounted at all, and a jig is used to bend it at the conductor layer.

The double-sided tapes BAT1 to BAT3 have a width of 3 mm and a length of 160 to 240 mm, which is an elongated shape. However, it is sufficient if adhesiveness can be secured, and a short shape may be attached at several places. The double-sided tapes BAT1 to BAT3 may be attached in advance on the transparent insulating substrate SUB1 side.

As described above, the transparent insulating substrate SUB is formed by accurately bending the multilayer flexible substrate using the jig.
Can be bonded to the surface of 1.

FIG. 9 shows a driving IC and a flexible substrate F.
FIG. 10 shows a part of the manufacturing process according to the present invention in which a PC is mounted on the transparent insulating substrate SUB1, and its manufacturing flow.

First, the anisotropic conductive film ACF2 is first attached to a plurality of driving IC portions arranged in a line. In this example, as shown in FIG. 4, a plurality of driving ICs arranged on each side
There is a total of three, which are pasted with one elongated shape.

Next, the driving IC is attached to the bonding head H.
Hold on the pressure surface of EAD and bump BUMP (projection electrode)
The position of is adjusted by the image pickup camera CAMERA so as to have a predetermined relative positional relationship (FIG. 9A). In this example,
The bumps BUMP are aligned so that the center of the bump BUMP is exactly the center of the imaging surface FACE.

Next, the position of the alignment mark ALC on the transparent insulating substrate SUB1 is adjusted by the image pickup camera CAMERA so as to have a predetermined relative positional relationship (FIG. 9 (b)).
In this example, the center of the alignment mark ALC is exactly the imaging plane F.
Align so that it is in the center of the ACE.

Therefore, the relative positions of the bump BUMP and the alignment mark ALC are determined. The alignment mark ALC is, as shown in FIG. 8, a square pattern in which an opaque aluminum AL used as a material for a gate wiring is covered with a transparent ITO film used as a material for a transparent pixel electrode. Is.

Next, the alignment mark A stored in advance
The XY stage is moved based on the relative position coordinates of the LC and the bonding portion of the wiring pattern, and the bonding portion of the wiring pattern is placed above the imaging surface FACE to detect the position. Normally, the mechanical movement accuracy of the XY stage is
Position correction is not performed in this step because it is much better than bonding accuracy.

Next, temporary attachment is performed for each driving IC (FIG. 9C).

Next, the bump BU is temporarily attached.
The relative positional relationship between the MP and the bonding portion of the wiring pattern is reconfirmed. In this step, if it is determined that the position is defective, the XY stage is finely moved again to correct the position because it is still temporarily attached.

Next, the bonding head HEAD is further lowered, and a plurality of driving ICs, which are normally arranged on one side, are collectively heat-pressed onto the transparent insulating substrate SUB1 to form the driving ICs. Bump BUMP and transparent insulating substrate S
The wiring pattern DTM, Td of UB1 is used as an anisotropic conductive film A.
It is electrically connected by CF2.

Next, the bonding head HEAD is raised, and the liquid crystal display panel on which the driving IC is mounted is once moved from the bonding step to the inspection step.

Next, in the inspection step, the connection state of the bumps BUMP and the operating state of the driving IC are tested from an inspection pad (not shown). If any defect is confirmed, repair work will be performed if possible.

Next, the anisotropic conductive film ACF1 is attached to the input wiring pattern portions to the plurality of driving ICs.
In this example, as shown in FIG. 4, a plurality of driving ICs arranged on each side are processed into one elongated shape in common, and there are three in total.

Next, the flexible substrate FPC is inserted into the fixing pin through the opening holes FHL opened at both ends shown in FIG.
The liquid crystal panel PNL and the flexible substrate FPC are roughly fixed. Furthermore, in order to improve the alignment accuracy, the alignment mark ALMG (or ALMD; see FIG. 7) and the alignment mark ALC are aligned and position-corrected above the imaging surface FACE (FIG. 9D).

Next, temporary attachment is performed (FIG. 9 (e)). again,
Check the position.

Finally, the bonding head HEAD is further lowered to set the flexible substrate FPC to the transparent insulating substrate S.
The flexible substrate FPC and the wiring pattern Td of the transparent insulating substrate SUB1 are electrically connected by the anisotropic conductive film ACF1 by thermocompression bonding onto the UB1.

Although the present invention has been described in detail with reference to the embodiments, the present invention is not limited to the above embodiments and can be modified within the scope of the invention.

[0060]

The first effect of the present invention is to reduce the outer shape of the module as much as possible even if the pitch of the bumps of the driving IC or the wiring pattern on the flexible substrate is reduced due to the high density of the liquid crystal display element. meet the requirements of the position accuracy, to provide a liquid crystal display device及beauty liquid crystal display module of the flip chip method to the above-described driving IC and the flexible substrate can be electrically connected to the wiring pattern on the transparent insulating substrate You can

A second effect of the present invention is that the outer shape of the module is desired to be reduced as much as possible even if the pitch of the bumps of the driving IC or the wiring pattern on the flexible substrate is reduced due to the high density of the liquid crystal display element. The anisotropic conductive film can be arranged on the wiring pattern on the transparent insulating substrate with good workability while satisfying the requirements and ensuring the bonding position accuracy.

[Brief description of drawings]

FIG. 1 is a plan view showing a state in which a driving IC is mounted on a transparent insulating substrate SUB1 of a liquid crystal display device to which the present invention is applied.

FIG. 2 is a perspective view of the liquid crystal display module seen from the front surface side after completion of assembly.

FIG. 3 is a block diagram showing a liquid crystal display panel of a liquid crystal display module and circuits arranged around the liquid crystal display panel.

FIG. 4 is a bottom view showing a state in which a multilayer flexible board and a multilayer printed board are mounted on the outer peripheral portion of a liquid crystal display panel.

5 is a sectional view taken along the line AA of FIG.

FIG. 6 is a perspective view showing a state in which a multilayer flexible substrate and a transparent insulating substrate are electrically connected by an anisotropic conductive film.

FIG. 7 is a perspective view showing a method for bending and mounting a bendable multilayer flexible substrate.

8 is a cross-sectional view taken along the line BB of FIG.

FIG. 9 is a diagram showing a part of a manufacturing process according to the present invention in which a driving IC and a flexible substrate FPC are mounted on a transparent insulating substrate SUB1.

10 is a diagram showing a manufacturing flow of the manufacturing method shown in FIG.

FIG. 11 is a diagram showing a part of a manufacturing process in which a conventional driving IC is mounted on a transparent insulating substrate SUB1.

[Explanation of symbols]

ACF1, ACF2 ... Anisotropic conductive film, IC ... Driving I
C, HEAD ... Bonding head, BUMP ... Bump (projection electrode), CAMERA ... Imaging camera, FACE ...
Imaging surface, SUB1 ... Transparent insulating substrate, ALC ... Alignment mark, XY stage ... XY stage, DTM, Td ...
Wiring pattern, FPC ... Flexible substrate, FHL ... Opening hole, PNL ... Liquid crystal panel.

Continuation of the front page (56) Reference JP-A-3-249734 (JP, A) JP-A-6-3686 (JP, A) JP-A-6-308515 (JP, A) JP-A-1-237520 (JP , A) JP 5-121854 (JP, A) JP 5-313178 (JP, A) JP 7-5486 (JP, A) JP 4-14022 (JP, A) 4-77137 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) G02F 1/1345

Claims (8)

(57) [Claims] 1. A wiring in which a driving IC is mounted on a transparent insulating substrate, a terminal formed on the transparent insulating substrate is connected to a flexible substrate, and an input to the driving IC is formed on the transparent insulating substrate. in the liquid crystal display device through a pattern is performed from the flexible substrate, a transparent insulating substrate in a region where the flexible substrate overlaps with the transparent insulating substrate, Ri alignment marks there between the flexible substrate, the
The alignment mark covers the wiring material with the transparent pixel electrode material
The liquid crystal display device of the flip chip method, wherein that you have been. 2. The alignment mark formed on the transparent insulating substrate with the flexible substrate is smaller than the second mark formed on the flexible substrate and paired with the alignment mark, and is transparent to the wiring material. The material of the pixel electrode is
When the transparent insulating substrate and the flexible substrate are bonded together, the second mark formed on the flexible substrate surrounds the alignment mark formed on the transparent insulating substrate. The flip-chip type liquid crystal display device according to claim 1, wherein the liquid crystal display device has a shape. 3. An anisotropic conductive film is common to a plurality of driving IC portions arranged in a line and has an elongated shape, and is common to an input wiring pattern portion to the plurality of driving ICs. The flip-chip type liquid crystal display device according to claim 1, wherein the long and thin shapes are separately attached. 4. The flexible mark is the second alignment mark.
Must be provided with pattern connection to the wiring on the board
The flip-chip type liquid crystal according to claim 2.
Display element. 5. The material of the wiring is aluminum
The flip according to any one of claims 1 to 4, characterized in that
Liquid crystal display element of chip type. 6. The wiring is a gate wiring,
The flip chip according to claim 1.
Type liquid crystal display element. 7. The material of the transparent pixel electrode is ITO.
The free friction according to any one of claims 1 to 4, characterized in that
Up-chip liquid crystal display device. 8. A liquid crystal display according to claim 1.
A liquid crystal display module characterized by using a display element
Le.