WO2012093468A1

WO2012093468A1 - Substrate for display device and display device

Info

Publication number: WO2012093468A1
Application number: PCT/JP2011/007324
Authority: WO
Inventors: 達朗黒田
Original assignee: シャープ株式会社
Priority date: 2011-01-06
Filing date: 2011-12-27
Publication date: 2012-07-12

Abstract

Alignment marks (26) for positioning a flexible printed substrate (24) are disposed in a terminal region (T) of a TFT substrate (2). The alignment marks (26) are formed from a first alignment mark (27), and a second alignment mark (28) which is disposed above the first alignment mark (27) and, when viewed in plan view, is the same size and the same shape as the first alignment mark (27). When viewed in plan view, the first alignment mark (27) and second alignment mark (28) are disposed so as to completely overlap one another.

Description

Display device substrate and display device

The present invention relates to a display device substrate and a display device on which electronic components such as a flexible printed circuit board are mounted.

In recent years, with the rapid mobilization of electronic devices equipped with display devices such as notebook computers and mobile phones, it has been desired to further reduce the thickness and size of display devices such as liquid crystal display devices.

In general, this liquid crystal display device includes a pair of substrates (that is, a TFT (Thin Film Transistor) substrate and a CF (Color Filter) substrate)) disposed opposite to each other and a liquid crystal layer provided between the pair of substrates. I have.

In general, a flexible printed circuit board is used as an electronic component for driving the liquid crystal display device in order to cope with the reduction in thickness and size of the liquid crystal display device. The flexible printed circuit board has a plurality of elements provided on the surface thereof, and is mounted on the TFT substrate by being connected to terminals provided in the terminal region of the TFT substrate.

Here, in general, when a flexible printed circuit board is mounted on a TFT substrate, in order to prevent a connection failure between the terminals of the flexible printed circuit board and the terminals provided on the TFT substrate, An alignment mark for positioning is provided (for example, see Patent Document 1).

JP 2002-329941 A

However, in the above prior art, when the alignment mark is damaged or dirty in the manufacturing process of the liquid crystal display device, the flexible printed circuit board is positioned based on the alignment mark, and the flexible printed circuit board is placed on the TFT substrate. It was difficult to implement. As a result, it is necessary to discard the TFT substrate in which the alignment mark is damaged or the mark is soiled as a defective substrate, resulting in a problem that the yield decreases.

Accordingly, the present invention has been made in view of the above-described problems, and a display device substrate and a display capable of reliably mounting an electronic component even when the alignment mark is damaged or dirty. An object is to provide an apparatus.

In order to achieve the above object, a first display device substrate of the present invention is provided with a display region for displaying an image, a terminal provided around the display region, and an electronic component to which the electronic component is connected. And a terminal region in which a mounting region is formed, and an alignment mark for positioning an electronic component is provided in the terminal region. The alignment mark is formed on the first alignment mark and the first alignment mark. The second alignment mark has the same size and the same shape as the first alignment mark in plan view, and the first alignment mark and the second alignment mark are completely in plan view. It is arranged so that it may overlap.

According to the same configuration, since the alignment mark is composed of the first alignment mark and the second alignment mark, even if any one of the alignment marks is damaged or dirty, the damage is caused. In addition, the electronic component can be positioned based on the alignment mark in which no mark contamination occurs, and the electronic component can be reliably mounted on the display device substrate. As a result, the yield of the display device substrate on which electronic components are mounted can be improved.

In the first display device substrate of the present invention, the third alignment mark having the same shape and the same size as the first alignment mark and the second alignment mark on the second alignment mark in plan view. And the first alignment mark, the second alignment mark, and the third alignment mark may be arranged so as to completely overlap in a plan view.

According to this configuration, since the alignment mark is composed of the first alignment mark, the second alignment mark, and the third alignment mark, it is assumed that one of the alignment marks is damaged or dirty. However, it is possible to position the electronic component on the basis of the alignment mark in which no damage or mark contamination occurs, and to securely mount the electronic component on the display device substrate. As a result, the yield of the display device substrate on which electronic components are mounted can be improved.

In the second display device substrate of the present invention, a display area for displaying an image, a terminal provided around the display area, to which an electronic component is connected, and a mounting area for mounting the electronic component are formed. A display device substrate having a terminal region, wherein an alignment mark for positioning an electronic component is provided in the terminal region, and the alignment mark is disposed on the first alignment mark and the first alignment mark. And a second alignment mark having a reduced similarity shape of the first alignment mark in plan view.

In the first and second display device substrates of the present invention, a pair of alignment marks may be provided with a mounting region interposed therebetween.

In the first and second display device substrates of the present invention, the electronic component may be a flexible printed circuit board.

Further, the display device substrate of the present invention has an excellent characteristic that the electronic component can be reliably mounted on the display device substrate and the yield of the display device substrate on which the electronic component is mounted can be improved. ing. Accordingly, the display device substrate of the present invention includes another display device substrate disposed opposite to the display device substrate, and a display medium layer provided between the display device substrate and the other display device substrate. Can be suitably used for a display device comprising: The display device of the present invention can be suitably used for a display device in which the display medium layer is a liquid crystal layer.

According to the present invention, the electronic component can be reliably mounted on the display device substrate, and the yield of the display device substrate on which the electronic component is mounted can be improved.

1 is a plan view showing a liquid crystal display device according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view showing the liquid crystal display device according to the first embodiment of the present invention, and is a cross-sectional view taken along the line AA in FIG. FIG. 3 is a cross-sectional view taken along the line BB in FIG. It is a top view which shows the state which the damage generate | occur | produced in the alignment mark in the liquid crystal display device which concerns on the 1st Embodiment of this invention. It is a conceptual diagram which shows the structure of the mounting apparatus which concerns on the 1st Embodiment of this invention. It is a flowchart for demonstrating the mounting method of the flexible printed circuit board in the liquid crystal display device which concerns on the 1st Embodiment of this invention. It is a top view which shows the liquid crystal display device which concerns on the 2nd Embodiment of this invention. It is CC sectional drawing of FIG. It is a top view which shows the state which the damage generate | occur | produced in the alignment mark in the liquid crystal display device which concerns on the 2nd Embodiment of this invention. It is a flowchart for demonstrating the mounting method of the flexible printed circuit board in the liquid crystal display device which concerns on the 2nd Embodiment of this invention. It is sectional drawing which shows the modification of the alignment mark in the liquid crystal display device which concerns on the 1st Embodiment of this invention. It is a figure which shows the modification of an alignment mark. It is a figure which shows the modification of an alignment mark. It is a figure which shows the modification of an alignment mark.

(First embodiment)
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the present embodiment, a liquid crystal display device is exemplified as the display device.

FIG. 1 is a plan view showing a liquid crystal display device according to the first embodiment of the present invention, and FIG. 2 is a cross-sectional view showing the liquid crystal display device according to the first embodiment of the present invention. FIG. 3 is a cross-sectional view taken along the line BB of FIG. 1, and FIG. 4 is a plan view showing a state where the alignment mark is damaged in the liquid crystal display device according to the first embodiment of the present invention.

As shown in FIGS. 1 and 2, the liquid crystal display device 1 includes a TFT substrate 2 that is a display device substrate on which a plurality of TFTs (Thin-FilmTransistors) that are switching elements are formed, and a TFT substrate 2 facing the TFT substrate 2. CF substrate 3 which is another display device substrate disposed, liquid crystal layer 4 which is a display medium layer sandwiched between TFT substrate 2 and CF substrate 3, TFT substrate 2 and CF substrate 3, And a sealing material 5 provided in a frame shape for adhering the TFT substrate 2 and the CF substrate 3 to each other and enclosing the liquid crystal layer 4.

The sealing material 5 is formed so as to circulate around the liquid crystal layer 4, and the TFT substrate 2 and the CF substrate 3 are bonded to each other via the sealing material 5. The TFT substrate 2 and the CF substrate 3 are each formed in a rectangular plate shape. In addition, the liquid crystal display device 1 includes a plurality of photo spacers (not shown) for regulating the thickness of the liquid crystal layer 4 (that is, the cell gap).

In the liquid crystal display device 1, as shown in FIGS. 1 and 2, a display area D for image display is defined in an area where the TFT substrate 2 and the CF substrate 3 overlap inside the sealing material 5. Yes. Here, the display area D is configured by arranging a plurality of pixels, which are the minimum unit of an image, in a matrix.

Further, as shown in FIG. 1, the liquid crystal display device 1 is formed in a rectangular shape, and in the longitudinal direction Y of the liquid crystal display device 1, the TFT substrate 2 protrudes from the CF substrate 3 on the upper side thereof. A terminal region T is defined in the protruding region. The terminal area T is provided around the display area D as shown in FIG.

The display area D is defined on each of the TFT substrate 2 and the CF substrate 3, but the terminal area T is defined only on the TFT substrate 2.

Further, as shown in FIG. 1, the terminal region T is provided with a plurality of terminals 9 and connection wirings 20 connected to each of the plurality of terminals 9.

Further, as shown in FIG. 1, in the mounting region R formed in the terminal region T, a flexible printed circuit board (driver chip is mounted on a film-shaped printed circuit board) which is an electronic component for supplying an external signal. Drive circuit board) 24 is mounted. As shown in FIG. 1, one end of the flexible printed board 24 is connected to the terminal 9.

As shown in FIG. 2, in the liquid crystal display device 1 of the present embodiment, in the terminal region T, the flexible printed circuit board 24 is mounted via the conductive adhesive layer 16 having adhesiveness, and the terminal 9 And the terminals 25 formed on the flexible printed circuit board 24 are electrically connected to connect the flexible printed circuit board 24 and the terminals 9.

The conductive adhesive layer 16 is not particularly limited as long as it has conductivity and has an adhesive force capable of bonding and fixing the TFT substrate 2 and the flexible printed board 24. For example, as the conductive adhesive layer 16, a film adhesive, a conductive paste, or the like can be used.

As the film-like adhesive, an adhesive containing conductive particles can be used, for example, an insulating thermosetting resin as a main component and conductive particles dispersed in the resin can be used.

As the thermosetting resin, for example, an epoxy resin, a polyimide resin, a polyurethane resin, or the like can be used. In addition, it is preferable to use an epoxy resin as a thermosetting resin from a viewpoint of improving the adhesiveness of a film-form adhesive, and film formability. Moreover, as electroconductive particle, metal particles, such as copper, silver, gold | metal | money, nickel, can be used, for example. In addition, the film adhesive should just have at least 1 sort (s) as a main component among the above-mentioned thermosetting resins, and should just use at least 1 sort (s) among the above-mentioned metal particles.

Also, an anisotropic conductive adhesive containing conductive particles can be used as the film adhesive. More specifically, as the anisotropic conductive adhesive, for example, an insulating thermosetting resin such as the above-described epoxy resin is a main component, and the conductive particles made of the above-described metal particles are included in the resin. Distributed ones can be used.

Then, by using an anisotropic conductive adhesive as the conductive adhesive layer 16, the thickness direction of the anisotropic conductive adhesive (that is, the conductive adhesive layer 16) (direction of arrow X in FIG. 2). , The terminal 9 and the flexible printed circuit board 24 are fixed so as to face each other, and the terminal 9 and the flexible printed circuit board 24 are electrically connected to each other, and in other directions, a conductive adhesive layer having insulation properties. 16 can be realized. In addition, as this anisotropic conductive adhesive, for example, a film-like anisotropic conductive film (Anisotropic Conductive Film) can be used.

As the conductive paste, the above-mentioned adhesive, which can be used as a paste, can be used. For example, a thermosetting conductive paste mainly composed of conductive particles, a binder resin, and a solvent can be used.

Here, as the conductive particles, for example, metal particles such as copper, silver, gold and nickel can be used. Moreover, an epoxy resin, a polyimide resin, a polyurethane resin etc. can be used for binder resin, for example. Further, as the solvent, for example, butyl acetate, butyl carbitol acetate or the like can be used.

Then, for example, a conductive adhesive layer 16 is formed by applying a conductive paste to the surface of the TFT substrate 2 by a screen printing method, an intaglio printing method, or the like, and applying a heat treatment to cure the binder resin. Is done.

In addition, it is good also as a structure containing a hardening | curing agent etc. as needed. For example, when an epoxy resin is used as the binder resin, an amine compound or an imidazole compound can be used as the curing agent.

The TFT substrate 2 includes a glass substrate (not shown), a TFT element having a gate electrode, a source electrode and a drain electrode (not shown) formed on the glass substrate, a transparent insulating layer, a pixel electrode, an alignment film, and the like. ing.

The CF substrate 3 is provided for each pixel, for example, between a black matrix (not shown) provided in a lattice shape and a frame shape as a light shielding portion on a glass substrate, and between each lattice of the black matrix. A color filter (not shown) including a plurality of types of colored layers (that is, a red layer R, a green layer G, and a blue layer B). The CF substrate 3 covers a common electrode (not shown) provided so as to cover the black matrix and the color filter, a photo spacer (not shown) provided in a column shape on the common electrode, and the common electrode. And an alignment film (not shown) provided.

Note that the black matrix is provided between adjacent colored layers and has a role of partitioning these plural types of colored layers. This black matrix is made of a metal material such as Ta (tantalum), Cr (chromium), Mo (molybdenum), Ni (nickel), Ti (titanium), Cu (copper), Al (aluminum), or a black pigment such as carbon. It is formed of a dispersed resin material or a resin material in which a plurality of colored layers having light transmittance are laminated.

The liquid crystal layer 4 is made of, for example, a nematic liquid crystal material having electro-optical characteristics.

Here, in the present embodiment, as shown in FIG. 1, an alignment mark (positioning mark) 26 for positioning the flexible printed circuit board 24 mounted on the TFT substrate 2 in the terminal region T of the TFT substrate 2. There is a feature in that is provided.

More specifically, as shown in FIG. 1, in the terminal region T, a pair of alignment marks 26 are provided across the mounting region R. The alignment marks 26 are formed on the TFT substrate as shown in FIG. The first alignment mark 27 provided on the second alignment mark 27 and the second alignment mark provided on the first alignment mark 27 and having the same size and the same shape as the first alignment mark 27 in plan view. 28. As shown in FIGS. 1 and 3, the first alignment mark 27 and the second alignment mark 28 are arranged so as to completely overlap in plan view.

The first alignment mark 27 is formed of, for example, a material for forming the gate electrode (for example, a metal such as molybdenum, aluminum, tungsten, tantalum, chromium, titanium, copper, or an alloy or metal nitride thereof). can do. Similarly, the second alignment mark 28 can be formed of, for example, a material for forming the above-described source electrode (for example, a metal such as titanium or aluminum).

As shown in FIG. 1, the alignment mark 26 (that is, the first alignment mark 27 and the second alignment mark 28) has a substantially donut shape with a hole in the center.

As described above, in the present embodiment, since two alignment marks (that is, the first alignment mark 27 and the second alignment mark 28) are provided, any one of the alignment marks is temporarily damaged or dirty. Even if it occurs, the flexible printed circuit board 24 can be reliably mounted on the TFT substrate 2 based on the alignment mark in which no damage or mark contamination occurs. Therefore, the yield of the TFT substrate 2 can be improved.

For example, as shown in FIG. 4, even if the second alignment mark 28 is chipped due to foreign matter or the like during the molding, the same size as the second alignment mark 28 in plan view under the second alignment mark 28. In addition, a first alignment mark 27 having the same shape as the second alignment mark 28 is provided, and the first alignment mark 27 and the second alignment mark 28 are disposed so as to completely overlap in plan view. Therefore, when viewed from the camera of the mounting apparatus, recognition can be performed in the same manner as a normally patterned alignment mark.

Similarly, even if the first alignment mark 27 is chipped due to foreign matter or the like during molding, the first alignment mark 27 has the same size as the first alignment mark 27 in plan view on the first alignment mark 27, and A second alignment mark 28 having the same shape as the first alignment mark 27 is provided, and the first alignment mark 27 and the second alignment mark 28 are disposed so as to completely overlap in plan view. When viewed from the camera of the apparatus, recognition can be performed in the same manner as an alignment mark that is normally patterned.

Therefore, in this embodiment, even when such alignment mark breakage occurs, when the flexible printed circuit board 24 is mounted on the TFT substrate 2, the position information of the alignment mark without breakage is provided. The flexible printed circuit board 24 to be mounted can be positioned based on the above.

Next, a mounting apparatus for mounting the flexible printed circuit board 24 will be described. FIG. 5 is a conceptual diagram showing the configuration of the mounting apparatus according to the first embodiment of the present invention.

As shown in FIG. 5, the mounting device 30 includes an irradiation lamp 31 for irradiating the terminal region T of the liquid crystal display device 1 provided with the first and second alignment marks 27 and 28, and terminals of the liquid crystal display device 1. And a camera 32 for capturing an image of the region T.

The irradiation lamp 31 is disposed so as to face the terminal region T of the TFT substrate 2 as shown in FIG.

Further, as shown in FIG. 5, the camera 32 is disposed so as to face the terminal region T of the TFT substrate 2 and is provided adjacent to the irradiation lamp 31.

The camera 32 is configured by a plurality of CCDs (charge-coupled devices), and the reflected light 33 which is the light irradiated by the irradiation lamp 31 and reflected by the terminal region T of the liquid crystal display device 1 is converted into the camera 32. Is configured to receive light.

When light enters the camera 32, electric charges are accumulated in the CCD constituting the camera 32 in accordance with the amount of incident light. The charge amount accumulated in each of the plurality of CCDs provided in the camera 32 is used as image data of the terminal region T of the TFT substrate 2.

As shown in FIG. 5, the mounting apparatus 30 is connected to the A / D converter 34 connected to the camera 32, the position detection means 35 connected to the A / D converter 34, and the position detection means 35. A mounting position control means 36 and a crimping means 37 connected to the mounting position control means 36 are provided.

The charge amount accumulated in the CCD constituting the camera 32 (that is, image data of the terminal region T of the TFT substrate 2 provided with the first and second alignment marks 27 and 28) is converted by the A / D converter 34. The digitized image data is input to the position detection means 35.

Then, the position detection means 35 detects the position of the alignment mark 26 (that is, the first alignment mark 27 and the second alignment mark 28) provided in the terminal region T of the TFT substrate 2, and the alignment mark 26 (that is, Position data of the first alignment mark 27 and the second alignment mark 28) is calculated.

Next, the calculated position data of the alignment mark 26 is input to the mounting position control means 36, and the mounting position of the flexible printed circuit board 24 is controlled based on the position data. Then, the flexible printed circuit 24 is configured to be crimped and mounted at a predetermined position (that is, the mounting region R) in the terminal region T of the TFT substrate 2 by the crimping means 37.

Next, a method for mounting the flexible printed circuit board 24 according to this embodiment will be described. FIG. 6 is a flowchart for explaining a flexible printed circuit board mounting method in the liquid crystal display device according to the first embodiment of the present invention.

First, the terminal area T of the TFT substrate 2 is irradiated with the irradiation lamp 31 (step S1).

Next, image data of the terminal region T of the TFT substrate 2 is photographed by the camera 32 in a state where the irradiation light from the irradiation lamp 31 is irradiated (step S2).

At this time, the light irradiated by the irradiation lamp 31 is reflected by the terminal region T of the TFT substrate 2, and the reflected light 33 is received by the camera 32. When light enters the camera 32, electric charges are accumulated in the CCD constituting the camera 32 according to the amount of incident light.

Next, the amount of charge accumulated in the CCD constituting the camera 32 (that is, the image data of the terminal region T of the TFT substrate 2 provided with the first and second alignment marks 27 and 28) is sent to the A / D converter 34. It is input and digitized by the A / D converter 34 (step S3).

Next, the digitized image data is input to the position detection means 35. The position detection means 35 detects the position of the alignment mark 26 provided in the terminal region T based on the input image data, and performs alignment. The position data of the mark 26 is calculated (step S4).

Here, as described above, the alignment mark 26 is provided on the first alignment mark 27 provided on the TFT substrate 2 and on the first alignment mark 27, and has the same size as the first alignment mark 27 in plan view. In addition, the second alignment mark 28 has the same shape, and the first alignment mark 27 and the second alignment mark 28 are disposed so as to completely overlap in plan view. Therefore, as described above, for example, even when the second alignment mark 28 is missing due to foreign matters during molding, the first alignment mark 27 is provided, so that it can be viewed from the camera of the mounting apparatus. For example, recognition can be performed in the same manner as a normally patterned alignment mark. Therefore, the position detection unit 35 can detect the position of the alignment mark 26 based on the digitized image data and calculate the position data of the alignment mark 26.

Next, the calculated position data of the alignment mark 26 is input to the mounting position control means 36 (step S5). The mounting position control means 36 controls the mounting position of the flexible printed circuit board 24 mounted by the pressure bonding means 37 based on the input position data (step S6). Then, it is crimped and mounted on the mounting region R in the terminal region T (step S7).

According to the present embodiment described above, the following effects can be obtained.

(1) In this embodiment, the alignment mark 26 is provided on the first alignment mark 27 and the first alignment mark 27, and has the same size and the same size as the first alignment mark 27 in plan view. A second alignment mark 28 having a shape is used. Further, the first alignment mark 27 and the second alignment mark 28 are arranged so as to completely overlap in a plan view. Therefore, even if one of the first and second alignment marks 27 and 28 is damaged or dirty, it is based on the alignment mark that is not damaged or dirty. Thus, the flexible printed circuit board 24 is positioned, and the flexible printed circuit board 24 can be reliably mounted on the TFT substrate 2. As a result, the yield of the TFT substrate 2 on which the flexible printed board 24 is mounted can be improved.

(Second Embodiment)
Next, a second embodiment of the present invention will be described. FIG. 7 is a plan view showing a liquid crystal display device according to the second embodiment of the present invention, and FIG. 8 is a sectional view taken along the line CC of FIG. Note that the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted. Further, since the cross-sectional view of the liquid crystal display device and the configuration of the mounting device are the same as those described in the first embodiment, detailed description thereof is omitted here.

In the liquid crystal display device 40 of the present embodiment, as shown in FIG. 7, in the terminal region T, a pair of alignment marks 45 are provided with the mounting region R interposed therebetween, as in the first embodiment described above. However, as shown in FIGS. 7 and 8, the alignment mark 45 is provided on the first alignment mark 42 provided on the TFT substrate 2 and on the first alignment mark 42. The second alignment mark 43 has a reduced similarity shape of the first alignment mark 42.

As with the first alignment mark 27, the first alignment mark 42 is formed of, for example, a material for forming the gate electrode (for example, a metal such as molybdenum, aluminum, tungsten, tantalum, chromium, titanium, copper, or the like) , These alloys and metal nitrides).

Also, the second alignment mark 43 can be formed of, for example, a material for forming the above-described source electrode (for example, a metal such as titanium or aluminum) in the same manner as the above-described second alignment mark 28.

As shown in FIG. 7, the alignment mark 45 (that is, the first alignment mark 42 and the second alignment mark 43) has a substantially square shape.

And also in this embodiment, two alignment marks (namely, the 1st alignment mark 42 and the 2nd alignment mark 43) are provided similarly to the case of the above-mentioned 1st Embodiment. Therefore, even if either one of the alignment marks is damaged or dirty, the flexible printed circuit board 24 is securely placed on the TFT substrate 2 based on the alignment mark that is not damaged or dirty. Can be implemented. Therefore, the yield of the TFT substrate 2 can be improved.

For example, as shown in FIG. 9, even if the first alignment mark 42 is chipped due to a foreign matter or the like during the molding, a reduced similarity shape of the first alignment mark 42 is obtained on the first alignment mark 42 in plan view. Since the second alignment mark 43 is provided, the flexible printed circuit board 24 to be mounted can be positioned based on the position information of the second alignment mark 43 that is not damaged.

Next, a method for mounting the flexible printed circuit board 24 according to this embodiment will be described. FIG. 10 is a flowchart for explaining a flexible printed circuit board mounting method in the liquid crystal display device according to the second embodiment of the present invention.

First, as in the case of the first embodiment described above, the terminal region T of the TFT substrate 2 is irradiated by the irradiation lamp 31 (step S11), and then the irradiation light from the irradiation lamp 31 is irradiated. The image data of the terminal area T is photographed by 32 (step S12).

Next, the amount of charge accumulated in the CCD constituting the camera 32 (that is, image data of the terminal region T of the TFT substrate 2 provided with the alignment mark 45) is input to the A / D converter 34, and the A / D Digitized by the converter 34 (step S13).

Next, digitized image data is input to the position detection means 35. The position detection means 35 first detects the position of the first alignment mark 42 provided in the terminal region T based on the input image data. I do.

Here, the position detection means 35 determines whether or not the position of the first alignment mark 42 can be detected based on the input image data (step S14), and the position of the first alignment mark 42 can be detected. Calculates position data of the first alignment mark 42 (step S15).

On the other hand, when the position of the first alignment mark 42 cannot be detected due to breakage of the first alignment mark 42 or the like, the position detection unit 35 uses the second alignment provided in the terminal region T based on the input image data. The position of the mark 43 is detected, and the position data of the second alignment mark 43 is calculated (step S16).

Next, the calculated position data of the first alignment mark 42 or the second alignment mark 43 is input to the mounting position control means 36 (step S17). The mounting position control means 36 controls the mounting position of the flexible printed circuit board 24 mounted by the pressure bonding means 37 based on the input position data (step S18). Then, it is crimped and mounted on the mounting region R in the terminal region T (step S19).

(2) In the present embodiment, the alignment mark 45 is provided on the first alignment mark 42 and the first alignment mark 42, and has a reduced similarity shape of the first alignment mark 42 in plan view. It is constituted by the mark 43. Therefore, even if one of the first and second alignment marks 42 and 43 is damaged or dirty, it is based on an alignment mark that is not damaged or dirty. Thus, the flexible printed circuit board 24 is positioned, and the flexible printed circuit board 24 can be reliably mounted on the TFT substrate 2. As a result, the yield of the TFT substrate 2 on which the flexible printed board 24 is mounted can be improved.

Note that the above embodiment may be modified as follows.

In the first embodiment, the alignment mark 26 is composed of the first and second alignment marks 27 and 28. However, as shown in FIG. 11, a third alignment mark 29 may be further provided.

More specifically, as shown in FIG. 11, the alignment mark 26 is provided on the first alignment mark 27 provided on the TFT substrate 2 and on the first alignment mark 27. A second alignment mark 28 having the same size and the same shape as the alignment mark 27, and provided on the second alignment mark 28, and in a plan view, the first alignment mark 27 and the second alignment mark 28 The third alignment mark 29 has the same size and the same shape. Then, the first alignment mark 27, the second alignment mark 28, and the third alignment mark 29 are arranged so as to completely overlap in plan view.

In this case as well, the alignment mark 26 (that is, the first alignment mark 27, the second alignment mark 28, and the third alignment mark 29) has a substantially donut shape with a hole in the center.

In this case, since three alignment marks (that is, the first alignment mark 27, the second alignment mark 28, and the third alignment mark 29) are provided, as in the case of the first embodiment described above, Even if any of the alignment marks is damaged or dirty, the flexible printed circuit board 24 is securely mounted on the TFT substrate 2 based on the alignment mark that is not damaged or dirty. It becomes possible. Therefore, the yield of the TFT substrate 2 can be improved.

As a result, as in the case of the first embodiment described above, even when the alignment mark is damaged, no damage occurs when the flexible printed board 24 is mounted on the TFT substrate 2. The flexible printed circuit board 24 to be mounted can be positioned based on the position information of the alignment mark.

In the above embodiment, the alignment mark has a substantially donut shape, a substantially square shape, or the like. However, the shape of the alignment mark is not particularly limited. For example, the alignment mark has a shape as shown in FIGS. The alignment marks 11 to 13 having the above may be used.

Moreover, in the said embodiment, although the flexible printed circuit board 24 was mentioned as an example as an electronic component mounted in the TFT substrate 2, as an electronic component, for example, the source terminal provided in the TFT substrate 2, and the gate terminal The present invention can also be applied to the case where an integrated circuit chip (driver IC chip) connected to is mounted.

In the present embodiment, a display device related to an LCD (liquid crystal display) is shown. However, the display device can be an organic EL (organic electroluminescence), electrophoresis (electrophoretic), PD (electrophoretic) plasma display (display), PALC (plasma addressed liquid crystal display), inorganic EL (inorganic electroluminescence), FED (field emission display), or SED (surface-conduction electron-emitter display) A surface electric field display) or the like.

As described above, the present invention is particularly useful for display device substrates and display devices on which electronic components are mounted.

1 Liquid crystal display device 2 TFT substrate (substrate for display device)
3 CF substrate (other display device substrate)
4 Liquid crystal layer (display medium layer)
9 Terminal 16 Conductive adhesive layer 24 Flexible printed circuit board (electronic component)
25 terminal 26 alignment mark 27 first alignment mark 28 second alignment mark 29 third alignment mark 40 liquid crystal display device 42 first alignment mark 43 second alignment mark 45 alignment mark D display region R mounting region T terminal region

Claims

A display device substrate having a display area for displaying an image, and a terminal area provided around the display area and having a terminal to which an electronic component is connected and a mounting area on which the electronic component is mounted. And
The terminal area is provided with an alignment mark for positioning the electronic component, and the alignment mark is provided on the first alignment mark and the first alignment mark. The second alignment mark is the same size as the one alignment mark and has the same shape, and the first alignment mark and the second alignment mark are arranged so as to completely overlap in plan view. A substrate for a display device.
A third alignment mark having the same size and the same shape as the first alignment mark and the second alignment mark in a plan view is provided on the second alignment mark. The display device substrate according to claim 1, wherein the mark, the second alignment mark, and the third alignment mark are arranged so as to completely overlap in a plan view.
A display device substrate having a display area for displaying an image, and a terminal area provided around the display area and having a terminal to which an electronic component is connected and a mounting area on which the electronic component is mounted. And
The terminal area is provided with an alignment mark for positioning the electronic component, and the alignment mark is provided on the first alignment mark and the first alignment mark. A display device substrate comprising: a second alignment mark having a reduced similarity shape of one alignment mark.
The display device substrate according to any one of claims 1 to 3, wherein a pair of the alignment marks are provided across the mounting region.
The display device substrate according to claim 1, wherein the electronic component is a flexible printed circuit board.
The display device substrate according to any one of claims 1 to 5,
Another display device substrate disposed opposite to the display device substrate;
A display medium layer provided between the display device substrate and the other display device substrate.
The display device according to claim 6, wherein the display medium layer is a liquid crystal layer.