JP3366296B2 - Surface discharge type plasma display panel - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a matrix display type surface discharge PDP (PLASMA DISPLAY PANEL).

A surface discharge type PDP is a PDP in which a pair of display electrodes defining a main discharge cell are arranged adjacent to each other on the same substrate. Since it is suitable for color display by a phosphor, a television image can be displayed. Widely used as a thin device. Also, it is regarded as a promising large-screen display device for high-definition video. Under such circumstances, in addition to high definition and large screen, improvement in display quality by high contrast is desired.

[0003]

2. Description of the Related Art FIG. 14 is a sectional view showing the internal structure of a conventional PDP 90. The PDP 90 is a matrix display type three-electrode structure surface discharge PDP, and is called a reflection type in terms of classification according to the arrangement form of the phosphors.

In the PDP 90, the glass substrate 11 on the front side
A pair of parallel display electrodes X and Y for generating a surface discharge along the substrate surface are arranged on the inner surface of each pair for each line of the matrix display. Then, A is formed so as to cover these display electrode pairs X and Y with respect to the discharge space 30.
A dielectric layer 17 for C drive is provided. A protective film 18 is vapor-deposited on the surface of the dielectric layer 17. Both the dielectric layer 17 and the protective film 18 have translucency.

Each of the display electrode pairs X and Y is composed of a wide linear transparent electrode 41 made of an ITO thin film and a narrow linear bus electrode 42 made of a metal thin film (Cr / Cu / Cr). Has been done. The bus electrode 42 is an auxiliary electrode for ensuring proper conductivity, and is the transparent electrode 41.
Is arranged at the edge portion on the side far from the surface discharge gap. By adopting such an electrode structure, it is possible to increase the luminous efficiency by expanding the surface discharge region while minimizing the blocking of the display light.

On the other hand, on the inner surface of the glass substrate 21 on the back side, the address electrodes A are arranged so as to be orthogonal to the display electrode pairs X and Y.
Are arranged. Then, the phosphor layer 28 is covered so as to cover the glass substrate 21 including the upper part of the address electrode A.
Is provided. The counter discharge between the address electrode A and the display electrode Y controls the wall charge accumulation state in the dielectric layer 17. The phosphor layer 28 is locally excited by ultraviolet rays UV generated by the surface discharge and emits visible light of a predetermined color. Of this visible light, the light that passes through the glass substrate 11 becomes the display light.

The gap S1 between the display electrode X and the display electrode Y on each line is called a "discharge slit",
The width (dimension in the arrangement direction of the display electrode pairs X and Y) w1 of the discharge slit S1 is selected so that surface discharge occurs when a drive voltage of about 100 to 200 volts is applied. On the other hand, the gap S2 between the display electrodes X and the display electrodes Y between the adjacent lines is called "reverse slit", and the width w2 of the reverse slit S2 is the width w1 of the discharge slit S1.
It is selected to be a value sufficiently larger than That is, discharge is prevented between the display electrode pairs X and Y arranged with the reverse slit S2 in between. By disposing the discharge slit S1 and the reverse slit S2 and arranging the display electrodes X and Y in this manner, each line can be selectively made to emit light.
Therefore, a portion of the display screen corresponding to the reverse slit S2 is a non-light emitting area or a non-display area, and a portion of the slit S1 is a light emitting area or a display area.

[0008]

The conventional panel structure is as follows.
The structure was such that the phosphor layer 28 in the non-light emitting state could be seen from the front side through the reverse slit S2. Non-luminous phosphor layer 2
8 is a whitish color such as white or light gray. Therefore, when used in a particularly bright place, external light is scattered by the phosphor layer 28 and the non-light emitting area between the lines becomes whitish,
The display contrast was lost.

As a method of increasing the contrast of a PDP for color display, a method of providing a color filter by applying a semitransparent paint corresponding to the emission color of the phosphor on the outer surface of the front substrate is separately provided on the front surface of the PDP. There is proposed a method of arranging the filter manufactured in 1. and a method of coloring the dielectric layer 17 by color-coding it into R, G, and B.

However, it is extremely difficult to apply the paint of each color corresponding to the minute pixels. When a separate filter is arranged on the front surface, the display image is distorted due to the gap between the PDP and the filter. Also, the dielectric layer 1
When 7 is color-coded, since the coloring material (pigment) is different for each color, the uniformity of the dielectric constant is impaired by the color-coding and the discharge characteristics become unstable. In addition, it is difficult to color-code the dielectric layers, like the coating of paints.

The present invention has been made in view of the above problems, and it is an object of the present invention to make a non-light emitting area between lines inconspicuous and to enhance display contrast.

A further object of the present invention is to provide an optimum structure for forming a light-shielding film containing a black pigment in a non-light emitting area between display lines.

[0013]

The first aspect of the present invention is as follows.
On the front substrate, a plurality of display electrode pairs arranged with discharge slits for surface discharge are arranged with predetermined reverse slits that do not discharge, respectively, and on the rear substrate, a plurality of display electrode pairs intersecting with the front display electrode pairs are arranged. In a three-electrode type surface discharge plasma display panel including address electrodes and a plurality of phosphors, a strip-shaped light shielding film is provided in the reverse slit portion between adjacent display electrode pairs of the front substrate, and The surface discharge type plasma display panel is characterized in that the light shielding film is also formed in a peripheral region of an effective display region.

The region corresponding to the gap between the display electrodes between the lines in the display screen (hereinafter referred to as "reverse slit") is a non-light emitting region. A light shielding film is arranged in each of the non-light emitting areas.
Since the plane pattern of each light-shielding film is strip-shaped, a stripe-shaped light-shielding pattern is formed on the entire display screen. The light shielding film blocks the visible light which is going to pass through the reverse slit. As a result, the phenomenon that the non-light emitting area looks bright due to external light and leaked light from each line is prevented, and the display contrast is enhanced.

Further, according to the above invention, since the light-shielding film is also formed in the peripheral area of the display area, undesired discharge or phosphor can be seen through in the area outside the effective display area. Therefore, it is possible to prevent the contrast from being lowered.

A more preferred embodiment of the present invention is the above first embodiment.
In the surface discharge type plasma display panel on the side surface, each display electrode pair is composed of a transparent electrode and a metal electrode that overlaps an edge portion of the transparent electrode near the reverse slit portion, and the metal The end portion of the electrode is led out to the periphery of the front substrate to be configured as a connection portion for an external control circuit, and the light shielding film in the peripheral region is arranged so as to cover the lead portion of the metal electrode. It is a characteristic surface discharge type plasma display panel.

In a further preferred embodiment of the present invention, in the surface discharge type plasma display panel according to the first aspect, dummy electrodes are arranged in parallel outside the outermost display electrode pair on the front substrate. The surface discharge plasma display panel is characterized in that the light-shielding film in the peripheral region is provided so as to cover the dummy electrode.

Another preferred embodiment of the present invention is the surface discharge type plasma display panel according to the first aspect, wherein the light shielding film is made of a dark material containing Mn, Fe and Cu. Characteristic surface discharge type plasma
It is a display panel.

Another preferred embodiment of the present invention is that in the surface discharge type plasma display panel according to the first aspect, the front substrate is a glass substrate, and the light shielding film contains a glass material. It is a characteristic surface discharge type plasma display panel.

[0020]

1 is a perspective view showing the basic structure of a PDP 1 according to the present invention. In addition, in FIG.
The same reference numerals are given to the constituent elements corresponding to 4 regardless of the difference in shape and material. The same applies to the other figures below.

The PDP 1 is a surface discharge type PDP of a matrix display type three-electrode structure which is called a reflection type like the conventional PDP 90. The outer shape is formed by a pair of glass substrates 11 and 21 facing each other with the discharge space 30 in between, and these glass substrates 11 and 21 are made of a low melting point glass provided in the peripheral portions of the facing regions of each other. It is joined by a frame-shaped seal layer (not shown).

On the inner surface of the front glass substrate 11, a pair of parallel linear display electrodes X and Y for generating surface discharge along the substrate surface are arranged in pairs for each line L of the matrix display. Has been done. Line pitch is 66, for example
It is 0 μm.

Each of the display electrode pairs X and Y is composed of a wide linear transparent electrode 41 made of an ITO thin film and a narrow linear bus electrode 42 made of a multi-layered metal thin film. As a specific example of the dimensions of the transparent electrode 41 and the bus electrode 42, the transparent electrode 41 has a thickness of 0.1 μm and a width of 180 μm.
The bus electrode 42 has a thickness of 1 μm and a width of 60 μm.

The bus electrode 42 is an auxiliary electrode for ensuring proper conductivity, and is arranged at the edge of the transparent electrode 41 on the side far from the surface discharge gap.

In the PDP 1, a dielectric layer (PbO-based low melting point glass layer) 17 for AC driving is provided so as to cover the display electrode pair X and Y with respect to the discharge space 30. A protective film 18 made of MgO (magnesium oxide) is deposited on the surface of the dielectric layer 17. The dielectric layer 17 has a thickness of about 30 μm, and the protective film 18 has a thickness of about 5000 ·.

On the other hand, the inner surface of the glass substrate 21 on the back side is
It is uniformly covered with a base layer 22 made of ZnO-based low melting point glass and having a thickness of about 10 μm. The address electrodes A are arranged on the base layer 22 at a constant pitch (220 μm) so as to be orthogonal to the display electrode pairs X and Y. The address electrode A is formed by baking a silver paste and has a thickness of about 10 μm. The base layer 22 prevents electromigration of the address electrode A.

The facing discharge between the address electrode A and the display electrode Y controls the accumulation state of wall charges in the dielectric layer 17. The address electrode A is also covered with a dielectric layer 24 made of low melting point glass having the same composition as the underlayer 22. The thickness of the dielectric layer 24 on the address electrode A is about 10 μm.

Above the dielectric layer 24, the height is approximately 150 μm.
A plurality of linear partition walls 29 are provided between the address electrodes A one by one in a plan view of m. Then, including the upper part of the address electrode A, the surface of the dielectric 24 and the partition 29.
R for full color display so as to cover the sides of
(Red), G (green), B (blue) three primary color phosphor layer 28
R, 28B and 28C (hereinafter, referred to as a phosphor layer 28 when there is no particular need to distinguish colors) are provided.
These phosphor layers 28 are excited by the ultraviolet rays generated by the surface discharge to emit light.

The partition 29 divides the discharge space 30 in the line direction (pixel array direction parallel to the display electrode pairs X and Y) for each unit light emitting region, and defines the gap size of the discharge space 30. In the PDP 1, there is no partition wall that partitions the discharge space 30 in the column direction of the matrix display (the arrangement direction of the display electrode pairs X and Y). However, the interval between the display lines L having the display electrode pairs X and Y (width of the reverse slit) is 100.
~ 400μm, 50μm in each line L
Since the surface discharge gap (width of the discharge slit) is large enough, interference of discharge between lines does not occur.

In the PDP 1, one pixel (pixel) for display is composed of three adjacent unit light emitting regions (subpixels) in each line L. The emission colors of the lines L in the same row are the same, and the phosphor layers 28R,
28B and 28C are provided by screen printing so as to be continuous in the row. Screen printing has excellent productivity. When the phosphor layers 28 are continuous in a row, it is easier to make the thickness of the phosphor layer 28 of each sub-pixel uniform, as compared with the case where the phosphor layers 28 are divided and arranged for each line L.

FIG. 2 is a sectional view of the main part of the PDP 1, and FIG. 3 is a plan view of the light shielding film 45. As shown in FIG. 2, in the PDP 1, a light shielding film 45 that blocks (blocks) visible light is provided for each reverse slit S2 so as to directly contact the inner surface of the glass substrate 11. As shown in FIG. 3, each light shielding film 45 is patterned in a strip shape extending in the line direction, and is arranged so as to overlap a region sandwiched between the display electrodes X and Y between adjacent lines L. These light-shielding films 45 separated from each other form a stripe-shaped (striped) light-shielding pattern on the entire display screen, and the phosphor layer 28 is hidden between the lines L to enhance the display contrast. According to the stripe pattern, unlike the matrix pattern surrounding the sub-pixels or pixels, there is no concern about the positional deviation in the line direction, and therefore the alignment of the glass substrates 11 and 21 in the manufacture of the PDP 1 becomes easy.

It is desirable that at least the top of the partition wall 29 described above is formed in the same dark color as the light shielding film. In this case, since the grid-like dark color pattern is formed by the barrier ribs and the light shielding film in the directions intersecting with each other, the contour of each sub-pixel becomes clear. Specifically, a black material such as chromium (Cr) is mixed into the material of the partition wall to form a partition wall that is entirely dark.

FIG. 4 is a diagram showing a method of manufacturing the front side portion of the PDP 1. The PDP 1 is manufactured by separately providing predetermined constituent elements for the glass substrate 11 and the glass substrate 21, and then arranging the two glass substrates 11 and 21 so as to face each other and joining the peripheral portions.

In manufacturing the front side, first, a dark insulating material is deposited on the surface of the glass substrate 11 by sputtering to form an insulating film (not shown) having a surface reflectance smaller than that of the metal electrode 42. As the insulating material, chromium oxide (CrO), silicon oxide (SiO), or the like can be used. The thickness of the insulating film is preferably 1 μm or less in order to reduce the step difference of the transparent electrode 41. Next, the insulating film is first
The patterning is performed by photolithography using the exposure mask of No. 1 to form the above-mentioned plurality of light-shielding films 45 at once (FIG. 4A).

Subsequently, an ITO film is formed on the glass substrate 11 having the light shielding film 45 and is patterned by photolithography using a second exposure mask so that the light shielding film 45 is partially overlapped. A transparent electrode 41 is formed on the substrate [FIG. 4 (b)].

A negative photosensitive material 6 which is insolubilized by exposure to ultraviolet rays so as to cover the light shielding film 45 and the transparent electrode 41.
1 is applied, and the entire surface of the photosensitive material is exposed from the back surface side of the glass substrate 11 [FIG. 4 (c)]. Then, the photosensitive material is developed to form a resist layer 62 which covers only the region between the light shielding films 45 [FIG. 4 (d)].

Next, a metal electrode 42 having a multilayer structure of nickel / copper / nickel, for example, is formed on the exposed portion of the transparent electrode 41 by selective plating [FIG. 4 (e)].

After that, the resist layer 62 is removed, the dielectric layer 17 and the protective film 18 are sequentially formed, and the manufacturing of the front side is completed [FIG. 4 (f)].

In the above front side manufacturing, the number of exposure masks required is "2", which is the same number as in the case of manufacturing the conventional PDP 90 (FIGS. 4 (a) and 4 (b)). Is the same number as the conventional one. That is, according to the manufacturing method of FIG. 4, the light shielding film 45 can be provided without lowering the yield associated with the misalignment.

FIG. 5 is a sectional view of the main part of the PDP 2 according to the second embodiment of the present invention, showing the structure of the front side portion of the discharge space. In the PDP 2, a light shielding film 46 having the same width as the reverse slit S2 is provided on the inner surface of the front glass substrate 11. Similarly to the light-shielding film 45 of FIG. 3, the light-shielding film 46 also has a strip shape extending in the line direction in a plan view and forms a stripe-shaped light-shielding pattern.

When manufacturing the PDP 2, the glass substrate 1 is used.
After the display electrode pair X and Y is formed on the black matrix 1, a black pigment having a heat resistance of 600 ° C. or higher, such as iron oxide or cobalt oxide, is printed in the reverse slit region S2 to form the light shielding film 46.
To form. And, the low melting point glass is 500 to 600 ° C.
Then, the dielectric layer 17 is formed by firing at the temperature.

The thickness of the light-shielding film 46 is the dielectric layer 1
In order to secure the flatness of the surface of No. 7, it is preferable that the thickness of each display electrode is equal to or less than the thickness. Further, it is desirable that the dielectric layer 17 has a two-layer structure and that each layer be fired. That is, a low-melting-point glass paste is applied relatively thinly and fired to form the lower dielectric layer 17a. After that, the low melting point glass paste is applied again so that the dielectric layer 17 having a required thickness is obtained and fired to form the upper dielectric layer 17b. By thinning the lower dielectric layer 17a that is in contact with the light-shielding film 46, it is possible to reduce the flow of the black pigment that accompanies the softening of the low-melting-point glass during firing, and the brightness due to the unnecessary spreading of the light-shielding film 46 Can be prevented. The thickness of the lower dielectric layer 17a is set to 1/10 of the width of the light shielding film 46.
If selected below, the effect of the flow of the pigment does not substantially appear.

By setting the firing temperature of the lower dielectric layer 17a to a temperature lower than the softening temperature of the low melting point glass, the unnecessary spreading of the light shielding film 46 can be prevented. In that case, the lower dielectric layer 17a and the upper dielectric layer 17b may have the same thickness, or the upper dielectric layer 1 may have the same thickness.
It is also possible to make 7b thinner than the lower dielectric layer 17a.

FIG. 6 is a sectional view of the main part of the PDP 3 according to the third embodiment of the present invention, showing the structure of the front side portion of the discharge space. In the PDP3, the dielectric layer 17
At the middle portion in the thickness direction of the
7 are arranged. Similarly to the light-shielding film 45 of FIG. 3, the light-shielding film 47 also has a strip shape extending in the line direction in a plan view and forms a stripe-shaped light-shielding pattern.

The width w47 of the light shielding film 47 is equal to the reverse slit S
2 is smaller than the width w2 and is smaller than the width w22 between the edges on the discharge slit S1 side of the metal electrode 42 that sandwiches the reverse slit S2. That is, the plane size of the light shielding film 47 is selected so as to overlap a part of each metal electrode 42. This allows
It becomes easy to position the light shielding film 47 so that it completely overlaps the reverse slit S2 and does not overlap the light transmitting portion in the line.

FIG. 7 is a sectional view of the essential parts of a PDP 4 according to the fourth embodiment of the present invention. The light-shielding film 45 shown in FIG. 2 includes the X, Y electrodes 41, 42 and the front glass substrate 10.
The fourth PDP shown in FIG. 7, which was formed between
Then, in the area of the reverse slit S2 between the X, Y electrodes 41, 42, the light shielding film 49 is formed so as to partially overlap the X, Y electrodes 41, 42. In such a structure, the light shielding film 49 is formed so as to completely cover the reverse slit regions between the display line regions L.
The structure is similar to that of the above-mentioned, but is different in the manufacturing process in which the light-shielding film 49 containing a black pigment is formed after forming the X, Y electrodes 41 and 42. This manufacturing process will be described in detail later.

In the structure of the PDP 4 shown in FIG. 7, the light shielding film 49 is a bus electrode 4 having a three-layer structure of Cr / Cu / Cr.
It is significant that they overlap so that they end on 2. That is, the bus electrode 42 is formed to give higher conductivity to the high resistance material of the transparent electrode 41.
It has a light-shielding property by itself. Therefore, the bus electrode 4
If the light-shielding film 49 is formed so as to overlap the upper part of the second line, the portion other than the display line region L is completely shielded.

FIG. 8 is a sectional view of the essential parts of a PDP 5 according to the fifth embodiment of the present invention. In this structure, the light-shielding film 48 is formed between the X and Y electrodes 41 and 42, and the light-shielding film 48 is provided so as not to contact the X and Y electrodes and separated from each other. For example, when the distance between the non-display area portions of the X and Y electrodes 41 and 42 is 500 μm (example of 42 inch PDP), the electrodes 41 and 42 are separated from each other by about 20 μm. Although such a structure does not completely close the display line region L, it is preferable from the viewpoint of the manufacturing process. That is, as in the case of the PDP 4 shown in FIG. 7, X,
The light-shielding film 48 can be formed after forming the Y electrodes 41 and 42, and the light-shielding film can be fired together with the firing process of the dielectric layer 17 made of low melting point glass formed thereon. In the baking process at high temperature, the light shielding film 48
Is not in contact with the electrodes 41 and 42, a stable process can be realized. This point will be described in detail later.

Further, in the structure of the PDP 5 of FIG. 8, regarding the alignment (positioning) when forming the light shielding film 48, the width of the light shielding film 48 is considerably narrower than the non-display area W22, so that there is a considerable margin. The alignment can be performed so that the light film 48 does not overlap the display line region L.

9 and 10 show the above-mentioned FIGS.
FIG. 6 is a cross-sectional view explaining the method of manufacturing the second, fourth and fifth PDPs shown in FIG.

As shown in FIG. 9A, the glass substrate 1
A transparent film 41 is formed on the entire surface by a spattering method, for example, a silicon oxide film is formed as a passivation film on the first surface. The material of the transparent electrode 41 is made of ITO and is formed to have a film thickness of about 0.1 μm. Then, an X and Y electrode 41 having a width of about 180 μm is formed by patterning in a stripe shape by a normal lithography process.

Next, as shown in FIG. 9B, a metal layer 42 having a three-layer structure of Cr / Cu / Cr is formed as a bus electrode layer with a thickness of about 1 μm on the entire surface by a sputtering method. And 60μ by the normal photolithography process
Pattern to about m. As mentioned above, the bus electrode 4
2 is formed so as to be located at the end of the transparent electrode 41 opposite to the opposite side.

The X and Y electrodes 41 and 42 are formed by a sputtering method with a glass substrate placed in a high vacuum chamber. At that time, the glass substrate 11 is provided with a light-shielding film containing a black pigment or the like. Therefore, the high vacuum process of sputtering can be carried out stably.

Next, as shown in FIG. 9C, a photoresist layer 71 containing a black pigment is formed by a screen printing method. This black pigment is, for example, manganese (M
n), iron (Fe), and copper (Cu) oxide, and such a pigment is mixed in the photoresist of the photosensitive material. For example, a pigment dispersion type photoresist (trade name CFPR BK) manufactured by Tokyo Ohka Kogyo Co., Ltd. is used.

Then, as shown in FIG. 9D, exposure and development are performed through a predetermined mask pattern, for example, 12
Baking (drying) is performed for 2 to 5 minutes in a dry atmosphere at a temperature of 0 to 200 ° C. to form the light shielding film 49. Figure 9
In the example of (d), the light-shielding film 4 like the PDP 4 shown in FIG.
9 is patterned on the X and Y electrodes 41 and 42 while overlapping.

By changing the mask pattern at this time,
As shown in FIG. 9E, it is possible to form the light shielding film 48 separated from the electrodes 41 and 42. This structure is the structure of PDP5 shown in FIG. Similarly, the light shielding film 46 can be formed as in the structure shown in FIG.

As described above, since the photosensitive resists of high molecular organic material are used for the light shielding films 49 and 48, if the light shielding film is formed before the electrode 41 and baked for stabilization, The unevenness of the surface may deteriorate the adhesion of the electrode 41. In that respect, the process of FIG. 9 is advantageous.

FIG. 10 further shows a dielectric layer 1 on the light-shielding film.
7 is a cross-sectional view showing a manufacturing process of forming the MgO layer 7 of FIG. In this example, the light shielding film 48 separated from the electrodes 41 and 42 as shown in FIGS. 8 and 9E will be described as an example.

In the manufacturing process of the dielectric layer 17 shown in FIG. 10, the light shielding film 48 is simultaneously baked in the baking process of the dielectric layer 17. Further, in forming the dielectric layer 17, lead oxide (P
bO) is used as a main component, and a paste of low melting point glass is printed on the surface and fired. This step is called printing and firing of at least the lower dielectric layer 17a and the upper dielectric layer 17b.
It consists of two processes. Moreover, as the lower dielectric layer 17a, a composition is selected in which the viscosity does not decrease even in the firing atmosphere and does not easily react with the ITO 41 of the transparent electrode or the copper (Cu) of the bus electrode 42. For example, PbO / SiO2
/ B2O3 / ZnO is a glass paste containing S
A material containing a relatively large amount of iO2 is selected.

As the upper dielectric layer 17b, a composition is selected so that the viscosity is sufficiently reduced in the firing atmosphere and the surface becomes flat. For example, PbO / SiO2 / B2
In the case of a glass paste containing O3 / ZnO, SiO2
A material containing a relatively small amount of is selected.

As shown in FIG. 10A, SiO 2
PbO / SiO2 / B2O3 / Zn containing a relatively large amount of
A glass paste containing O is printed on the surface of the glass substrate 11. Then, it is baked for about 60 minutes in a dry atmosphere at about 580 to 590 ° C. The viscosity of the glass paste did not decrease so much even at the firing temperature, and the ITO4 of the transparent electrode
1 and the copper (Cu) of the bus electrode 42 do not easily react. Further, it is baked together with the light shielding film 48. The baking process can be saved as compared with the case where the light shielding film 48 is formed before the electrodes 41 and 42.

Next, as shown in FIG. 10B, the upper dielectric layer 17b is formed. As with the lower layer,
Print the glass paste and bake for about 60 minutes in a dry atmosphere at about 580-590 ° C. As this glass paste, as described above, PbO containing a relatively small amount of SiO2
A glass paste containing / SiO2 / B2O3 / ZnO is preferred. As a result, the dielectric layer 17 having a flat surface is formed.

Finally, after a thick film of a low melting glass material for sealing is formed around the glass substrate 11 (not shown), MgO is used as a protective film as shown in FIG. 10C.
The film 18 is formed by the vapor deposition method.

In the process of FIG. 10, the light shielding film 48 is used as the electrode 4
1 and 42 are separated from each other, but as described above, FIG.
The light-shielding film may be in contact with the electrode 41 as in PDPs 2 and 4 shown in FIG. However, although the reason is not clear, when the light-shielding film is placed in a firing atmosphere near 600 ° C. in contact with the electrodes 41 and 42, the light-shielding film may turn brown. In some cases, it may be effective to separate the electrodes 41 and 42 from each other. The separation distance in this case is referred to as a discoloration preventing gap for convenience.

FIG. 11 is a plan view of the case where the light shielding film 48 is formed also on the peripheral portion outside the display area of the panel. Figure 1
2 is a sectional structural view of a portion indicated by XX-YY in FIG. 11. The light shielding film 48 has display line regions L1, L2, and
As described above, the contrast is increased by providing the X electrode and the Y electrode between L3. In FIG. 11, the light shielding film 48 is also provided on the other peripheral portions.

In the PDP, dummy X, Y electrodes DX, D are formed around the pair of X, Y electrodes X1, Y1, X2, Y2, X3, Y3 as normal display electrodes to prevent accidental discharge.
Y is provided. By positively discharging even between the dummy electrodes DX and DY, wall charges unnecessary for display are prevented from being accumulated. However, the discharge in the peripheral area and the exposure of the phosphor layer decrease the contrast of the display area. Therefore, as shown in FIG. 11, on the dummy electrodes DX and DY (Dummy in the figure), and further on the bus electrode 42.
The light-shielding film 48 is also formed on the peripheral region PE in which the lead-out portion 42R is formed. In the figure, EX indicated by a one-dot chain line is a display screen frame provided on the surface of the panel, and a sealant 50 for sealing between the glass substrates is formed at the position of the frame EX. In the cross-sectional view of FIG. 12, the sealing agent 50 formed on the front glass substrate 11 and the MgO film 18 is shown, and the rear glass substrate is omitted.

The lead-out portion 42R of the bus electrode is connected to an external control circuit via a flexible cable (not shown). Therefore, the two glass substrates are sealed by the sealing material 50 at the lead-out portion 42R of the bus electrode.

[Material for Light Shielding Film] As shown in FIG.
It has been described that the dielectric layer 17 is formed on the light shielding film 48 and firing is performed at about 600 ° C. At this time, if the display electrode and the light-shielding film are in contact with each other, the black color of the light-shielding film 48 may be discolored. The reason for this is not always clear, but during firing, an ionization tendency occurs between the display electrode in contact with the light-shielding film, and the low-melting-point glass paste deprives oxygen from the oxides of Mn, Fe, and Cu of the black pigment, It seems that the reduction of those oxides is the cause. Therefore, it is effective to prevent discoloration by mixing the photosensitive resist 71 containing the black pigment, which becomes the light-shielding film, with an oxidizing agent that itself actively releases oxygen.

Specific oxidizing agents include NaNO3,
BaO2 and the like. As a result, it was confirmed that discoloration did not occur even after the firing process.

Further, the light-shielding film can increase the display contrast of the PDP by not letting the light from the inside of the PDP to the outside. However, on the other hand, since it is black, light from the outside is specularly reflected at the interface between the light-shielding film 48 and the glass substrate 11, and the reflection due to specular reflection causes a phenomenon in which the surface of the display screen becomes difficult to see. Occurs. The regular reflection between the display electrode pair occurs on the surface of the address electrode on the rear substrate even in the conventional structure in which the light shielding film is not formed. Therefore, in order to prevent regular reflection at the interface between the light shielding film 48 and the glass substrate 11, a low melting point glass powder is mixed in the material of the light shielding film.

This low melting point glass powder is, for example, the same material as the dielectric layer 17, and is 50% in the organic photosensitive resist 71.
Include some. Therefore, the organic photosensitive resist 71 contains the black pigment and the low melting point glass powder. As a result, specular reflection of external light occurs on the front surface side of the front glass substrate 11 as usual, but at the interface between the glass substrate 11 and the light shielding film 48, the refractive index of the light shielding film 48 is equal to that of the glass substrate 11.
Since it is close to the refractive index of, the reflectance is halved. Further, the black pigment of the light shielding film 48 absorbs the light, and the reflected light is reduced by that amount. Therefore, the total number of specular reflections on the display screen is reduced, and the difficulty of seeing due to reflection is improved.

When the low melting point glass was not mixed, the regular reflectance was about 8% (4% at the glass surface and 4% at the interface). As a result of mixing the low melting point glass powder into the light shielding film 48, Regular reflection is about 6% (4% at the glass surface, 2 at the interface)
%).

As described above, the light-shielding film was provided in order to increase the contrast of the display screen. When forming the light-shielding film, an oxidant was mixed in to prevent discoloration during firing, and a low light-shielding film was added to prevent regular reflection. The melting point glass powder is mixed.

As a measure for preventing discoloration of the light-shielding film, there is a method in which each display electrode is covered with a thin insulating film, for example, a SiO 2 film, and the light-shielding film and the display electrode are not in contact with each other by this insulating thin film. To be

FIG. 13 is a sectional view of a modification of the PDP. In this figure, the glass substrate 11 on the front side and the glass substrate 21 on the back side are shown. In this example, the light shielding film 48 is an area between the display lines L and is an example of the light shielding film 48A formed on the outer surface of the front substrate 11 and the light shielding film formed in the dielectric layer 17. An example of the light film 48B, and a light shielding film 48C formed on the fluorescent film 24 of the substrate on the back side.
And examples are shown.

Even if the light shielding film 48 is formed at any position, it is possible to prevent the light from the fluorescent film 24 from leaking to the front side.

In the above description, the reflection type PDPs 1, 2,
Although 3, 4, and 5 are illustrated, the present invention is also applicable to a transmissive PDP in which the phosphor layer 28 is arranged on the front glass substrate 11. Further, the light shielding film may be provided on the outer surface of the glass substrate 11. However, in that case, alignment between the glass substrates is required.

[0078]

According to the present invention, the non-light emitting area between the display lines can be made inconspicuous and the display contrast can be enhanced.

According to the present invention, reflection of external light on the surface of the phosphor layer can be prevented and high contrast display can be realized.

According to the present invention, it is possible to prevent the reflection of external light between the display lines and the external light on the surface of the metal electrode, and to realize high contrast display. .

According to the present invention, the spread of the light-shielding film at the time of forming the dielectric layer can be eliminated, and the decrease in brightness can be prevented.

According to the present invention, since the light shielding film can be provided without increasing the number of times of mask alignment for patterning, it is possible to improve the display contrast while maintaining the yield.

Further, according to the present invention, after the display electrode is formed, the light shielding film and the dielectric layer can be formed and fired at the same time, and the process can be performed by a relatively stable process.

[Brief description of drawings]

FIG. 1 is a perspective view showing a basic structure of a PDP according to the present invention.

FIG. 2 is a sectional view of a main part of a PDP.

FIG. 3 is a plan view of a light shielding film.

FIG. 4 is a diagram showing a method of manufacturing the front surface side portion of the PDP.

FIG. 5 is a sectional view of a main part of a second PDP.

FIG. 6 is a cross-sectional view of a main part of a third PDP.

FIG. 7 is a cross-sectional view of a main part of a fourth PDP.

FIG. 8 is a cross-sectional view of a main part of a fifth PDP.

FIG. 9 is a cross-sectional view illustrating a method of manufacturing second, fourth and fifth PDPs.

FIG. 10 is a cross-sectional view illustrating a method of manufacturing second, fourth and fifth PDPs.

FIG. 11 is a plan view showing a case where a light-shielding film 48 is also formed on the peripheral portion outside the display area of the panel.

12 is a sectional structural view of a portion indicated by XX-YY in FIG.

FIG. 13 is a sectional view of a modification of the PDP.

FIG. 14 is a sectional view of an essential part showing the internal structure of a conventional PDP.

[Explanation of symbols]

1, 2 and 3 PDP (Surface discharge type PDP) 11 Glass substrate (front side substrate) 17 Dielectric layer 21 Glass substrate (back side substrate) 28R, 28G, 28B Phosphor layer (phosphor) 30 Discharge space 41 Transparent electrode 42 Metal electrodes 45, 46, 47, 48 Light-shielding film 61 Photosensitive material 62 Resist layer L Display line S1 Slit S2 Reverse slit (area sandwiched between display electrodes between lines) X, Y Display electrode pair

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masayuki Wakitani 4-1-1 Kamiotanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Within Fujitsu Limited (72) Inventor Shinoda 4-chome, 1-chome, Ueda, Nakahara-ku, Kawasaki, Kanagawa No. 1 in Fujitsu Limited (72) Inventor Keiichiro Konno 4-chome Kamiodachu, Nakahara-ku, Kawasaki City, Kanagawa Prefecture 1-1 No. 1 In-house Fujitsu Limited (72) Yasuo Yanagibashi 4-chome, Ueda Nakagawa-ku, Kawasaki City, Kanagawa Prefecture 1-1 No. 1 within Fujitsu Limited (72) Inventor Nao Sakamoto 4-1-1 Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture Within Fujitsu Limited (56) Reference JP-A-5-299019 (JP, A) Kaihei 5-299022 (JP, A) JP 64-38944 (JP, A) JP 58-5943 (JP, A) JP 3-74030 (JP, A) Actual Kai 1-1 58141 (JP, U) Actual development 59-93054 (JP, U) Actual development 64-29757 (JP, U) Actual development Sho 64-29758 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01J 11/02 H01J 11/00

Claims (6)

(57) [Claims] 1. A plurality of display electrode pairs arranged with a discharge slit for surface discharge separated on a front substrate with a predetermined reverse slit not discharging, and a plurality of display electrode pairs arranged on a rear substrate.
A three-electrode type surface discharge plasma display panel comprising a plurality of address electrodes and a plurality of phosphors intersecting a front display electrode pair, wherein the reverse slit portion between adjacent display electrode pairs of the front substrate is provided. A band-shaped light-shielding film is provided, and the light-shielding film is also provided in a peripheral region of an effective display region , and the light-shielding film is a black pigment.
Discharge type plasma display panel characterized by being formed of an insulating material containing . 2. The surface discharge plasma display panel according to claim 1, wherein each of the display electrode pairs is a transparent electrode and a metal electrode that overlaps an edge portion of the transparent electrode near the reverse slit portion. And the end portion of the metal electrode is led out to the periphery of the front substrate to be configured as a connection portion to an external control circuit, and the light shielding film in the peripheral region covers the lead portion of the metal electrode. Discharge type plasma display panel characterized by being arranged in. 3. The surface discharge plasma display panel according to claim 1, wherein dummy electrodes are provided in parallel outside the outermost display electrode pair on the front substrate, and the light shielding film in the peripheral region is A surface discharge type plasma characterized by being arranged so as to cover the dummy electrode.
Display panel. 4. A surface discharge plasma display panel according to either Re without gall claims 1 to 3, a black pigment of the light-shielding film, Mn, Fe, oxides of Cu or <br/> et al A surface discharge type plasma display panel characterized by: 5. The surface discharge plasma display panel according to claim 1, wherein the front substrate is a glass substrate, and the light-shielding film contains a glass material. Discharge type plasma
Display panel. 6. The surface discharge type plasma display according to claim 1.
In a method of manufacturing a spray panel, Before forming the light-shielding film on the front substrate,
With multiple display electrode pairs formed on the surface substrate,
To a photosensitive resist film containing a black pigment,
Corresponds to the reverse slit through light, development and drying process
A band-shaped light-shielding film and a portion corresponding to the peripheral area of the display area
Surface release characterized by forming a light-shielding film having a fixed pattern
Method for manufacturing electric plasma display panel.