JP3361872B2 - Substrate cleaning equipment - Google Patents
Substrate cleaning equipmentInfo
- Publication number
- JP3361872B2 JP3361872B2 JP01055894A JP1055894A JP3361872B2 JP 3361872 B2 JP3361872 B2 JP 3361872B2 JP 01055894 A JP01055894 A JP 01055894A JP 1055894 A JP1055894 A JP 1055894A JP 3361872 B2 JP3361872 B2 JP 3361872B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- ultrasonic
- cleaning
- cleaning apparatus
- substrate cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Liquid Crystal (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明はガラス基板等の表面に付
着している微細なゴミを洗浄する装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for cleaning fine dust adhering to the surface of a glass substrate or the like.
【０００２】[0002]
【従来の技術】例えばガラス基板の一面にＴＦＴ（薄膜
トランジスタ）を形成したカラー液晶基板を製作するに
は、半導体ウェーハ上にデバイスを形成する場合と同様
に被膜の形成等多くの表面処理工程を経て製作される。2. Description of the Related Art For example, in order to manufacture a color liquid crystal substrate in which a TFT (thin film transistor) is formed on one surface of a glass substrate, many surface treatment steps such as formation of a coating film are performed as in the case of forming a device on a semiconductor wafer. Produced.
【０００３】ここで、表面処理を行う前または後にガラ
ス基板表面にゴミが付着していると、歩留まり低下の原
因となる。そこで、従来から表面処理を行う前後には必
ず洗浄処理を行っている。斯かる洗浄処理を行う装置と
してディスクブラシ或いはロールブラシを用いて表面に
付着しているゴミを排出する装置が知られている。Here, if the dust adheres to the surface of the glass substrate before or after the surface treatment, the yield will be reduced. Therefore, conventionally, cleaning treatment is always performed before and after the surface treatment. As a device for performing such a cleaning process, a device for discharging dust adhering to the surface by using a disk brush or a roll brush is known.
【０００４】[0004]
【発明が解決しようとする課題】上述したようにブラシ
によってゴミを排除する場合には、ブラシにゴミが付着
し、洗浄能力が低下しやすく、また洗浄能力自体も十分
でなく洗浄時間がかかる不利がある。しかも、表面に傷
をつける恐れがあり問題となっている。When the dust is removed by the brush as described above, the dust adheres to the brush and the cleaning ability is liable to decrease, and the cleaning ability itself is not sufficient, which is disadvantageous in that the cleaning time is long. There is. Moreover, the surface may be scratched, which is a problem.
【０００５】そこで、洗浄液に超音波による振動を与
え、この洗浄水により表面に付着しているゴミを除去す
る手段が考えられる。この場合には洗浄水を噴出するノ
ズルとして超音波ノズルを用いることとなるが、超音波
ノズルにて洗浄水を基板表面に当てた場合、反射する洗
浄水の向きが定まらず、あらゆる方向に洗浄水が飛び散
り、環境の汚染や再付着もあり得る。Therefore, it is conceivable to apply a vibration to the cleaning liquid by ultrasonic waves and remove the dust adhering to the surface by this cleaning water. In this case, an ultrasonic nozzle is used as a nozzle for ejecting the cleaning water, but when the cleaning water is applied to the substrate surface with the ultrasonic nozzle, the direction of the reflected cleaning water is not fixed and cleaning is performed in all directions. Water splashes can cause environmental pollution and redeposition.
【０００６】[0006]
【課題を解決するための手段】上記課題を解決すべく本
発明は、基板洗浄装置として３本以上の超音波ノズルを
有する超音波洗浄ユニットを備えるようにし、しかも３
本以上の超音波ノズルの軸を噴出した洗浄液が基板表面
の１点において収束するように配列し、更に各超音波ノ
ズルの軸を平面視で前記収束する１点を中心とした水平
方向で９０〜１８０°の範囲内に全て収めるようにし
た。ここで、超音波ノズルの配置範囲を水平方向で９０
〜１８０°としたのは、９０°以内に３本以上の超音波
ノズルを配置するのは困難であるとともに基板表面を撹
拌する効果が落ちるので、洗浄効果が低下し、また１８
０°を超えると、各超音波ノズルからの洗浄液が互いに
反発して飛散することによる。In order to solve the above problems, the present invention is provided with an ultrasonic cleaning unit having three or more ultrasonic nozzles as a substrate cleaning apparatus, and further, 3
The cleaning liquids ejected from the axes of the ultrasonic nozzles are arranged so as to converge at one point on the surface of the substrate, and the axes of the ultrasonic nozzles are arranged in the horizontal direction about the converged point in the plan view. All of them were set within the range of 180 °. Here, the placement range of the ultrasonic nozzle is 90 in the horizontal direction.
The reason for setting the angle to 180 ° is that it is difficult to dispose three or more ultrasonic nozzles within 90 ° and the effect of stirring the substrate surface is lowered, so that the cleaning effect is reduced, and
If it exceeds 0 °, the cleaning liquids from the ultrasonic nozzles repel each other and scatter.
【０００７】[0007]
【作用】複数の超音波ノズルの軸を基板表面上の洗浄液
の収束点を中心とした水平方向で９０〜１８０°の範囲
内に全て収めるようにしたので、各超音波ノズルから噴
出する洗浄液が互いに反発し合うことなく、超音波洗浄
を行う。Since the axes of the plurality of ultrasonic nozzles are all contained within the range of 90 to 180 ° in the horizontal direction about the convergence point of the cleaning liquid on the substrate surface, the cleaning liquid ejected from each ultrasonic nozzle is Perform ultrasonic cleaning without repelling each other.
【０００８】[0008]
【実施例】以下に本発明の実施例を添付図面に基づいて
説明する。ここで、図１は本発明に係る基板洗浄装置の
全体縦断面図、図２は同基板洗浄装置の要部拡大平面
図、図３は同基板洗浄装置を構成する超音波洗浄ユニッ
トの縦断面図、図４は超音波洗浄ユニットを構成する超
音波ノズルの配置を示す平面図、図５は超音波ノズルの
取り付けプレートの平面図である。Embodiments of the present invention will be described below with reference to the accompanying drawings. Here, FIG. 1 is an overall vertical sectional view of a substrate cleaning apparatus according to the present invention, FIG. 2 is an enlarged plan view of an essential part of the substrate cleaning apparatus, and FIG. 3 is a vertical sectional view of an ultrasonic cleaning unit constituting the substrate cleaning apparatus. FIG. 4 is a plan view showing an arrangement of ultrasonic nozzles constituting the ultrasonic cleaning unit, and FIG. 5 is a plan view of an ultrasonic nozzle mounting plate.
【０００９】基板洗浄装置は洗浄ステーション１の側方
に超音波洗浄ユニット１０を配置している。洗浄ステー
ション１には洗浄ケース２が設けられ、この洗浄ケース
２底部にスピンナー３が配置され、このスピンナー３の
上端部に半導体ウェーハやガラス基板Ｗを受けるチャッ
ク４が取り付けられている。The substrate cleaning apparatus has an ultrasonic cleaning unit 10 arranged beside the cleaning station 1. A cleaning case 2 is provided in the cleaning station 1, a spinner 3 is arranged at the bottom of the cleaning case 2, and a chuck 4 for receiving a semiconductor wafer or a glass substrate W is attached to an upper end of the spinner 3.
【００１０】また、洗浄ケース２の外側にはレール５が
設けられ、このレール５に沿って基板Ｗを搬送するハン
ドラー６が走行可能とされ、また洗浄ケース２の内側壁
には上下に離間して２種類のスカート部７，８を設けて
いる。下方のスカート部７は上下に位置調整可能とされ
ている。A rail 5 is provided on the outside of the cleaning case 2, and a handler 6 for transporting the substrate W can be moved along the rail 5, and the inner wall of the cleaning case 2 is vertically separated from each other. 2 types of skirts 7 and 8 are provided. The lower skirt portion 7 can be vertically adjusted.
【００１１】一方、超音波洗浄ユニット１０はシリンダ
ユニット１１によって２段回で上下動可能とされた中空
状の旋回アーム１２の先端にパイプ１３を取り付け、こ
のパイプ１３の下端に取り付けプレート１４を介して３
本の超音波ノズル１５を固着している。具体的には取り
付けプレート１４には図５に示すように下向きの傾斜面
１４ａが３カ所形成され、これら傾斜面１４ａに取り付
け金具１６によって超音波ノズル１５を固着している。On the other hand, in the ultrasonic cleaning unit 10, a pipe 13 is attached to the tip of a hollow revolving arm 12 which can be moved up and down in two steps by a cylinder unit 11, and a mounting plate 14 is attached to the lower end of the pipe 13. 3
The ultrasonic nozzle 15 of the book is fixed. Specifically, as shown in FIG. 5, three downwardly inclined surfaces 14a are formed on the mounting plate 14, and the ultrasonic nozzles 15 are fixed to the inclined surfaces 14a by mounting hardware 16.
【００１２】前記超音波ノズル１５には洗浄水を供給す
るチューブ１８が側面に接続され、また供給された洗浄
水を振動させる超音波を印加するケーブル１７が上部に
接続されている。A tube 18 for supplying cleaning water is connected to a side surface of the ultrasonic nozzle 15, and a cable 17 for applying an ultrasonic wave for vibrating the supplied cleaning water is connected to an upper portion thereof.
【００１３】また、３本の超音波ノズル１５は噴出する
洗浄液が基板Ｗ上の１点（収束点Ｐ）で収束すべく図３
に示すように水平面（基板面）に対してその軸線が傾斜
（実施例では約４５°）するとともに、また図４に示す
ように、各超音波ノズル１５の軸は前記収束点Ｐを中心
とした水平方向で９０〜１８０°の範囲内に全て収めて
いる。特に本実施例にあっては３本の超音波ノズル１５
の水平方向の間隔を約７０°としている。このように、
各超音波ノズル１５の軸を収束点Ｐを中心とした水平方
向で９０〜１８０°の範囲内に収めることで、超音波ノ
ズルから噴出する洗浄液が互いに反発し合うことなく、
互いに協働してゴミを浮き上がらせて一定の方向へ向け
て叩き出す。Further, the three ultrasonic nozzles 15 are arranged so that the cleaning liquid ejected is converged at one point (convergence point P) on the substrate W as shown in FIG.
As shown in FIG. 4, the axis of the ultrasonic nozzle 15 is inclined (about 45 ° in the embodiment) with respect to the horizontal plane (substrate surface), and as shown in FIG. 4, the axis of each ultrasonic nozzle 15 is centered on the convergence point P. All are contained within the range of 90 to 180 ° in the horizontal direction. Particularly, in this embodiment, three ultrasonic nozzles 15 are used.
The horizontal interval is about 70 °. in this way,
By keeping the axis of each ultrasonic nozzle 15 within the range of 90 to 180 ° in the horizontal direction around the convergence point P, the cleaning liquids ejected from the ultrasonic nozzles do not repel each other,
Collaborate with each other to raise dust and knock it out in a certain direction.
【００１４】また、前記取り付けプレート１４にはブラ
ケット１９を介して傘２０が取り付けられ、この傘２０
内に各超音波ノズル１５の先端部が臨んでいる。このよ
うに超音波ノズル１５の先端部を傘２０内に臨ませるこ
とで、洗浄液の跳ね返りが防止される。更に、傘２０の
中心部にはアーム１２及びパイプ１３内を通した洗浄液
管２１の噴出口が開口している。このようにすると、傘
２０内側の２次汚染が防げる。また、各超音波ノズルの
洗浄液の噴出量及び超音波の発振数を個別に制御可能と
することで、洗浄液の排出方向を変更したり、ゴミの付
着の量や種類に応じた洗浄が可能となる。 An umbrella 20 is attached to the mounting plate 14 via a bracket 19, and the umbrella 20
The tip of each ultrasonic nozzle 15 faces inside. By thus exposing the tip of the ultrasonic nozzle 15 to the inside of the umbrella 20, splashing of the cleaning liquid is prevented. Further, a jet port of the cleaning liquid pipe 21 that passes through the inside of the arm 12 and the pipe 13 is opened at the center of the umbrella 20. In this way, secondary pollution inside the umbrella 20 can be prevented. Also, for each ultrasonic nozzle
It is possible to individually control the jetting amount of cleaning liquid and the number of ultrasonic waves.
Change the discharge direction of the cleaning liquid or attach dust.
It is possible to wash according to the amount and type of clothes.
【００１５】以上において、基板Ｗの洗浄を行うには、
ハンドラー６によって基板Ｗをチャック４上に載置し、
基板Ｗを１００〜４００ｒｐｍで回転しつつ、図４に示
すように超音波洗浄ユニット１０のアーム１２を必要な
回数だけ往復揺動させ、基板Ｗの外径から内径方向へ、
また内径から外径方向に洗浄を行う。In the above, to clean the substrate W,
The substrate W is placed on the chuck 4 by the handler 6,
While rotating the substrate W at 100 to 400 rpm, as shown in FIG. 4, the arm 12 of the ultrasonic cleaning unit 10 is reciprocally rocked a necessary number of times to move the substrate W from the outer diameter to the inner diameter direction.
In addition, cleaning is performed from the inner diameter to the outer diameter.
【００１６】そして、この洗浄において、基板Ｗの回転
速度は外径部で大きく、内径部で小さくなる。この場
合、アーム１２の揺動速度を一定にしていると、基板の
外径部付近では基板と超音波ノズルとの相対速度が大き
くなり、基板の内径部付近では基板と超音波ノズルとの
相対速度が小さくなる。この相対速度が大きいと洗浄液
が飛散するため、アーム１２の揺動速度を一定にする場
合には、その速度は基板Ｗの外径部での回転速度に律せ
られることになり、内径部付近での速度が必要以上に遅
くなる。そこで、本実施例にあってはアーム１２の揺動
速度を、基板の外径部付近では遅く、基板の内径部付近
では速くして、基板と超音波ノズルとの相対速度が一定
となるようにし、洗浄時間の短縮を図っている。In this cleaning, the rotation speed of the substrate W is high at the outer diameter portion and low at the inner diameter portion. In this case, if the swing speed of the arm 12 is constant, the relative velocity between the substrate and the ultrasonic nozzle becomes large near the outer diameter portion of the substrate, and the relative velocity between the substrate and the ultrasonic nozzle near the inner diameter portion of the substrate. The speed decreases. If the relative speed is high, the cleaning liquid is scattered. Therefore, when the swing speed of the arm 12 is constant, the speed is limited by the rotation speed of the outer diameter portion of the substrate W, and the vicinity of the inner diameter portion. The speed is slower than necessary. Therefore, in this embodiment, the swing speed of the arm 12 is slow near the outer diameter portion of the substrate and fast near the inner diameter portion of the substrate so that the relative velocity between the substrate and the ultrasonic nozzle is constant. The cleaning time is shortened.
【００１７】また。別実施例にあってはアーム１２の揺
動速度を一定とし、基板Ｗの回転速度を変化させる。ア
ーム１２が基板の外径部付近にあるときは基板Ｗの回転
速度を速く、基板の内径部付近にあるときは遅くして、
基板と超音波ノズルとの相対速度が一定になるようにし
ている。Also, In another embodiment, the swing speed of the arm 12 is kept constant and the rotation speed of the substrate W is changed. When the arm 12 is near the outer diameter portion of the substrate, the rotation speed of the substrate W is increased, and when it is near the inner diameter portion of the substrate, the rotation speed is decreased.
The relative speed between the substrate and the ultrasonic nozzle is made constant.
【００１８】[0018]
【発明の効果】以上に説明したように本発明によれば、
基板洗浄装置の超音波洗浄ユニットとして３本以上の超
音波ノズルを設け、これら３本以上の超音波ノズルの軸
を噴出した洗浄液が基板表面の１点において収束するよ
うに配列し、更に各超音波ノズルの軸を前記収束点を中
心とした水平方向で９０〜１８０°の範囲内に全て収め
るようにしたので、各超音波ノズルから噴出する洗浄液
が互いに反発し合うことなく、基板に非接触で超音波洗
浄を行う。したがって、洗浄能力自体も十分で洗浄時間
が短縮でき、しかも基板表面に傷をつける恐れもない。As described above, according to the present invention,
As an ultrasonic cleaning unit of the substrate cleaning apparatus, three or more ultrasonic nozzles are provided, and the cleaning liquid ejected from the axes of these three or more ultrasonic nozzles is arranged so as to converge at one point on the substrate surface. Since the axes of the ultrasonic nozzles are all contained within the range of 90 to 180 ° in the horizontal direction around the convergence point, the cleaning liquids ejected from the ultrasonic nozzles do not repel each other and do not contact the substrate. Ultrasonic cleaning. Therefore, the cleaning ability itself is sufficient, the cleaning time can be shortened, and there is no fear of scratching the substrate surface.
【００１９】また、各超音波ノズルの洗浄液の噴出量及
び超音波の発振数を個別に制御可能とすることで、洗浄
液の排出方向を変更したり、ゴミの付着の量や種類に応
じた洗浄が可能となる。Further, by making it possible to individually control the ejection amount of the cleaning liquid and the number of oscillations of the ultrasonic waves from each ultrasonic nozzle, it is possible to change the discharge direction of the cleaning liquid and to perform cleaning in accordance with the amount and type of dust adhesion. Is possible.
【００２０】また、各超音波ノズルの先端部を１つの傘
内に臨ませることで、洗浄液の跳ね返りが防止され、ま
た霧化した洗浄液の巻き上げも防止され、更に傘の中心
部に洗浄液噴出口を開口させることで、傘内側の２次汚
染も防げる。Further, by making the tip of each ultrasonic nozzle face into one umbrella, the splash of the cleaning liquid is prevented, and the atomization of the cleaning liquid is prevented from being rolled up. By opening the, you can also prevent secondary pollution inside the umbrella.
【図１】本発明に係る基板洗浄装置の全体縦断面図FIG. 1 is an overall vertical sectional view of a substrate cleaning apparatus according to the present invention.
【図２】同基板洗浄装置の要部拡大平面図FIG. 2 is an enlarged plan view of an essential part of the substrate cleaning apparatus.
【図３】同基板洗浄装置を構成する超音波洗浄ユニット
の縦断面図FIG. 3 is a vertical sectional view of an ultrasonic cleaning unit that constitutes the substrate cleaning apparatus.
【図４】超音波洗浄ユニットを構成する超音波ノズルの
配置を示す平面図FIG. 4 is a plan view showing an arrangement of ultrasonic nozzles that constitute an ultrasonic cleaning unit.
【図５】超音波ノズルの取り付けプレートの平面図FIG. 5 is a plan view of an ultrasonic nozzle mounting plate.
１…洗浄ステーション、 ２…洗浄ケース、 ３…スピ
ンナー、 ４…チャック、 １０…超音波洗浄ユニッ
ト、 １２…旋回アーム、 １４…取り付けプレート、
１５…超音波ノズル、 ２０…傘、 Ｐ…洗浄液の収
束点、 Ｗ…基板。1 ... Washing station, 2 ... Washing case, 3 ... Spinner, 4 ... Chuck, 10 ... Ultrasonic washing unit, 12 ... Swivel arm, 14 ... Mounting plate,
15 ... Ultrasonic nozzle, 20 ... Umbrella, P ... Convergence point of cleaning liquid, W ... Substrate.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ Ｈ０１Ｌ 21/304 ６４３ Ｈ０１Ｌ 21/304 ６４３Ｄ (72)発明者 小針 英也 神奈川県川崎市中原区中丸子150番地 東京応化工業株式会社内 (56)参考文献 特開 平１−151975（ＪＰ，Ａ) 特開 昭63−126587（ＪＰ，Ａ) 特開 平３−16685（ＪＰ，Ａ) 特開 昭59−150584（ＪＰ，Ａ) 実開 昭63−39487（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) B08B 1/00 - 7/04 H01L 21/304 G02F 1/03,1/1333 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 7 Identification code FI H01L 21/304 643 H01L 21/304 643D (72) Inventor Hideya Kodaira 150 Nakamaruko Nakahara-ku, Kawasaki-shi, Kanagawa Tokyo Ohka Kogyo Co., Ltd. (56) Reference JP 1-151975 (JP, A) JP 63-126587 (JP, A) JP 3-16685 (JP, A) JP 59-150584 (JP, A) 63-39487 (JP, U) (58) Fields investigated (Int.Cl. 7 , DB name) B08B 1/00-7/04 H01L 21/304 G02F 1 / 03,1 / 1333
Claims (4)
せつつ排除する基板洗浄装置において、この基板洗浄装
置は洗浄液を基板表面に向けて噴出する超音波洗浄ユニ
ットを備え、この超音波洗浄ユニットは３本以上の超音
波ノズルを有し、これら超音波ノズルの軸は噴出した洗
浄液が基板表面の１点において収束するように配列さ
れ、更に各超音波ノズルの軸は平面視で前記収束する１
点を中心とした水平方向で９０〜１８０°の範囲内に全
て収められていることを特徴とする基板洗浄装置。1. A substrate cleaning apparatus for removing dust existing on the surface of a substrate while rotating the substrate, the substrate cleaning apparatus including an ultrasonic cleaning unit for ejecting a cleaning liquid toward the surface of the substrate. has an ultrasonic nozzle of the three or more, these cleaning liquid the axis of the ultrasonic nozzle is jetted are arranged so as to converge at one point of the substrate surface, further axes of the ultrasonic nozzle is the convergence in plan view 1
A substrate cleaning apparatus characterized in that all are contained within a range of 90 to 180 ° in the horizontal direction centered on a point .
て、複数の超音波ノズルは洗浄液の噴出量及び超音波の
発振数が個別に制御可能とされていることを特徴とする
基板洗浄装置。2. The substrate cleaning apparatus according to claim 1, wherein the plurality of ultrasonic nozzles are capable of individually controlling the ejection amount of the cleaning liquid and the oscillation number of ultrasonic waves.
において、この基板洗浄装置は旋回アームを備え、この
旋回アームの先端に傘が取り付けられ、この傘の外側に
配置される複数の超音波ノズルの少なくともその先端部
が前記傘内に臨むことを特徴とする基板洗浄装置。3. The substrate cleaning apparatus according to claim 1 or 2, wherein the substrate cleaning apparatus includes a swing arm,
An umbrella is attached to the tip of the swivel arm.
At least the tip of the plurality of ultrasonic nozzles to be arranged
A substrate cleaning apparatus, wherein the substrate cleaning apparatus faces the inside of the umbrella .
て、前記傘の中心部に洗浄液噴出口が開口していること
を特徴とする基板洗浄装置。4. The substrate cleaning apparatus according to claim 3, wherein a cleaning liquid ejection port is opened at the center of the umbrella.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01055894A JP3361872B2 (en) | 1994-02-01 | 1994-02-01 | Substrate cleaning equipment |
| KR1019950001437A KR100292932B1 (en) | 1994-02-01 | 1995-01-27 | Board Cleaning Device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01055894A JP3361872B2 (en) | 1994-02-01 | 1994-02-01 | Substrate cleaning equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07214015A JPH07214015A (en) | 1995-08-15 |
| JP3361872B2 true JP3361872B2 (en) | 2003-01-07 |
Family
ID=11753588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP01055894A Expired - Fee Related JP3361872B2 (en) | 1994-02-01 | 1994-02-01 | Substrate cleaning equipment |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP3361872B2 (en) |
| KR (1) | KR100292932B1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3630524B2 (en) * | 1997-05-08 | 2005-03-16 | 大日本スクリーン製造株式会社 | Substrate cleaning device |
| KR100634832B1 (en) * | 2000-02-24 | 2006-10-17 | 엘지.필립스 엘시디 주식회사 | Fine Jet Apparatus |
| KR100416592B1 (en) * | 2001-02-10 | 2004-02-05 | 삼성전자주식회사 | single type wafer cleaning apparatus and wafer cleaning method using the same |
| CN115009667B (en) * | 2022-05-27 | 2024-02-09 | 曹阳 | Soil sample's strorage device in soil property detects |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR940001307A (en) * | 1992-06-27 | 1994-01-11 | 김광호 | Surface Cleaning Device of Semiconductor Substrate |
-
1994
- 1994-02-01 JP JP01055894A patent/JP3361872B2/en not_active Expired - Fee Related
-
1995
- 1995-01-27 KR KR1019950001437A patent/KR100292932B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR950034560A (en) | 1995-12-28 |
| JPH07214015A (en) | 1995-08-15 |
| KR100292932B1 (en) | 2001-06-15 |
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