KR950034560A - Board Cleaning Device - Google Patents
Board Cleaning Device Download PDFInfo
- Publication number
- KR950034560A KR950034560A KR1019950001437A KR19950001437A KR950034560A KR 950034560 A KR950034560 A KR 950034560A KR 1019950001437 A KR1019950001437 A KR 1019950001437A KR 19950001437 A KR19950001437 A KR 19950001437A KR 950034560 A KR950034560 A KR 950034560A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- cleaning
- ultrasonic
- cleaning liquid
- cleaning apparatus
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Liquid Crystal (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
본 발명은 유리기판등의 표면에 부착되어 있는 미세한 먼지를 세정하는 기판 세정장치에 관한 것으로, 기판의 세정을 단시간에 효과적으로 하려는 목적을 달성하기 위해, 3개의 초음파노즐(15)은 분출하는 세정액이 기판(W)위의 1점(집속점P)에서 집속되도록 수평면(기판면)에 대하여 그 축선이 경사하도록 할 뿐만 아니라 각 초음파노즐(15)의 축은 상기 집속점(P)을 중심으로 하여 수평방향에서 90~180° 범위내에 모두 수용되도록 구성하여, 기판을 비접촉 세정하므로서 흠집없이 효율좋게 세정을 할 뿐만 아니라 세정액의 배출방향 및 회전 속도 진동수의 조정으로 먼지의 부착량이나 종류등에 관계없이 모두 적절히 세정할 수 있도록 하였다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cleaning apparatus for cleaning fine dust adhered to a surface such as a glass substrate. In order to achieve the purpose of effectively cleaning the substrate in a short time, the three ultrasonic nozzles 15 are provided with a cleaning liquid to be ejected. Not only does the axis be inclined with respect to the horizontal plane (substrate surface) so as to focus at one point (focusing point P) on the substrate W, but the axis of each ultrasonic nozzle 15 is horizontal with respect to the focusing point P. It is configured to be accommodated within the range of 90-180 ° in the direction, and it cleans the substrate efficiently without being scratched by non-contact cleaning, and it properly cleans all irrespective of the amount or type of dust by adjusting the discharge direction and rotation speed frequency of the cleaning liquid. I could do it.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제1도는 본 발명에 관한 기판세정장치의 전체 종단면도, 제2도는 본 발명의 요부 확대 평면도, 제3도는 본 발명을 구성하는 초음파 세정유닛트의 종단면도.1 is an overall longitudinal sectional view of the substrate cleaning apparatus according to the present invention, FIG. 2 is an enlarged plan view of the main portion of the present invention, and FIG. 3 is a longitudinal sectional view of the ultrasonic cleaning unit constituting the present invention.
Claims (4)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP94-10558 | 1994-02-01 | ||
JP01055894A JP3361872B2 (en) | 1994-02-01 | 1994-02-01 | Substrate cleaning equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950034560A true KR950034560A (en) | 1995-12-28 |
KR100292932B1 KR100292932B1 (en) | 2001-06-15 |
Family
ID=11753588
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950001437A KR100292932B1 (en) | 1994-02-01 | 1995-01-27 | Board Cleaning Device |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP3361872B2 (en) |
KR (1) | KR100292932B1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3630524B2 (en) * | 1997-05-08 | 2005-03-16 | 大日本スクリーン製造株式会社 | Substrate cleaning device |
KR100634832B1 (en) * | 2000-02-24 | 2006-10-17 | 엘지.필립스 엘시디 주식회사 | Fine Jet Apparatus |
KR100416592B1 (en) * | 2001-02-10 | 2004-02-05 | 삼성전자주식회사 | single type wafer cleaning apparatus and wafer cleaning method using the same |
CN115009667B (en) * | 2022-05-27 | 2024-02-09 | 曹阳 | Soil sample's strorage device in soil property detects |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR940001307A (en) * | 1992-06-27 | 1994-01-11 | 김광호 | Surface Cleaning Device of Semiconductor Substrate |
-
1994
- 1994-02-01 JP JP01055894A patent/JP3361872B2/en not_active Expired - Fee Related
-
1995
- 1995-01-27 KR KR1019950001437A patent/KR100292932B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH07214015A (en) | 1995-08-15 |
JP3361872B2 (en) | 2003-01-07 |
KR100292932B1 (en) | 2001-06-15 |
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E902 | Notification of reason for refusal | ||
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E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20120302 Year of fee payment: 12 |
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