JP3358764B2 - Flexible support for applying ceramic paint and method for producing ceramic electronic component - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible support for applying a ceramic paint and a method for producing a ceramic electronic component using the same.

[0002]

2. Description of the Related Art When a ceramic electronic component such as a capacitor, a piezoelectric component, a positive temperature coefficient thermistor, a negative temperature coefficient thermistor or a varistor is manufactured, a ceramic powder, an organic binder, a plasticizer, A step of forming a green sheet by applying a ceramic paint containing a solvent or the like and forming electrodes of palladium, silver, nickel or the like thereon by screen printing may be employed. When obtaining a laminated structure in this manufacturing process,
The obtained green sheets are laminated one by one so as to have a desired laminated structure, and a ceramic green chip is obtained through a press cutting step. The binder in the ceramic green chip thus obtained was burned out and 1
Baked at 000 ° C. to 1400 ° C.
Form terminal electrodes of silver-palladium, nickel, copper, etc.,
Obtain ceramic electronic components.

As another prior art, a method has been proposed in which a green sheet is thermally transferred so that a flexible support faces upward (Japanese Patent Laid-Open No. 63-188926).

As another prior art, a laminated body is obtained by repeating a step of forming a green sheet on a flexible support and a step of printing electrodes on the green sheet by a required number of layers. Methods have also been proposed.

[0005] In any of the above production methods, a step of peeling the formed green sheet from the flexible support is involved. Conventionally, in this peeling step, it is difficult to peel the green sheet from the flexible support without damaging the green sheet and the like, and the resulting product frequently has characteristic defects such as short-circuits, and the lamination yield is low. There is a problem that it gets worse. This problem becomes more prominent when the green sheet is made thinner. For example, in the case of a multilayer ceramic capacitor, it is necessary to reduce the thickness of one dielectric layer and increase the number of stacked layers as a method of reducing the size and increasing the capacitance. At this time, the thin green sheet cannot be peeled off from the flexible support, and the lamination yield becomes very poor. Further, since thin green sheets are handled, the resulting products often have characteristic defects such as short circuits.

[0006] In order to improve the releasability, it is conceivable to perform a release treatment on the entire surface of the flexible support on which the ceramic paint is applied. However, if the releasability is too good, on the contrary, the green sheet is peeled off from the flexible support by a very small force applied from the outside, or a broken green sheet piece is interposed as a foreign substance at the lamination interface. Causes structural defects.

[0007]

SUMMARY OF THE INVENTION An object of the present invention is to provide a flexible support capable of giving a green sheet an appropriate peeling property and adhesion, and a method of manufacturing a ceramic electronic component using the same. It is to provide.

Another object of the present invention is to provide a flexible support and a ceramic electronic device using the same, which can significantly reduce the difficulty of peeling and poor product characteristics even when the green sheet is thinned. It is to provide a method of manufacturing a part.

Yet another object of the present invention is to provide a method of manufacturing a ceramic electronic component in which the step between the layers caused by the electrodes is significantly reduced and the reliability is improved.

[0010]

In order to solve the above-mentioned problems, a belt-shaped flexible support having one surface used as a ceramic coating surface is provided.
It has a region where the peeling treatment has been performed and a region where the peeling treatment has not been performed. Preferably, the region where the peeling process has not been performed is provided on both sides in the width direction. More preferably, the area where the peeling processing has not been performed includes a mark forming area, and the mark forming area may be colored.

According to the method for manufacturing a ceramic electronic component of the present invention, a green sheet forming step of forming a green sheet by applying a ceramic paint on a flexible support, and printing the electrodes on the green sheet. And performing the steps. The flexible support is the flexible support according to the present invention.

In the method for manufacturing a ceramic electronic component according to the present invention, there are two methods for laminating a green sheet and an electrode. The first method is a method in which a green sheet forming step and a printing step are repeated on a flexible support. In a second method, after the green sheet forming step and the printing step are performed a plurality of times, the obtained laminated green sheet is peeled from the flexible support, and then, the plurality of peeled green sheets obtained by peeling are obtained. This is a method of laminating laminated green sheets.

[0013]

The green paint formed on the flexible support is easily peeled off from the flexible support because the ceramic paint-coated surface of the flexible support has an area subjected to a release treatment. can do.

In addition, since the ceramic paint-applied surface has a non-peeled area in addition to a peeled area, the adhesion of the green sheet to the flexible support is enhanced. For this reason, the green sheet does not peel off from the flexible support and adhere to the plate making, and the broken green sheet piece is intervened as a foreign substance at the lamination interface and does not cause a structural defect. Further, the green sheet does not separate from the flexible support due to the contact of the ceramic sheet applying means such as a nozzle and a blade with the green sheet.

In particular, in the case where the untreated areas are on both sides in the width direction of the flexible support, both ends in the width direction of the green sheet are in close contact with the flexible support.
For this reason, the edge adhesion of the green sheet to the flexible support is increased, and the above-described action is further promoted. The width of the region not subjected to the peeling treatment is about 0.5 to 20 mm under normal manufacturing conditions.

Next, in the method for manufacturing a ceramic electronic component according to the present invention, a green sheet forming step of forming a green sheet by applying a ceramic paint on a flexible support, and printing an electrode on the green sheet. And a printing step, the amount of the flexible support used can be reduced, and the mass productivity is improved. In performing this step, in any step, the green sheet is peeled from the flexible support. Here, since the flexible support according to the present invention is used, the advantage of the flexible support described above can be obtained as it is. The method of printing and laminating an internal electrode on a green sheet, which is a general manufacturing method, is sufficiently effective.

In the above manufacturing process, when the first method in which the green sheet forming step and the printing step are repeated on a flexible support is adopted, each of the green sheets is subjected to the flexible supporting step during the laminating step. There is no need to peel from the body,
No need to handle. Also, there is no thermal transfer step. For this reason, a highly accurate and highly reliable ceramic electronic component can be easily manufactured. In addition, a step between a portion having an electrode and a portion having no electrode is absorbed by the repetition of the formation of the green sheet and the printing of the electrode, so that defects such as cracks due to the step are improved. In addition, by the above-mentioned process,
Since a laminated green chip in which a plurality of layers of green sheets are integrated with electrodes can be obtained, delamination after pressing, which has conventionally been a problem, is not observed.

When the first method is adopted, the laminate is peeled from the flexible support in the final stage. Here, since the flexible support according to the present invention is used, the above-described advantages can be obtained as it is.

The green sheet forming step and the printing step
The method according to the present invention can also be applied to a case where a second method of peeling the green sheet from the flexible support after performing the plurality of times and then laminating a plurality of ceramic green sheets obtained by peeling is adopted. By using the flexible support, the advantage can be sufficiently exhibited.

In addition, in the case of the second method, since it is handled in a state of a thick laminated strip, it is not necessary to peel off a single layer of the green sheet from the flexible support, and it is not necessary to handle the green sheet. Also, there is no thermal transfer step. For this reason, a highly accurate and highly reliable ceramic electronic component can be easily manufactured. In addition, a step between a portion having an electrode and a portion having no electrode is absorbed by the repetition of the formation of the green sheet and the printing of the electrode, so that defects such as cracks due to the step are improved. In addition, since a laminated band in which a plurality of layers of green sheets are integrated with electrodes can be obtained by the above-described process, delamination after pressing, which has conventionally been a problem, is not observed.

The other features of the present invention and the operation and effect thereof will be described in more detail with reference to the accompanying drawings and embodiments.

[0022]

FIG. 1 is a cross-sectional view of a flexible support according to the present invention. The flexible support 19 according to the present invention is a strip-shaped film used on one side with a ceramic paint applied surface. The flexible support 19 can be composed of a transparent, translucent or opaque plastic film. The surface of the flexible support 19 to which the ceramic paint is applied has an area 190 where the release processing is performed and an area 191 where the release processing is not performed. The peeling treatment can be performed by thinly coating a surface of the flexible support 19 with a peeling film 190 made of, for example, Si or the like.

As described above, the surface of the flexible support 19 on which the ceramic coating is applied is formed in the area 190 on which the release treatment has been performed.
Therefore, the green sheet formed on the flexible support 19 can be easily separated from the flexible support 19.

In addition, since the surface coated with the ceramic paint has an area 191 not subjected to the peeling treatment in addition to the area 190 subjected to the peeling treatment, the flexible support 19
The adhesion of the green sheet to the green sheet is increased. For this reason, the green sheet does not peel off from the flexible support 19 and adhere to the plate during printing, or a broken green sheet piece is intervened as a foreign substance at the lamination interface, and does not cause a structural defect. Further, the green sheet does not separate from the flexible support 19 due to the contact of the ceramic sheet applying means such as a nozzle and a blade with the green sheet. When the peeling film 190 is provided on the entire surface of the flexible support 19, the edge of the green sheet is peeled from the flexible support 19 and adheres to the plate making, or the damaged edge is laminated as a foreign substance during lamination. There is a risk of intervening at the interface and causing structural defects. Further, the green sheet may be separated from the flexible support 19 by a slight contact of the green sheet with a ceramic paint applying means such as a nozzle or a doctor blade. If the peeling film 190 is formed so that the region 191 where the peeling process is not performed is generated on the flexible support 19, the edge adhesion of the green sheet to the flexible support 19 is increased, so that the above-described problem occurs. Can be avoided. This will be described in more detail later.

In the embodiment shown in FIG. 1, the regions 191 not subjected to the peeling treatment are located on both sides in the width direction of the flexible support 19, so that the edge adhesion of the green sheet to the flexible support 19 is increased. Thus, the above-described action is further promoted. The width of the region 191 not subjected to the peeling process is approximately 0.5 to 20 mm under normal manufacturing conditions.

FIG. 2 is a sectional view showing another embodiment of the flexible support according to the present invention. In this embodiment, the regions 191 that have not been subjected to the peeling process are located on both sides in the width direction of the flexible support 19 and the regions 191 that have not been subjected to the peeling process.
Include the mark forming area 192. The mark forming area 192 is colored. The mark forming area 192 is
It can be formed by applying a paint or the like of a color that makes a contrast to the flexible support 19 in a strip shape along the length direction of the flexible support 19. The role of the mark forming area 192 is to enable a target mark and a hitch mark to be accurately detected in image processing described later.

FIG. 3 is a cross sectional view showing another embodiment of the flexible support 19 according to the present invention. In this embodiment, a region 191 that has not been subjected to a peeling process is provided on both sides in the width direction of the flexible support 19, and a region where the peeling process has been performed is provided outside the region 191 that has not been subjected to the peeling process. 190.

Next, a method for manufacturing a ceramic electronic component according to the present invention will be described. FIG. 4 is a sectional view of a multilayer ceramic capacitor as an example of a ceramic electronic component manufactured by the manufacturing method according to the present invention. In FIG. 4, 1 is a multilayer ceramic capacitor, 2 is a dielectric layer,
3 is an electrode and 4 is a terminal electrode. FIG. 5 is a manufacturing flowchart in the case of manufacturing a multilayer ceramic capacitor by the manufacturing method according to the present invention, and FIG. 6 is a manufacturing flowchart showing another example of the manufacturing method according to the present invention.

In the manufacturing flowchart of FIG. 5, a ceramic powder made of a dielectric material is formed into a paint, and the formed ceramic paint is applied on a flexible support to form a green sheet. The flexible support is the flexible support according to the present invention as illustrated in FIGS. The ceramic powder is selected according to the ceramic electronic component to be obtained.

Next, after drying the green sheet, electrodes are printed on the green sheet. After the electrode printing is completed, a drying step is performed. Among the above steps, the steps from the green sheet forming step to the drying through the electrode printing step by image processing are repeated on the flexible support until the required number of laminated layers is reached. When the number of stacked layers is reached, a green sheet serving as a protective layer is formed on the surface of the electrode located on the uppermost layer and the ceramic green sheet supporting the electrode. Thereafter, the laminate is peeled from the flexible support, the laminate of the electrode and the green sheet is cut, the multilayer ceramic capacitor is taken out, and further subjected to necessary steps such as firing and application of an end electrode, and the laminate is laminated. A finished ceramic capacitor is obtained.

According to the manufacturing method shown in FIG. 5, a green sheet forming step of forming a green sheet by applying a ceramic paint on a flexible support, and a printing step of printing electrodes on the green sheet are performed. Because of this, the amount of the flexible support used can be reduced, and the mass productivity is improved.

Since the ceramic coating surface of the flexible support 19 has an area 190 on which the release treatment has been performed, the green sheet molded on the flexible support 19 is removed in the release step. It can be easily peeled off from the flexible support 19.

In addition, since the ceramic coating surface has an area 191 that has not been subjected to the release treatment in addition to the area 190 that has been subjected to the release treatment, the flexible support 19
The adhesion of the green sheet to the green sheet is increased. For this reason, the green sheet does not peel off from the flexible support 19 and adhere to the plate making, or a broken green sheet piece intervenes as a foreign substance at the lamination interface, and does not cause a structural defect. Further, the green sheet does not separate from the flexible support 19 due to the contact of the ceramic sheet applying means such as a nozzle and a blade with the green sheet. Peeling film 1
When 90 is provided on the entire surface of the flexible support 19,
The edge of the green sheet may peel off from the flexible support 19 and adhere to the plate making, or the damaged edge may intervene as a foreign substance at the lamination interface at the time of lamination and cause a structural defect. Further, the green sheet may be separated from the flexible support 19 by a slight contact of the green sheet with a ceramic paint applying means such as a nozzle or a doctor blade. If the peeling film 190 is formed so that the region 191 where the peeling process is not performed is generated on the flexible support 19, the edge adhesion of the green sheet to the flexible support 19 is increased, so that the above-described problem occurs. Can be avoided. In addition, a step between a portion having an electrode and a portion having no electrode is absorbed by the repetition of the formation of the green sheet and the printing of the electrode, so that defects such as cracks due to the step are improved. In addition, since a laminated green chip in which a plurality of layers of green sheets are integrated with electrodes can be obtained, delamination after pressing, which has conventionally been a problem, is not observed.

In the electrode printing step, the electrodes are printed by image processing. Prior to the printing step or simultaneously with the first printing step, a first target mark for image processing is formed on the flexible support, and information obtained by the image processing of the first target mark is used. The printing positioning of the electrode is performed based on this. Thereby, an electrode can be formed with high precision at a predetermined position with reference to the first target mark. Therefore, even a complicated electrode laminated structure can be accurately formed in a short time.

In the manufacturing flowchart shown in FIG.
The difference from the manufacturing flowchart shown in FIG. 5 is that the green sheet forming step and the printing step are performed a plurality of times, and after reaching the set number of laminations, the obtained laminated green sheet is peeled from the flexible support. And laminating a plurality of laminated green sheets obtained by peeling. After laminating in this manner, pressing is performed, and further, through necessary steps such as a cutting step, a firing step, and an end electrode applying step, a completed multilayer ceramic capacitor is obtained.

Here, since the flexible support according to the present invention is used, the same operation as in the case of following the production flowchart of FIG. 5 can be obtained with respect to the application of the ceramic paint and the peeling of the green sheet.

In the case of the manufacturing method shown in FIG. 6, the printing step includes a step of printing a second target mark on a green sheet, and based on information obtained by image processing of the second target mark. Then, the laminated green sheets are laminated. Thereby, a plurality of green sheet lamination strips can be positioned and laminated with high precision so that their electrodes have a predetermined positional relationship based on the second target mark. The protective layer is separately formed into a sheet and laminated by a laminating machine.

Next, the present invention will be described in more detail with reference to specific examples.

<Formation of a Dielectric Coating Material>
After baking a powder of about 1.0 μm such as barium titanate, chromium oxide, yttrium oxide, manganese carbonate, barium carbonate, calcium carbonate, silicon oxide, etc., BaTiO ₃
Assuming 100 mol%, 0.3 mol% in terms of Cr ₂ O ₃ , 0.4 mol% in terms of MnO, 2.4 mol% in terms of BaO, 1.6 mol in terms of CaO %, SiO
4 mol% in terms of _2, 0.1 mol% in terms of Y ₂ O ₃
And then mixed by a ball mill for 24 hours, and dried to obtain a dielectric material. This dielectric material 10
0 parts by weight, 5 parts by weight of an acrylic resin, 40 parts by weight of methylene chloride, 25 parts by weight of acetone, and 6 parts by weight of mineral spirit are mixed, and commercially available φ10 mm zirconia beads are mixed for 24 hours using a pot stand to obtain a dielectric ceramic paint. I got

<Green Sheet Forming> The dielectric ceramic paint obtained as described above is applied to a continuously supplied belt-shaped flexible support to form a green sheet. The first green sheet molding step is a step of forming a protective film on a flexible support when following the production flowchart shown in FIG. 5, and a protective film when following the production flowchart shown in FIG. This is a step of forming a green sheet that is not expected to be. As the flexible support, any one described in FIGS. 1 to 3 is used. In the case of the multilayer ceramic capacitor of FIG. 4, the protective film serves as an outer package constituting either the uppermost layer or the lowermost layer.

FIG. 7 is a view showing a green sheet forming step. The extrusion type coating head 10 is provided with the ceramic paint 1
7 a is applied to the flexible support 19. 11 is a payout reel, 121 to 127 are guide rollers, 161, 162
Is a meandering correction roller, 14 is a drying oven, and 17 is a take-up reel. In order to make the green sheet surface uniform, the tension is controlled between the suction rollers 151 and 152, and the drive-in dimension and nozzle angle of the application head 10 are controlled.

FIG. 8 is a plan view of the flexible support 19 having the green sheet 43 applied as described above.
Is a green sheet 4 using the flexible support shown in FIG.
3 is a cross-sectional view when the green sheet is formed, and FIG. 10 is a cross-sectional view when a green sheet is formed using the flexible support shown in FIG. The flexible support 19 is shown in FIG.
As shown in FIG. 3 to FIG. 3, the ceramic paint application surface has a region 190 subjected to the release treatment and a region 191 not subjected to the release treatment. The peeling process is performed on one surface of the flexible support 19 by a peeling film 190 made of, for example, Si.
Can be carried out by thin coating.
By performing such a peeling process, the lowermost green sheet 43 formed on the flexible support 19 is removed from the flexible support 19 after the necessary number of layers are laminated. It can be easily peeled off.

The peeling film 190 is not provided on the entire surface of the flexible support 19 as shown in FIG. Is formed. The advantage of the flexible support 19 shown in FIG. 9 has already been seen in FIGS.
That is, when the peeling film 190 is provided on the entire surface of the flexible support 19, the edge of the green sheet 43 is peeled off from the flexible support 19 and adheres to the plate making in the internal electrode printing step described below. The broken edge may be present as a foreign substance at the time of lamination as a foreign substance at the lamination interface, leading to a structural defect. Further, a slight contact of the nozzle 10 with the green sheet 43 causes the green sheet 43 to
May be peeled off from the surface. On the other hand, as shown in FIG. 9, when the peeling film 190 is formed so that the regions 191 where the peeling process is not performed are generated on both sides in the width direction of the flexible support 19, the flexible support 19 is formed. Since the edge adhesion of the green sheet 43 to the sheet 19 increases, the above-described problem can be avoided. Under the normal manufacturing conditions, the width of the region 191 not subjected to the peeling process is 0.5 to 20 mm.
And sufficiently smaller than the area 190 subjected to the peeling treatment.

In FIG. 10, regions 191 where no peeling treatment has been performed are on both sides in the width direction of the flexible support 19, and mark forming regions 192 are formed in these regions 191. The green sheet 43 is applied so that the edge in the width direction is located between the peeling film 190 and the mark forming region 192.

When the extrusion type coating head 10 is used as in the illustrated embodiment, it is possible to obtain a uniform green sheet having very good surface accuracy and small thickness variation. The first green sheet to be the protective film is
Instead of the extrusion-type coating head, a conventional doctor blade method or a reverse roll method may be used. Further, the thickness may be repeated several times to obtain a desired thickness. Filter 8
Is installed to finally remove foreign matter.

FIG. 11 shows the shape of the extrusion type coating head 10. 46 is a slit for discharging the ceramic paint, 47 is an upstream nozzle, 48 is a downstream nozzle, 49 is a ceramic paint pool, and 53 is a supply port to the ceramic paint pool. Such extrusion coating heads are known.

When the extrusion type coating head 10 as shown in FIG. 11 is used, the ceramic paint 17a is supplied to the coating head 10 through the filter 8 and the mass flow meter 9 using the metering pump 6 and the precision metering gear pump 7. It is desirable. FIG. 12 shows the extrusion type coating head 1 shown in FIG.
, The green sheet 43 on the flexible support 19.
The green sheet 43 having a high degree of surface accuracy and extremely small thickness variation can be obtained. In FIG. 11, reference numeral F1 indicates the traveling direction of the flexible support 19.

FIG. 13 shows another example of the coating head 10. The nozzle shown in FIG.
2 having a plurality of nozzles. 491 and 492 are ceramic paint reservoirs, and 531, 532 are supply ports to the ceramic paint reservoirs 491 and 492. When the coating head 10 is used, as shown in FIG. 12, the ceramic paint 431 stored in the ceramic paint pool 491 is used.
Is applied to the flexible support 19 through the slit 461, and then another ceramic paint layer 432 is applied through the slit 462 on the applied ceramic paint layer 431. This suppresses the occurrence of pinholes.

Next, in order to obtain a green sheet 43 without stripes, it is desirable to use a ceramic paint having a low viscosity. The extrusion type coating head 10 is suitable for forming a green sheet of a ceramic paint having such a low viscosity. This is because a ceramic paint having a low viscosity has a large drying shrinkage ratio, so that the supply amount can be increased in order to obtain the same thickness after drying, and the tip of the coating head 10 and the flexible support 19 (or green sheet) can be used. This is because it is possible to increase the gap between them and to avoid the occurrence of streaks due to the coating head 10.

As described above, the extrusion type coating head 10 has a remarkable advantage in addition to forming a uniform green sheet without streaks. That is, it is very effective to form a green sheet again on the green sheet 43 once formed. In the doctor blade method, since the edge side of the head of the doctor blade is always in contact with the flexible support 19, there is no problem at the time of forming the first green sheet, but it is absolutely necessary at the time of forming the second and subsequent green sheets. The dry surface on the edge side of the first green sheet 43 contacts. Therefore, there is a problem that the edge side of the first green sheet 43 is shaved. In addition, as the number of layers increases, the total thickness increases, so that it comes into contact with the upstream side of the blade and eventually peels off.

In this respect, in the extrusion type coating head 10, the green sheet 43 formed in advance is placed on the surface of the green sheet 43.
When the next green sheet 43 is formed, the extrusion type coating head 10 is applied to the surface of the green sheet 43 formed in advance.
And a good green sheet 43 without scraping can be obtained.

After the formation of the green sheet 43, the flexible support 19 is dried through the drying furnace 14, and is taken up by the take-up reel 1.
7 (see FIG. 7).

<Target Mark Formation> Next, before the electrode printing, as shown in FIGS.
The first target marks a1, b1, c1, d1 for image processing and the pitch mark e1 are formed on the flexible support 19 having the three. When the flexible support 19 has a structure as shown in FIG. 1, as shown in FIG. 9, the first target marks a1 to d1 and the pitch mark e1 are formed on the surface on which the green sheet 43 is applied. Side, and is formed in a region 191 that has not been subjected to a peeling process at an end in the width direction of the flexible support 19. When the flexible support 19 has a structure as shown in FIG. 2, as shown in FIG. 10, the first target marks a1 to d1 and the pitch marks e1
Is formed on the mark forming area 192 provided in the area 191 which has not been subjected to the peeling process. The first target marks a1 to d1 and the pitch mark e1 may be marks formed by screen printing or ink jet printing or marks capable of image processing such as through holes, and the printing surface may be either the front or back of the flexible support 19. It may be a plane. Further, the formation timing of the first target marks a1 to d1 and the pitch mark e1 may be any time before the electrode printing by image processing is performed, and may be at the same time as the first electrode formation. The preferred timing for forming the first target marks a1 to d1 is before the flexible support material is cut with a slitter. If the first target marks a1 to d1 are formed before the flexible support material is cut by the slitter, the first target marks a1 to d1 are cut when the slitter cuts the material to a predetermined width.
Cutting can be performed based on d1. It is desirable that the first target marks a1 to d1 have a clear contrast with the flexible support 19 and have a circular shape.

<Electrode Printing by Image Processing> Next, using the take-up reel 17 on which the flexible support 19 is taken up,
Electrodes are printed on the green sheet 43 on the flexible support 19. In printing the electrode, the first target mark a
Printing positioning of the electrodes is performed based on information obtained by the image processing of 1 to d1. FIG. 15 is a diagram schematically showing a configuration of a printing press with an image processing device (hereinafter, referred to as an image processing printing press) used for electrode printing. The flexible support 19 on which the green sheet 43 is formed is provided on the supply roll 2.
1 and passes through the guide roller 22 to be xy-θ
-Z is led to the table 25. Reference numeral 23 denotes a support for supporting the guide roller 22, and reference numeral 24 denotes a support base.

The table 25 has cameras 26a, 26b,
26c and 26d are provided.
26d, the first target marks a1 to d1 are read, and printing positioning of the electrodes is performed based on the read information. The printing positioning of the electrodes is performed by the xy-θ-z table 25. The electrodes are printed by a plate making 27 provided on a plate making stand 28. The xy-θ-z table 25 is a vacuum suction surface, and cameras 26a to 26d are provided at four corners with glasses 56a, 56b, 56 at the four corners as shown in FIG.
c, 56d. Camera 26a-
26d is arranged upward, and the cameras 26a to 26d
The arrangement is such that the flexible support 19 passes above d. With such a structure, it is possible to obtain an extremely excellent effect that image processing by the cameras 26a to 26d can be executed without being affected by the plate making 27 that moves up and down on the xy-θ-z table 25. Can be. x-
The y-θ-z table 25 has a vacuum suction surface, and the formed flexible support 19 of the green sheet 43 is vacuum-sucked on the vacuum suction surface.
Is driven by the correction operation, the flexible support 19 is driven integrally with the xy-θ-z table 25,
There is no displacement. As shown in FIG. 15, the cameras 26a to 26d are arranged upward, and when the flexible supports 19 are arranged to pass above the cameras 26a to 26d, the flexible supports 19 It is composed of a transparent plastic film. Thereby, the first target marks a1 to d1 provided on the upper surface side can be read by the cameras 26a to 26 from the lower surface side of the flexible support member 19 through the flexible support member 19. In particular, as shown in FIG.
To d1 are formed on the mark forming region 192 provided in the region 191 which has not been subjected to the peeling process, and when the mark forming region 192 is colored, Within the first target mark a
Since 1 to d1 are located, the first target marks a1 to d1 can be reliably read by the cameras 26a to 26d. In particular, the colors of the first target marks a1 to d1 and the mark formation area 192
When the color of the camera makes a contrast,
Detection of the first target marks a1 to d1 by 26d is performed more reliably.

Based on the data obtained by reading the coordinates (x, y) of the first target marks a1 to d1 by the cameras 26a to 26d, data processing is performed by a computer system (not shown), and an xy-θ-z table 25 is obtained. Is moved in the θ direction, the x direction, and the y direction as needed.

FIG. 17 shows an electrode pattern 44 obtained by the above-described electrode printing step, and FIG. 18 shows a side view of FIG. Each electrode constituting the electrode pattern 44 is
It is made of an appropriate electrode material, for example, an electrode material mainly containing nickel, copper or the like. In the electrode pattern 44, individual electrodes are arranged at intervals in the horizontal and vertical directions. In the embodiment, each electrode has m rows in the horizontal direction, and has 6 rows in the odd matrix and 5 rows in each even column in the vertical direction. The first digit of the reference number given to the electrode indicates the column to which the electrode belongs, and the second digit indicates the row to which the electrode belongs. The number of rows and the number of columns are arbitrary. Among the above-mentioned electrodes, an electrode row adjacent in the horizontal direction, for example, electrodes 211 to 261 belonging to a first row, and an electrode 2 belonging to a second row
12 to 252, corresponding individual electrodes (211 and 21)
2) to (261 and 262) are arranged so as to differ by a predetermined dimension L in the vertical direction. The dimension L is appropriately 1/2 of the electrode pitch 2L. However, the electrode pattern is xy
Since the desired pattern can be moved by the -θ-z table 25, the pattern need not be the illustrated one. For example, a pattern in which the electrodes in each row repeat the same arrangement may be used.

In the printing step, the second target marks a2, b2, c2 and d2 are formed together with the electrode pattern 44.
And the pitch mark e2 are printed. Along with the electrode pattern 44, the second target marks a2, b2, c2, d
By printing the green sheet and the pitch mark e2, as shown in FIG. 3, after performing the green sheet forming step and the printing step a plurality of times, the obtained laminated green sheet is peeled from the flexible support, Next, in a case where a step of laminating a plurality of laminated green sheets obtained by peeling is performed, the electrode patterns 44 of the second target mark a
2, b2, c2, and d2 can be positioned and laminated with high precision so as to have a predetermined positional relationship with reference to them. Further, in the case of the first method shown in FIG. 4, when the plate making is replaced, the first target marks a1, b2, c2, d2 for the second target marks a1, b2, c2, d2 formed simultaneously with the electrode pattern 44 are formed. b1, c1, d1
The relative positions of the first target marks a1, b1, c1, and d1 and the electrode pattern 44 can be determined by observing the positional relationship described above, and image processing can be performed.

<Positioning by Image Processing> Next, x-
The details of the positioning and alignment using the y-θ-z table 25 will be described. FIG. 18 is a diagram showing the positional relationship of the four cameras 26a to 26d with respect to the xy-θ-z table 25. The cameras 26a to 26d are connected to the first target marks a1 to d on the flexible support 19 described above.
It is arranged at four points corresponding to position 1. Camera 26
Although the arrangement positions of a to 26d are determined by design, there are actually arrangement errors and the like, so that a coordinate reading error occurs as it is. As means for correcting this, before operating the manufacturing process, one of the cameras 26a to 26d located below the xy-θ-z table 25, for example, the center point of the camera 26a is set as the origin. (0,0)
Is determined. Next, the xy-θ-z table 25 is moved in the x-axis direction so that the position corresponding to the origin (0, 0) is the coordinates (Xb, Yb) when the center point of the camera 26b is reached.
Read. Accordingly, the position of the camera 26b when the center point of the camera 26a is set to the origin (0, 0) is represented by the coordinates (X
b, Yb). Other camera 2
Similarly, the coordinates (Xc, Y
c) and (Xd, Yd) are obtained. The above-described initial correction is performed using image processing on the display. As described above, the coordinates of the cameras 26a to 26d are determined by driving the xy-θ-z table 25 with high accuracy.
The coordinate reading error becomes extremely small. Reference O ₀
Are coordinates (0, 0) representing the positions of the cameras 26a to 26d.
This is the midpoint calculated from (Xd, Yd).

The printing positions of the first target marks a1 to d1 can be adjusted even if there is almost no displacement.
9 is being conveyed, it is often rotated at an angle θ in the plane of the table 25 or is displaced in the X-axis or Y-axis direction. By correcting this displacement, the electrode pattern 44 is printed with high accuracy. As means therefor, the cameras 26a to 26d for which the initial correction has been completed are used, and x-
The coordinates of the first target marks a1 to d1 of the flexible support 19 that is vacuum-adsorbed on the y-θ-z table 25 are read as shown in FIG. Cameras 26a-2
The read value according to 6d is converted into coordinates in consideration of the coordinates (Xb to Yb) to (Xd to Yd) set by the initial correction. The first thus obtained by the camera 26a
Are the coordinates of the target mark a of (X1, Y1), the coordinates of the first target mark b obtained by the camera 26b are (X2, Y2), the coordinates obtained by the camera 26c are (X3, Y3), and the camera 26d Are obtained as (X4, Y4).

The obtained coordinates (X1, Y1) to (X4, Y
From the data of 4), as shown in FIG. 20, a center point O1 of a quadrilateral surrounded by the first target marks a1 to d1 is obtained. The middle point O1 is a middle point (a) of two opposing sides,
And (b) is obtained as the midpoint of the line segment L1. This middle point O1 is the origin for alignment during printing. Then, a perpendicular line L2 passing through the middle point O1 is obtained for the line segment L1. Normal line L2 is usually in xy-θ-z table 25.
Has an angle θ with respect to the Y axis. Middle point O1 and angle θ
Is calculated by the computer system based on data input from the cameras 26a to 26d to a computer system (not shown). Then, based on a control signal given from the computer system, xy-θ-z
The table 25 is driven to rotate in the direction of the arrow so that θ = 0, whereby the angle θ is corrected. xy-
The θ-z table 25 is further driven in the X-axis direction and the Y-axis direction based on a control signal from the computer system, and alignment in the X-axis direction and the Y-axis direction is performed, thereby completing the alignment. 21 shows a state after the correction of the angle θ is performed, FIG. 22 shows a state after the alignment in the X-axis direction is performed, and FIG. 23 shows a state after the alignment in the Y-axis direction is performed. The state is shown. However, in the actual positioning operation, while correcting the angle θ, the midpoint O1 is
Made to the operation, such as to match the midpoint O ₀ of the camera 26a~26d.

Here, in order to improve the accuracy, the camera 26
a to 26d and four correction cameras 29a to 29d are used, but two first target marks and two cameras
The image processing and printing can be sufficiently performed by calculating the midpoint between the two points, calculating the deviation angle θ between the two points, and processing the image with a computer. Since the xy-θ-z table 25 has a vacuum suction surface, the xy-θ-z table 25 can move accurately in the x direction, the y direction, and the θ direction. After performing the image processing in this manner, the xy-θ-z table 25 is moved in the z direction by an arbitrary distance so as to contact the back surface of the flexible support, and screen printing is performed.

After printing, the flexible support 19 is moved by a fixed size by the fixed-size feeding device 29 (see FIG. 15), and is subsequently sent to a position where the correction cameras 30a to 30d are located. In the fixed-size feeding device 29, the surface in contact with the flexible support 19 is a vacuum suction surface.
The back surface of 9 is fixed by suction to the vacuum suction surface of the fixed-size feeding device 29. Then, the pitch mark e1 is read by a sensor (camera), and the fixed support is fed to the flexible support 19 until the next pitch mark e1 is read by the sensor. In this manner, since the fixed-length feed corresponding to the interval between the adjacent pitch marks e1 is added, the first target marks a1 to d2 may be out of the field of view of the cameras 30a to 30d due to a conveyance deviation. There is no problem. Moreover, the fixed-size feeder 29
Since the surface in contact with the flexible support 19 is a vacuum suction surface, the flexible support 19 does not displace on the standard feeder 29 during the standard feed operation.

The cameras 30a to 30d have different stations but the same positional relationship as the cameras 26a to 26d. Here, the positional deviation at the time of attachment of the pattern plate can be measured by reading the coordinate between the first target mark and the second target mark by the same method as in the image processing described above, and is not shown. The computer system performs data processing to calculate a necessary correction amount, feeds back data to the control system of the xy-θ-z table 25, drives the xy-θ-z table 25, and performs position correction. Perform In the above description, 4
Although the description has been given of the case where the cameras 30a to 30d are used, a configuration in which eight cameras are used and the first target marks a1 to d1 and the second target marks a2 to d2 are simultaneously read by the eight cameras. It may be. The positional relationship between the first target marks a1 to d1 and the second target marks a2 to d2 is determined in advance by the first
Can be clarified by using a standard version (for example, a glass standard version) on which the target marks a1 to d1 are printed.

The thus obtained green sheet 19 on which the electrodes are formed is placed on a belt conveyor 36 rotating between the rollers 33 and 34 via the transmitted light visual inspection table 31 and the guide roller 32, and placed in a drying oven. After drying at 35 ° C., for example, at 60 ° C., the paper passes between the guide roller 37 and the cutter 38 and is taken up by the take-up take-up roller 39.

<Step of Obtaining Set Lamination Number> a. When following the manufacturing flowchart of FIG. 5 As described above, the green sheet on which the electrodes are printed is
The green sheet forming step shown in FIG. 7 is performed, and the green sheet forming step shown in FIG.
Through 62, as in the first green sheet molding, control is performed so as to have a desired green sheet thickness, green sheet molding is performed, and then, based on image processing by the image processing printing machine shown in FIG. The process of printing the electrodes is repeated for the required number of layers.

FIG. 24 and FIG. 25 are views showing the electrode printing positions in the second and subsequent electrode printing steps. Printing is performed by shifting the position by one line with respect to the first electrode. When the electrode pattern changes, x corresponds to the electrode pattern.
The −y−θ−z table 25 is controlled in the x direction, the y direction, or the θ direction, and is controlled so that necessary electrode pattern overlap is obtained. For example, as shown in FIG. 27, in the case where the electrode pattern 44 has a pattern in which the same electrode rows are arranged at intervals, the second electrode pattern 44 is more flexible than the first electrode pattern. The support 19 is moved in the width direction. The xy-θ-z table 25 is in the x direction,
The camera 26a can be moved arbitrarily in the y direction and the θ direction.
Target marks a1 to d1 obtained in the steps 26 to 26d
Is input to the computer system, and the computer system can control the xy-θ-z table 25 so that necessary electrode patterns overlap. This second and subsequent green sheet molding,
Image processing printing is repeated up to a desired number of layers. Then, finally, the second protective layer 56B is formed to have a thickness of, for example, 160 μm.

Next, the final laminated body is placed on the transmitted light visual inspection table 3.
1. The guide roller 32 is placed on a belt conveyor 36 rotating between rollers 33 and 34, dried in a drying furnace 35, and then guided between a guide roller 37 and a cutter 38. After cutting both ends in the width direction, the laminated green sheet is peeled from the flexible support 19. FIG. 27 is a view showing a cutting step by the cutter 38, in which both ends in the width direction of the final laminate are cut by the cutter 38 rotating in the direction of arrow r1. The cutter 38 is provided with the green sheet 4 so that the cutting edge is over the peeling film 190.
3 and the laminated green sheet including the electrode 54 are cut. Thereafter, the laminated green sheet including the green sheet 43 and the electrode 54 is peeled from the flexible support 19,
Winding is performed by a winding roller 39. After the laminated green sheet is cut by the cutter 38, the laminated green sheet is only supported on the flexible support 19 by the release film 190, so that the laminated green sheet is 19 is peeled off very smoothly. The remaining flexible support 19 is also taken up by a take-up roller (not shown). FIG. 28 shows a sectional view of a laminate obtained by peeling.

B. When following the manufacturing flowchart shown in FIG. 6 When following the manufacturing flowchart shown in FIG.
After performing the green sheet forming step and the printing step Q times, the obtained laminated green sheets 561 to 56Q are separated from the flexible support. In the peeling, as shown in FIG. 29, after cutting both ends in the width direction of the laminated green sheet with the cutter 38, the laminated green sheet is peeled from the flexible support 19. After the laminated green sheet is cut by the cutter 38, the laminated green sheet is only supported on the flexible support 19 by the release film 190, so that the laminated green sheet is 19 is peeled off very smoothly.
FIG. 30 shows a cross-sectional view of the laminated green sheet obtained by peeling.

Next, as shown in FIG. 31, a plurality of laminated green sheets obtained by peeling are laminated on the separately formed first protective layer. And finally, the second
Is formed so as to have a thickness of, for example, 160 μm. FIG. 32 shows a specific example thereof.

<Steps after Obtaining the Set Number of Laminations> The laminated green sheets obtained as described above are punched, pressed and cut to obtain the laminated green chips shown in FIG. The obtained laminated green chip is subjected to a binder removal treatment under a predetermined temperature condition, baked, and further, a terminal electrode is formed by baking.

The conditions for removing the binder and firing are well known in the art. For example, the binder is removed at 280 ° C. for 12 hours, and baked at 1300 ° C. for 2 hours in a reducing atmosphere. The terminal electrode 4 (see FIG. 1) is formed on the laminate obtained after firing. The material and forming method of the terminal electrode 4 are well known in the related art. For example, at 800 ° C. in N 2 + H 2 with copper as a main component
Baking for 30 minutes.

<Evaluation of Characteristics 1: Flexible Support> Table 1 shows the evaluation of the characteristics of the peeling treatment of the flexible support 19. In Table 1, the full-width release treatment refers to a treatment in which the entire surface of the ceramic paint applied surface of the flexible support is subjected to a release treatment. This is the case where the surface of the flexible support to which the ceramic paint is applied has a region 190 that has been subjected to a release treatment and a region 191 that has not been subjected to a release treatment. As shown in Table 1, 75
In repeated running (1000 m / times), the peeling frequency was 5 times in the case of the full-width peeling process, but was 0 in the case of the width-regulated peeling process. This is because, as described above, in the case of the full width peeling process in which the peeling film 190 is provided on the entire surface of the flexible support 19, the edge of the green sheet peels off from the flexible support 19 and adheres to the plate making. Or the contact of the ceramic sheet applying means such as a slight nozzle or doctor blade to the green sheet,
While the green sheet may peel off from the flexible support 19, the peeling film 19 may be formed such that the flexible support 19 has a region 191 that has not been subjected to the release treatment.
In the case of the width-regulating peeling process in which 0 is formed,
This is presumed to be because the edge adhesion of the green sheet to the edge becomes high.

<Evaluation of Characteristics 2: Alignment mainly by Image Processing> Next, the characteristics of the multilayer ceramic capacitor obtained by the above-described manufacturing method and the characteristics of the multilayer ceramic capacitor obtained by the conventional manufacturing method are shown in Table 2. Shown in In Table 2, the sample No. 1-3 are multilayer ceramic capacitors obtained through the manufacturing process of FIG.
o. 6 is a multilayer ceramic capacitor obtained through the manufacturing process of FIG. Reference numerals 4 and 5 denote multilayer ceramic capacitors obtained by a conventional manufacturing method.

Sample No. 1 is green sheet thickness 8.0
μm, the thickness of the fired dielectric layer 2 is 5 μm, and the number of stacked layers is 75. Sample No. 2 is the green sheet thickness.
5 μm, the thickness of one layer of the dielectric layer 2 after firing is 1.5 μm,
The number of layers is 75. Sample No. 3 is a green sheet having a thickness of 2.5 μm, and the thickness of one layer of the dielectric layer 2 after firing is 1.5
μm, the number of layers is 150.

Sample No. 4 is green sheet thickness 8.0
μm, the thickness of the fired dielectric layer 2 is 5 μm, and the number of stacked layers is 75.

Sample No. 5 is green sheet thickness 2.5
μm, the thickness of the fired dielectric layer 2 is 1.5 μm, and the number of stacked layers is 150. However, the sample No. 5 is 2.5 μm
Due to the thickness of the thin green sheet, it was not possible to stack the layers to such an extent that the characteristics required for a multilayer ceramic capacitor could be obtained (lamination was not possible).

Sample No. 6 is green sheet thickness 8.0
μm, the thickness of the fired dielectric layer 2 is 5 μm, and the number of stacked layers is 75. Sample No. Through 1 to 6, the external dimensions were fixed to 3.2 mm x 1.6 mm. The thickness dimension varies depending on the number of layers and the thickness of one dielectric layer.

The multilayer ceramic capacitor was subjected to an evaluation test for the number of pinholes (pieces / 10 m), capacitance, dielectric loss, insulation resistance, breakdown voltage, short-circuit defect rate, printing deviation, and yield. Table 2 shows the evaluation results. Sample No. In each of 1 to 6, the number of samples subjected to the test is 30,000.

With respect to the evaluation test results described in Table 2,
In comparing the manufacturing method according to the present invention with the conventional technique, the manufacturing method is performed between samples having the same number of green sheets and the same number of laminations. Specifically, the sample No. Sample Nos. 1 and 6 No. 4, comparison with Sample No. 4 2, 3 and sample No.
This is a comparison with 5.

A. Capacitance and dielectric loss Measured at 20 ° C. with an impedance analyzer HP-4284A manufactured by Hewlett-Packard Company. For the capacitance, the sample No. 4 is 0.91 μF, whereas Sample No. 4 is 0.91 μF. 1 was 1.01 μF, sample No. 6 is 1.0
Sample No. 3 obtained by the manufacturing method according to the present invention. Samples Nos. 1 and 6 were sample Nos.
A capacitance larger than 4 can be obtained.

Sample No. Sample Nos. 2, 3 In comparison with Sample No. 5, 5 is green sheet thickness 2.5μ
m cannot be laminated, whereas the sample No. obtained by the production method according to the present invention does not. A few sheets are 3.3 μF, 6.63 using a thin green sheet of 2.5 μm.
A capacitance of μF can be obtained.

Regarding tan δ (%), sample no. 4
Is 1.88 (%), whereas the sample No. In sample No. 1, 1.86 (%) and in sample No. In Sample No. 6, the value is 1.85 (%). Sample Nos. 1 and 6 are sample Nos. 4, the dielectric loss is smaller. Sample No. 2, 3 is 2.5μ
Even with a very thin green sheet of m
(%) And 1.96 (%).

B. Insulation resistance and short failure rate High resistance meter HP-4329A manufactured by Hewlett-Packard
, A voltage of 10 V was applied at 20 ° C., and measurement was performed after 30 seconds. When the insulation resistance was 1000Ω or less, the sample was evaluated as short-circuit failure. In each of Nos. 1 to 6, the ratio of the number of short failures to the number of samples subjected to the test was indicated as a short failure rate.

The insulation resistance of the sample No. 1.7 × 1 for 4
0 ⁹ Ω, while Sample No. 2.0 × 10 ^{9 for} 1
Ω, sample No. 6 is 3.1 × 10 ⁹ Ω, and the sample No. 6 obtained by the manufacturing method according to the present invention. 1, 6
The sample No. by the conventional manufacturing method was used. An insulation resistance larger than 4 can be obtained. In addition, the sample No. Even 2 or 3, 7.1 ×
An insulation resistance of 10 ⁸ Ω and 4.6 × 10 ⁸ Ω can be secured.

[0086] The short-circuit defect rate was measured for the sample No. 4 for 3
3.2 (%), whereas the sample No. 0.7 for 1
(%), Sample No. 6 is 0.4 (%), and the sample No. 6 obtained by the manufacturing method according to the present invention has 1, 6
The sample No. by the conventional manufacturing method was used. 4, the short-circuit defect rate is significantly smaller. In addition, the sample No. Two, three
However, the short defect rates are 0.8 (%) and 1.0 (%).

C. Breakdown voltage The breakdown voltage was evaluated by an automatic booster. The breakdown voltage of the sample No. Sample No. 4 was 150 (v), whereas Sample No. 4 was 150 (v). In the case of Sample Nos. 1 and 6, the value was 230 (v). 1, 6
The sample No. by the conventional manufacturing method was used. A breakdown voltage larger than 4 can be secured. The green sheet thickness is 2.5μ.
m (1.5 μm thickness after drying)
Even with a few, a breakdown voltage of 90 (v) and 80 (v) can be secured.

D. Printing Misalignment The multilayer ceramic capacitor was cut along the dotted line in FIG. 25, and an average value ΔGmax−av of the maximum value ΔGmax (see FIG. 25) of the positional deviation amounts of the ten electrodes was measured on the cut surface. The average value ΔGmax-av is the sample No. 4 was 250 μm, whereas Sample No. 4 was 250 μm. 8μ for 1
m, sample No. 6 is 11 μm, and the sample No. 6 obtained by the manufacturing method according to the present invention has Samples Nos. 1 and 6 were sample Nos. 4, printing deviation is significantly smaller. Sample No. Average value ΔGmax even for 2 and 3
-Av is 12 μm or 13 μm, and the printing deviation is extremely small.

E. Number of pinholes (pieces / 10 m) Sample No. obtained by the manufacturing method according to the present invention. 1 to
In any of 3 and 6, the number of pinholes is 0 (pieces / 1
0m). On the other hand, in the case of the sample No. In sample No. 4, 49/10 m pinholes were observed. In No. 5, 84/10 m pinholes were observed. In the conventional manufacturing method, the dielectric paste applied surface of the flexible support is in contact with the roller both before and after application, so that many pinholes due to peeling of the green sheet occur. hand,
In the manufacturing method according to the present invention, the dielectric paste application surface of the flexible support does not come into contact with the roller before or after application, so that a pinhole due to peeling is formed on the green sheet. It is assumed that this does not occur.

F. Yield Yield was determined according to the sample No. In contrast to 4 (33%),
Sample No. In Sample Nos. 1 and 6, it was 92 (%).
High yields of 92 (%) and 90 (%) can be ensured even in a few cases. According to the manufacturing method of the present invention, the yield is remarkably improved.

In short, according to the present invention, it is possible to accurately laminate a 2.5 μm thin green sheet which could not be laminated conventionally, and has a low short-circuit defect rate and excellent characteristics. Capacitors can be manufactured with high yield. In addition, a very good effect was obtained even at a green sheet thickness of 8 μm, which can be managed by the conventional method.

Further, according to the conventional method, a step is formed between a portion having an electrode and a portion having no electrode by the product of the thickness of the electrode and the number of electrodes. In the present invention, in order to form a green sheet again on a green sheet obtained by performing image processing printing on the green sheet (hereinafter referred to as Wet on Dr).
y), there is a direction in which this step can be eliminated. results of the experiment,
A step of 2 μm per electrode became a step of 1.5 μm. Thus, although slightly, the step was eliminated. Although it is slight per electrode, when the number of layers increases, for example, in the case of 150 layers, 0.5 μm × 150 = 75 μm
The steps can be eliminated.

[0093]

As described above, according to the present invention, the following effects can be obtained. (A) It is possible to provide a flexible support capable of imparting appropriate releasability and adhesion to a green sheet, and a method for manufacturing a ceramic electronic component using the same. (B) It is possible to provide a flexible support capable of significantly reducing the probability of difficulty in peeling or poor product characteristics even when the green sheet is thin, and a method for manufacturing a ceramic electronic component using the same. it can. (C) It is possible to provide a method for manufacturing a ceramic electronic component in which the step between the layers caused by the electrodes is significantly reduced and the reliability is improved. (D) It is possible to provide a method for manufacturing a ceramic electronic component capable of minimizing the displacement of the electrode pattern of the laminate.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a flexible support according to the present invention.

FIG. 2 is a sectional view showing another embodiment of the flexible support according to the present invention.

FIG. 3 is a sectional view showing another embodiment of the flexible support according to the present invention.

FIG. 4 is a sectional view of a ceramic electronic component which is a part of a product manufactured by the manufacturing method according to the present invention.

FIG. 5 is a view showing a manufacturing flowchart of the ceramic electronic component according to the present invention.

FIG. 6 is a view showing a manufacturing flowchart of the ceramic electronic component according to the present invention.

FIG. 7 is a view showing a green sheet forming step and a forming apparatus included in the method for manufacturing a ceramic electronic component according to the present invention.

FIG. 8 is a plan view of a green sheet obtained through the process shown in FIG.

FIG. 9 is a cross-sectional view of the green sheet shown in FIG.

FIG. 10 is a sectional view showing another example of the green sheet shown in FIG.

11 is a cross-sectional view of an extrusion-type coating head used in the green sheet forming apparatus shown in FIG.

FIG. 12 is a diagram illustrating green sheet molding using the extrusion-type coating head shown in FIG.

FIG. 13 is a sectional view showing another embodiment of the extrusion type coating head used in the green sheet molding apparatus shown in FIG.

14 is a diagram illustrating green sheet molding using the extrusion-type coating head shown in FIG.

FIG. 15 is a view showing an image processing printer used for carrying out the method for manufacturing a ceramic electronic component according to the present invention.

FIG. 16 is a diagram showing an arrangement of an image processing camera included in the image processing printer shown in FIG.

FIG. 17 is a plan view of the surface of the flexible support after printing a first electrode by the image processing printer shown in FIG. 15;

FIG. 18 is a side view of the flexible support shown in FIG.

FIG. 19 is a diagram illustrating alignment using image information using an image processing camera.

FIG. 20 shows θ based on image information obtained by using an image processing camera.
It is a figure explaining a correction.

FIG. 21 is a diagram illustrating a state after θ correction has been performed in alignment using image information using an image processing camera.

FIG. 22 is a diagram illustrating a state after the X-axis direction alignment is performed in the alignment based on the image information using the image processing camera.

FIG. 23 is a diagram showing a state after the Y-axis direction alignment is performed in the alignment based on image information using the image processing camera.

FIG. 24 is a plan view of the surface of the flexible support after printing a second electrode by the image processing printer shown in FIG. 15;

FIG. 25 is a side view of the flexible support shown in FIG. 24.

FIG. 26 is a plan view showing another example of an electrode obtained by the image processing printer shown in FIG.

FIG. 27 is a diagram illustrating cutting and peeling of the laminated green sheet obtained by the manufacturing flowchart shown in FIG.

FIG. 28 is a cross-sectional view of the laminated green sheet obtained through the step of FIG.

29 is a diagram illustrating cutting and peeling of the laminated green sheet obtained according to the manufacturing flowchart shown in FIG. .

FIG. 30 is a view showing a laminated green sheet obtained through the step of FIG. 29.

FIG. 31 is a view showing a lamination step after the step of FIG. 31;

FIG. 32 is a view showing a lamination step after the step of FIG. 32;

FIG. 33 is a perspective view of a laminated green chip obtained by pressing and cutting the laminate shown in FIG. 28 or 32.

FIG. 34 is a diagram for explaining the definition of the maximum value ΔGmax of the amount of electrode displacement.

FIG. 35 is a diagram showing characteristic evaluation data of a flexible support according to the present invention in comparison with a comparative example.

FIG. 36 is a view showing characteristic evaluation data of a sample obtained by the manufacturing method according to the present invention and the conventional manufacturing method.

[Explanation of symbols]

 REFERENCE SIGNS LIST 10 Extrusion type coating head 19 Flexible support 190 Area subjected to peeling processing 191 Area not subjected to peeling processing 25 xy-θ-z tables 26a, 26b, 26c, 26d Cameras a1 to d1 First Target mark a2 to d2 Second target mark 27 Plate making 28 Plate making table 43 Green sheet

Continued on the front page (72) Inventor Eizo Tsunoda 1-13-1 Nihonbashi, Chuo-ku, Tokyo TDK Corporation (72) Inventor Kaoru Kawasaki 1-13-1 Nihonbashi, Chuo-ku, Tokyo TDK Corporation (72) Inventor Ryoji Hosoya 1-13-1 Nihombashi, Chuo-ku, Tokyo Inside TDK Corporation (56) References JP-A-2-113901 (JP, A) JP-A-61-253811 (JP, A) (58) Field surveyed (Int. Cl. ⁷ , DB name) H01G 4/00-4/42

Claims (5)

(57) [Claims] 1. A one side is a strip-like flexible support is needed use <br/> as ceramic coating application surface, the ceramic coating application surface includes a region in which release treatment has been performed, release treatment is performed And a region where the peeling treatment is not performed is provided on both sides in the width direction.
Flexible support provided . 2. The flexible support according to claim 1, further comprising a region subjected to a release treatment outside a region not subjected to the release treatment. 3. The flexible support according to claim 1, wherein the area not subjected to the peeling processing includes a mark forming area, and the mark forming area is colored. . 4. A ceramic electronic device comprising: a green sheet forming step of forming a green sheet by applying a ceramic paint on a flexible support; and a printing step of printing an electrode on the green sheet. A method of manufacturing a component, wherein the flexible support is a ceramic electronic component according to any one of claims 1, 2 and 3. 5. The method for manufacturing a ceramic electronic component according to claim 4, wherein after performing the green sheet forming step and the printing step a plurality of times, the obtained laminated green sheet is supported by the flexible support. A method for manufacturing a ceramic electronic component, comprising a step of peeling off from a body and then laminating a plurality of the laminated green sheets obtained by peeling.