JP3339387B2 - Method for manufacturing TAB tape - Google Patents
Method for manufacturing TAB tapeInfo
- Publication number
- JP3339387B2 JP3339387B2 JP30520797A JP30520797A JP3339387B2 JP 3339387 B2 JP3339387 B2 JP 3339387B2 JP 30520797 A JP30520797 A JP 30520797A JP 30520797 A JP30520797 A JP 30520797A JP 3339387 B2 JP3339387 B2 JP 3339387B2
- Authority
- JP
- Japan
- Prior art keywords
- polyimide
- solder resist
- tab tape
- tape
- photo
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Wire Bonding (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ＴＡＢ（Tape Aut
omated Bonding）用テープの製造方法に関し、特に、ポ
リイミド系ソルダーレジストが塗布された配線ピッチが
８０μｍ以下の配線層を有するＴＡＢ用テープの製造方
法に関する。The present invention relates to a TAB (Tape Aut)
More particularly, the present invention relates to a method for manufacturing a TAB tape having a wiring layer coated with a polyimide solder resist and having a wiring pitch of 80 μm or less.
【０００２】[0002]
【従来の技術】図４は、従来のＴＡＢ用テープの製造方
法による行程を示す。先ず、ポリイミドフィルム１３の
片面（図４では上面）に、銅箔を貼り付けるための接着
剤１４を塗布する(401) 。このポリイミドフィルム１３
に、インナーリードと半導体素子を接続するためのＩＬ
Ｂ（Inner Lead Bonding）ウインドウ１５を、金型によ
るパンチング加工によって形成する(402) 。ＩＬＢウイ
ンドウ１５の形成されたポリイミドフィルム１３の接着
剤１４塗布面に、銅箔１６を連続ロールラミネータで貼
り付け(403) 、銅箔１６の表面に銅箔配線パターン１８
を形成する(404)。2. Description of the Related Art FIG. 4 shows a process according to a conventional TAB tape manufacturing method. First, an adhesive 14 for attaching a copper foil is applied to one surface (the upper surface in FIG. 4) of the polyimide film 13 (401). This polyimide film 13
To connect the inner lead to the semiconductor element
A B (Inner Lead Bonding) window 15 is formed by punching with a mold (402). The copper foil 16 is adhered to the adhesive 14 applied surface of the polyimide film 13 with the ILB window 15 formed thereon by a continuous roll laminator (403), and the copper foil wiring pattern 18 is formed on the surface of the copper foil 16.
Is formed (404).
【０００３】この銅箔配線パターン１８の所定の部分に
液状のポリイミド系ソルダーレジスト４を印刷で塗布し
ベーク処理を行う(405) 。更に、銅箔配線パターン１８
の所定の部分にＮｉ／Ａｕめっきを施してＴＡＢ用テー
プ１７を製造している。A liquid polyimide solder resist 4 is applied to a predetermined portion of the copper foil wiring pattern 18 by printing and baking is performed (405). Furthermore, the copper foil wiring pattern 18
The TAB tape 17 is manufactured by applying Ni / Au plating to a predetermined portion of the TAB tape.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、図４に
示したような従来のＴＡＢ用テープの製造方法によれ
ば、液状のポリイミド系ソルダーレジスト４を印刷で塗
布しているため、ポリイミド系ソルダーレジスト４の流
れ出しや、かすれによる薄状化が生じ、１回の塗布行程
ではポリイミド系ソルダーレジスト４の被覆が安定せ
ず、ベーク処理後のポリイミド系ソルダーレジスト４の
厚さが１０μｍ以下になってしまって配線保護機能を発
揮できず、このため２回の塗布行程が必要となり、製品
歩留が低下し、生産性が悪いという問題があった。However, according to the conventional TAB tape manufacturing method as shown in FIG. 4, the liquid polyimide solder resist 4 is applied by printing. 4 and thinning due to blurring occur, and the coating of the polyimide solder resist 4 is not stable in one coating process, and the thickness of the polyimide solder resist 4 after the baking treatment is reduced to 10 μm or less. As a result, the wiring protection function cannot be exerted, which requires two application steps, resulting in a problem that the product yield is reduced and the productivity is poor.
【０００５】従って、本発明の目的は、簡易にポリイミ
ド系ソルダーレジストの厚さを１０μｍ以上にでき、Ｔ
ＡＢ用テープの歩留と生産性を向上させるＴＡＢ用テー
プの製造方法を提供することである。Therefore, an object of the present invention is to easily make the thickness of the polyimide solder resist to be 10 μm or more,
An object of the present invention is to provide a method for producing a TAB tape that improves the yield and productivity of an AB tape.
【０００６】[0006]
【課題を解決するための手段】本発明は、以上に述べた
目的を実現するため、絶縁フィルムの片面上に所定の配
線パターンを有するＴＡＢ（Tape Automated Bonding）
用テープの製造方法において、絶縁フィルムの配線パタ
ーンの設けられた面側にフォトカバーレイ付ポリイミド
系ソルダーレジストをロールラミネートにより貼り合わ
せ、フォトカバーレイ付ポリイミド系ソルダーレジスト
のフォトカバーレイを感光現像して所定のパターンに形
成し、所定のパターンに形成されたフォトカバーレイを
マスク材として、フォトカバーレイ付ポリイミド系ソル
ダーレジストのポリイミド系ソルダーレジストをエッチ
ングしてベーク処理し、マスク材として使用したフォト
カバーレイを剥離して、ＴＡＢ用テープを製造すること
を特徴とするＴＡＢ用テープの製造方法を提供する。SUMMARY OF THE INVENTION In order to achieve the above-mentioned object, the present invention provides a TAB (Tape Automated Bonding) having a predetermined wiring pattern on one surface of an insulating film.
In the method of manufacturing a tape, a polyimide-based solder resist with a photo coverlay is laminated by roll lamination on the surface of the insulating film on which the wiring pattern is provided.
Then , a photo-coverlay of a polyimide-based solder resist with a photo-coverlay is exposed to light to form a predetermined pattern by photo-development, and the photo-coverlay formed in a predetermined pattern is used as a mask material. A method for producing a TAB tape, characterized in that a polyimide-based solder resist is etched and baked, and a photocoverlay used as a mask material is peeled off to produce a TAB tape.
【０００７】[0007]
【発明の実施の形態】以下本発明のＴＡＢ用テープの製
造方法を詳細に説明する。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a method for producing a TAB tape of the present invention will be described in detail.
【０００８】図１は、本発明のＴＡＢ用テープの製造方
法で使用されるフォトカバーレイ付ポリイミド系ソルダ
ーレジスト（ポリアミック酸）を示す。図１に示したフ
ォトカバーレイ付ポリイミド系ソルダーレジスト５は、
ポリイミド系ソルダーレジスト４と、感光性樹脂のフォ
トカバーレイ１２とから成り、ポリイミド系ソルダーレ
ジスト４とフォトカバーレイ１２のそれぞれ片面を貼り
合わせた構造になっている。このフォトカバーレイ付ポ
リイミド系ソルダーレジスト５の両面（フォトカバーレ
イ１２側およびポリイミド系ソルダーレジスト４側）に
フォトカバーレイ付ポリイミド系ソルダーレジスト５を
保護するためのＰＥＴ離型フィルム１１が貼られてい
る。このＰＥＴ離型フィルム１１は、ＴＡＢ用テープの
製造時に剥離される。FIG. 1 shows a polyimide-based solder resist (polyamic acid) with a photocoverlay used in the method for producing a TAB tape of the present invention. The polyimide-based solder resist 5 with a photo coverlay shown in FIG.
It is composed of a polyimide-based solder resist 4 and a photo-cover lay 12 of a photosensitive resin, and has a structure in which one side of each of the polyimide-based solder resist 4 and the photo-cover lay 12 is bonded. A PET release film 11 for protecting the polyimide solder resist 5 with a photo cover lay is attached to both surfaces (the photo cover lay 12 side and the polyimide solder resist 4 side) of the polyimide solder resist 5 with a photo cover lay. I have. This PET release film 11 is peeled off when the TAB tape is manufactured.
【０００９】図２は、図１で示したフォトカバーレイ付
ポリイミド系ソルダーレジスト５を使用してＴＡＢ用テ
ープを製造する方法を示す。ここで、フォトカバーレイ
付ポリイミド系ソルダーレジスト５は、そのポリイミド
系ソルダーレジスト４の厚さが５０μｍのものを使用す
る。先ず、接着剤レスのポリイミドキャスティング材で
あるポリイミドフィルム１３（厚さ４０μｍ、初期弾性
係数５５０ｋｇｆ／ｍｍ2)の片面（図２では上面）に、
銅箔配線パターン１を形成して接着剤レス片面銅被覆Ｃ
ＣＬ（Copper Clad Laminate）３を作成する。この接着
剤レス片面銅被覆ＣＣＬ３の銅箔配線パターン１側と、
ポリイミド系ソルダーレジスト４側のＰＥＴ離型フィル
ム１１を剥離したフォトカバーレイ付ポリイミド系ソル
ダーレジスト５のポリイミド系ソルダーレジスト４側と
を、ロールラミネートで貼り合わせる(201、202)。FIG. 2 shows a method of manufacturing a TAB tape using the polyimide-based solder resist 5 with a photo coverlay shown in FIG. Here, as the polyimide solder resist 5 with a photo coverlay, a polyimide solder resist 4 having a thickness of 50 μm is used. First, on one side (upper surface in FIG. 2) of a polyimide film 13 (thickness: 40 μm, initial modulus of elasticity: 550 kgf / mm 2 ) which is an adhesive-less polyimide casting material,
Form copper foil wiring pattern 1 and use adhesive-less single-sided copper coating C
A CL (Copper Clad Laminate) 3 is created. A copper foil wiring pattern 1 side of the adhesive-less single-sided copper coating CCL3;
The polyimide-based solder resist 5 with a photo cover lay from which the PET release film 11 on the polyimide-based solder resist 4 is peeled off is bonded to the polyimide-based solder resist 4 side by roll lamination (201, 202).
【００１０】次に、フォトカバーレイ付ポリイミド系ソ
ルダーレジスト５のフォトカバーレイ１２側のＰＥＴ離
型フィルム１１を剥離し、フォトカバーレイ１２を１０
０μｍの加工精度の露光現像でパターンニングする(20
3) 。このパターンニングされたフォトカバーレイ付ポ
リイミド系ソルダーレジスト５のフォトカバーレイ１２
をマスクとして、１０％アルカリ水溶液（ＮａＯＨ）で
フォトカバーレイ付ポリイミド系ソルダーレジスト５の
厚さ５０μｍのポリイミド系ソルダーレジスト４をエッ
チングした後、２７０℃の温度でベーク処理してポリイ
ミド２に硬化する(204) 。この硬化後のポリイミド２
は、厚さが２５μｍ、初期弾性係数５００ｋｇｆ／ｍｍ
2 、ガラス転移温度３３０℃となった。その後、フォト
カバーレイ１２を剥離して、銅箔配線パターン１８の所
定の部分にＮｉ／Ａｕめっき（図示せず）を施し、ＴＡ
Ｂ用テープ６を製造する(205) 。Next, the PET release film 11 on the photo cover lay 12 side of the polyimide solder resist 5 with photo cover lay is peeled off, and the photo cover lay 12 is removed.
Perform patterning by exposure and development with processing accuracy of 0 μm (20
3) The photo-coverlay 12 of the patterned polyimide solder resist 5 with the photo-coverlay patterned
Is used as a mask, the polyimide-based solder resist 4 with a photocoverlay having a thickness of 50 μm is etched with a 10% alkaline aqueous solution (NaOH), and then baked at a temperature of 270 ° C. to cure the polyimide 2 (204). This cured polyimide 2
Has a thickness of 25 μm and an initial elastic modulus of 500 kgf / mm
2. The glass transition temperature was 330 ° C. Thereafter, the photo coverlay 12 is peeled off, Ni / Au plating (not shown) is performed on a predetermined portion of the copper foil wiring pattern 18, and TA is applied.
The tape 6 for B is manufactured (205).
【００１１】この様にして製造されたＴＡＢ用テープ６
において、ポリイミド２は、その厚さが２５μｍなって
おり、十分にその特性を発揮すると共に、Ｎｉ／Ａｕめ
っきを施しても、ポリイミド２に剥がれやめくれが生じ
ず、ＴＡＢ用テープ６の歩留と生産性が向上した。The TAB tape 6 thus manufactured
In the above, the polyimide 2 has a thickness of 25 μm, exhibits sufficient characteristics, and does not peel off or turn over even when Ni / Au plating is performed, and the yield of the TAB tape 6 And increased productivity.
【００１２】また、本発明の製造方法で製造されたＴＡ
Ｂ用テープ６について、ＭＩＴ屈曲試験を行ったとこ
ろ、ポリイミド系ソルダーレジスト層であるポリイミド
２のクラック発生が、屈曲数１００以上となり、銅箔配
線パターン１の保護機能を十分に果たすものとなった。Further, the TA manufactured by the manufacturing method of the present invention is used.
When the MIT bending test was performed on the tape 6 for B, the occurrence of cracks in the polyimide 2 which was the polyimide-based solder resist layer became 100 or more in number, and the protective function of the copper foil wiring pattern 1 was sufficiently achieved. .
【００１３】更に、半導体素子接合のための模擬加熱試
験を１５０℃×８時間行ってもポリイミド２の剥がれや
めくれが発生せず、銅箔配線パターン１との密着性が良
好なものとなった。Furthermore, even if a simulated heating test for bonding a semiconductor element was performed at 150 ° C. for 8 hours, the polyimide 2 did not peel off or turn over, and the adhesion to the copper foil wiring pattern 1 was good. .
【００１４】以上、本発明の一実施形態を示したが、Ｔ
ＡＢ用テープ６はデバイスホールを設けたインナーリー
ドボンディングタイプのＴＡＢ用テープであってもよ
い。The embodiment of the present invention has been described above.
The AB tape 6 may be an inner lead bonding type TAB tape provided with device holes.
【００１５】図３は、本発明の製造方法によって製造さ
れたデバイスホールを設けたインナーリードボンディン
グタイプのＴＡＢ用テープを示す。このＴＡＢ用テープ
７は、デバイスホール８の設けられたポリイミドフィル
ム１３と、ポリイミドフィルム１３の片面に塗布された
接着剤１４と、接着剤１４によってポリイミドフィルム
１３に接着されている銅箔配線パターン１と、銅箔配線
パターン１を保護するためのソルダーレジスト層である
ポリイミド２とから成る。FIG. 3 shows an inner lead bonding type TAB tape provided with device holes manufactured by the manufacturing method of the present invention. The TAB tape 7 includes a polyimide film 13 provided with a device hole 8, an adhesive 14 applied to one surface of the polyimide film 13, and a copper foil wiring pattern 1 bonded to the polyimide film 13 by the adhesive 14. And a polyimide 2 which is a solder resist layer for protecting the copper foil wiring pattern 1.
【００１６】銅箔配線パターン１は、インナーリード９
とアウターリード１０を有し、インナーリード９と半導
体素子（図示せず）とを接合して、半導体装置を形成す
る。The copper foil wiring pattern 1 has inner leads 9
And an outer lead 10, and the inner lead 9 and a semiconductor element (not shown) are joined to form a semiconductor device.
【００１７】本発明の製造方法によって製造されたＴＡ
Ｂ用テープ７において、接着剤１４およびポリイミド系
ソルダーレジストのポリイミド２のガラス転移温度は、
１５０℃以上であり、接着剤１４とポリイミド２の密着
性が高いことが望ましい。このガラス転移温度が１５０
℃以上であれば、２７０℃のポリイミド系ソルダーレジ
スト４のベーク処理温度に耐えることができ、このガラ
ス転移温度が高ければ高いほど耐熱性が向上することに
なる。TA manufactured by the manufacturing method of the present invention
In the tape 7 for B, the glass transition temperature of the adhesive 14 and the polyimide 2 of the polyimide solder resist is
It is desirable that the temperature be 150 ° C. or higher and the adhesiveness between the adhesive 14 and the polyimide 2 be high. This glass transition temperature is 150
If the temperature is not less than 0 ° C., the polyimide solder resist 4 can withstand the baking treatment temperature of 270 ° C., and the higher the glass transition temperature, the higher the heat resistance.
【００１８】ポリイミド系ソルダーレジスト４をベーク
処理して生成されるポリイミド２の初期弾性係数は、ポ
リイミドフィルム１３の初期弾性係数の１／１０以上が
望ましい。これは、ポリイミド２の初期弾性係数とポリ
イミドフィルム１３の初期弾性係数が近ければ近いほ
ど、ポリイミド２の剥がれやめくれが発生しにくくなる
からであり、両者の曲げ歪みが等しい場合、この初期弾
性係数が応力バランスに影響するためである。The initial elastic modulus of the polyimide 2 formed by baking the polyimide solder resist 4 is preferably at least 1/10 of the initial elastic modulus of the polyimide film 13. This is because the closer the initial elastic modulus of the polyimide 2 and the initial elastic modulus of the polyimide film 13 are, the more difficult it is for the polyimide 2 to be peeled or turned up. This affects the stress balance.
【００１９】[0019]
【発明の効果】以上述べた通り、本発明のＴＡＢ用テー
プの製造方法によれば、配線層を保護するソルダーレジ
ストをフォトカバーレイ付ポリイミド系ソルダーレジス
トによって作成することとしたので、ポリイミド系ソル
ダーレジストのベーク処理後のソルダーレジストの厚さ
を容易に１０μｍ以上にすることができ、配線層とソル
ダレジストの密着性が向上し、剥離やめくれが生じず屈
曲性に優れ、８０μｍ以下の配線ピッチが可能なＴＡＢ
用テープの製品歩留と生産性が向上するようになった。As described above, according to the method for producing a TAB tape of the present invention, the solder resist for protecting the wiring layer is formed by the polyimide solder resist with photo coverlay. The thickness of the solder resist after the resist baking treatment can be easily increased to 10 μm or more, the adhesion between the wiring layer and the solder resist is improved, the exfoliation and curling do not occur, the flexibility is excellent, and the wiring pitch is 80 μm or less. Possible TAB
The product yield and productivity of tapes have been improved.
【００２０】また、本発明のＴＡＢ用テープの製造方法
で使用されるフォトカバーレイ付ポリイミド系ソルダー
レジストは、液状でないため、ソルダーレジストの流れ
出しや、かすれによる薄状化も発生せず、ポリイミド系
ソルダーレジストの被覆が安定して行うことができ、Ｔ
ＡＢ用テープの製品歩留と生産性が向上するようになっ
た。Further, since the polyimide solder resist with a photo coverlay used in the method for producing a TAB tape of the present invention is not in a liquid state, the solder resist does not flow out or is thinned due to fading. Solder resist coating can be performed stably, and T
Product yield and productivity of AB tapes have been improved.
【図１】本発明によるＴＡＢ用テープの製造方法で使用
されるフォトカバーレイ付ポリイミド系ソルダーレジス
トの実施の一形態を示す概略図である。FIG. 1 is a schematic view showing an embodiment of a polyimide-based solder resist with a photo coverlay used in the method for producing a TAB tape according to the present invention.
【図２】本発明によるＴＡＢ用テープの製造方法を示す
図である。FIG. 2 is a view showing a method for producing a TAB tape according to the present invention.
【図３】本発明によるＴＡＢ用テープの製造方法によっ
て製造されたＴＡＢ用テープの実施の一形態を示す図で
ある。FIG. 3 is a view showing one embodiment of a TAB tape manufactured by a method for manufacturing a TAB tape according to the present invention.
【図４】従来のＴＡＢ用テープの製造方法を示す図であ
る。FIG. 4 is a view showing a conventional method for producing a TAB tape.
１ 銅箔配線パターン ２ ポリイミド ３ 接着剤レス片面銅被覆ＣＣＬ ４ ポリイミド系ソルダーレジスト ５ フォトカバーレイ付ポリイミド系ソルダーレジスト ６、７ ＴＡＢ用テープ ８ デバイスホール ９ インナーリード １０ アウターリード １１ ＰＥＴ離型フィルム １２ フォトカバーレイ １３ ポリイミドフィルム １４ 接着剤 １５ ＩＬＢウインドウ １６ 銅箔 DESCRIPTION OF SYMBOLS 1 Copper-foil wiring pattern 2 Polyimide 3 Adhesive-less single-sided copper coating CCL 4 Polyimide solder resist 5 Polyimide solder resist with photo coverlay 6, 7 TAB tape 8 Device hole 9 Inner lead 10 Outer lead 11 PET release film 12 Photo coverlay 13 Polyimide film 14 Adhesive 15 ILB window 16 Copper foil
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平４−137642（ＪＰ，Ａ) 特開 平７−14886（ＪＰ，Ａ) 特開 平８−335600（ＪＰ，Ａ) 特開 平９−115963（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/60 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-4-137642 (JP, A) JP-A-7-14886 (JP, A) JP-A-8-335600 (JP, A) JP-A-9-99 115963 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) H01L 21/60
Claims (4)
ンを有するＴＡＢ用テープの製造方法において、 前記絶縁フィルムの前記配線パターンの設けられた面側
にフォトカバーレイ付ポリイミド系ソルダーレジストを
ロールラミネートにより貼り合わせ、 前記フォトカバーレイ付ポリイミド系ソルダーレジスト
のフォトカバーレイを感光現像して所定のパターンに形
成し、 前記所定のパターンに形成された前記フォトカバーレイ
をマスク材として、前記フォトカバーレイ付ポリイミド
系ソルダーレジストのポリイミド系ソルダーレジストを
エッチングしてベーク処理し、 前記マスク材として使用した前記フォトカバーレイを剥
離して、 前記ＴＡＢ用テープを製造することを特徴とするＴＡＢ
用テープの製造方法。1. A method for producing a TAB tape having a predetermined wiring pattern on one surface of an insulating film, wherein a polyimide-based solder resist with a photocoverlay is provided on the surface of the insulating film on which the wiring pattern is provided.
The photo cover lay of the polyimide-based solder resist with photo cover lay is exposed to light and developed to form a predetermined pattern, and the photo cover lay formed in the predetermined pattern is used as a mask material. TAB characterized in that the polyimide solder resist of the polyimide solder resist with cover lay is baked by etching, and the photo cover lay used as the mask material is peeled off to produce the TAB tape.
Manufacturing method for tape.
の初期弾性係数が前記絶縁フィルムの初期弾性係数の１
／１０以上であることを特徴とする請求項１記載のＴＡ
Ｂ用テープの製造方法。2. The polyimide solder resist according to claim 1, wherein an initial elastic modulus of the polyimide solder resist is one of an initial elastic modulus of the insulating film.
The TA according to claim 1, wherein the ratio is at least / 10.
A method for producing a tape for B.
接着剤によって接着され、 前記接着剤と前記ポリイミド系ソルダーレジストは、１
５０℃以上のガラス転移温度であることを特徴とする請
求項１記載のＴＡＢ用テープの製造方法。3. The wiring pattern is adhered to the insulating film with an adhesive, and the adhesive and the polyimide solder resist are
The method for producing a TAB tape according to claim 1, wherein the glass transition temperature is 50 ° C or higher.
あり、前記ベーク処理された前記ポリイミド系ソルダー
レジストの被覆部分以外をＮｉ／ＡｕめっきまたはＳｎ
／はんだめっきされることを特徴とする請求項１記載の
ＴＡＢ用テープの製造方法。4. The wiring pattern is a copper foil wiring pattern, and Ni / Au plating or Sn plating is performed on a portion other than a portion covered with the baked polyimide solder resist.
2. The method for producing a TAB tape according to claim 1, wherein the tape is solder-plated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30520797A JP3339387B2 (en) | 1997-11-07 | 1997-11-07 | Method for manufacturing TAB tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30520797A JP3339387B2 (en) | 1997-11-07 | 1997-11-07 | Method for manufacturing TAB tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11145205A JPH11145205A (en) | 1999-05-28 |
| JP3339387B2 true JP3339387B2 (en) | 2002-10-28 |
Family
ID=17942350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30520797A Expired - Fee Related JP3339387B2 (en) | 1997-11-07 | 1997-11-07 | Method for manufacturing TAB tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3339387B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102858091A (en) * | 2011-06-28 | 2013-01-02 | 北大方正集团有限公司 | Method for clearing resin flowing glue of mixed pressing formed PCB (printed circuit board) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001127117A (en) * | 1999-10-26 | 2001-05-11 | Hitachi Cable Ltd | Method for manufacturing tab tape |
| US7000313B2 (en) | 2001-03-08 | 2006-02-21 | Ppg Industries Ohio, Inc. | Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions |
| US6951707B2 (en) * | 2001-03-08 | 2005-10-04 | Ppg Industries Ohio, Inc. | Process for creating vias for circuit assemblies |
| EP1520454B1 (en) | 2002-06-27 | 2012-01-25 | PPG Industries Ohio, Inc. | Single or multi-layer printed circuit board with extended breakaway tabs and method of manufacture thereof |
| US6824959B2 (en) * | 2002-06-27 | 2004-11-30 | Ppg Industries Ohio, Inc. | Process for creating holes in polymeric substrates |
| JP3914135B2 (en) * | 2002-11-07 | 2007-05-16 | 三井金属鉱業株式会社 | Film carrier tape for mounting electronic components |
| JP5699610B2 (en) * | 2011-01-11 | 2015-04-15 | 富士通株式会社 | MOUNTING STRUCTURE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE |
-
1997
- 1997-11-07 JP JP30520797A patent/JP3339387B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102858091A (en) * | 2011-06-28 | 2013-01-02 | 北大方正集团有限公司 | Method for clearing resin flowing glue of mixed pressing formed PCB (printed circuit board) |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11145205A (en) | 1999-05-28 |
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