JP3331900B2 - Manufacturing method of multilayer electronic component - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a multilayer electronic component such as a multilayer capacitor, a multilayer coil, a multilayer piezoelectric component, and a multilayer varistor. The present invention relates to a method for manufacturing a molded electronic component.

[0002]

2. Description of the Related Art Hitherto, for example, the following manufacturing method has been used to manufacture a multilayer capacitor which is one of multilayer electronic components.

That is, a conductive film serving as an internal electrode is formed on a ceramic green sheet, a plurality of ceramic green sheets on which the conductive film is formed are prepared, and the ceramic green sheets are laminated to obtain a ceramic laminate.
After sintering the ceramic laminate, a conductive film to be an external electrode was applied to manufacture a multilayer capacitor.

As a method of forming a conductive film serving as an internal electrode on a ceramic green sheet, a screen printing method has been usually used. (Hereinafter, it will be referred to as “prior art 1”.) In general, such multilayer capacitors are required to be reduced in size and increased in capacitance.
In order to increase the capacity, it is conceivable to reduce the thickness of the ceramic green sheet or the conductive film serving as the internal electrode.

However, there is a limit in forming a conductive film to be an internal electrode uniformly and thinly on the ceramic green sheet by the screen printing method, and when a ceramic laminate is obtained by laminating the ceramic green sheets, A step was generated due to a difference in thickness between a portion where the conductive film serving as the internal electrode was formed and a portion where the conductive film serving as the internal electrode was not formed. The occurrence of the step may affect the electrical characteristics of the multilayer capacitor. This problem,
This became more remarkable as the thickness of the ceramic green sheet became thinner.

In order to overcome such a problem, research has been made on using electroless plating instead of screen printing as a method for forming a conductive film serving as an internal electrode on a ceramic green sheet.

As one of the methods for forming a conductive film serving as an internal electrode on a ceramic green sheet by electroless plating, there is the following method.

That is, a conductive film is formed on the entire surface of a carrier film such as a polyester film by electroless plating, and the conductive film is patterned into a predetermined shape by etching. A ceramic green sheet is formed on a carrier film on which a conductive film is patterned, and then the carrier film is peeled from the ceramic green sheet, and the conductive film is transferred to the ceramic green sheet. Thus, a ceramic green sheet on which a conductive film serving as an internal electrode is formed is obtained. (Hereinafter, "Prior art 2"
And Also, as another method using electroless plating, there is a method described below.

That is, as shown in Japanese Patent Application Laid-Open No. 63-169015, an activated catalyst solution is selectively applied to a predetermined portion of a ceramic green sheet by a stamping method or a printing method. In this method, a ceramic green sheet to which a liquid is selectively applied is immersed in an electroless plating bath, and a conductive film serving as an internal electrode is formed in a portion of the ceramic green sheet to which an activation catalyst liquid has been applied. (Hereinafter, this will be referred to as “prior art 3”.)

[0010]

According to the above-described method of forming a conductive film by electroless plating, the conductive film is uniformly formed on the ceramic green sheet as compared with the prior art 1 using the screen printing method. It can be formed thin.
Therefore, it is possible to prevent the occurrence of a step in the ceramic laminate when they are laminated. However, the conventional method of forming a conductive film by electroless plating has the following problems.

First, in the case of the above-mentioned prior art 2, a large amount of organic solvent or acid must be used in order to pattern the conductive film formed on the entire surface of the carrier film into a predetermined shape by etching. The use of an organic solvent or acid caused an increase in cost.

Further, since a large amount of organic solvent or acid is used, the carrier film may be dissolved or swelled.

On the other hand, in the case of the above-mentioned prior art 3, the activation catalyst liquid is selectively applied to a predetermined portion on the ceramic green sheet by a stamping method or a printing method. And the positional accuracy is limited, making it difficult to miniaturize the conductive film.

Accordingly, an object of the present invention is to form a conductive film uniformly and thinly, to make the conductive film finer, to achieve miniaturization and higher functionality, to provide a safe,
An object of the present invention is to provide a method for manufacturing a laminated electronic component that can be reduced in cost.

[0015]

A method of manufacturing a multilayer electronic component according to the present invention comprises a first invention, a second invention, and a sixth invention.

According to a first aspect, a ceramic green sheet is prepared, a conductive film is formed on the ceramic green sheet, and a plurality of ceramic green sheets on which the conductive film is formed are laminated. And a step of sintering the ceramic laminate, wherein the step of forming a conductive film on the ceramic green sheet comprises:
By applying a light-activated catalyst solution, a step of forming a photosensitive film formed of a light-activated catalyst solution is irradiated with light in the photoresist message
A step of precipitating the precipitated activating catalyst can, the plating analysis
Dipping the ceramic green sheet on which the activation catalyst has been deposited in an electroless plating bath, and subjecting the ceramic green sheet to electroless plating.

According to a second aspect of the present invention, there is provided a step of preparing a long carrier film, a step of forming a conductive film on the carrier film, and forming a ceramic green sheet on the carrier film on which the conductive film is formed. Process, peeling the carrier film from the ceramic green sheet,
Transferring the conductive film to the ceramic green sheet;
Laminating a plurality of ceramic green sheets to which the conductive film has been transferred, providing a ceramic laminate, and sintering the ceramic laminate, and forming a conductive film on the carrier film, , on a carrier film to impart hydrophilicity of the light activated catalyst solution, touch photoactivation
A step of forming a photosensitive film composed of a liquid medium, a step of irradiating the photosensitive film with light to deposit an activation catalyst for plating deposition, and an electroless plating of the carrier film on which the activation catalyst for plating deposition is deposited. Dipping the carrier film in a bath and applying electroless plating to the carrier film.

In a third aspect, a resin film preparing step, a conductive film forming step on the resin film, and a plurality of resin films having the conductive film formed thereon are laminated to form a resin film laminate. Preparing a conductive film on the resin film, wherein a hydrophilic photo-activated catalyst solution is applied on the resin film to form a photo-activated catalyst.
Forming a photosensitive film consisting of transfer fluid, wherein the step of irradiating the light to precipitate plating deposition activating catalyst in the photosensitive layer, electroless plating the resin film where the plating deposition activating catalyst was precipitated Dipping in a bath and subjecting the resin film to electroless plating.

A fourth invention is a ceramic green.
Sheet preparation process and ceramic green sheet
Forming a conductive film on a substrate and forming the conductive film on the plurality of substrates
Ceramic green sheets laminated, ceramic laminated
Preparing a body and sintering the ceramic laminate
And a conductive step on the ceramic green sheet.
The process of forming a film is performed on a ceramic green sheet.
By applying an aqueous photo-activated catalyst solution,
Forming a photosensitive film, and a specific region of the photosensitive film
Irradiate only the light to deposit the activating catalyst for plating deposition
And the light is not irradiated on the photosensitive film.
Flushing the damaged area with water or a liquid containing water as a main component
And the ceramic on which the activation catalyst for plating deposition is deposited.
The green sheet is immersed in an electroless plating bath.
A step of applying electroless plating to the lamic green sheet ;
It is characterized by having.

The fifth invention is directed to a long carrier filter.
A step of preparing a film and forming a conductive film on the carrier film.
Forming step and carrier film on which conductive film is formed
Forming a ceramic green sheet on the
Peel the carrier film from the Mick Green Sheet,
Transferring the conductive film to the ceramic green sheet;
Multiple ceramic green sheets with conductive film transferred
And a step of preparing a ceramic laminate,
Sintering a laminar laminate, wherein the carrier
The step of forming a conductive film on a film is performed by using a carrier film.
Apply a hydrophilic photo-activated catalyst solution on the
Forming a photosensitive film made of a liquid medium;
By irradiating light only to certain areas to activate the plating deposition catalyst
Depositing and irradiating the light on the photosensitive film.
Wash the unremoved area with water or a water-based liquid.
Flowing step and before the plating-deposition activation catalyst is deposited
The carrier film is immersed in an electroless plating bath,
Applying an electroless plating to the carrier film.
It is characterized by the following.

In a sixth aspect, a resin film is provided.
And forming a conductive film on the resin film
And multiple resin films on which conductive films are formed
And a step of preparing a resin film laminate,
The step of forming a conductive film on a resin film is performed by using a resin film.
Apply a hydrophilic photo-activated catalyst solution on the
Forming a photosensitive film made of a liquid medium;
By irradiating light only to certain areas to activate the plating deposition catalyst
Depositing and irradiating the light on the photosensitive film.
Wash the unremoved area with water or a water-based liquid.
Flowing step and before the plating-deposition activation catalyst is deposited
The resin film is immersed in an electroless plating bath,
Applying electroless plating to the film.
Sign.

[0022] According to the first aspect to sixth aspect, the photosensitive film is irradiated with light to deposit plating deposition activating catalyst, plating deposition activating catalyst deposited resin film,
Since the carrier film or the green sheet is subjected to the electroless plating, compared with the case of using the stamping method or the printing method of the related art 3, it is possible to form a fine conductive film with higher positional accuracy and resolution.

According to the first to sixth aspects of the present invention,
For example, since the photoactivation catalyst liquid is hydrophilic, a conductive film can be formed by an aqueous treatment operation without using an organic solvent.

The first invention, the second invention, and the fourth invention
According to the light and fifth inventions, the conductive film can be formed by electroless plating, so that the thickness of the conductive film can be reduced uniformly as compared with the case where the conductive film is formed by screen printing as in the prior art 1. can do.

Further , in the fourth to sixth inventions,
In this case, light is irradiated only to a specific area of the photosensitive film,
After the step of depositing the activation catalyst for deposition, the photosensitive film
Water or water in the area where the light was not irradiated in
Unnecessary because there is a step of washing with the liquid as the main component
Completely removing the photosensitive film to increase the resolution of the conductive film
It becomes easy to perform.

In this case, the water used in the developing step
Even if remains, do not bother
The electrolytic plating step can be performed immediately .

In the first invention and the fourth invention , the ceramic green sheet is formed continuously on a long carrier film in the longitudinal direction, and the ceramic green sheets are laminated. And
Before the step of preparing the ceramic laminate, it is preferable to include a step of peeling the carrier film from the ceramic green sheet.

In this case, the ceramic green sheet is supported on the carrier film until just before the laminating step and the mechanical strength is maintained, so that the handling of the ceramic green sheet becomes easy.

Further, in the first invention to the sixth invention , the photoactivation catalyst solution is a hydrophilic photoactivation catalyst solution containing copper oxalate, a palladium salt and an alkaline solution. Or a hydrophilic photoactivated catalyst solution containing zinc oxalate, a copper salt, a palladium salt, and an alkaline solution.

[0030]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method for manufacturing a multilayer electronic component according to the present invention will be described below with reference to the accompanying drawings.

Embodiment 1 A case where the first invention according to the method of manufacturing a multilayer electronic component is applied to a multilayer capacitor which is one of multilayer electronic components is referred to as an embodiment 1, and the embodiment 1 will be described below. .

The outline of all the steps in Example 1 is as follows.

First, a ceramic green sheet continuously formed along a longitudinal direction on a long carrier film is prepared.

Here, as the carrier film, for example, a polyester film can be used.

The ceramic green sheet is obtained, for example, by coating a ceramic slurry on a carrier film by a doctor blade method and drying the slurry. The thickness of the dried ceramic green sheet is 5
μm to 50 μm. This ceramic slurry is obtained by dispersing, for example, an oxide raw material powder made of barium titanate or the like with a solvent made of ethanol and toluene using polyvinyl butyral as a binder.

Next, a conductive film serving as an internal electrode is formed on the ceramic green sheet supported by the carrier film by electroless plating. Details of this step will be described later.

Next, a plurality of ceramic green sheets on which the conductive films are formed are laminated to prepare a ceramic laminate.

This lamination step is performed, for example, in Japanese Patent Publication No. 7-54.
779 can be carried out by a known processing method.

That is, the ceramic green sheet supported by the carrier film is cut into a predetermined shape together with the conductive film using a cutting head having a suction means inside. At this time, the carrier film is not cut. Then, the ceramic green sheet cut into a predetermined shape is peeled off from the carrier film by a suction means built in the cutting head, and separated from other ceramic green sheets. The ceramic green sheet peeled from the carrier film is laminated with another ceramic green sheet peeled from the carrier film by the same method. By repeating the above steps,
A ceramic laminate is obtained.

The ceramic green sheets may be laminated in a cutting blade provided in the cutting head, or may be transferred to a separately prepared laminating station by the cutting head and laminated in the laminating station.

Thereafter, the ceramic laminate is pressed and pressed as necessary, and further cut into a predetermined shape. Thus, a chip-shaped ceramic laminate is obtained.

Next, the chip-shaped ceramic laminate was
Sintering is performed in an oxidizing atmosphere or a neutral atmosphere at 00 ° C. to 1400 ° C., and then external electrodes are formed on the end faces of the chip-shaped ceramic laminate. Thereby, the multilayer capacitor is completed. The binder (polyvinyl butyral) contained in the ceramic green sheet constituting the chip-shaped ceramic laminate burns before the chip-shaped ceramic laminate is sintered.

Next, the process of forming a conductive film to be an internal electrode on a ceramic green sheet supported by a carrier film by electroless plating will be described in detail.

FIG. 1 is a process explanatory view showing a process of forming a conductive film to be an internal electrode by electroless plating on a ceramic green sheet supported by a carrier film.

First, as shown in FIG. 1A, a ceramic green sheet 2 formed on a carrier film 1 is formed.
On top, a hydrophilic photoactivated catalyst solution is applied by roller coating or spraying in the form of a mist, and dried,
A photosensitive film 3 made of a photoactivation catalyst liquid is formed.

[0046] At this time, as a light-activated catalyst solution, because of the use of hydrophilic photoactivatable catalyst solution, and the carrier film 1 made of a polyester film, a binder consisting of polyvinyl butyral contained in the ceramic green sheet 2 Does not dissolve or swell.

As the photoactivation catalyst solution , a hydrophilic photoactivation catalyst containing copper oxalate, a palladium salt and an alkaline solution is used.
A medium solution was used.

As the palladium salt, palladium chloride can be used. Ammonia water can be used as the alkaline solution.

Next, as shown in FIG. 1B, the photosensitive film 3 is irradiated with ultraviolet rays from an excimer lamp (wavelength: 172 nm) for 20 seconds through a quartz / chrome photomask to form a conductive film. Metallic palladium 4 is deposited on the part to be formed.

Next, as shown in FIG.
Is washed away with water or a liquid containing water as a main component.

[0051] At this time, can be developed by a liquid containing water as a main component or water, as a light-activated catalyst solution, is because by using a hydrophilic photoactivatable catalyst solution. Therefore, the carrier film 1 made of a polyester film
Also, the binder made of polyvinyl butyral contained in the ceramic green sheet 2 does not dissolve or swell.

Next, as shown in FIG. 1D, the ceramic green sheet 2 on which the metal palladium 4 was deposited was placed in an electroless plating bath (60 ° C.) containing silver and palladium.
For 10 minutes, and electroless plating is applied to the portion of the ceramic green sheet 2 where the metal palladium 4 is deposited. As a result, a conductive film 5 serving as an internal electrode is formed on the ceramic green sheet 2 supported by the carrier film 1.

In FIG. 1, the thickness of the metal palladium 4 and the conductive film 5 is set to be larger than the actual thickness in order to emphasize the metal palladium 4 and the conductive film 5. It can be formed so thin that no step occurs. Actually, the thickness of the conductive film 5 is formed larger than the thickness of the metal palladium 4.

Embodiment 2 A case where the second invention according to the method of manufacturing a multilayer electronic component is applied to a multilayer capacitor which is one of the multilayer electronic components will be described as an embodiment 2, and the embodiment 2 will be described below. .

The outline of all the steps in Example 2 is as follows.

First, a conductive film serving as an internal electrode is formed on a long carrier film by electroless plating. Here, as the carrier film, for example, a polyester film can be used. Details of this step will be described later.

Next, ceramic green sheets are continuously formed on the carrier film on which the conductive film is formed, along the longitudinal direction of the carrier film. The ceramic green sheet can be formed, for example, by coating a ceramic slurry on a carrier film on which a conductive film has been formed by a doctor blade method, and drying it. The thickness of the ceramic green sheet after drying is 5 μm to 50 μm.
μm. This ceramic slurry is obtained by dispersing, for example, an oxide raw material powder made of barium titanate or the like with a solvent made of ethanol and toluene using polyvinyl butyral as a binder.

Next, the carrier film is peeled from the ceramic green sheet, and the conductive film is transferred from the carrier film to the ceramic green sheet.

Next, a plurality of ceramic green sheets on which a conductive film is formed are laminated to prepare a ceramic laminate. The step of transferring the conductive film from the carrier film to the ceramic green sheets and the step of laminating a plurality of ceramic green sheets on which the conductive films are formed can be continuously performed by the following method.

That is, the ceramic green sheet and the conductive film supported by the carrier film are cut into a predetermined shape using a cutting head having suction means therein. At this time, the carrier film is not cut. Then, the ceramic green sheet cut into a predetermined shape is peeled off from the carrier film by a suction means built in the cutting head, and separated from other ceramic green sheets. At this time, the conductive film is peeled off from the carrier film together with the ceramic green sheet, and is transferred to the ceramic green sheet. The ceramic green sheet peeled from the carrier film,
It is laminated with another ceramic green sheet peeled off from the carrier film by the same method. By repeating the above steps, a ceramic laminate is obtained.

The ceramic green sheets may be laminated in a cutting blade provided in the cutting head, or may be transferred to a separately prepared laminating station by the cutting head and laminated in the laminating station.

Thereafter, the ceramic laminate is pressed as necessary, and further cut into a predetermined shape. Thus, a chip-shaped ceramic laminate is obtained.

Next, the chip-shaped ceramic laminate was
Sintering is performed in an oxidizing atmosphere or a neutral atmosphere at 00 ° C. to 1400 ° C., and then external electrodes are formed on the end faces of the chip-shaped ceramic laminate. Thereby, the multilayer capacitor is completed. The binder (polyvinyl butyral) contained in the ceramic green sheet constituting the chip-shaped ceramic laminate burns before the chip-shaped ceramic laminate is sintered.

Next, the details of the step of forming a conductive film to be an internal electrode on a ceramic green sheet supported by a carrier film by electroless plating will be described.

FIG. 2 is a process explanatory view showing a process of forming a conductive film to be an internal electrode on a carrier film by electroless plating.

[0066] First, as shown in FIG. 2 (a), on the carrier film 11, a hydrophilic light activated catalyst solution was applied by spraying in the roller coating or mist, dried, light-activated catalyst A photosensitive film 13 made of a liquid is formed.

[0067] At this time, as a light-activated catalyst solution, because of the use of hydrophilic optical activating catalytic solution, or by dissolving the carrier film 11 made of polyester film, never or swell.

The photoactivation catalyst solution includes a hydrophilic photoactivation catalyst containing copper oxalate, a palladium salt and an alkaline solution.
Use a medium solution .

As the palladium salt, palladium chloride can be used. Ammonia water can be used as the alkaline solution.

Next, as shown in FIG. 2B, the photosensitive film 13 is irradiated with ultraviolet rays from an excimer lamp (wavelength: 172 nm) through a quartz / chrome photomask for 20 seconds to form a conductive film. Metal palladium 14 is deposited on the portion to be formed.

Next, as shown in FIG.
The region of the sample 3 not irradiated with the ultraviolet rays is washed away with water or a liquid containing water as a main component.

[0072] At this time, can be developed by a liquid containing water as a main component or water, as a light-activated catalyst solution, is because by using a hydrophilic photoactivatable catalyst solution. Therefore, the carrier film 1 made of a polyester film
1 does not dissolve or swell.

Next, as shown in FIG. 2D, the carrier film 11 on which the metal palladium 14 has been deposited is placed in an electroless plating bath (60 ° C.) containing silver and palladium for 1 hour.
After immersion for 0 minutes, electroless plating is applied to the portion of the carrier film 11 where the metal palladium 14 is deposited. Thus, a conductive film 15 serving as an internal electrode is formed on the carrier film 11.

In FIG. 2, metal palladium 1
4, metal palladium 14, to emphasize conductive film 15,
Although the thickness of the conductive film 15 is described as being larger than the actual thickness,
Actually, it can be formed as thin as not to cause a step at the time of lamination. Actually, the thickness of the conductive film 15 is formed larger than the thickness of the metal palladium 14.

Embodiment 3 A case where the third invention according to the method of manufacturing a multilayer electronic component is applied to a multilayer coil which is one of the multilayer electronic components will be referred to as a third embodiment, and the third embodiment will be described below. .

The outline of all the steps in Example 3 is as follows.

First, a conductive film is formed on a resin film having through holes by electroless plating. Here, as the resin film, for example, an epoxy film or a polyimide film can be used. The conductive film is continuously formed in a spiral shape on the surface of the resin film, and is formed on the back surface of the resin film and the inner surface of the through hole. The spiral conductive film formed on the surface of the resin film and the conductive film formed on the back surface of the resin film are formed on the inner surface of the through hole and are electrically connected by the conductive film. Details of this step will be described later.

Next, a plurality of resin films on which a conductive film is formed are prepared, and these are laminated to prepare a resin film laminate. The plurality of resin films on which the conductive films are formed are joined by thermocompression bonding or an adhesive made of polyimide. When joining with an adhesive made of polyimide,
Excellent moisture resistance, high heat resistance and high reliability. The spiral conductive film formed on each surface of the adjacent resin films is electrically connected to each other by the conductive film formed on the back surface of each resin film and the conductive film formed on the inner surface of the through hole. Is done. Thereby, a laminated coil is completed.

Next, the process of forming a conductive film on a resin film by electroless plating will be described in detail.

FIG. 3 is a process explanatory view showing a process of forming a conductive film on a resin film by electroless plating.

First, as shown in FIG. 3A, a hydrophilic photo-activated catalyst solution is spin-coated on both surfaces of the resin film 22 and the inner surface of the through hole 22a under the condition of 1000 rpm / 30 seconds, and dried. A photosensitive film 23 made of a photoactivation catalyst liquid is formed. In this case, a light-activated catalyst solution <br/> Te, because of the use of hydrophilic photoactivatable catalyst solution, and an epoxy film, or by dissolving the resin film 22 made of a polyimide film or the like, or swelling Nothing.

The photoactivation catalyst solution includes a hydrophilic photoactivation catalyst containing copper oxalate, a palladium salt and an alkaline solution.
Use a medium solution .

As the palladium salt, palladium chloride can be used. Ammonia water can be used as the alkaline solution.

Next, as shown in FIG. 3B, the photosensitive film 23 is irradiated with ultraviolet rays from an excimer lamp (wavelength: 172 nm) for 20 seconds through a quartz / chrome photomask to invert the resin film 22. UV light is applied for 20 seconds. Thereby, the metal palladium 24 can be deposited on a predetermined portion of the photosensitive film 23. Since the method is a method of irradiating ultraviolet rays, the metal palladium 24 can be easily deposited on the photosensitive film 23 formed on the inner surface of the through hole 22a.

Next, as shown in FIG.
The region of the sample 3 not irradiated with the ultraviolet rays is washed away with water or a liquid containing water as a main component.

[0086] At this time, can be developed by liquid mainly composed of water or water because the light activated catalyst solution <br/> Te uses a hydrophilic photoactivatable catalyst solution is there.
Therefore, the resin film 22 made of an epoxy film, a polyimide film, or the like does not dissolve or swell.

Next, as shown in FIG. 3D, the resin film 22 on which the metal palladium 24 has been deposited is immersed in an electroless plating bath (60 ° C.) containing silver and palladium for 10 minutes. Electroless plating is applied to the portion where the metal palladium 24 is deposited. Thereby, a conductive film 25 is formed on a predetermined portion of the resin film 22.

In FIG. 3, metal palladium 2
4, metal palladium 24 to emphasize conductive film 25,
Although the thickness of the conductive film 25 is described as being larger than the actual thickness,
Actually, it can be formed as thin as not to cause a step at the time of lamination. Further, actually, the thickness of the conductive film 25 is formed to be thicker than the thickness of the metal palladium 24.

As described above, the first invention, the second invention, and the third invention according to the method of manufacturing a multilayer electronic component have been described based on one embodiment. However, the present invention is not limited to the above embodiment. It is not limited, and various changes can be made within the scope of the present invention.

That is, in Examples 1, 2 and 3, the hydrophilic photoactivated catalyst solution contains copper oxalate, a palladium salt and an alkaline solution.
Although the photoactivation catalyst liquid was used, the first invention, the second invention,
The third and third inventions are not limited to this. For example, instead of the photoactivation catalyst solution containing copper oxalate, a palladium salt, and an alkali solution, a hydrophilic activation catalyst solution containing zinc oxalate, a copper salt, a palladium salt, and an alkali solution may be used. . In this case, palladium chloride can be used as the palladium salt. As the alkaline solution, aqueous ammonia, sodium salt, and potassium salt can be used. Further, zinc oxalate can be replaced with a zinc salt. As zinc salts,
Zinc chloride and zinc sulfate can be used. Further, as the copper salt, copper oxalate, copper chloride, copper sulfate, and copper nitrate can be used.

In Examples 1, 2 and 3, the photosensitive films 3, 13, and 23 were irradiated with ultraviolet rays to deposit metal palladiums 4, 14, and 24. Although the regions which were not irradiated with ultraviolet rays in 13 and 23 were washed away with water or a liquid containing water as a main component, the first invention, the second invention, and the third invention do not necessarily require this step. And not. That is, when it is not necessary to increase the resolution of the conductive film to be formed, the developing step by washing with water can be omitted. The omission of the development process is thus possible.
This is because the photoactivation catalyst liquid is hydrophilic.

In the first, second, and third embodiments, the electroless plating of silver and palladium was performed. However, the first, second, and third inventions are not limited to this. But not limited to nickel, copper, gold,
It is also possible to perform electroless plating of another metal such as platinum.

In the first and second embodiments, a multilayer capacitor has been described as an example. However, the first invention and the second invention are not limited to this, and the multilayer coil and the piezoelectric The present invention is also applicable to other multilayer electronic components such as multilayer components and multilayer varistors.

Similarly, in the third embodiment, the laminated coil is described as an example. However, the third invention is not limited to this, and can be applied to other laminated electronic components.

In the first embodiment, the conductive film 5 is formed on the ceramic green sheet 2 supported by the carrier film 1, and the conductive film 5 is formed before the laminating step.
Is peeled off from the ceramic green sheet 2, but the first invention is not limited to this. After forming the conductive film 5 on the ceramic green sheet 2 and laminating it in the cutting head, the carrier film 1 may be separated from the ceramic green sheet 2. Also,
Before forming the conductive film 5, the carrier film 1 may be peeled from the ceramic green sheet 2.

In the first embodiment, the conductive film 5 is formed on the ceramic green sheet 2 supported by the carrier film 1, and the carrier film 1 is separated from the ceramic green sheet 2 and laminated. The first invention is not limited to this, but forms a first ceramic green sheet on a carrier film,
Forming a conductive film on the first ceramic green sheet;
Further, after forming the second ceramic green sheet on the conductive film, a ceramic green sheet having a built-in conductive film may be laminated between the first ceramic green sheet and the second ceramic green sheet. The carrier film may be peeled off from the first ceramic green sheet before forming the conductive film, or may be peeled off from the first ceramic green sheet after forming the second ceramic green sheet. Alternatively, it may be separated from the first ceramic green sheet after lamination. In this case, since the conductive film is formed uniformly and thinly by electroless plating and is embedded between the first ceramic green sheet and the second ceramic green sheet, a step occurs during lamination. It is effective in preventing such a situation.

In the first and second embodiments, the conductive films 5 and 15 are formed on the long ceramic green sheet 2 and the long carrier film 11, respectively. The second invention is not limited to this. For example, a conductive film may be formed on a ceramic green sheet or a carrier film formed in a predetermined shape in advance. In this case, a spin-coating method can be used as a method for applying the photoactivation catalyst liquid to the ceramic green sheet or the carrier film formed in a predetermined shape.

Conversely, in the third embodiment, the conductive film 25 is formed on the resin film 22 formed in a predetermined shape in advance, but the third invention is not limited to this. For example, a conductive film may be formed on a long resin film, and then cut into a predetermined shape and laminated. In this case, as a method of applying the photoactivated catalyst liquid on the long resin film, a roller coating method, a method of spraying the photoactivated catalyst liquid in a mist state, or the like can be used.

In addition, it goes without saying that the material of the photoactivation catalyst liquid , the ceramic slurry, the conductive film and the composition ratio thereof can be changed.

[0100]

As described above, according to the first to sixth aspects of the present invention,
According to the invention , the photosensitive film is irradiated with light to activate the plating deposition.
The electroless plating is performed on the resin film, carrier film, or green sheet on which the activating catalyst for plating deposition is deposited, so that the positional accuracy is higher than when using the stamping method or printing method of the prior art 3. Is high,
A fine conductive film can be formed.

Therefore, it is possible to reduce the size and the functionality of the multilayer electronic component.

According to the first to sixth aspects of the present invention , since the photoactivation catalyst liquid is hydrophilic, the conductive film can be formed by an aqueous treatment operation without using an organic solvent. it can.

Therefore, cost reduction can be expected by using water instead of the organic solvent.

Further, the first invention, the second invention, and the fourth invention
According to the light and fifth inventions , the conductive film can be formed by electroless plating, so that the thickness of the conductive film can be reduced uniformly as compared with the case where the conductive film is formed by screen printing as in the prior art 1. can do.

Therefore, when the ceramic green sheets are laminated, it is possible to prevent the occurrence of a step in the ceramic laminate.

In the first invention and the second invention , the ceramic green sheet is formed continuously on a long carrier film in a longitudinal direction thereof, Before the step of laminating the ceramic green sheets and preparing the ceramic laminate, it is preferable to include a step of peeling the carrier film from the ceramic green sheets.

In this case, the ceramic green sheet is supported on the carrier film until just before the laminating step, and the mechanical strength is maintained, so that the handling of the ceramic green sheet becomes easy.

Therefore, in this case, it is possible to use a thinner ceramic green sheet, which contributes to the miniaturization and high performance of the laminated electronic component.

Further, in the first invention to the sixth invention , the photoactivation catalyst liquid is a hydrophilic photoactivation catalyst liquid containing copper oxalate, a palladium salt and an alkaline solution. Or a hydrophilic photoactivated catalyst solution containing zinc oxalate, a copper salt, a palladium salt, and an alkaline solution.

These photoactivated catalyst solutions have high sensitivity to light. Therefore, even if the energy of light such as ultraviolet rays for exposure is small, or the exposure time is short, a sufficient precipitation reaction of the plating deposition activation catalyst can be achieved.

Further, a conductive film formed by electroless plating using these photoactivated catalyst solutions has high adhesion strength.

Further , in the fourth to sixth inventions,
In this case, light is irradiated only to a specific area of the photosensitive film,
After the step of depositing the activation catalyst for deposition, the photosensitive film
Great Keru regions water or water wherein the light is not irradiated to the
Unnecessary because there is a step of washing with the liquid as the main component
Completely removing the photosensitive film to increase the resolution of the conductive film
It becomes easy to perform. Therefore, in this case,
A fine conductive film can be formed.

In this case, the water used in the developing step is used.
Even if remains, do not bother
The electrolytic plating step can be performed immediately . But
In this case, a series of treatments for electroless plating
Can proceed efficiently.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing a step of forming a conductive film on a ceramic green sheet in a method of manufacturing a multilayer electronic component according to an embodiment of the first invention.

FIG. 2 is a process explanatory view showing a process of forming a conductive film on a carrier film in a method of manufacturing a laminated electronic component according to an embodiment of the second invention.

FIG. 3 is an explanatory view showing a step of forming a conductive film on a resin film in the method of manufacturing a laminated electronic component according to one embodiment of the third invention.

[Explanation of symbols]

1, 11 Carrier film 2 Ceramic green sheet 3, 13, 23 Photosensitive film 4, 14, 24 Metal palladium ( Plating activity
5, 15, 25 Conductive film 22 Resin film

Continuation of front page (72) Inventor Yukio Sakabe 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto Prefecture Examiner, Murata Manufacturing Co., Ltd. JP-A-57-39166 (JP, A) JP-A-7-263271 (JP, A) JP-A-6-231999 (JP, A) JP-A-3-2855311 (JP, A) JP-A-1-281792 (JP) , A) (58) Field surveyed (Int. Cl. ⁷ , DB name) H01G 4/00-4/10 H01G 4/14-4/42 H01G 13/00-13/06

Claims (9)

(57) [Claims] A step of preparing a ceramic green sheet; a step of forming a conductive film on the ceramic green sheet; and a step of laminating a plurality of ceramic green sheets on which the conductive film is formed to prepare a ceramic laminate. When, and a step of sintering the ceramic laminate, the step of forming a conductive film on the ceramic green sheet, touch photoactivatable hydrophilic on the ceramic green sheet
A step of applying a medium solution to form a photosensitive film made of a photoactivation catalyst solution ; and irradiating the photosensitive film with light to form a plating deposition activity.
Depositing a catalyst for activation, and activating the plating deposition.
Dipping the ceramic green sheet on which the catalyst has been deposited in an electroless plating bath and applying electroless plating to the ceramic green sheet. 2. The ceramic green sheet is formed continuously on a long carrier film in the longitudinal direction thereof, and before the step of laminating the ceramic green sheets and preparing a ceramic laminate. 2. The method according to claim 1, further comprising a step of peeling the carrier film from the ceramic green sheet. 3. A step of preparing a long carrier film, a step of forming a conductive film on the carrier film, a step of forming a ceramic green sheet on the carrier film on which the conductive film is formed, Removing the carrier film from the substrate, transferring the conductive film to the ceramic green sheet, laminating a plurality of ceramic green sheets to which the conductive film has been transferred, preparing a ceramic laminate, and firing the ceramic laminate. Forming a conductive film on the carrier film, wherein a hydrophilic photo-active film is formed on the carrier film.
Applying a photocatalyst solution to form a photosensitive film composed of a photoactivated catalyst solution , and irradiating the photosensitive film with light to perform plating.
Depositing an activation catalyst for dispensing ;
Dipping the carrier film on which the activation catalyst has been deposited in an electroless plating bath and applying electroless plating to the carrier film. 4. A step of preparing a resin film, a step of forming a conductive film on the resin film, and a step of laminating a plurality of resin films on which the conductive film is formed to prepare a resin film laminate. The step of forming a conductive film on the resin film comprises forming a hydrophilic photo-activated film on the resin film .
Applying a catalyst solution to form a photosensitive film made of a photoactivated catalyst solution ; and irradiating the photosensitive film with light to deposit a plating film .
A step of precipitating the activated catalyst, the plating deposition for the active
Immersing the resin film on which the catalyst has been deposited in an electroless plating bath and applying electroless plating to the resin film. 5. A process for preparing a ceramic green sheet.
And forming a conductive film on the ceramic green sheet
Process and a plurality of ceramic grease with conductive film formed
Of stacking ceramic sheets and preparing a ceramic laminate
And sintering the ceramic laminate.
Forming a conductive film on the ceramic green sheet
Has a hydrophilic light-activated touch on a ceramic green sheet.
Applying a liquid medium to form a photosensitive film composed of a photoactivation catalyst liquid
And irradiating light only to a specific area of the photosensitive film.
Depositing an activation catalyst for plating deposition by
An area of the optical film where the light was not irradiated was water or
A step of rinsing with a liquid containing water as a main component;
The ceramic green sea on which the activated catalyst is deposited.
Dipped in an electroless plating bath,
Subjecting the sheet to electroless plating.
A method of manufacturing a laminated electronic component. 6. The ceramic green sheet is long.
On its carrier film, continuous over its length
Ceramic green sheet
Before the process of preparing the ceramic laminate,
The carrier film from the ceramic green sheet
The method according to claim 5, further comprising a separating step.
A method for manufacturing a laminated electronic component. 7. A step of preparing a long carrier film
Forming a conductive film on the carrier film;
Ceramic grits on the carrier film
Forming a green sheet and a ceramic green sheet
Remove the carrier film from the
Step of transferring to green sheet and conductive film Was transcribed
Laminating multiple ceramic green sheets
Preparing a ceramic laminate, and firing the ceramic laminate.
A conductive film on the carrier film.
Is formed on the carrier film with a hydrophilic photoactive
Photosensitive film made of photoactivated catalyst liquid by applying activating catalyst liquid
Forming light, and applying light only to a specific area of the photosensitive film.
Irradiating to deposit an activation catalyst for plating deposition,
The area of the photosensitive film where the light was not irradiated was filled with water.
Or a step of rinsing with a liquid containing water as a main component;
The carrier film on which the activated catalyst for deposition has been deposited
Immersed in an electroless plating bath,
Performing an electrolytic plating process.
Manufacturing method of layered electronic components. 8. A process for preparing a resin film, comprising:
Forming a conductive film on the film; and forming the conductive film on the film.
Laminated resin film
Preparing a conductive film on the resin film.
The process of forming the hydrophilic photo-activated on the resin film
Apply a catalyst solution to form a photosensitive film consisting of a photoactivated catalyst solution.
And irradiating only a specific area of the photosensitive film with light
Depositing an activated catalyst for plating deposition, and
The area of the photosensitive film where the light has not been irradiated is exposed to water or water.
Is a step of washing with a liquid containing water as a main component, and
Electroless electrolysis of the resin film on which the activated catalyst for deposition is deposited
Immerse in a plating bath and apply electroless plating to the resin film.
And a applying step.
Manufacturing method. 9. The photo-activated catalyst solution contains copper oxalate and
Hydrophilic photoactivatable contacts containing radium salts and alkaline solutions
Medium, or zinc oxalate, copper salt, palladium salt and aluminum
A hydrophilic photoactivated catalyst solution containing potassium solution
The product according to any one of claims 1 to 8, characterized in that:
Manufacturing method of layered electronic components.