JP4775550B2 - Electroless plating film forming method and catalyst pattern forming apparatus - Google Patents

Description

  The present invention relates to an electroless plating film forming method and a catalyst pattern forming apparatus therefor, and more specifically, a method of forming an internal electrode film of a multilayer electronic component such as a multilayer ceramic capacitor by electroless plating, and The present invention relates to a catalyst pattern forming apparatus applied to the implementation of the method.

  Conventionally, a multilayer electronic component such as a multilayer ceramic capacitor is manufactured by the following process. First, an electrode pattern made of a conductive paste is formed on a ceramic green sheet by a screen printing method. Next, a plurality of ceramic green sheets are laminated to form a sheet laminate. And after crimping | bonding a sheet | seat laminated body, it cut | disconnects into a some chip | tip (individual item) and obtains a lamination | stacking green chip. Further, the laminated green chip is subjected to known treatments such as binder removal, firing, and terminal electrode formation to obtain a laminated electronic component having a plurality of internal electrode films.

  By the way, in recent years, in order to follow the progress of miniaturization and high functionality of electronic devices, the market demand for miniaturization and high capacity of laminated electronic components is extremely large. In order to meet this demand, for example, it is desired to form an electrode pattern thin in advance in the manufacturing process for the internal electrode film.

  Also, as the thickness of the electrode pattern increases, the risk of stacking misalignment due to thickness differences and non-lamination increases, so the thinning of the electrode pattern is from the viewpoint of quality assurance of the final laminated electronic component. Is also desired.

  However, in the conventional screen printing method, the electrode pattern cannot be formed thinner than the particle size of the Ni particles contained in the conductor paste, so that there is a limit to thinning the electrode pattern.

  Thus, electroless plating has been studied as a method for thinning the electrode pattern. In electroless plating, by applying a catalyst on a sheet in advance, Ni can be attached to the surface of the catalyst application portion in an atomic state, so that an electrode pattern to be an internal electrode film is thinly formed. be able to.

  In performing such electroless plating, Patent Documents 1 to 3 are known as conventional techniques for providing a catalyst on a sheet. In Patent Documents 1 and 2, after a transfer sheet is immersed in a catalyst solution to apply a catalyst, a resist is applied by screen printing to set a catalyst pattern. Further, a plating film used as an electrode pattern is formed on the catalyst pattern by electroless plating. Thereafter, the plating film formed on the transfer sheet is thermally transferred to the ceramic green sheet.

  However, according to the disclosure contents of Patent Documents 1 and 2, there is a problem that productivity is poor due to the large number of steps until formation of the catalyst pattern. In addition, since it includes a step of thermally transferring the electrode pattern formed on the transfer film to the ceramic green sheet, the adhesion between the ceramic green sheet and the electrode pattern is likely to be impaired, and a peeling accident is likely to occur.

  In Patent Document 3, a ceramic green sheet subjected to masking treatment is immersed in a catalyst solution to form a catalyst pattern directly on the ceramic green sheet, and then a plating film used as an electrode pattern by electroless plating is formed on the catalyst pattern. Form.

According to Patent Document 3, there is a problem that productivity is poor because the number of steps until formation of the catalyst pattern is large. Furthermore, since the catalyst solution is usually an acidic solution made of tin chloride, palladium chloride, etc., immersing the ceramic green sheet in this acidic solution causes damage to the sheet, and as a result, the reliability of the laminated electronic component that is the final product. There is a problem that the performance is impaired.
JP-A-10-125556 JP-A-10-208980 JP 2002-231574 A

  An object of the present invention is to provide an electroless plating film forming method capable of forming an electrode pattern thinly on a ceramic green sheet, and a catalyst pattern forming apparatus applied to the implementation of this method.

  Another object of the present invention is to provide an electroless plating film forming method with high productivity and a catalyst pattern forming apparatus applied to the implementation of this method.

  Still another object of the present invention is to provide an electroless plating film forming method capable of obtaining a high-quality multilayer electronic component, and a catalyst pattern forming apparatus applied to the implementation of this method.

  In order to solve the above-described problems, the electroless plating film forming method according to the present invention is such that a transfer material impregnated with a catalyst solution is brought into contact with a ceramic green sheet, and a catalyst pattern by the catalyst solution is formed on the ceramic green sheet. Then, electroless plating is applied to the catalyst pattern.

  As described above, in the electroless plating film forming method according to the present invention, the transfer material impregnated with the catalyst solution is brought into contact with the ceramic green sheet, and the catalyst pattern by the catalyst solution is directly formed on the ceramic green sheet. , Work efficiency is improved. For example, a step of immersing the sheet in the catalyst solution, a resist coating step for setting a catalyst pattern, or a masking treatment step is not necessary. Therefore, the number of processes can be greatly reduced, and an electroless plating film forming method with high productivity can be provided.

  In addition, the transfer material impregnated with the catalyst solution is brought into contact with the ceramic green sheet to form a catalyst pattern with the catalyst solution on the ceramic green sheet. Various catalyst patterns can be obtained depending on the transfer surface structure (transfer pattern) of the transfer material. Can be formed efficiently.

  Furthermore, since the catalyst pattern is formed only in the portion where the transfer material contacts the ceramic green sheet, damage to the ceramic green sheet due to the catalyst solution can be reduced to a minimum. Therefore, according to the electroless plating film forming method of the present invention, a high-quality multilayer electronic component can be obtained.

  Since the electroless plating film forming method according to the present invention performs electroless plating on a catalyst pattern, a plating film used as an electrode pattern can be formed thin.

  Moreover, since the catalyst pattern is formed on the ceramic green sheet and the plating film is directly formed on the ceramic green sheet, the working efficiency is improved. For example, the process of transferring the plating film from the transfer sheet to the ceramic green sheet can be reduced. Therefore, the number of processes can be greatly reduced, and an electroless plating film forming method with high productivity can be provided.

  Furthermore, the adhesion between the ceramic green sheet and the electrode pattern can be ensured, and a high-quality multilayer electronic component can be obtained. In addition, since the plating film is formed only in the catalyst pattern application region on the ceramic green sheet, the electrode pattern can be formed with high accuracy.

  In a preferred embodiment of the electroless plated film forming method according to the present invention, the above-described catalyst pattern is formed using a rotating roller. According to this configuration, the catalyst pattern can be formed on the ceramic green sheet quickly and inexpensively.

  The catalyst pattern forming apparatus for electroless plating according to the present invention includes a transfer device. The transfer device includes a support and a transfer material. The support supports the transfer material, and the transfer material has liquid retention with respect to the catalyst solution. According to this catalyst pattern forming apparatus, the above-described electroless plating film forming method can be efficiently and reliably executed.

  Other objects, configurations, and advantages of the present invention will be described in more detail with reference to the accompanying drawings. The accompanying drawings are merely examples.

As described above, according to the present invention, the following effects can be obtained.
(1) An electroless plating film forming method capable of forming an electrode pattern thinly on a ceramic green sheet, and a catalyst pattern forming apparatus applied to the implementation of this method can be provided.
(2) An electroless plating film forming method with high productivity and a catalyst pattern forming apparatus applied to the implementation of this method can be provided.
(3) It is possible to provide an electroless plating film forming method capable of obtaining a high-quality multilayer electronic component and a catalyst pattern forming apparatus applied to the implementation of this method.

  FIG. 1 is a view showing a catalyst pattern forming apparatus used in the electroless plating film forming method according to the present invention. 2 to 5 are diagrams illustrating a catalyst pattern forming method using the catalyst pattern forming apparatus illustrated in FIG. 1, FIGS. 6 and 7 are diagrams illustrating an electroless plating method, and FIG. 8 is a diagram illustrating FIGS. 7 is a cross-sectional view of a multilayer electronic component obtained through the process shown in FIG.

  First, referring to FIG. 1, the catalyst pattern forming apparatus includes a first transfer device 3 and a second transfer device 4. These are arranged along the sheet conveyance path 2 along which the ceramic green sheet 1 is conveyed.

  The ceramic green sheet 1 is obtained by applying and drying a ceramic paste mixed with ceramic powder, a solvent, a binder, and the like, and has a constant thickness. The ceramic green sheet 1 is attached to the surface of a support (not shown) such as a flexible plastic film. The ceramic green sheet 1 is placed on the sheet conveyance path 2 with the catalyst application surface 10 facing up, and is conveyed in the direction indicated by the arrow m1.

  The first transfer device 3 is a catalyst pattern transfer device used as a sensitizer, and includes a first support 30 and a first transfer material 31. The first support 30 shown in FIG. 1 is a so-called rotating roller, and a plurality of first transfer materials 31 are provided on the outer peripheral surface of the roller. Hereinafter, for convenience of explanation, the first support 30 will be described as the rotating roller 30.

  Each of the first transfer materials 31 has a liquid retaining property or a liquid absorbing property with respect to the catalyst solution, and protrudes from the outer peripheral surface of the rotating roller 30. More specifically, the first transfer material 31 is preferably a sponge-like porous body using a synthetic resin material having acid resistance, and the one formed into a convex piece is the rotating roller 30. Are arranged at a predetermined pitch interval on the outer peripheral surface of each of them. The number of installed first transfer materials 31 and the pitch interval are design matters set in consideration of productivity. The specific surface shape of the first transfer material 31 is a design matter set by the pattern shape of the desired catalyst pattern.

  In the first transfer device 3, the surface of the first transfer material 31 is provided on the sheet conveyance path 2 at a position facing the catalyst application surface 10 of the ceramic green sheet 1.

  The first transfer material 31 is impregnated with a first catalyst solution 32 supplied by a supply device (not shown). The first catalyst solution 32 is a solution of a catalyst agent used as a sensitizer, and is preferably an aqueous tin chloride solution.

  With respect to the first transfer device 3, the transfer process of the first catalyst solvent 32 will be described with reference to FIGS. First, the ceramic green sheet 1 is previously passed through an ion exchange water tank (not shown), washed with water on the catalyst application surface 10, dried, and then sent in the direction indicated by the arrow m1 along the sheet conveyance path 2.

  Referring to FIG. 2, the first transfer device 3 includes a ceramic green sheet in which the first transfer material 31 impregnated with the first catalyst solution 32 is conveyed in the m1 direction according to the rotation R30 of the rotation roller 30. The first catalyst solution 32 is transferred to the catalyst application surface 10 at a predetermined pitch interval.

  In the ceramic green sheet 1 obtained by the process of FIG. 2, a film-like first catalyst pattern 320 is formed on the catalyst application surface 10 by the first catalyst solution 32 (see FIG. 3). The film thickness d320 of the first catalyst pattern 320 is about 0.02 μm.

  Again, the second transfer device 4 will be described with reference to FIG. The second transfer device 4 is a catalyst pattern transfer device used as an activator, and includes a second support 40 and a second transfer material 41. The second support 40 is a so-called rotating roller, and includes a second transfer material 41 on the roller outer peripheral surface. Hereinafter, for convenience of explanation, the second support 40 will be described as the rotating roller 40.

  The second transfer material 41 has a liquid retaining property or a liquid absorbing property with respect to the catalyst solution, and is provided on the outer peripheral surface of the rotating roller 40. More specifically, the second transfer material 41 is preferably a sponge-like porous molded body using an acid-resistant synthetic resin material, and is wound around the entire circumference of the roller outer peripheral surface. ing. The same material as the first transfer material 31 can be used for the second transfer material 41.

  In the second transfer device 4, the surface of the second transfer material 41 is provided on the sheet conveyance path 2 at a position facing the catalyst application surface 10 of the ceramic green sheet 1.

  The second transfer material 41 is impregnated with the second catalyst solution 42 supplied by a supply device (not shown) or the like. The second catalyst solution 42 is a solution of a catalyst activator used as an activator (activator), and is preferably an aqueous palladium chloride solution.

  In FIG. 1, the second transfer device 4 is provided after the first transfer device 3 as viewed in the conveyance direction m <b> 1 of the ceramic green sheet 1, and is formed by the first transfer device 3. The second catalyst solution 42 is transferred to the catalyst pattern 320.

  The transfer process of the second catalyst solvent 42 in the second transfer device 4 will be described more specifically with reference to FIGS. First, the ceramic green sheet 1 is previously passed through an ion exchange water tank (not shown), washed with water on the surface of the catalyst application surface 10 and the first catalyst pattern 320, dried, and then moved to the sheet conveyance path 2 with an arrow m1. Sent in the direction indicated by.

  Referring to FIG. 4, the second transfer device 4 includes a ceramic green sheet in which the second transfer material 41 to which the second catalyst solution 42 is adhered is conveyed in the m1 direction according to the rotation R40 of the rotation roller 40. 1 contacting surface 10 of the catalyst. Here, the second catalyst solution 42 containing palladium chloride is fixed only on the surface of the first catalyst pattern 320 containing tin chloride in nature, and the catalyst application surface on which the first catalyst pattern 320 is not formed. The portion transferred onto the surface 10 is repelled. Accordingly, the second catalyst solution 42 is transferred only to the surface of the first catalyst pattern 320.

  The ceramic green sheet 1 obtained by the process of FIG. 4 is preferably subjected to a drying process of the transferred second catalyst solution 42, whereby the surface of the first catalyst pattern 320 is formed by the second catalyst solution 42. A film-like second catalyst pattern 420 is formed (see FIG. 5). The film thickness d420 of the second catalyst pattern 420 is about 0.02 μm.

  After the step shown in FIG. 4, the ceramic green sheet 1 formed by laminating the first and second catalyst patterns 320 and 420 is passed through an ion exchange water tank (not shown), washed with water, and dried.

  After the catalyst pattern is formed as described above, an electroless plating process is then performed. Referring to FIG. 6, after the steps shown in FIGS. 2 to 5, the first and second catalyst patterns 320 and 420 are subjected to electroless plating. Specifically, the ceramic green sheet 1 is lowered in the direction indicated by the arrow m2, and the first and second catalyst patterns 320 and 420 are immersed in the boron-based electroless Ni plating bath 5. For example, when the Ni film 50 having a film thickness (0.1 μm) is formed, the immersion time in the electrolytic Ni plating bath 5 is about 6 seconds. By immersing in the plating bath 5, the Ni film 50 is formed on the surface of the second catalyst pattern 420.

An example of the composition of the plating bath 5 is as follows.
1. Plating bath composition Nickel sulfate hexahydrate 26 g / liter Dimethylamine borane 1.8 g / liter Ammonium acetate 16 g / liter pH 6
Bath temperature 60 ° C

  Through the electroless plating process of FIG. 6, as shown in FIG. 7, the ceramic green sheet 1 in which the Ni film 50 is formed on the surfaces of the first and second catalyst patterns 320 and 420 by electroless plating is obtained. It is done. The film thickness d50 of the Ni film 50 is about 0.1 μm. Therefore, the total of the film thickness d320 of the first catalyst pattern 320, the film thickness d420 of the second catalyst pattern 420, and the film thickness d50 of the Ni film 50 is about 0.1 to 0.2 μm.

After the steps shown in FIG. 1 to FIG. 6, the ceramic green sheet 1 is raised in the direction indicated by the arrow m3, and further passed through an ion exchange water tank (not shown) so that the catalyst application surface 10 and the plating film 6 are formed. Wash with water and dry. Furthermore, a step of laminating ceramic green sheets 1 printed with Ni film 50 to produce a sheet laminate, a step of cutting the sheet laminate to a predetermined size to create a laminate green chip, and a laminate green chip For example, if a step of firing in a gas composed of N ₂ , H ₂ and H ₂ 0 at 1200 ° C. for 2 hours, and further steps such as terminal electrode formation are performed, the multilayer chip component shown in FIG. 7 is obtained. It is done. The film thickness of the final internal electrode film obtained through the above steps is about 0.1 to 0.2 μm.

  As described above, in the catalyst pattern forming apparatus described with reference to FIG. 1, the first transfer material 31 impregnated with the first catalyst solution 32 is brought into contact with the ceramic green sheet 1 to provide the catalyst application surface 10. In addition, the first catalyst pattern 320 is formed by the first catalyst solution 32, and the second transfer material 41 impregnated with the second catalyst solution 42 on the first catalyst pattern 320 is used to activate the first catalyst pattern 320. Since the second catalyst pattern 420 is formed by the second catalyst solution 42 as the agent, the first catalyst pattern 320 can be activated.

  Moreover, since the number of processes is small, the processing time is short, and the work efficiency is improved. For example, a process of immersing the ceramic green sheet 1 in the first and second catalyst solutions 32 and 42, a resist coating process for forming the first and second catalyst patterns 320 and 420, or a masking process, respectively. The number of processes such as can be reduced. Therefore, it is possible to provide an electroless plating film forming method and a catalyst pattern forming apparatus that are inexpensive and highly productive.

  In addition, since the first and second catalyst patterns 320 and 420 are formed using the first and second transfer materials 31 and 41, various transfer patterns of the first and second transfer materials 31 and 41 can be used. First and second catalyst patterns 320 and 420 may be formed.

  Further, since the first and second catalyst patterns 320 and 420 are formed only in the portions where the first and second transfer materials 31 and 41 are in contact with the ceramic green sheet 1, the first and second catalyst solutions Damage to the ceramic green sheet 1 due to 32 and 42 can be minimized. Therefore, a high quality laminated electronic component can be obtained.

  In the present invention, electroless plating is further applied to the first and second catalyst patterns 320 and 420 formed as described above. Thereby, the Ni film 50 used as the electrode pattern can be formed thin.

  Further, since the first and second catalyst patterns 320 and 420 are formed on the ceramic green sheet 1 and the Ni film 50 is directly formed on the ceramic green sheet 1, the working efficiency is improved. For example, the step of transferring the Ni film 50 from another sheet to be plated to the ceramic green sheet 1 can be reduced. Therefore, the number of processes can be reduced, and a highly productive electroless plating film forming method and catalyst pattern forming apparatus can be provided.

  Furthermore, since the Ni film 50 is directly formed on the ceramic green sheet 1, the adhesion between the Ni film 50 and the ceramic green sheet 1 can be secured, and a high-quality multilayer electronic component can be obtained.

  According to the composition of the electroless plating bath 5 described with reference to FIG. 6, the plating bath 5 is added with DMAB (dimethylamine borane) as a reducing agent, and the Ni—B compound is formed on the ceramic green sheet 1. Therefore, boron is vitrified by firing, and the adhesion between the internal electrode obtained by firing the Ni film 50 and the ceramic green sheet 1 is improved.

  In addition, since the Ni film 50 is formed only in the application region of the first and second catalyst patterns 320 and 420 on the ceramic green sheet 1, the Ni film 50 can be formed with high accuracy.

  In a preferred embodiment of the electroless plating film forming method according to the present invention, the first and second catalyst patterns 320 and 420 are performed using the rotating rollers 30 and 40. According to this configuration, an electroless plating film forming method and a catalyst pattern forming apparatus with high productivity can be realized.

  In the screen printing method, there is a limit to the thinning of the internal electrode due to the size of the Ni particles contained in the paste itself. On the other hand, in the electroless plating according to an embodiment of the present invention, since Ni is formed on the sheet from an atomic state, it can be formed to be 25 to 90% thinner than the conventional technique. The electrode pattern (Ni film 50) formed by electroless plating is more suitable for thinning than the paste printing method, and can correspond to a film thickness of about 0.1 μm as an experimental value.

  In addition, when the electrical characteristics and structural defects of the multilayer electronic component shown in FIG. 7 were examined, the electrode coverage was better and the capacity could be increased compared to the conventional method, so that the electrical characteristics were good, and cracks and non-lamination were achieved. Chip components with few structural defects such as delamination could be obtained.

  9 and 10 are views showing another embodiment of the catalyst pattern forming apparatus according to the present invention. 9 and 10, the same reference numerals are given to the same components as those shown in FIGS. 1 to 8.

  The catalyst pattern forming apparatus for electroless plating shown in FIGS. 9 and 10 shows rotating rollers 30 and 40 assuming a so-called gravure printing method.

  As described with reference to FIGS. 1 to 8, one of the characteristic parts of the present invention is that the ceramic green sheet 1 is used from the viewpoints of work efficiency, productivity improvement, and quality maintenance of the final product. The first and second catalyst patterns 320 and 420 are formed by transfer using the first and second transfer materials 31 and 41. Therefore, if the 1st and 2nd catalyst solvents 32 and 42 are transcribe | transferred to the ceramic green sheet 1, and the 1st and 2nd catalyst patterns 320 and 420 by the 1st and 2nd catalyst solvents 32 and 42 can be formed, The specific shapes of the first and second transfer materials 31 and 41, the specific structures of the first and second supports 30 and 40 on which the first and second transfer materials 31 and 41 are provided, etc. are free. Can be set to For example, the first and second supports 30 and 40 are not limited to a roller type using the rotating rollers 30 and 40, and may be a stamp type that moves up and down.

  Although the contents of the present invention have been specifically described with reference to the preferred embodiments, various modifications can be made by those skilled in the art based on the basic technical idea and teachings of the present invention. Is self-explanatory.

It is a figure which shows one Embodiment of the catalyst pattern formation apparatus which concerns on this invention. It is a figure which shows the catalyst pattern formation method using the catalyst pattern formation apparatus shown in FIG. It is sectional drawing which expands and shows a part of ceramic green sheet obtained by the process of FIG. It is a figure which shows the process after the process shown in FIG. It is sectional drawing which expands and shows a part of ceramic green sheet obtained by the process of FIG. It is a figure which shows the electroless-plating process after the process shown in FIG. It is sectional drawing which expands and shows a part of ceramic green sheet obtained by the process of FIG. FIG. 8 is a cross-sectional view of a multilayer electronic component obtained through the steps shown in FIGS. 2 to 7. It is a figure which shows another embodiment of the catalyst pattern formation apparatus which concerns on this invention. It is a figure which shows another embodiment of the catalyst pattern formation apparatus which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Ceramic green sheet 3 1st transfer apparatus 30 1st support body 31 1st transfer material 32 1st catalyst solution 320 1st catalyst pattern 4 2nd transfer apparatus 40 2nd support body 41 2nd Transfer material 42 Second catalyst solution 420 Second catalyst pattern

Claims (7)

A method for manufacturing a laminated electronic component, comprising:
In the first transfer device, a step of bringing a transfer material impregnated with a catalyst solution into contact with a catalyst application surface of a ceramic green sheet, transferring the catalyst solution to the catalyst application surface, and forming a catalyst solution layer;
In the second transfer device, the transfer material impregnated with the solution of the catalyst activator is brought into contact with the surface of the catalyst solution layer, and the solution of the catalyst activator is transferred onto the surface of the catalyst solution layer. Forming an agent layer;
A plating film forming step of performing electroless plating treatment on the surface of the catalyst activator layer;
Laminating the ceramic green sheets on which the plating film is formed to obtain a laminate;
Cutting the laminate to create a green chip,
Further, the catalyst solution layer is a catalyst pattern used as a sensitizer, and is formed on the catalyst application surface at a predetermined pitch interval,
The catalyst activator layer is a catalyst pattern used as an activator, formed only on the surface of the catalyst solution layer, and constitutes a catalyst pattern layer together with the catalyst solution layer,
A method for manufacturing a laminated electronic component. A method for manufacturing a laminated electronic component according to claim 1,
Each of the step of forming the catalyst solution layer and the step of forming the catalyst activator layer is performed using a rotating roller.
A method for manufacturing a laminated electronic component. A method for manufacturing a laminated electronic component according to claim 1 or 2,
The catalyst solution is a tin chloride aqueous solution,
The catalyst activator solution is an aqueous palladium chloride solution,
A method for manufacturing a laminated electronic component. An apparatus for forming a catalyst pattern layer for electroless plating on the catalyst application surface of a ceramic green sheet, comprising a first transfer device and a second transfer device,
The first transfer device includes a first support, a first transfer material, and a catalyst solution,
The first support supports the first transfer material,
The first transfer material has a liquid retaining property with respect to the catalyst solution, and has a surface shape along the pattern shape of the catalyst pattern layer,
The catalyst solution is impregnated in the first transfer material, and when the surface of the first transfer material comes into contact with the catalyst application surface, the catalyst solution layer is transferred to the catalyst application surface through the contact portion. Configure
The second transfer device includes a second support, a second transfer material, and a solution of a catalyst activator,
The second support supports the second transfer material, and
The second transfer material has liquid retention properties with respect to the solution of the catalyst activator,
The catalyst activator solution is impregnated in the second transfer material, and when the surface of the second transfer material contacts the surface of the catalyst solution layer, the surface of the catalyst solution layer through the contact portion. To constitute the catalyst activator layer,
Furthermore, the catalyst solution layer is a catalyst pattern used as a sensitizer, and is formed on the catalyst application surface at a predetermined pitch interval,
The catalyst activator layer is a catalyst pattern used as an activator, formed only on the surface of the catalyst solution layer, and constitutes the catalyst pattern layer together with the catalyst solution layer,
Catalyst pattern forming device. The catalyst pattern forming apparatus according to claim 4 ,
The first support is a rotating roller, and includes the first transfer material on an outer peripheral surface of the roller.
The second support is a rotating roller, and includes the second transfer material on an outer peripheral surface of the roller.
Catalyst pattern forming device. The catalyst pattern forming apparatus according to claim 4 or 5,
The first transfer material has a convex piece shape,
Catalyst pattern forming device. The catalyst pattern forming apparatus according to any one of claims 4 to 6,
The catalyst solution is a tin chloride aqueous solution,
The catalyst activator solution is an aqueous palladium chloride solution,
Catalyst pattern forming device.

Images