JP3329995B2 - Method for manufacturing circuit board with electric components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to relates to manufacturing <br/> manufacturing method of a circuit board with electrical components mounted electrical components such as capacitors and resistors and diodes in a substrate formed by a printed circuit board or the like is intended, more particularly electrical components and chip components, to a method of joining the circuit board having a chip component.

[0002]

2. Description of the Related Art Conventionally, various methods have been employed for joining surface-mounted electrical components such as capacitors, resistors and diodes to the surface of a substrate formed of a printed circuit board or the like. JP-A-60-16349
No. 5 discloses the following method.

[0003] First as the first method FIG. 31 (a)
As shown in (b), a solder paste 54 is applied to the circuit pattern 13 such as a land provided on the upper surface of the substrate 1 by screen printing or the like, and the solder paste 54 is brought into contact with the electrode portion 14 of the electric component 5. The electric component 5 is placed on the solder paste 54 by irradiating the electrode portion 14 and the solder paste 54 with a laser 6 to heat and melt the solder paste 54. By curing the paste 54, the electric component 5 is
It is intended to be joined to.

FIG. 31C shows a second method.
As shown in (d), a circuit 55 for laser irradiation is provided alongside a circuit pattern 13 such as a land provided on the upper surface of the substrate 1, and a solder paste 54 is applied to the circuit pattern 13 by screen printing or the like. The electric component 5 is placed on the solder paste 54 so that the electrode part 14 of the electric component 5 is brought into contact with the electric component 5, and the laser 6 is irradiated to the laser irradiation circuit 55 by heating, and this heat is applied to the circuit pattern 13. The electric component 5 is joined to the substrate 1 by melting the solder paste 54 by being transmitted and then stopping the irradiation of the laser 6 to cure the solder paste 54.

[0005]

However, according to the first and second methods, since the solder paste 54 is applied by printing, the application position of the solder paste 54 is determined by the circuit pattern 13.
There is a problem that the printing may be performed out of alignment, and the solder paste 54 may be displaced, so that the joining position of the electric component 5 placed on the solder paste 54 may be shifted. In the first and second methods, since the solder pattern 54 and the electrode portion 14 of the electric component 5 are heated by irradiating the laser 6 in the atmosphere, the solder pattern 54 and the electrode portion 14 are protected from being oxidized. There is a problem that flux is required, so that after the electric component 5 is joined, cleaning must be performed to remove the flux.

In the first method, the laser 6 is directly applied to the electrode portion 14 of the electric component 5.
There was a possibility that the electric component 5 was heated and damaged. Further, as described above, since the solder paste 54 contains a flux and the laser 6 is directly applied to the solder paste 54, the flux and the solvent in the solder paste 54 rapidly evaporate and the solder and the flux are scattered. However, there is a problem that the circuit patterns 13 that are not to be conducted are conducted by the scattered solder and solder failure is likely to occur.

In the second method, since the laser 6 is irradiated to the laser irradiation circuit 55, the substrate 1 is heated via the laser irradiation circuit 55, and is affected by this heat. Therefore, there is a problem that the substrate 1 is damaged, such as being distorted or warped.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and can prevent breakage of an electric component or a substrate, does not cause a solder defect, and furthermore, determines a joint position of an electric component. It is an object of the present invention to provide a method of joining an electric component to a substrate and a circuit board having the electric component, which can be prevented from being shifted and need not be cleaned in addition to remove flux. .

[0009]

Method of manufacturing a circuit board comprising an electrical component according to claim 1 SUMMARY OF THE INVENTION The present invention includes a substrate 1 second electrodeposition
When manufacturing a circuit board having the electronic component 5,
1 and at least one of the concave portion 2 and the convex portion is formed.
Metal fittings 7 coated with metal 4
Provided and held with the electrical component 5 in contact with the brazing material 4
And a pulse beam of 1 ms or more and 100 ms or less is applied to the brazing material 4.
Irradiate at least one pulse or multiple pulses
The brazing material 4 is melted, and the electric components 5
Are joined.

[0010] Also the invention described in claim 2 of the present invention, a feature to hold in addition to the first aspect, the electrical component 5 in fittings 7 so as not to move along the surface of the substrate 1 Is what you do.

According to a third aspect of the present invention, in addition to the configuration of the first aspect , the electric component 5 is held by the metal fitting 7 so as not to move in a direction away from the surface of the substrate 1. Is what you do.

[0012] Also the invention described in claim 4 of the present invention, in addition to the first aspect, toward the mark 11 detects the marks 11 formed on the bracket 7 coated with brazing material beam 6 Is irradiated.

[0013]

Embodiments of the present invention will be described below.

[0014] FIG. 3 shows an example of implementation in the form of a circuit board with electrical components. In this embodiment, the substrate 1
A pair of recesses 2 penetrating the circuit pattern 13 is provided on the upper surface of the portion around the portion where the electric component 5 is mounted. Each of the recesses 2 on the upper surface of the substrate 1 is provided with a pair of metal fittings 7 coated with a brazing material 4. The metal fitting 7 is formed by projecting an insertion portion 17 on the lower surface, and the outer surface of the metal fitting 7 is coated with the brazing material 4 by any method such as plating, sputtering, vapor deposition, or cladding.

Next, an embodiment of a method for manufacturing a circuit board provided with the electric components shown in FIG. 3 will be described. First, a pair of recesses 2 are provided in the substrate 1 through the circuit pattern 13. The recess 2 may be formed in a groove shape opening on the upper surface of the substrate 1 as shown in FIGS. 2A and 2B, or may be formed on both the upper surface and the lower surface of the substrate 1 as shown in FIGS. 2 (e) and 2 (f), or a bottomed circular hole as shown in FIGS. 2 (e) and 2 (f), or the substrate 1 as shown in FIGS. 2 (g) and 2 (h). It is formed on the substrate 1 by being formed into a circular hole opening on both the upper surface and the lower surface. Then figure
As shown in FIG. 4 (a), the insert 7 is inserted into the recess 2, and the brazing material 4 on the lower surface of the metal fitting 7 is brought into contact with the circuit pattern 13. The electric component 5 is placed on the metal fitting 7 so that Next, as shown in FIG. 4 (b) fitting 7
The brazing material 4 is heated and melted by irradiating the beam 6 from above only to the (brazing material 4). By re-cure the brazing material 4 to stop the irradiation of the beam 6 Next, and FIG. 4 (c)
As shown in FIG. 3, the substrate 1, the metal fittings 7, and the electrode portions 14 of the electrical components 5
And can be bonded simultaneously.

As described above, in this embodiment, the substrate 1
The insertion part 17 of the metal fitting 7 is inserted into the concave part 2 of the substrate 1 so that the metal fitting 7 is provided on the substrate 1, so that the positioning of the metal fitting 7 can be easily performed, so that the joining position of the electric component 5 to the substrate 1 does not shift. You can do so. In addition, the insertion portion 17 of the metal fitting 7 is inserted and locked in the concave portion 2, so that when the electric component 5 is placed on the metal fitting 7, the metal fitting 7 does not move to cause displacement. Can be. Also, since the metal fitting 7 is not melted by the irradiation of the beam 6, the electric component 5 can be supported by the metal fitting 7,
The electric component 5 can be prevented from being shifted and joined to the metal fitting 7. Further, since the beam 6 is applied only to the metal fitting 7, heat is hardly transmitted to the electric component 5 and the substrate 1, and the electric component 5 and the substrate 1 can be prevented from being damaged by the beam 6. In addition, since the thickness of the brazing material 4 can be more easily controlled by the coating process such as plating than in the conventional screen printing, the supply amount of the brazing material 4 can be easily controlled to a constant amount.

FIG. 5 shows another embodiment of a method of manufacturing a circuit board having electric components. The metal fitting 7 of this embodiment is formed by a bottom portion 18 having a substantially circular plane, a support portion 20 protruding from a substantially central portion of the upper surface of the bottom portion 18, and an insertion portion 19 provided on the back surface of the bottom portion 18. The metal fitting 7 is formed by coating with the brazing material 4 by the above-described method.

When the electric component 5 is joined to the substrate 1, the insertion portion 19 is inserted into the concave portion 2 so that the brazing material 4 on the lower surface of the bottom portion 18 is brought into contact with the circuit pattern 13. 7, the supporting part 20 is brought into contact with the electrode part 14 on the lateral end face of the electric part 5, and the electric part 5 is placed between the metal fittings 7 so that the electrode part 14 is placed on the bottom part 18. The Couto 5 from above the bottom 18 as shown in (a) by irradiating a beam 6 is melted by heating the brazing material 4. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is cured again, whereby the substrate 1, the metal fitting 7, and the electrode portion 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, the substrate 1
The metal fitting 7 is provided on the substrate 1 by inserting the fitting portion 19 of the metal fitting 7 into the concave portion 2 of the substrate 1, so that the positioning of the metal fitting 7 can be easily performed, and the joining position of the electric component 5 to the substrate 1 is shifted. Can not be. Also, the insertion portion 19 of the metal fitting 7 is inserted and locked in the concave portion 2, so that when the electric component 5 is placed on the metal fitting 7, the metal fitting 7 does not move to cause a positional shift. .
Further, by sandwiching the electric component 5 with the metal fitting 7, it is possible to prevent the electric component 5 from moving and causing displacement.

FIG. 6 shows another embodiment of a method of manufacturing a circuit board having electric components. The metal fitting 7 of this embodiment is formed in a substantially L-shaped cross section by a plate-shaped bottom portion 18 and a support portion 20 protruding from an upper surface of the bottom portion 18, and an insertion portion 19 is provided on the back surface of the bottom portion 18. The metal fitting 7 is formed by coating with the brazing material 4 by the above-described method.

When the electric component 5 is joined to the substrate 1, the insertion portion 19 is inserted into the concave portion 2 so that the brazing material 4 on the lower surface of the bottom portion 18 contacts the circuit pattern 13, and a pair of metal fittings is attached to the substrate 1. The metal part 7 is provided by contacting the electrode part 14 on the end face in the short direction of the electric component 5 with the support part 20.
The electric component 5 is installed therebetween. The Couto 6 (a) by irradiating a beam 6 from above heating and melting the brazing material 4 in the bottom 18 as shown in. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is hardened again, so that the substrate 1 and the metal
And the electrode part 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, the substrate 1
The metal fitting 7 is provided on the substrate 1 by inserting the fitting portion 19 of the metal fitting 7 into the concave portion 2 of the substrate 1, so that the positioning of the metal fitting 7 can be easily performed, and the joining position of the electric component 5 to the substrate 1 is shifted. Can not be. Also, the insertion portion 19 of the metal fitting 7 is inserted and locked in the concave portion 2, so that when the electric component 5 is placed on the metal fitting 7, the metal fitting 7 does not move to cause a positional shift. .
Further, by sandwiching the electric component 5 with the metal fitting 7, it is possible to prevent the electric component 5 from moving and causing displacement.

FIG. 7 shows another embodiment of a method of manufacturing a circuit board provided with electric components. The metal fitting 7 of this embodiment is formed in a plate shape, and the metal fitting 7 is formed by coating with the brazing material 4 by the above-described method.

In joining the electric component 5 to the substrate 1, the lower end of the metal fitting 7 is inserted into the recess 2 so that the brazing material 4
A pair of metal fittings 7 is provided on the substrate 1 so that the metal part 7 is in contact with the circuit pattern 13 in the concave part 2. 5 is installed. This bracket 7 as shown in Couto 7 irradiated with the beam 6 from the side by heating the brazing material 4 is melted. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is cured again, whereby the substrate 1, the metal fitting 7, and the electrode portion 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, the substrate 1
Since the lower end of the metal fitting 7 is inserted into the concave portion 2 and provided on the substrate 1, the positioning of the metal fitting 7 can be easily performed, and therefore, the joining position of the electric component 5 with respect to the substrate 1 can be prevented from shifting. it can. The metal fitting 7 is the concave 2
Therefore, when the electric component 5 is mounted on the metal fitting 7, the metal fitting 7 is prevented from moving and causing a positional shift. Further, by sandwiching the electric component 5 with the metal fitting 7, it is possible to prevent the electric component 5 from moving and causing displacement.

FIG. 8 shows another embodiment of a method of manufacturing a circuit board having electric components. The metal fitting 7 of this embodiment is formed by a bottom portion 18 having a substantially circular plane, a support portion 20 protruding from a substantially central portion of the upper surface of the bottom portion 18, and an insertion portion 19 provided on the back surface of the bottom portion 18. The metal fitting 7 is formed by coating with the brazing material 4 by the above-described method. Further it is through-holes 21 to the electrode portion 14 of the electrical components 5 which penetrates the upper and lower surfaces, as shown in FIG. 8 (a) is formed.

[0027] Then when joining electrical components 5 on the substrate 1, and FIG. 8 (b) circuit lower surface of the brazing material 4 of the bottom 18 of the insertion portion 19 as shown in (c) is inserted into the recess 2 pattern 13 A pair of metal fittings 7 is provided on the substrate 1 so as to be in contact with the substrate 1, the through hole 21 of the electric component 5 is inserted into the support 20 from above, the electrode 14 is brought into contact with the support 20, and the electrode is placed on the bottom 18. The electric component 5 is installed between the metal fittings 7 so that the electronic component 5 is placed thereon. Brazing material 4 from above to the bottom 18 as shown in Couto 8 (c) by irradiating a beam 6
Is heated and melted. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is cured again, whereby the substrate 1, the metal fitting 7, and the electrode portion 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, the substrate 1
The metal fitting 7 is provided on the substrate 1 by inserting the fitting portion 19 of the metal fitting 7 into the concave portion 2 of the substrate 1, so that the positioning of the metal fitting 7 can be easily performed, and the joining position of the electric component 5 to the substrate 1 is shifted. Can not be. Also, the insertion portion 19 of the metal fitting 7 is inserted and locked in the concave portion 2, so that when the electric component 5 is placed on the metal fitting 7, the metal fitting 7 does not move to cause a positional shift. .
Further, by inserting the support portion 20 of the metal fitting 7 into the through hole 21 of the electric component 5, it is possible to prevent the electric component 5 from moving and causing a positional shift.

FIG. 9 shows another embodiment of a method of manufacturing a circuit board provided with electric components. The metal fitting 7 of this embodiment is formed by a bottom portion 18 having a substantially circular plane, a support portion 20 protruding from a substantially central portion of the upper surface of the bottom portion 18, and an insertion portion 19 provided on the back surface of the bottom portion 18. The metal fitting 7 is formed by coating with the brazing material 4 by the above-described method. Further it is formed a groove portion 22 which opens in the lateral direction of the side surfaces of the upper and lower surfaces and the electrical components 5 to the electrode portion 14 of the electrical component 5 shown in FIG. 9 (a).

When the electric component 5 is joined to the substrate 1, as shown in FIGS. 9 (b) and 9 (c), the insertion portion 19 is inserted into the concave portion 2 and the brazing material 4 on the lower surface of the bottom portion 18 is removed. A pair of metal fittings 7 is provided on the substrate 1 so as to make contact with the substrate 1, and the support portion 20 is fitted into the groove portion 22 of the electric component 5 so that the support portion 20 comes into contact with the electrode portion 14, and
The electric component 5 is placed between the metal fittings 7 so that the electrode part 14 is placed on the metal part 8. The Couto 9 at the bottom 18 as shown in (c) by irradiating a beam 6 from above heating and melting the brazing material 4. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is cured again, whereby the substrate 1, the metal fitting 7, and the electrode portion 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, the substrate 1
The metal fitting 7 is provided on the substrate 1 by inserting the fitting portion 19 of the metal fitting 7 into the concave portion 2 of the substrate 1, so that the positioning of the metal fitting 7 can be easily performed, and the joining position of the electric component 5 to the substrate 1 is shifted. Can not be. Also, the insertion portion 19 of the metal fitting 7 is inserted and locked in the concave portion 2, so that when the electric component 5 is placed on the metal fitting 7, the metal fitting 7 does not move to cause a positional shift. .
Further, by inserting the support portion 20 of the metal fitting 7 into the electric component 5, it is possible to prevent the electric component 5 from moving along the surface of the substrate 1 and causing a position shift.

FIG. 10 shows another embodiment of a method of manufacturing a circuit board having electric components. The metal fitting 7 of this embodiment is formed in a substantially L-shaped cross section by a plate-shaped bottom portion 18 and a support portion 20 protruding from an upper surface of the bottom portion 18.
Is formed with an insertion portion 19 on the back surface thereof, and the metal fitting 7 is formed by coating with the brazing material 4 by the above-described method. Further, the support portion 20 is slightly bent toward the bottom portion 18, so that the support portion 20 is formed to have a spring property.

When joining the electric component 5 to the substrate 1, the insertion portion 19 is inserted into the concave portion 2 so that the brazing material 4 on the lower surface of the bottom portion 18 contacts the circuit pattern 13, and a pair of metal fittings is attached to the substrate 1. 7 is provided, and the supporting part 20 is brought into contact with the electrode part 14 on the end face in the short direction of the electric component 5 so that the metal fitting 7 is provided.
The electric component 5 is inserted and installed from above. Beam from above the bottom 18 as shown in Couto 10 (b) 6
To heat and melt the brazing material 4. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is cured again, whereby the substrate 1, the metal fitting 7, and the electrode portion 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, the substrate 1
The metal fitting 7 is provided on the substrate 1 by inserting the fitting portion 19 of the metal fitting 7 into the concave portion 2 of the substrate 1, so that the positioning of the metal fitting 7 can be easily performed, and the joining position of the electric component 5 to the substrate 1 is shifted. Can not be. Also, the insertion portion 19 of the metal fitting 7 is inserted and locked in the concave portion 2, so that when the electric component 5 is placed on the metal fitting 7, the metal fitting 7 does not move to cause a positional shift. .
Further, the electric component 5 is sandwiched between the support portions 20 of the metal fittings 7 having spring properties, so that the electric component 5 is firmly held by the elastic force of the support portion 20 so that the electric component 5 does not move to cause displacement. be able to.

FIG. 11 shows another embodiment of a method of manufacturing a circuit board having electric components. The metal fitting 7 of this embodiment is formed in a substantially L-shaped cross section by a plate-shaped bottom portion 18 and a support portion 20 protruding from an upper surface of the bottom portion 18.
Is formed with an insertion portion (not shown) on the back surface of
Further, sandwiching pieces 23 are provided on both sides of the support portion 20.
The sandwiching piece 23 is bent toward the inside of the metal fitting 7 toward the front end, so that the sandwiching piece 23 is formed to have a spring property. The metal fitting 7 is formed by coating with the brazing material 4 by the above-described method.

When the electric component 5 is joined to the substrate 1, the insertion portion is inserted into the concave portion 2 so that the brazing material 4 on the lower surface of the bottom portion 18 contacts the circuit pattern 13, and a pair of metal fittings 7 are attached to the substrate 1. Are provided with the sandwiching pieces 23 facing each other,
The sandwiching piece 23 is connected to the electrode portion 14 on the end face of the electrical component 5 in the longitudinal direction.
And the electric component 5 is inserted between the metal fittings 7 from above and installed. Bottom 18, as shown in Couto 11 (b)
The brazing material 4 is heated and melted by irradiating a beam 6 from above. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is hardened again, whereby the substrate 1, the metal fitting 7, and the electric component 5 are hardened.
Can be simultaneously bonded to the electrode portion 14.

As described above, in this embodiment, the substrate 1
The fitting portion of the metal fitting 7 is inserted into the concave portion 2 of the
Is provided, the positioning of the metal fitting 7 can be easily performed, and thus the joining position of the electric component 5 with respect to the substrate 1 can be prevented from shifting. In addition, the fitting portion of the metal fitting 7 is inserted into the concave portion 2 and locked,
Therefore, when the electric component 5 is placed on the metal fitting 7, the metal fitting 7 is prevented from moving and causing a positional shift. Further, the electric component 5 is sandwiched between the clip pieces 23 of the metal fitting 7 having spring properties, whereby the electric component 5 is firmly held by the clip pieces 23, and the electric component 5 moves along the surface of the substrate 1 to cause positional displacement. Can not be.

FIG. 12 shows another embodiment of a method of manufacturing a circuit board provided with electric components. The metal fitting 7 of this embodiment is formed by a bottom portion 18 having a substantially circular plane, a support portion 20 protruding from a substantially central portion of the upper surface of the bottom portion 18, and an insertion portion 19 provided on the back surface of the bottom portion 18. In addition, a burr piece 24 protrudes from an upper portion of the support portion 20. The metal fitting 7 is formed by coating with the brazing material 4 by the above-described method.

When joining the electric component 5 to the substrate 1, the insertion portion 19 is inserted into the concave portion 2 and the bottom portion 1 is inserted.
A pair of metal fittings 7 are provided on the substrate 1 with the barb pieces 24 facing each other so that the brazing material 4 on the lower surface of the electrical component 8 contacts the circuit pattern 13. 14 and contact the electrode 1 on the bottom 18.
4, and furthermore, the electric component 5 is installed between the metal fittings 7 so that the barbs 24 are locked on the upper surface of the electric component 5.
Then, a beam is irradiated from above onto the bottom portion 18 to heat and melt the brazing material 4. Next, the irradiation of the beam is stopped and the brazing material 4 is cured again, whereby the substrate 1, the metal fitting 7, and the electrode portion 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, the substrate 1
The metal fitting 7 is provided on the substrate 1 by inserting the fitting portion 19 of the metal fitting 7 into the concave portion 2 of the substrate 1, so that the positioning of the metal fitting 7 can be easily performed, and the joining position of the electric component 5 to the substrate 1 is shifted. Can not be. Also, the insertion portion 19 of the metal fitting 7 is inserted and locked in the concave portion 2, so that when the electric component 5 is placed on the metal fitting 7, the metal fitting 7 does not move to cause a positional shift. .
Further, by locking the burrs 24 of the metal fittings 7 on the upper surface of the electric component 5, the electric component 5 is prevented from floating and moving in a direction away from the upper surface of the substrate 1 to cause a position shift. be able to.

FIG. 13 shows another embodiment of a method of manufacturing a circuit board having electric components. The metal fitting 7 of this embodiment is formed in a substantially L-shaped cross section by a plate-shaped bottom portion 18 and a support portion 20 protruding from an upper surface of the bottom portion 18.
Is formed with an insertion portion 19 on the back surface thereof, and a contact piece 25 is provided on one side end of the support portion 20.
The metal fitting 7 is formed by coating with the brazing material 4 by the above-described method.

When the electric component 5 is joined to the substrate 1, the insertion portion is inserted into the concave portion 2 so that the brazing material 4 on the lower surface of the bottom portion 18 contacts the circuit pattern 13, and a pair of metal fittings 7 are attached to the substrate 1. Are provided with the contact pieces 25 facing each other,
Figure 13 abutting piece 25 to the electrical components 5 of the contact piece 25 at one longitudinal direction of the other with contacting the electrode portion 14 of the end face of the fitting 7 of the electrical components 5 of one bracket 7 as shown in (b) The electrode part 14 on the other longitudinal end face of the
The electric component 5 is installed therebetween. The Couto 13 brazing material 4 is irradiated with a beam 6 from above the bottom 18 as shown in (a)
Is heated and melted. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is cured again, whereby the substrate 1, the metal fitting 7, and the electrode portion 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, the substrate 1
The metal fitting 7 is provided on the substrate 1 by inserting the fitting portion 19 of the metal fitting 7 into the concave portion 2 of the substrate 1, so that the positioning of the metal fitting 7 can be easily performed, and the joining position of the electric component 5 to the substrate 1 is shifted. Can not be. Also, the insertion portion 19 of the metal fitting 7 is inserted and locked in the concave portion 2, so that when the electric component 5 is placed on the metal fitting 7, the metal fitting 7 does not move to cause a positional shift. .
In addition, the contact piece 25 of the metal fitting 7 is held in contact with the side surface of the electric component 5 so that the electric component 5 is firmly held by the contact piece 25, and the electric component 5 moves along the upper surface of the substrate 1. A shift can be prevented.

FIG. 14 shows another embodiment of a method of manufacturing a circuit board having electric components. The metal fitting 7 of this embodiment is formed in a substantially L-shaped cross section by a plate-shaped bottom portion 18 and a support portion 20 protruding from an upper surface of the bottom portion 18.
The back surface of the support member 20 is provided with an insertion portion 19, and a contact piece 25 is provided on both side ends of the support portion 20.
The metal fitting 7 is formed by coating with the brazing material 4 by the above-described method.

When the electric component 5 is joined to the substrate 1, the insertion portion is inserted into the concave portion 2 so that the brazing material 4 on the lower surface of the bottom portion 18 contacts the circuit pattern 13, and a pair of metal fittings 7 are attached to the substrate 1. As shown in FIG. 14 (b), the electric parts 5 are installed between the metal fittings 7 so that the contact portions 25 of the metal fittings 7 are brought into contact with the electrode portions 14 on both end faces in the longitudinal direction of the electric parts 5. . The Couto 14 (a) by irradiating a beam 6 from above the bottom 18 as shown in heating and melting the brazing material 4. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is cured again, whereby the substrate 1, the metal fitting 7, and the electrode portion 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, the substrate 1
The metal fitting 7 is provided on the substrate 1 by inserting the fitting portion 19 of the metal fitting 7 into the concave portion 2 of the substrate 1, so that the positioning of the metal fitting 7 can be easily performed, and the joining position of the electric component 5 to the substrate 1 is shifted. Can not be. Also, the insertion portion 19 of the metal fitting 7 is inserted and locked in the concave portion 2, so that when the electric component 5 is placed on the metal fitting 7, the metal fitting 7 does not move to cause a positional shift. .
Also, by contacting and holding the contact pieces 25 of the metal fitting 7 on both sides of the electric component 5, the electric component 5 is firmly held by the contact pieces 25, and the electric component 5 moves along the upper surface of the substrate 1. It is possible to prevent the displacement.

FIG. 15 shows another embodiment of a method of manufacturing a circuit board having electric components. The metal fitting 7 of this embodiment is provided with a plate-shaped bottom portion 18, a support portion 20 protruding from the upper surface of the bottom portion 18, and a holding piece 26 projecting from the upper end of the support portion 20 to the side opposite to the bottom portion 18. It has a substantially S-shaped cross section, and further has an insertion portion (not shown) on the back surface of the bottom portion 18. The metal fitting 7 is formed by coating with the brazing material 4 by the above-described method.

In joining the electric component 5 to the substrate 1, the supporting portion 20 of the metal fitting 7 and the holding piece 26 are brought into contact with the end surface and the upper surface of the electrode portion 14 of the electric component 5, respectively, so that both sides of the electric component 5 A metal fitting 7 is provided on the bottom 1 in this state.
8 the lower surface of the brazing material 4 is disposed an electric component 5 and a pair of brackets 7 on the substrate 1 by inserting the insertion portion into the recess 2 so as to contact with the circuit pattern 13, the bottom 1 as shown in FIG. 15
8 is irradiated with a beam 6 from above to heat and melt the brazing material 4. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is cured again, whereby the substrate 1, the metal fitting 7, and the electrode portion 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, the substrate 1
The fitting portion of the metal fitting 7 is inserted into the concave portion 2 of the
Is provided, the positioning of the metal fitting 7 can be easily performed, and thus the joining position of the electric component 5 with respect to the substrate 1 can be prevented from shifting. Further, by contacting the holding piece 26 of the metal fitting 7 with the upper surface of the electric component 5, the electric component 5 is firmly held on the substrate 1 by the holding piece 26, so that the electric component 5 floats, and the electric component 5 is attached to the board 1.
To move away from the upper surface of the device so as not to cause displacement.

FIG. 16 shows another embodiment of a method of manufacturing a circuit board having electric components. The metal fitting 7 of this embodiment includes a plate-like bottom portion 18, a support portion 20 protruding from the upper surface of the bottom portion 18, a holding piece 26 projecting from the upper end of the support portion 20 on the opposite side to the bottom portion 18, It is formed by contact pieces 25 provided on both sides of the portion 20, and further, an insertion portion (not shown) is provided on the back surface of the bottom portion 18. The metal fitting 7 is formed by coating with the brazing material 4 by the above-described method.

In joining the electric component 5 to the substrate 1, the supporting portion 20, the holding piece 26, and the contact piece 25 of the metal fitting 7 are brought into contact with the end surface, the upper surface, and the side surface of the electrode portion 14 of the electric component 5, respectively. To provide metal fittings 7 on both sides of the electrical component 5,
In this state, the brazing material 4 on the lower surface of the bottom 18 is
So as to contact with the 3 disposed a pair of brackets 7 and the electrical components 5 on the substrate 1 by inserting the insertion portion into the recess 2, by irradiating a beam 6 from above the bottom 18 as shown in FIG. 16 wax The material 4 is heated and melted. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is cured again, whereby the substrate 1, the metal fitting 7, and the electrode portion 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, the substrate 1
The fitting portion of the metal fitting 7 is inserted into the concave portion 2 of the
Is provided, the positioning of the metal fitting 7 can be easily performed, and thus the joining position of the electric component 5 with respect to the substrate 1 can be prevented from shifting. Further, by contacting the holding piece 26 of the metal fitting 7 with the upper surface of the electric component 5, the electric component 5 is firmly held on the substrate 1 by the holding piece 26, so that the electric component 5 floats, and the electric component 5 is attached to the board 1.
To move away from the upper surface of the device so as not to cause displacement. Further, by bringing the contact piece 25 of the metal fitting 7 into contact with the side surface of the electric component 5, the contact piece 25
Thus, the electric component 5 can be firmly held on the substrate 1 so as to prevent the electric component 5 from moving along the upper surface of the substrate 1 and causing a displacement.

FIG. 17 shows another embodiment of a method of manufacturing a circuit board having electric components. The metal fitting 7 of this embodiment includes a holding piece 26, holding pieces 27 formed at both ends of the holding piece 26 so as to protrude downward, and a bottom portion provided at an end of each holding piece 27 so as to protrude outward. 18, and an insertion portion (not shown) is provided on the back surface of the bottom portion 18. The metal fitting 7 is formed by coating with the brazing material 4 by the above-described method.

In joining the electric component 5 to the substrate 1, the holding piece 26 and the holding piece 27 of the metal fitting 7 are respectively brought into contact with the upper surface and the side surface of the electrode portion 14 of the electric component 5, and the metal fitting is provided on both sides of the electric component 5. In this state, the fitting portion is inserted into the concave portion 2 so that the brazing material 4 on the lower surface of the bottom portion 18 contacts the circuit pattern 13, and a pair of metal fittings 7 are attached to the substrate 1.
Then, the electric parts 5 are arranged, and the bottom 6 is irradiated with the beam 6 from above as shown in FIG. 17 to heat and melt the brazing material 4. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is cured again, whereby the substrate 1, the metal fitting 7, and the electrode portion 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, the substrate 1
The metal fitting 7 is provided on the substrate 1 by inserting the fitting portion 19 of the metal fitting 7 into the concave portion 2 of the substrate 1, so that the positioning of the metal fitting 7 can be easily performed, and the joining position of the electric component 5 to the substrate 1 is shifted. Can not be. Also, by contacting the pressing piece 26 of the metal fitting 7 with the upper surface of the electric component 5, the electric component 5 is firmly held on the substrate 1 by the pressing piece 26, and the electric component 5 moves away from the upper surface of the substrate 1. A shift can be prevented. Further, by contacting the holding piece 27 of the metal fitting 7 with the side surface of the electric component 5, the electric component 5 is firmly held on the substrate 1 by the holding piece 27, and the electric component 5 moves along the upper surface of the substrate 1 and is displaced. Can be prevented.

FIG. 18 shows another embodiment of a method of manufacturing a circuit board provided with electric components. The metal fitting 7 according to this embodiment includes a bottom portion 18 formed in a substantially circular plane, a support portion 20 protruding from a substantially central portion of the upper surface of the bottom portion 18, and a substantially circular flat surface formed on an upper end of the support portion 20. And a fixing piece 28 of
It is formed by an insertion portion 19 provided on the back surface of the bottom portion 18, and the metal fitting 7 is formed by coating with the brazing material 4 by the above-described method.

When bonding the electric component 5 to the substrate 1, the electrode portion 14 of the electric component 5 is connected to the bottom 18 of the metal fitting 7.
Between the bottom 18 and the fixing piece 2.
8 is brought into contact with the bottom surface and the top surface of the electrode portion 14, respectively, and the metal fittings 7 are provided on both sides of the electric component 5. In this state, the brazing material 4 on the bottom portion 18 is brought into contact with the circuit pattern 13 so that the insertion portion 19 is formed. It arranged electrical components 5 and a pair of brackets 7 on the substrate 1 is inserted into the recess 2, by heating the brazing material 4 is irradiated with a beam 6 from above the fixing piece 28 as shown in FIG. 18 (a) melt Let it. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is cured again, whereby the substrate 1, the metal fitting 7, and the electrode portion 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, the substrate 1
The metal fitting 7 is provided on the substrate 1 by inserting the fitting portion 19 of the metal fitting 7 into the concave portion 2 of the substrate 1, so that the positioning of the metal fitting 7 can be easily performed, and the joining position of the electric component 5 to the substrate 1 is shifted. Can not be. Also, by contacting the fixing piece 28 of the metal fitting 7 to the upper surface of the electric component 5, the electric component 5 is firmly held on the substrate 1 by the fixing piece 28, and the electric component 5 moves away from the upper surface of the substrate 1 to move to the position. A shift can be prevented.

FIG. 19 shows another embodiment of a method of manufacturing a circuit board provided with electric components. The metal fitting 7 of this embodiment is formed by a fixing piece 28 having a substantially circular plane and a support portion 20 protruding from a substantially central portion of the lower surface of the fixing piece 28. The metal fitting 7 is formed by the above-described method. It is formed by coating with brazing material 4. Further it is through-holes 21 to the electrode portion 14 of the electrical components 5 which penetrates the upper and lower surfaces, as shown in FIG. 19 (a) is formed.

Then, the electric component 5 is joined to the substrate 1.
At the beginning, figure19(B) Through-hole as shown in (c)
The support portion 20 is inserted into the upper portion 21 from the upper side, and the fixing piece 28 is inserted.
The brazing material 4 on the lower surface of the
A pair of metal fittings 7 are provided on the component 5 and project from the lower surface of the electrical component 5.
Insert the lower end of the supporting portion 20 into the recess 2 and remove the brazing material 4
The contact is made with the circuit pattern 13 in the
The air component 5 and the metal fitting 7 are set on the substrate 1. After this figure19
As shown in (c), the beam 6 is illuminated onto the fixing piece 28 from above.
The brazing material 4 is heated and melted. Next, beam 6
By stopping the irradiation and curing the brazing material 4 again,
The substrate 1, the metal fitting 7, and the electrode part 14 of the electric component 5 at the same time.
Can be joined.

As described above, in this embodiment, the substrate 1
The supporting portion 20 of the metal fitting 7 is inserted into the concave portion 2 so that the metal fitting 7 is provided on the substrate 1, so that the positioning of the metal fitting 7 can be easily performed, and therefore, the joining position of the electric component 5 to the substrate 1 does not shift. You can do so. Further, by inserting the support portion 20 of the metal fitting 7 into the electric component 5, it is possible to prevent the electric component 5 from moving and causing displacement. Also, by contacting the fixing piece 28 of the metal fitting 7 to the upper surface of the electric component 5, the electric component 5 is firmly held on the substrate 1 by the fixing piece 28, and the electric component 5 moves away from the upper surface of the substrate 1 to move to the position. A shift can be prevented.

FIG. 20 shows another embodiment of a method of manufacturing a circuit board provided with electric components. The metal fitting 7 of this embodiment is formed in a substantially U-shape by a holding piece 26 and holding pieces 27 formed at both ends of the holding piece 26 so as to protrude downward. It is formed by coating with a brazing material 4 by a method. Also, as shown in FIG. 20A , a groove 22 is formed in the electrode portion 14 of the electric component 5 so as to open on the upper surface, the lower surface, and the side surface of the electric component 5 in the longitudinal direction.

[0063] Then when joining electrical components 5 on the substrate 1, FIG. 20 in the upper surface of the electrode portion 14 of the electrical component 5 with contacting the pressing piece 26 of the bracket 7 so as to insert the holding piece 27 into the groove 22 As shown in (b), metal fittings 7 are provided on both sides of the electric component 5, and in this state, the lower end of the holding piece 27 is recessed so that the brazing material 4 below the holding piece 27 contacts the circuit pattern 13 in the recess 2. arranged electrical components 5 and a pair of brackets 7 on the substrate 1 is inserted into 2, heating and melting the brazing material 4 is irradiated with a beam 6 from above the pressing piece 26 as shown in FIG. 20 (c) . Next, the irradiation of the beam 6 is stopped and the brazing material 4 is hardened again, whereby the substrate 1
And the metal fitting 7 and the electrode portion 14 of the electric component 5 can be joined at the same time.

As described above, in this embodiment, the substrate 1
The metal piece 7 is provided on the substrate 1 by inserting the holding piece 27 of the metal material 7 into the concave portion 2 of the substrate 1. Therefore, the metal member 7 can be easily positioned, and the joining position of the electric component 5 to the substrate 1 does not shift. You can do so. Also, by contacting the pressing piece 26 of the metal fitting 7 with the upper surface of the electric component 5, the electric component 5 is firmly held on the substrate 1 by the pressing piece 26, and the electric component 5 moves away from the upper surface of the substrate 1. A shift can be prevented. Further, the holding piece 27 of the metal fitting 7 is inserted into the groove 22 of the electric component 5.
Is inserted, the electric piece 5 can be firmly held on the substrate 1 by the holding piece 27 so that the electric part 5 does not move along the upper surface of the substrate 1 to cause a positional shift.

FIG. 21 shows another embodiment of a method of manufacturing a circuit board provided with electric components. The recesses 2 formed in the substrate 1 of this embodiment are formed in a hole shape with a bottom as shown in FIG. 21 (b), and four recesses 2 are provided in the substrate 1 as shown in FIG. 21 (a). As a group of concave portions. The bracket 7 is formed in a manner similar to that shown in FIG. 5, for example.

When the electric component 5 is joined to the substrate 1, the mounting portion is inserted into the concave portion 2 so that the brazing material 4 on the lower surface of the bottom portion 18 contacts the circuit pattern 13, and the four metal fittings are attached to the substrate 1. 7 is provided, placed four corners of the electrode portions 14 of the electrical component 5 on the bottom portion 18 as shown in FIG. 21 (c) with contacting electrode portion 14 of the end surface in the short direction of the electric component 5 a support 20 Thus, the electric component 5 is installed between the metal fittings 7. The rear portion 18 is irradiated with the beam 6 from above to heat and melt the brazing material 4. Next, beam 6
Is stopped and the brazing material 4 is cured again, whereby the substrate 1, the metal fitting 7, and the electrode portion 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, the substrate 1
The fitting portion of the metal fitting 7 is inserted into the concave portion 2 of the
Is provided, the positioning of the metal fitting 7 can be easily performed, and thus the joining position of the electric component 5 with respect to the substrate 1 can be prevented from shifting. In addition, the fitting portion of the metal fitting 7 is inserted into the concave portion 2 and locked,
Therefore, when the electric component 5 is placed on the metal fitting 7, the metal fitting 7 is prevented from moving and causing a positional shift. Further, by holding the periphery of the electric component 5 with the four metal fittings 7, the joint area between the electric component 5 and the metal fitting 7 increases, and the electric component 5 can be firmly held so as not to move and cause displacement. .

FIG.22Of a circuit board with electrical components
Another embodiment of the fabrication method is shown. This embodiment
Then, a resin member 9a formed of an insulating resin is filtered.
Using a socket 9 formed by coating with a filler material 4.
Thus, the electric component 5 is attached to the substrate 1. Tree
The fat member 9a is shown in FIG.22Open bottom as shown in (a)
The storage part 30 to be formed and the outer periphery protruding outward from the lower edge of the storage part
And a lower surface of the peripheral piece 31
And an insertion portion 19 to be provided. Also figure22
As shown in (b), the storage section 3 is provided on the front and back of the resin member 9a.
Brazing material except for the approximate center of 0 (indicated by cross hatching)
4 is coated.

In joining the electric component 5 to the substrate 1, the electric component 5 is fitted into the storage portion 30 from below, and the brazing material 4 in the storage portion 30 and the electrode portion 14 are held in contact with each other. In this state, the insertion part 19 is inserted into the recess 2 so that the brazing material 4 on the lower surface of the peripheral piece 31 contacts the circuit pattern 13, and the electric component 5 and the socket 9 are installed on the substrate 1. This Couto 22 by irradiating the beam 6 from above the peripheral piece 31 as shown in (c) heating and melting the brazing material 4. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is hardened again, so that the substrate 1, the socket 9, and the electrode portion 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, the substrate 1
The insertion portion 19 of the socket 9 is inserted into the concave portion 2 of the
Since the socket 9 is provided on the substrate 1, the positioning of the socket 9 can be easily performed, and therefore, the joining position of the electric component 5 with respect to the substrate 1 can be prevented from shifting. Further, by holding the entire periphery of the electric component 5 with the socket 9, the joint area between the electric component 5 and the socket 9 increases, and the electric component 5 can be firmly held so as not to move and cause displacement. The close contact between the socket 9 and the electric component 5 can be largely and reliably obtained, and stable joining can be performed. Also, by holding the electric component 5 in the socket 9, handling of the electric component 5 can be facilitated.

[0071] Multi-socket 40 as in FIG. 23 are integrally formed a plurality of sockets 9 shown in FIG. 22
Is shown. The multi-socket 40 has a plurality of storage portions 30 formed on the lower surface of the flat resin member 9a. An insertion portion 19 protruding from the lower surface is provided at an opening edge of the storage portion 30. Further, the resin member 9a is
Is coated with the brazing material 4 except for a joint portion of the peripheral piece 31 adjacent to a portion other than the substantially central portion.

[0072] Then when bonded to the substrate 1 an electrical component 5 as shown in FIG. 2 by using the multi-socket 40 (a) to (h), electrically from below into the respective storage unit 30 as shown in FIG. 24 Insert the part 5 into the multi socket 40
Holds a large number of electric components 5 and the brazing material 4 in the storage section 30.
And the electrode portion 14 are brought into contact with each other. In this state, the insertion portion 19 is inserted into the concave portion 2 so that the brazing material 4 on the lower surface of the peripheral piece 31 contacts the circuit pattern 13, and the electric component 5 and the multi socket 40 is installed. Thereafter, the peripheral piece 31 is irradiated with the beam 6 from above to heat and melt the brazing material 4. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is hardened again, whereby the substrate 1, the multi-socket 40, and the electrode portion 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, a large number of electric components 5 can be held by the multi-socket 40 and attached to the substrate 1, and the electric components 5 can be multiplied.

FIG.25Of a circuit board with electrical components
Another embodiment of the fabrication method is shown. This embodiment
Metal fittings 725(A) As shown in FIG.
A support portion 20 protruding from an upper surface of the bottom portion 18;
A holding piece 26 projecting from the upper end of the projection 20 to the side opposite to the bottom 18.
Is formed to have a substantially S-shaped cross section.
An insertion portion 19 is provided on the back surface and the tip of the holding piece 26 is provided.
Is provided with a fitting piece 33 protruding therefrom. The metal fitting 7 should be
It is formed by coating with a brazing material 4 by a method. Ma
The resin member 9a of this embodiment is formed in a plate shape.
Thus, fitting recesses 34 are provided on both side surfaces. Soshi
The fitting piece 33 is inserted into the fitting recess 34 so that the resin member 9
a by attaching metal fittings 7 on both sides of FIG.25
A socket 9 is formed as shown in FIG.
Is surrounded by a support portion 20, a holding piece 26 and a resin member 9a.
A storage portion 30 that is rarely opened downward is formed.

When the electric component 5 is joined to the substrate 1, the electric component 5 is fitted into the accommodating portion 30 from below, and the brazing material 4 in the accommodating portion 30 and the electrode portion 14 are held in contact with each other. In this state, the insertion part 19 is inserted into the concave part 2 so that the brazing material 4 on the lower surface of the bottom part 18 contacts the circuit pattern 13, and the electric component 5 and the socket 9 are installed on the substrate 1. This Couto 25 by irradiating the beam 6 from above the peripheral piece 31 as shown in (c) heating and melting the brazing material 4. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is hardened again, so that the substrate 1, the socket 9, and the electrode portion 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, the substrate 1
The insertion portion 19 of the socket 9 is inserted into the concave portion 2 of the
Since the socket 9 is provided on the substrate 1, the positioning of the socket 9 can be easily performed, and therefore, the joining position of the electric component 5 with respect to the substrate 1 can be prevented from shifting. Further, by holding the periphery of the electric component 5 with the socket 9, the joint area between the electric component 5 and the socket 9 increases and the electric component 5 can be firmly held so that the electric component 5 does not move and displace. The adhesion between the electric component 9 and the electric component 5 can be largely and reliably obtained, and stable joining can be performed. Also, by holding the electric component 5 in the socket 9, handling of the electric component 5 can be facilitated.

FIG.26Of a circuit board with electrical components
Another embodiment of the fabrication method is shown. This embodiment
Metal fittings 726(B) As shown in FIG.
And projecting upward from one end of the bottom portion 18
The support portion 20 and the other end of the bottom portion 18 are directed downward.
It is formed by a projecting insertion portion 19. The metal fittings 7
It is formed by coating with the brazing material 4 by the above method.
is there. Further, the resin member 9a of this embodiment is opened on the lower surface.
It is formed by providing an accommodating storage section 30. And storage
30 and the supporting portion 20 of the metal fitting 7 is inserted into the resin member 9a.
By attaching the metal fittings 7 on both sides of the26
The socket 9 as shown in FIG.

In joining the electric component 5 to the substrate 1, the electric component 5 is fitted into the housing portion 30 from below, and the supporting portion 20 of the metal fitting 7 is held in contact with the end surface of the electrode portion 14. In this state, the insertion part 19 is inserted into the concave part 2 so that the brazing material 4 on the lower surface of the bottom part 18 contacts the circuit pattern 13, and the electric component 5 and the socket 9 are installed on the substrate 1. This Couto 26 by irradiating the beam 6 from above the peripheral piece 31 as shown in (c) heating and melting the brazing material 4. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is hardened again, so that the substrate 1, the socket 9, and the electric component 5 are hardened.
Can be simultaneously bonded to the electrode portion 14.

As described above, in this embodiment, the substrate 1
The insertion portion 19 of the socket 9 is inserted into the concave portion 2 of the
Since the socket 9 is provided on the substrate 1, the positioning of the socket 9 can be easily performed, and therefore, the joining position of the electric component 5 with respect to the substrate 1 can be prevented from shifting. Further, by holding the periphery of the electric component 5 with the socket 9, the joint area between the electric component 5 and the socket 9 increases and the electric component 5 can be firmly held so that the electric component 5 does not move and displace. The adhesion between the electric component 9 and the electric component 5 can be largely and reliably obtained, and stable joining can be performed. Also, by holding the electric component 5 in the socket 9, handling of the electric component 5 can be facilitated.

FIG. 27 shows another embodiment of a method of manufacturing a circuit board having electric components. The metal fitting 7 of this embodiment is formed by a plate-shaped bottom portion 18 and an insertion portion 19 protruding from a substantially central portion of the lower surface of the bottom portion 18.
Is formed as a flange 10. The metal fitting 7 is formed by coating with the brazing material 4 by the above-described method.

In joining the electric component 5 to the substrate 1, first, as shown in FIG. 27A , the brazing material 4 on the lower surface of the metal fitting 7 is inserted into the recess 2 so as to contact the circuit pattern 13. The electrical component 5 is mounted on the metal fitting 7 so that the metal part 7 is provided on the substrate 1 by inserting the part 19 and the electrode part 14 is brought into contact with the brazing material 4. Next, the beam 6 is irradiated from above onto the flange portion 10 of the metal fitting 7 protruding outside the electric component 5 to heat and melt the brazing material 4. By re-cure the brazing material 4 to stop the irradiation of the beam 6 Next, the substrate as shown in FIG. 27 (b) 1
The metal part 7 and the electrode part 14 of the electric component 5 can be joined.

As described above, in this embodiment, the substrate 1
The metal fitting 7 is provided on the substrate 1 by inserting the fitting portion 19 of the metal fitting 7 into the concave portion 2 of the substrate 1, so that the positioning of the metal fitting 7 can be easily performed, and the joining position of the electric component 5 to the substrate 1 is shifted. Can not be. Also, the insertion portion 19 of the metal fitting 7 is inserted and locked in the concave portion 2, so that when the electric component 5 is placed on the metal fitting 7, the metal fitting 7 does not move to cause a positional shift. .
Further, a flange 10 is provided on the metal fitting 7, and the flange 1
Since the irradiation of the beam 6 is performed at 0, the irradiation area of the beam 6 can be enlarged, and the tolerance for the deviation of the irradiation position of the beam 6 can be increased. In addition, by adjusting the thickness of the bottom portion 18, the height of bonding of the electric component 5 to the substrate 1 can be changed, and the height of the electric component 5 can be managed.

FIG. 28 shows another embodiment of a method of manufacturing a circuit board having electric components. In the flange portion 10 of the fitting 7 in Fig. 27 in this embodiment, the mark 11 on the portion serving as the irradiation area of the beam 6 is provided. Mark 11 may be any one as long as it can be monitored by the camera, for example, depression, as shown in scratches and FIG 28 (b), as shown in FIG. 28 (a), or a sign of protrusions or other specific shape Etc. can be used.

In joining the electric component 5 to the substrate 1, the metal part 7 is provided on the substrate 1 in the same manner as shown in FIG. 27 , and the electrode part 14 is brought into contact with the brazing material 4 on the upper surface of the metal part 7. The electric component 5 is placed on the metal fitting 7.
Next, as shown in FIG. 28 (a), marks 11 of the camera 3
5 monitored by detects, irradiating a beam 6 of the mark 11 as the irradiation position, as shown in FIG. 29 (a). After it may be bonded to the electrode portion 14 of the substrate 1 and the metal member 7 and the electrical components 5 in a manner similar to that shown in Figure 27.

As described above, in this embodiment, the mark 11 provided on the flange portion 10 is detected and this mark 11
Irradiating the beam 6 toward the substrate 6, the accuracy of the irradiation position of the beam 6 can be improved, and therefore, the erroneous irradiation of the beam 6 to the electric component 5 and the substrate 1 is eliminated. The component 5 can be prevented from being damaged.

FIG. 29 shows another embodiment of a method of manufacturing a circuit board having electric components. In this embodiment, the flange portion 10 of the metal fitting 7 shown in FIG. 27 or the brazing material 4 covering the flange portion 10 is provided with an uneven surface 12 at a portion to be irradiated with the beam 6. Uneven surface 12 may beam 6 any as long as it can increase the surface area of the or the irradiation area can be reflected in multiple, scratches Ya of example V-shaped, as shown in FIG. 29 (a) A depression as shown in FIG. 29 (b) or FIG. 29 (c)
, And the V-shaped scratches 12b are repeatedly formed.

[0087] Then when joining electrical components 5 on the substrate 1, so as to contact the electrode portion 14 to the brazing material 4 of the upper surface of the bracket 7 is provided with the bracket 7 to the substrate 1 similar to that shown in FIG. 27 The electric component 5 is placed on the metal fitting 7. Next, as shown in FIGS. 29A to 29C, the uneven surface 12 is irradiated with the beam 6. After it may be bonded to the electrode portion 14 of the substrate 1 and the metal member 7 and the electrical components 5 in a manner similar to that shown in Figure 27.

As described above, in this embodiment, the uneven surface portion 12 is formed on the flange portion 10 and the beam 6 is applied to the uneven surface portion 12.
Energy can be improved, and the board 1, the electric component 5, and the metal fitting 7 can be joined with less heat input.

FIG . 30 shows another embodiment of a method of manufacturing a circuit board provided with electric components. The substrate 1 according to this embodiment is the one shown in FIGS.
Any of those shown in (c) and (d), those shown in FIGS. 2E and 2F, and those shown in FIGS. 2G and 2H may be adopted. The metal fitting 7 has a flat upper surface and an insertion portion 17 projecting from the lower surface. The metal fitting 7 is formed by coating with the brazing material 4 by the above-described method.

Then, the electric component 5 is joined to the substrate 1.
First, figure30As shown in FIG.
Insert the insertion part 17 into the
The metal fitting 7 is attached to the substrate 1 so as to be in contact with the road pattern 13.
So that the electrode part 14 is in contact with the metal fitting 7.
Then, the electric component 5 is placed on the metal fitting 7. Next figure30
As shown in (b), the electric component 5 and the metal
Blow an inert gas 8 such as elemental or helium
The surroundings of the electric parts 5 and the metal fittings 7 are sealed in an atmosphere of an inert gas 8.
And a metal fitting 7 (filter)
Irradiating the beam 6 from above only to the brazing material 4)
Heat to melt. Beam 6 used here is
It is a pulse laser with high energy density. Also here
A pulse of 1 ms or more and 100 ms or less is applied to brazing material 4
Or multiple pulses, and brazing material 4
Only heat locally. Beam 6 pulse
Is increased by increasing the amount of energy per unit time.
Can be shortened, but stable
It takes about 1 ms or more to obtain the (beam) light
Is necessary. Next, the irradiation of the beam 6 is stopped to stop the brazing material 4.
By curing again the figure30(C)
The substrate 1, the metal fitting 7, and the electrode part 14 of the electric component 5 are simultaneously
Can be joined.

As described above, in this embodiment, the substrate 1
The insertion part 17 of the metal fitting 7 is inserted into the concave part 2 of the substrate 1 so that the metal fitting 7 is provided on the substrate 1, so that the positioning of the metal fitting 7 can be easily performed, so that the joining position of the electric component 5 to the substrate 1 does not shift. You can do so. In addition, the insertion portion 17 of the metal fitting 7 is inserted and locked in the concave portion 2, so that when the electric component 5 is placed on the metal fitting 7, the metal fitting 7 does not move to cause displacement. Can be. Also, since the metal fitting 7 is not melted by the irradiation of the beam 6, the electric component 5 can be supported by the metal fitting 7,
The electric component 5 can be prevented from being shifted and joined to the metal fitting 7. Further, since the beam 6 irradiates only the metal fitting 7, heat is less likely to be transmitted to the electric component 5 and the substrate 1, and the electric component 5 and the substrate 1 can be prevented from being damaged by the beam 6. In addition, since the thickness of the brazing material 4 can be more easily controlled by the coating process such as plating than in the conventional screen printing, the supply amount of the brazing material 4 can be easily controlled to a constant amount.

Further, in the atmosphere of the inert gas 8, the brazing material 4
By irradiating the beam 6 and the irradiation of the beam 6 in a short time, it is possible to prevent the brazing material 4 and the electrode portion 14 from being oxidized, and it becomes unnecessary to include a flux component in the brazing material 4. And since fluxless bonding is possible in this way, the substrate 1 is bonded after the electrical component 5 is bonded.
Need not be washed.

[0093]

As described above, according to the first aspect of the present invention, a method for manufacturing a circuit board having an electric component on the board is provided.
At least one of a concave portion and a convex portion is formed on the substrate.
Fitting the concave or convex coated with brazing material that bets both
On the brazing material and hold the electrical parts in contact with the brazing material
And a pulse bead of 1 ms or more and 100 ms or less
At least one pulse or multiple pulses
The brazing material was melted and the electrical components were joined to the board with the brazing material
Therefore, metal fittings are provided in the concave or convex portions of the substrate.
And the positioning of the bracket can be easily performed.
Position of the electric component to the substrate
It is possible to prevent displacement. Also
The metal fittings will be inserted and locked in the concave or convex parts,
Therefore, when placing electrical components on the bracket, the bracket moves and
It is possible to prevent displacement,
Ensure that the bonding position of components to the board does not shift
Can be done. Also, apply brazing material to the substrate by printing.
Can make the thickness of the brazing material easier to maintain than
Control of brazing material supply
Things. In addition, beam irradiation is performed in a short time.
This prevents oxidation of the brazing filler metal and electrode.
It is necessary to include flux components in brazing material
Eliminates flux, enabling fluxless joining
This eliminates the need to clean the substrate after joining the products.
And soldering failure due to flux and solder scattering
It can be prevented from occurring.

According to the second aspect of the present invention, since the electric component is held by the metal fitting so as not to move along the surface of the substrate, the joining position of the electric component does not shift along the surface of the substrate. It is something that can be.

According to the third aspect of the present invention, since the electric component is held by the metal fitting so as not to move in the direction away from the surface of the substrate, the joining position of the electric component is shifted in the direction away from the surface of the substrate. Is something that can be avoided.

In the invention according to claim 4 of the present invention, since a mark formed on a bracket coated with a brazing material is detected and a beam is irradiated toward the mark, the accuracy of the beam irradiation position is improved. This makes it difficult to irradiate the electric parts and the substrate with the beam, thereby preventing the electric parts and the substrate from being damaged.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of a circuit board provided with an electric component of the present invention.

2A is a plan view showing the same substrate, FIG. 2B is a cross-sectional view of FIG. 2A, FIG. 2C is a plan view showing another substrate,
(D) is a sectional view of (c), (e) is a plan view of another substrate, (f) is a sectional view of (e), (g) is a plan view of another substrate, and (h) is a plan view of another substrate. It is sectional drawing of (g).

FIG. 3 is a cross-sectional view showing a joint structure of the electric component according to the first embodiment;

FIG. 4A is a cross-sectional view showing another embodiment of the above embodiment;
(B) is a sectional view, and (c) is a sectional view.

FIG. 5A is a cross-sectional view showing another embodiment of the above,
(B) is a plan view.

FIG. 6A is a cross-sectional view showing another embodiment of the same as the above,
(B) is a plan view.

FIG. 7 is a cross-sectional view showing another embodiment of the above.

FIG. 8 (a) is a plan view of the electric component, and FIG.
A plan view showing another embodiment above, and FIG.
You.

FIG. 9A is a plan view of an electric component, and FIG.
(C) is a side view showing the embodiment.

FIG. 10 (a) is a cross section showing another embodiment of the above.
FIG. 2B is a sectional view.

FIG. 11A is a plan view showing another embodiment of the embodiment.
FIG. 2B is a plan view.

FIG. 12 is a cross-sectional view showing another embodiment of the above.

FIG. 13 (a) is a side view showing another embodiment of the above.
FIG. 2B is a plan view.

FIG. 14 (a) is a side view showing another embodiment of the above.
FIG. 2B is a plan view.

FIG. 15 is a perspective view showing another embodiment of the above.

FIG. 16 is a perspective view showing another embodiment of the above.

FIG. 17 is a perspective view showing another embodiment of the above.

FIG. 18 (a) is a cross section showing another embodiment of the above.
FIG. 2B is a plan view.

19A is a plan view of an electric component, and FIG.
FIG. 10 is a plan view showing another embodiment, and FIG.

20A is a plan view of an electric component, and FIG.
FIG. 10 is a plan view showing another embodiment, and FIG.

21A is a plan view showing a substrate, and FIG.
FIG. 3C is a cross-sectional view, and FIG.
FIG.

FIG. 22A is a side view showing a resin member, and FIG.
A side view showing a socket, and (c) is another embodiment of the above.
FIG.

FIG. 23 is a rear view showing another embodiment of the above.

FIG. 24 is a partial cross-section showing the embodiment of FIG.
FIG.

FIG. 25A is a cross-sectional view showing a bracket, and FIG.
(C) shows another embodiment of the above.
It is sectional drawing.

26A is a side view showing a resin member, and FIG.
Sectional drawing which shows a socket, (c) is another embodiment same as the above.
FIG.

FIG. 27 (a) is a cross section showing another embodiment of the above.
FIG. 2B is a sectional view.

28A is a cross-sectional view showing a part of a metal fitting, and FIG.
It is a sectional view showing a part of other metal fittings.

FIG. 29A is a cross-sectional view showing a part of a bracket, and FIG.
Sectional drawing which shows a part of other metal fittings, (c) is another metal fitting.
It is sectional drawing which shows a part of.

FIG. 30 (a) is a cross section showing another embodiment of the present invention.
(B) is a sectional view, and (c) is a sectional view.

31A is a cross-sectional view showing a conventional example, and FIG.
(A) is a plan view, (c) is a cross-sectional view showing another conventional example,
(D) is a plan view of (c).

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Substrate 2 Concave part 4 Brazing material 5 Electric component 6 Beam 7 Metal fitting 8 Inert gas 1 1 Mark

────────────────────────────────────────────────── ─── Continuation of the front page Examiner Takashi Nakagawa (56) References JP-A-6-326440 (JP, A) JP-A-4-1274747 (JP, A) JP-A-6-151035 (JP, A) JP-A-6-45752 (JP, A) JP-A-5-90743 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 3/34 H05K 1/18 H05K 13/04

Claims (4)

(57) [Claims] 1. A circuit board having an electric component on a board is manufactured.
In doing so, at least one of the concave part and the convex part
Metal fittings formed and coated with brazing material
Or on the protruding part, with the electrical component in contact with the brazing material.
Hold and apply a pulse of 1 ms to 100 ms to the brazing material.
Irradiate the beam with at least one pulse or multiple pulses
Melt the brazing material and join the electrical components to the board with the brazing material
Of a circuit board provided with an electric component
Method. 2. The electric component does not move along the surface of the substrate.
2. The method according to claim 1, wherein the support is held by metal fittings.
A method for manufacturing a circuit board provided with the electric component of the present invention. 3. The electric component is moved away from the surface of the substrate.
Claims characterized by holding with metal fittings so as not to move
A method for manufacturing a circuit board provided with the electric component according to claim 1. 4. A metal member coated with a brazing material.
The target mark and irradiate the beam toward the mark
The electrical component according to claim 1, wherein
A method for manufacturing a circuit board.